CN105960102B - A kind of preparation method of high-copper thicker printed circuit board - Google Patents
A kind of preparation method of high-copper thicker printed circuit board Download PDFInfo
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- CN105960102B CN105960102B CN201610382648.9A CN201610382648A CN105960102B CN 105960102 B CN105960102 B CN 105960102B CN 201610382648 A CN201610382648 A CN 201610382648A CN 105960102 B CN105960102 B CN 105960102B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention discloses a kind of preparation method of high-copper thicker printed circuit board, comprising the following steps: (1) selects a conductive metal paillon sawing sheet, location hole is bored on metal foil；(2) metal foil constructs copper line pattern in metal foil reverse side after photic pre-treatment；(3) metal foil successively presses together from top to bottom with prepreg, high molecular polymer substrate, and wherein metal foil reverse side is towards prepreg；(4) copper line pattern is constructed in metal foil front, the copper line pattern of metal foil front and back sides requires to be completely coincident；(5) by difference etching process by the complete corrosion inhibitor of the metal foil in logicalnot circuit area, fine-line is made；(6) subsequent processing is carried out to obtain printed circuit board to fine-line.The copper thickness of the printed circuit board being prepared through the invention, route significantly improves, and route also has lesser line width/line-spacing, can meet the route copper thickness of PCB much higher than line width/line-spacing market demand.
Description
Technical field
The invention belongs to printed circuit board (PCB) technical fields, and in particular to a kind of system of high-copper thicker printed circuit board
Preparation Method.
Background technique
Currently, the fabricating technology of printed circuit board (PCB) has developed to obtain comparative maturity, still, electronic manufacture row
The development of industry is more swift and violent, and by taking smart phone as an example, more and more functions need to be integrated into mobile phone hardware, and product
Lightening development trend is but presented in size, this brings many new challenges to PCB industry.One kind key technology therein is asked
Topic is concentrated mainly in the manufacture of fine-line, for example many fine-lines require line width line-spacing as low as 10/10 μm, Yi Jiyao
Ultra-thin substrate is asked to control etc..
At present there are mainly two types of the common methods of production PCB route: one kind is semi-additive process, that is, uses film dry film and cover
Copper sheet makes printed circuit board, wherein first protects logicalnot circuit area with negative-appearing image figure, then fine-line is electroplated in line areas, finally
By the layers of copper corrosion inhibitor of non-line section；Another kind is subtractive process, that is, positive print shape protection circuit area is used, then by logicalnot circuit area
Corrosion inhibitor falls.
Semi-additive process can usually be used to produce fine-line, for example application No. is 201510296726.9 patent public affairs
Opened a kind of micro- interval circuit plate outer-layer circuit processing method of thick copper foil fine-wire circuit, by bore the outer fabrication hole of thin copper foil substrate,
Pasted on thin copper foil substrate dry film and to the windowing of all figures, to all pattern plating coppers, move back film, bore pcb board inner hole, subsequent
The processing steps such as conventional machining are carried out to pcb board, it is possible to produce printed circuit board, the printed circuit board substantially can be to avoid biographies
System outer layer is made using thick base copper and is unfavorable for the problem of fine rule road makes.But the processing method of the patent disclosure is still deposited
In certain limitation, because usually, the resolution of film photosensitive dry film is same or similar with film thickness in Vehicles Collected from Market,
For example it is usually 20~25 μm that the thickness of dry film of 10 μm of analytic abilities, which is usually the thickness of dry film of 10~15 μm, 20 μm analytic abilities,
Deng, even some especially high-end good film photosensitive dry films, resolution and film thickness still relatively, than if any one kind
Film photosensitive dry film, film thickness are 25 μm, and analytic ability is also only 10 μm.Based on this, since this patent is the list in copper foil
Face carries out electro-coppering, and the copper thickness of fine-line is generally equivalent to the thickness of photosensitive dry film in PCB, therefore, PCB made from this patent
The copper thickness of fine-line still do not exceed the thickness of dry film.In other words, when PCB requires the copper thickness of fine-line to be significantly larger than
When line width line-spacing, existing semi-additive process technology is difficult to meet the design requirement.And for subtractive process, since it can not overcome line
The lateral erosion effect on road is equally also difficult to meet above-mentioned design requirement.
However, in currently very popular automobile electronics, camera lens anti-shaking module product and miniature inductance device etc.
