CN103533741A - Double-side thick copper plate and manufacturing method thereof - Google Patents
Double-side thick copper plate and manufacturing method thereof Download PDFInfo
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- CN103533741A CN103533741A CN201310518906.8A CN201310518906A CN103533741A CN 103533741 A CN103533741 A CN 103533741A CN 201310518906 A CN201310518906 A CN 201310518906A CN 103533741 A CN103533741 A CN 103533741A
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Abstract
The invention discloses a double-side thick copper plate and a manufacturing method thereof. The method comprises the following steps: S1, cutting copper foils; S2, drilling riveting holes in the copper foils; S3, manufacturing circuits on the copper foils; S4, riveting and pressing two copper foils subjected to circuit manufacturing; S5, continuing circuit manufacturing on the copper foils. Compared with the ordinary process, the method disclosed by the invention has the advantages that the erosion and burring of the circuits are reduced and the consistence of upper line width and lower line width is ensured, after the copper foils subjected to primary circuit manufacturing are pressed, the line distance is filled with a medium layer, and the seams at the part do not need to be filled with silk-screen anti-soldering oil, so that the silk-screen times and the quality risk caused by silk screen are reduced.
Description
Technical field
The present invention relates to double-sided PCB board and make field, relate in particular to a kind of two-sided thick copper coin and preparation method thereof.
Background technology
At present, double-sided PCB board manufacture craft is generally: adopt conventional copper-clad plate to claim again CCL, cut into the size that is applicable to factory process according to PCB processing request, by setting process, machine.Be that double sided board work flow is: electricity-etching is made-schemed to sawing sheet-boring-heavy copper-plate electricity-circuit, but this is generally only suitable in the little two-sided copper coin of thickness, for two-sided thick copper coin more than 6OZ, adopt conventional technique to make, to there is following problem, as Fig. 1:
1, after etching, upper and lower live width difference is large, and lower live width produces larger burr, and copper is thick, and this problem is more serious;
2, the super process capability problem of line-spacing, such as the thick copper coin of 6OZ, if production requirement minimum spacing is 0.25mm, and client's design only has 0.15mm, and this type of thick copper coin cannot be produced.
3, copper is thick, anti-solder ink needs repeatedly silk-screen could meet production requirement, and general anti-solder ink, thereafter roasting total time is limiting value at 150min, therefore 1 need of silk-screen roasting 50min calculating afterwards routinely, the silk-screen number of times of anti-solder ink can not surpass 3 times, otherwise will there will be quality hidden danger.Along with copper is thick, more pcb board often after silk-screen 3 times still difficulty meet production requirement.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of two-sided thick copper coin and preparation method thereof, be intended to solve that the upper and lower live width difference of existing double-sided PCB board manufacture method is large and etching burr are excessive, a little less than the super process capability of line-spacing and the too much problem of silk-screen number of times.
Technical scheme of the present invention is as follows:
A thick copper coin manufacture method, wherein, comprises step:
S1, Copper Foil sawing sheet;
S2, Copper Foil is bored to rivet hole process;
S3, on the enterprising line of Copper Foil road, make;
S4, the Copper Foils that two process circuits are made carry out riveted pressing;
S5, continuation are carried out circuit making to Copper Foil.
Described two-sided thick copper coin manufacture method, wherein, half that the etch quantity that the circuit in described step S3 is made is copper thickness.
Described two-sided thick copper coin manufacture method, wherein, also comprises between described step S4 and S5: the Copper Foil after riveted pressing is sunk to copper and plate electric treatment.
Described two-sided thick copper coin manufacture method, wherein, also comprises after described step S5:
Copper Foil is carried out to the processing of figure electroetching.
Described two-sided thick copper coin manufacture method, wherein, in described step S2, bores the processing of rivet hole and registration holes to two Copper Foils, wherein, the rivet hole position of two Copper Foils is corresponding, staggers in registration holes position.
Described two-sided thick copper coin manufacture method, wherein, in described S4, the one side contraposition riveted pressing in opposite directions that two Copper Foils are made through circuit.
Described two-sided thick copper coin manufacture method, wherein, in described step S4, carries out the processing of milling location hole to two Copper Foils after pressing.
A thick copper coin, wherein, adopts as above arbitrary described two-sided thick copper coin manufacture method to make.
Beneficial effect: method of the present invention is with respect to common process, side etching quantity and the burr of circuit have been reduced, guaranteed the consistency of upper live width and lower live width, after the Copper Foil pressing that circuit is made for the first time, its line-spacing has been filled dielectric layer, this part gap does not need to fill by the anti-solder paste of silk-screen, the quality risk that has reduced silk-screen number of times and brought.
Accompanying drawing explanation
Fig. 1 is the structural representation of two-sided thick copper coin in prior art.
Fig. 2 is the flow chart of the two-sided thick copper coin manufacture method of the present invention preferred embodiment.