In manufacturing, the market demand that the copper thickness of fine-line is significantly larger than line width line-spacing in PCB is just gradually increased, therefore, how
The copper thickness for solving fine-line in PCB is significantly larger than this technical problem of line width line-spacing, becomes urgent need instantly.
Summary of the invention
In view of the deficiencies of the prior art, the purpose of the present invention is to provide a kind of preparation sides of high-copper thicker printed circuit board
Method, the printed circuit board being prepared by this method also have lesser while the copper thickness of route is significantly improved
Line width/line-spacing, so that the copper thickness for very well satisfying route in PCB is significantly larger than line width/line-spacing market demand.
In order to achieve the above-mentioned object of the invention, the technical solution adopted in the present invention is as follows:
A kind of preparation method of high-copper thicker printed circuit board, which comprises the following steps:
S1, one conductive metal paillon sawing sheet of selection, and location hole is bored on the metal foil；
S2, the metal foil construct the copper route of design after photic pre-treatment, in the metal foil reverse side
Figure；
S3, the metal foil and prepreg, high molecular polymer substrate successively press together from top to bottom, wherein
The metal foil reverse side is towards the prepreg；
S4, the copper line pattern of design is constructed in the metal foil front, the metal foil is positive described
The copper line pattern of copper line pattern and the metal foil reverse side is completely coincident；
S5, by difference etching process, by the complete corrosion inhibitor of the metal foil in logicalnot circuit area, to be made required fine
Route；
S6, conventional subsequent processing is carried out to the fine-line, to obtain required printed circuit board.
Further, the copper thickness of the copper line pattern constructed in the metal foil front is the fine lines
The 1/2 of road thickness；It is that the fine-line is thick in the copper thickness for the copper line pattern that the metal foil reverse side constructs
The 1/2 of degree.
Further, in step sl, on the metal foil bore location hole used in method be machine drilling or
Person's laser drill.
Further, in step s 2, the technique of the copper line pattern of design is constructed in the metal foil reverse side
Sub-step specifically includes: pasting film dry film in the metal foil reverse side, exposure-processed, development treatment, is cleaned using Plasma
Technique removes remaining film dry film skirt, figure copper plating treatment.
Further, in step s 4, the technique of the copper line pattern of design is constructed in the metal foil front
Sub-step specifically includes: in the positive face paste film dry film of the metal foil, exposure-processed, development treatment, being cleaned using Plasma
Technique removes remaining film dry film skirt, figure copper plating treatment.
Further, in step s 5, by the complete corrosion inhibitor of the metal foil in logicalnot circuit area method particularly includes: need to subtract
The metal foil in the logicalnot circuit area of erosion is with a thickness of the 100%~120% of the metal foil thickness.
Further, in step s 6, the conventional subsequent processing includes: printing on the fine-line surface
Brush ink, fine-line surface pasting protective film or manufacture multi-panel.
Further, the metal foil is copper foil or aluminium foil.
Further, the metal foil with a thickness of 2~50 μm.
Further, the high molecular polymer substrate is polyimide base film, polyetherimide substrate or polytetrafluoro
Vinyl pieces.
Compared with the prior art, the advantageous effects that the present invention obtains are as follows:
On the one hand, the preparation method of high-copper thicker printed circuit board provided by the present invention, uses in preparation process
A kind of new thought, it may be assumed that the present invention does not use in the manufacturing process of fine-line and covers Copper base material, then in conductivity type gold
The copper route for belonging to the two sides difference tectonic sieving of paillon (such as pure copper foil or aluminium foil etc.), will be non-thread by difference etching process
The complete corrosion inhibitor of the metal foil in road area, the fine-line of the completely new printed circuit board of available one kind.The present invention is prepared
The fine-line of printed circuit board not only there is very high copper wire thickness, but also there is lesser line width/line-spacing, can be with
The copper thickness for meeting route in current PCB well is significantly larger than line width/line-spacing market demand, conforms perfectly to market development and becomes
Gesture.Therefore, the present invention has very high Social benefit and economic benefit in Electronic products manufacturing field.
On the other hand, the preparation method of high-copper thicker printed circuit board provided by the present invention, completely can be using tradition
PCB production line without doing special repacking, may be implemented to produce in batches, used each processing step be it is conventional at
Ripe technique, it is easy to accomplish, therefore, the present invention is conducive to improve production efficiency, helps to control production cost.
Detailed description of the invention
Fig. 1 is the flow diagram of one embodiment of preparation method of high-copper thicker printed circuit board of the present invention.
Fig. 2 is the product knot in the preparation method of high-copper thicker printed circuit board of the present invention before difference etching process
Structure schematic diagram.
Fig. 3 is the fine-line that the preparation method of the high-copper thicker printed circuit board described through the invention is prepared
Structural schematic diagram.
In figure:
1, metal foil；2, prepreg；3, high molecular polymer substrate；4, fine-line；41, metal foil reverse side
Copper line pattern；42, the positive copper line pattern of metal foil；5, logicalnot circuit area.
Specific embodiment
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention.But the present invention can be with
It is different from the other modes of this description much to implement, those skilled in the art can be without violating the connotation of the present invention
Similar popularization is done, therefore the present invention is not limited by following public specific embodiment.
The invention discloses a kind of preparation methods of high-copper thicker printed circuit board, as shown in Figures 1 to 3, including following step
It is rapid:
S1, selection one conductive metal paillon, 1 sawing sheet, and location hole is bored on metal foil 1.
In above-mentioned steps S1, method used in location hole of boring on metal foil 1 is machine drilling or laser drilling
Automated production is realized in hole.Wherein, the effect of location hole is to provide benchmark for subsequent line pattern construction, to guarantee route
Integral manufacturing it is more accurate.In the present invention, location hole can be set as different numbers according to the real area of metal foil 1
Amount, therefore, the various simple changes of the quantity of location hole are equivalent protection range of the invention.
S2, metal foil 1 construct the copper line pattern 41 of design after photic pre-treatment, in 1 reverse side of metal foil.
In above-mentioned steps S2, the sub-step of the copper line pattern 41 of design is constructed in 1 reverse side of metal foil
Specifically include: 1 reverse side of metal foil paste film dry film, exposure-processed, development treatment, using Plasma cleaning process remove it is residual
The film dry film skirt stayed, figure copper plating treatment.Due to constructing each sub-step of the copper line pattern 41 of design
It is the Conventional process steps of PCB industry, details are not described herein.In addition, in step S2, the effect of metal foil 1 be for
The copper line pattern 41 made of its reverse side construction provides the base support of strength.
S3, metal foil 1 and prepreg 2, high molecular polymer substrate 3 successively press together from top to bottom, wherein
1 reverse side of metal foil is towards prepreg 2.
It in above-mentioned steps S3, is acted on by pressing, so that the copper line pattern 41 of 1 reverse side of metal foil is solid by half
Changing piece 2 can be bonded to one with high molecular polymer substrate 3, then high molecular polymer substrate 3 can be with one in following process
Directly the supporting layer as copper route is conducive to so that the line arrangement for the printed circuit board being prepared is more accurate
Improve the quality of product.In the present invention, the thickness of prepreg is selected as 25~500 μm.
S4, the copper line pattern 42 of design, the positive copper route of metal foil 1 are constructed in 1 front of metal foil
The copper line pattern 41 of 1 reverse side of figure 42 and metal foil is completely coincident.
In above-mentioned steps S4, the sub-step of the copper line pattern 42 of design is constructed in 1 front of metal foil
Specifically include: the positive face paste film dry film of metal foil 1, exposure-processed, development treatment, using Plasma cleaning process remove it is residual
The film dry film skirt stayed, figure copper plating treatment.Due to constructing each sub-step of the copper line pattern 42 of design
It is the Conventional process steps of PCB industry, details are not described herein.In addition, in step s 4, due to there is high molecular polymer substrate
Support based on 3 (guarantee the sound construction of copper line pattern 41 of 1 reverse side of metal foil and indeformable), location hole conduct
Benchmark, therefore can construct in the front of metal foil 1 and be completely coincident with the copper line pattern 41 of 1 reverse side of metal foil
The rejection rate of copper line pattern 42, i.e., preparation method according to the present invention, the printed circuit board being prepared can drop
To very low.
S5, pass through difference etching process, by the complete corrosion inhibitor of metal foil 1 in logicalnot circuit area 5, required fine lines are made
Road 4.
In above-mentioned steps S5, by the complete corrosion inhibitor of metal foil 1 in logicalnot circuit area 5 method particularly includes: need the non-of corrosion inhibitor
The metal foil 1 of line areas 5 is with a thickness of the 100%~120% of 1 thickness of metal foil.It, can be by logicalnot circuit area 5 based on this
The metal foil 1 of all remnants all removes the quality for being completely conducive to improve product.
S6, conventional subsequent processing is carried out to fine-line 4, to obtain required printed circuit board.