Different conditions structural representation when Fig. 3 to Fig. 8 makes two-sided thick copper coin for employing manufacture method of the present invention.
Embodiment
The invention provides a kind of two-sided thick copper coin and preparation method thereof, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 2, Fig. 2 is the flow chart of the two-sided thick copper coin manufacture method of the present invention preferred embodiment, and as shown in the figure, it comprises step:
S1, Copper Foil sawing sheet;
S2, Copper Foil is bored to rivet hole process;
S3, on the enterprising line of Copper Foil road, make;
S4, the Copper Foils that two process circuits are made carry out riveted pressing;
S5, continuation are carried out circuit making to Copper Foil.
The present invention is mainly by carrying out at twice circuit making, and comes contraposition to realize the docking of finished product circuit by precision and the outer-layer circuit of pressing.Its main flow process changes to Copper Foil sawing sheet-brill rivet hole-L1-and L2-sandwich circuit is made (regular link mirror image processing, name L1-and L2-layer)-pressing-milling location hole-boring-heavy copper--and plate electricity the-the 2nd secondary line is made (normal L1 and L2 sandwich circuit)-figure electricity-etching.By 2 secondary lines, make side etching quantity and the burr that reduced circuit, guaranteed the consistency of upper live width and lower live width.And, the live width after circuit is for the first time made after pressing, filled media layer between distance between centers of tracks, this part gap need to be filled by silk-screen anti-solder ink originally, do not need now, reduced anti-solder ink silk-screen number of times, reduced the quality risk that repeatedly silk-screen brings.
In the present embodiment, half that the etch quantity that the circuit in described step S3 is made is copper thickness.To carry out pressing processing.
Between described step S4 and S5, also comprise: the Copper Foil after riveted pressing is sunk to copper and plate electric treatment.
Further, after described step S5, also comprise: Copper Foil is carried out to the processing of figure electroetching.
Further, in described step S2, two Copper Foils are bored to the processing of rivet hole and registration holes, wherein, the rivet hole position of two Copper Foils is corresponding, staggers in registration holes position.
Further, the one side contraposition riveted pressing in opposite directions of two Copper Foils being made through circuit.And at the one side filled media layer of mutual riveted pressing, so just need not fill by silk-screen anti-solder ink, reduce silk-screen number of times.
Further, in described step S4, two Copper Foils after pressing are carried out to the processing of milling location hole.Location hole is for location.
Based on above-mentioned manufacture method, the present invention also provides a kind of two-sided thick copper coin, and it adopts two-sided thick copper coin manufacture method as above to make.
Embodiment:
1, Copper Foil sawing sheet:
If required copper thick for 12OZ, just considered that follow-up plating can thicken the copper of 1OZ left and right, so to select thickness be the Copper Foil of 11OZ by cutting 1OZ when selecting materials, as shown in Figure 3;
2, Copper Foil bores rivet hole and registration holes:
Drill through the rivet hole that pressing is used, the rivet hole position of 2 Copper Foils that double sided board circuit circuit is used is corresponding, and registration holes position staggers, as shown in Figure 4;
3, circuit is made:
This is decided to be internal layer circuit and makes, the same with outer-layer circuit design, such as finished product copper is thick, be 12OZ, internal layer is made circuit etching 6OZ, outer etching 6OZ, as shown in Figure 5, should be noted that this is same finished product circuit, outer-layer circuit is L1 during normal making, and circuit is L1-during internal layer etching, when just internal layer circuit is made by L1 layer mirror image processing;
4, pressing:
Individual line layer order is superimposed, and by the rivet hole riveted the getting out early stage pressing of getting up, as shown in Figure 6, location hole while milling out boring by multiple-plate operation with X-RAY after pressing completes, projects by X-ray, projects the target of internal layer, then at target correspondence position, turn location hole
Now the precision of two line layers can reach +/-3mil, has met the production required precision of wiring board completely.
5, outer-layer circuit:
By normal boring, carry out circuit making, as shown in Figure 7, now only surplus 6OZ copper is thick has needed etching for L1 layer, the 6OZ that simultaneously internal layer etches away filled media layer when pressing, this Partial Height is follow-up also without silk-screen anti-solder ink, reduce anti-solder ink silk-screen number of times, reduced the ink quality risk that repeatedly silk-screen brings.As shown in Figure 8, the difference of its upper and lower live width is much smaller for the two-sided thick copper coin finally making.
In sum, method of the present invention is with respect to common process, side etching quantity and the burr of circuit have been reduced, guaranteed the consistency of upper live width and lower live width, after the Copper Foil pressing that circuit is made for the first time, its line-spacing has been filled dielectric layer, and this part gap does not need to fill by the anti-solder paste of silk-screen, the quality risk that has reduced silk-screen number of times and brought.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (8)
1. a two-sided thick copper coin manufacture method, is characterized in that, comprises step:
S1, Copper Foil sawing sheet;
S2, Copper Foil is bored to rivet hole process;
S3, on the enterprising line of Copper Foil road, make;
S4, the Copper Foils that two process circuits are made carry out riveted pressing;
S5, continuation are carried out circuit making to Copper Foil.
2. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, half that the etch quantity that the circuit in described step S3 is made is copper thickness.
3. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, between described step S4 and S5, also comprises: the Copper Foil after riveted pressing is sunk to copper and plate electric treatment.
4. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, after described step S5, also comprises:
Copper Foil is carried out to the processing of figure electroetching.
5. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, in described step S2, two Copper Foils is bored to the processing of rivet hole and registration holes, and wherein, the rivet hole position of two Copper Foils is corresponding, staggers in registration holes position.
6. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, in described S4, and the one side contraposition riveted pressing in opposite directions that two Copper Foils are made through circuit.
7. two-sided thick copper coin manufacture method according to claim 1, is characterized in that, in described step S4, two Copper Foils after pressing is carried out to the processing of milling location hole.
8. a two-sided thick copper coin, is characterized in that, adopts the two-sided thick copper coin manufacture method as described in as arbitrary in claim 1 to 7 to make.
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| CN103533741B CN103533741B (en) | 2016-07-06 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661451A (en) * | 2014-06-17 | 2015-05-27 | 昆山市鸿运通多层电路板有限公司 | Printing process of multilayered circuit board with ultrathin medium and thick copper foil |
| CN105960102A (en) * | 2016-05-31 | 2016-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of high-copper thick type printed circuit board |
| CN106507598A (en) * | 2016-11-01 | 2017-03-15 | 深圳市强达电路有限公司 | A kind of processing method of super thick copper circuit board |
| CN108513460A (en) * | 2018-04-16 | 2018-09-07 | 四会富士电子科技有限公司 | A kind of riveting method of multi-layer PCB board |
| CN110087397A (en) * | 2019-03-28 | 2019-08-02 | 深圳市众阳电路科技有限公司 | A kind of PCB thickness copper sheet segmentation etch method |
| CN111988918A (en) * | 2020-09-15 | 2020-11-24 | 四川英创力电子科技股份有限公司 | Manufacturing method of thick copper circuit board |
| CN112672546A (en) * | 2020-12-28 | 2021-04-16 | 珠海市深联电路有限公司 | Processing method for printing multilayer board by ultra-thick copper foil |
| CN114206018A (en) * | 2021-12-27 | 2022-03-18 | 百强电子（深圳）有限公司 | Efficient thick copper plate solder resist printing method |
| CN115633464A (en) * | 2022-12-19 | 2023-01-20 | 浙江万正电子科技股份有限公司 | Manufacturing method of circuit board with thick copper foil |
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| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN102291946A (en) * | 2011-07-27 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing thick copper circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661451A (en) * | 2014-06-17 | 2015-05-27 | 昆山市鸿运通多层电路板有限公司 | Printing process of multilayered circuit board with ultrathin medium and thick copper foil |
| CN105960102A (en) * | 2016-05-31 | 2016-09-21 | 安捷利（番禺）电子实业有限公司 | Preparation method of high-copper thick type printed circuit board |
| CN105960102B (en) * | 2016-05-31 | 2019-03-29 | 安捷利（番禺）电子实业有限公司 | A kind of preparation method of high-copper thicker printed circuit board |
| CN106507598A (en) * | 2016-11-01 | 2017-03-15 | 深圳市强达电路有限公司 | A kind of processing method of super thick copper circuit board |
| CN108513460A (en) * | 2018-04-16 | 2018-09-07 | 四会富士电子科技有限公司 | A kind of riveting method of multi-layer PCB board |
| CN110087397A (en) * | 2019-03-28 | 2019-08-02 | 深圳市众阳电路科技有限公司 | A kind of PCB thickness copper sheet segmentation etch method |
| CN111988918A (en) * | 2020-09-15 | 2020-11-24 | 四川英创力电子科技股份有限公司 | Manufacturing method of thick copper circuit board |
| CN112672546A (en) * | 2020-12-28 | 2021-04-16 | 珠海市深联电路有限公司 | Processing method for printing multilayer board by ultra-thick copper foil |
| CN114206018A (en) * | 2021-12-27 | 2022-03-18 | 百强电子（深圳）有限公司 | Efficient thick copper plate solder resist printing method |
| CN114206018B (en) * | 2021-12-27 | 2022-08-02 | 百强电子（深圳）有限公司 | Efficient thick copper plate solder resist printing method |
| CN115633464A (en) * | 2022-12-19 | 2023-01-20 | 浙江万正电子科技股份有限公司 | Manufacturing method of circuit board with thick copper foil |
| CN115633464B (en) * | 2022-12-19 | 2023-08-22 | 浙江万正电子科技股份有限公司 | Manufacturing method of circuit board with thick copper foil |
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