In above-mentioned steps S6, conventional subsequent processing includes: in 4 surface printing ink of fine-line, in essence
4 surface pasting protective film of fine rule road or manufacture multi-panel.In other words, according to the actual needs, step S5 is prepared fine
Route 4 can carry out following process production by the Conventional processing methods of PCB industry in this step, such as print ink, patch
Protective film, manufacture doubling plate or multi-panel etc..Since the Treatment technique for processing of step S6 is conventional in PCB industry
Mature technology, details are not described herein.
In the present invention, the copper thickness of the copper line pattern 42 constructed in 1 front of metal foil is 4 thickness of fine-line
1/2, the copper line pattern 41 that 1 reverse side of metal foil constructs copper thickness be 4 thickness of fine-line 1/2.More specifically
, in the present invention, 4 thickness of fine-line being prepared (meets up to 20~200 μm, as low as 5~50 μm of route spacing
The copper thickness of route is much higher than line width/line-spacing design requirement), correspondingly, the positive copper line pattern 42 of metal foil 1 and gold
The copper thickness for belonging to the copper line pattern 41 of 1 reverse side of paillon is 10~100 μm, route spacing is 5~50 μm.
In the present invention, metal foil 1 is conductivity type copper foil or conductivity type aluminium foil.Certainly, in the present invention, metal foil
Piece 1 can also be other conductive metal paillons, therefore, the simple change of such as type of metal foil 1 (but must be conductive
Type) it is equivalent protection range of the invention.In addition, the thickness of metal foil 1 is selected at 2~50 μm.
In the present invention, high molecular polymer substrate 3 is polyimide base film, polyetherimide substrate or polytetrafluoroethyl-ne
Alkenyl piece.
Based on above-mentioned preparation method, the present invention is suitable for preparing the fine lines that route copper thickness is 2~6 times of line width/line-spacing
Road, i.e., the copper thickness that the present invention can meet route in current PCB well are significantly larger than line width/line-spacing market demand.
To facilitate a better understanding of the present invention, the present invention is made further followed by a specific embodiment
It is bright.
Embodiment 1
The present embodiment specifically discloses a kind of preparation method of high-copper thicker printed circuit board comprising following steps:
S1, a copper foil (area is 250mm × 250mm, with a thickness of 12 μm) sawing sheet is selected, is existed using the method for laser drill
4 location holes are bored on copper foil.
After photic pre-treatment, first stick film dry film in copper foil reverse side (is with a thickness of 25 μm, analytic ability for S2, copper foil
10 μm), reuse mirror image (wherein minimum feature/line of route that exposure machine exposes the line pattern designed out in copper foil reverse side
Away from being designed as 20/13 μm), development treatment then is carried out to copper foil, is then done the remaining film using Plasma cleaning process
Film skirt eliminates, and finally graphic plating Copper treatment is carried out to copper foil, to plate out the copper line pattern of design in copper foil reverse side.
Since the copper thickness of route in PCB is generally equivalent to the thickness of dry film, line thicknesses are controlled at 25 μm.
The prepreg of S3, copper line pattern 75 μ m-thicks of direction for plating out copper foil reverse side, then by copper foil, semi-solid preparation
Polyimides (PI) substrate that piece and a layer thickness are 50 μm successively presses together from top to bottom.
S4, film dry film (being 10 μm with a thickness of 25 μm, analytic ability) is sticked in copper foil front, then as step S2
It is successively exposed (wherein the minimum feature of route/line-spacing same design be 20/13 μm), development treatment, clear using Plasma
Technique removal remaining film dry film skirt and graphic plating Copper treatment are washed, to plate out the copper of design in copper foil front
Line pattern, line thicknesses are equally controlled at 25 μm.Wherein, two copper line patterns of metal foil positive and negative are completely heavy
It closes.
S5, the product for obtaining step S4 carry out difference etching process, and the complete corrosion inhibitor of the copper foil in logicalnot circuit area (is subtracted copper
Thickness control is 12~13 μm), after the completion of subtracting copper, obtain required fine-line.Wherein, the minimum feature of fine-line/
Line-spacing is 20/13 μm, and the copper thickness of route is 50 μm.
S6, the ink for being 55 μm in fine-line surface printing a layer thickness, obtain final printed circuit board (PCB).
The preparation method of high-copper thicker printed circuit board provided by the invention successively constructs respectively in the two sides of metal foil
Then the copper route of design passes through difference etching process for the complete corrosion inhibitor of the metal foil in logicalnot circuit area, resulting fine lines
Road also has lesser line width/line-spacing while copper wire thickness is significantly improved, and complies fully with smart in current PCB industry
The copper thickness of fine rule road is much higher than the market demand of line width line-spacing, in automobile electronics, camera lens anti-shaking module product and miniature
There is very high market value in the manufacturings such as inductance component.
The preferred embodiment of the present invention has been described in detail above, it should be understood that those skilled in the art without
It needs creative work according to the present invention can conceive and makes many modifications and variations.Therefore, all technologies in the art
Personnel pass through logic analysis, reasoning or available according to limited experiment according to present inventive concept in prior art basis
Technical solution, should be among protection scope determined by the claims.
Claims (8)
1. a kind of preparation method of high-copper thicker printed circuit board, which comprises the following steps:
S1, one conductive metal paillon sawing sheet of selection, and location hole is bored on the metal foil；
S2, the metal foil construct the copper line pattern of design after photic pre-treatment, in the metal foil reverse side；
In step s 2, the sub-step that the copper line pattern of design is constructed in the metal foil reverse side specifically includes:
Metal foil reverse side patch film dry film, development treatment, using Plasma cleaning process removes the remaining film at exposure-processed
Dry film skirt, figure copper plating treatment；
S3, the metal foil and prepreg, high molecular polymer substrate successively press together from top to bottom, wherein described
Metal foil reverse side is towards the prepreg；
S4, the copper line pattern of design, the positive copper of metal foil are constructed in the metal foil front
The copper line pattern of line pattern and the metal foil reverse side is completely coincident；In step s 4, in the metal foil
The sub-step that piece front constructs the copper line pattern of design specifically includes: dry in the positive face paste film of the metal foil
Film, exposure-processed, development treatment, using Plasma cleaning process remove remaining film dry film skirt, figure copper plating treatment；
S5, pass through difference etching process, by the complete corrosion inhibitor of the metal foil in logicalnot circuit area, required fine lines are made
Road；
S6, conventional subsequent processing is carried out to the fine-line, to obtain required printed circuit board.
2. the preparation method of high-copper thicker printed circuit board according to claim 1, it is characterised in that: in the metal foil
The copper thickness for the copper line pattern that piece front constructs is the 1/2 of the fine-line thickness；It is anti-in the metal foil
The copper thickness for the copper line pattern that surface construction goes out is the 1/2 of the fine-line thickness.
3. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, it is characterised in that: in step S1
In, method used in location hole of boring on the metal foil is machine drilling or laser drill.
4. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, which is characterized in that in step S5
In, by the complete corrosion inhibitor of the metal foil in logicalnot circuit area method particularly includes: need the metal foil in the logicalnot circuit area of corrosion inhibitor
Piece is with a thickness of the 100%~120% of the metal foil thickness.
5. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, which is characterized in that in step S6
In, the conventional subsequent processing includes: in the fine-line surface printing ink, on the fine-line surface
Pasting protective film or manufacture multi-panel.
6. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, it is characterised in that: the metal
Paillon is copper foil or aluminium foil.
7. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, it is characterised in that: the metal
Paillon with a thickness of 2~50 μm.
8. the preparation method of high-copper thicker printed circuit board according to claim 1 or 2, it is characterised in that: the high score
Sub- polymer matrix film is polyimide base film, polyetherimide substrate or teflon substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610382648.9A CN105960102B (en) | 2016-05-31 | 2016-05-31 | A kind of preparation method of high-copper thicker printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610382648.9A CN105960102B (en) | 2016-05-31 | 2016-05-31 | A kind of preparation method of high-copper thicker printed circuit board |
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| CN105960102A CN105960102A (en) | 2016-09-21 |
| CN105960102B true CN105960102B (en) | 2019-03-29 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533741A (en) * | 2013-10-29 | 2014-01-22 | 景旺电子科技(龙川)有限公司 | Double-side thick copper plate and manufacturing method thereof |
| CN104582292A (en) * | 2013-10-18 | 2015-04-29 | 深南电路有限公司 | Thick copper circuit board processing method |
-
2016
- 2016-05-31 CN CN201610382648.9A patent/CN105960102B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582292A (en) * | 2013-10-18 | 2015-04-29 | 深南电路有限公司 | Thick copper circuit board processing method |
| CN103533741A (en) * | 2013-10-29 | 2014-01-22 | 景旺电子科技(龙川)有限公司 | Double-side thick copper plate and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 电镀式半加成法制作精细线路的研究;陈苑明 等;《电镀与精饰》;20120731(第7期);第5-13页 |
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