CN105643711A - Backdrill method for PCB and drilling machine - Google Patents
Backdrill method for PCB and drilling machine Download PDFInfo
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- CN105643711A CN105643711A CN201410727959.5A CN201410727959A CN105643711A CN 105643711 A CN105643711 A CN 105643711A CN 201410727959 A CN201410727959 A CN 201410727959A CN 105643711 A CN105643711 A CN 105643711A
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Abstract
The invention provides a backdrill method for a PCB and a drilling machine. The backdrill method for the PCB comprises the steps that the PCB is located on a machine table of the drilling machine, and the actual thickness H1 of the PCB is measured; the actual drilling control depth H of the PCB is determined according to the actual thickness H1, theoretical thickness H2 and theoretical drilling control depth H3 of the PCB; and the drilling machine controls a drill bit to drill into the PBC according to the determined actual drilling control depth H of the PCB. According to the backdrill method for the PCB, operation is easy and convenient, the drilling depth is precise, and efficiency is high; and the quantity of stub residues can be effectively controlled, and stub residues are prevented from being too long or too short so that the problems that a signal is reflected, scattered, delayed and the like in the transmission process due to the fact that the stub residues are too long or too short can be eliminated, and therefore signal distortion is avoided.
Description
Technical field
The present invention relates to PCB and manufacture field, more specifically, it relates to the back drilling method of a kind of PCB and a kind of rig.
Background technology
At present in PCB (printed-wiring board (PWB)) making processes, the effect of back drill technique (backdrill) is got rid of by the through hole sector hole copper not playing any connection or transmitting effect, cause signal in transmitting procedure because reflecting to avoid this part metals residual (that is: residual stake, be called for short " stub "), scattering, delay etc. and finally cause signal " distortion ". Therefore, in the process quality control of back drill technique, back drill severity control is the key factor affecting signal integrity, like this, just the back drill degree of depth must be carried out effective management and control in actual production.
Owing to the thickness of current PCB back drill classification product is more and more thicker, (plate is thick reaches more than 3.0mm, severity control becomes the thick limit of nearly plate), the thick homogeneity of force fit plate of high multi-ply wood (one of PCB) controls usually in the limit of error of 5%��10%, the thick extreme difference of the plate of whole plate (thickest point-the thinnest point) is 0.15��0.3mm, for the control accuracy of the Z direction of principal axis (vertical direction) of back drill machine platform (depth accuracy of machine platform Z axle is controlled to �� 2mil), the thick impact of the precision on severity control of its plate is essential factor. the method of control drilling depth precision main at present is bored (that is: back drill) front making section (edges of boards coupon position or get local figure in plate) and confirm whether the degree of depth and the number of plies reach engineering setting requirement batch control is dark, and depth data when relying on these data to adjust batch making, the degree of depth of same specification can only be set to fixed value in whole brill plate makes, the problem that severity control is affected by the thick extreme difference of plate cannot be avoided substantially, therefore cause the situation of degree of depth ultra-specification very common in actual production process, simultaneously for the problem of the thick homogeneity of plate, also the local technologic improvement progressively thick homogeneity of riser can only be done, and this problem cannot be eradicated, seriously hinder the development of PCB industry.
Summary of the invention
The present invention is intended to one of technical problem at least solving existence in prior art.
For this reason, the present invention provides the back drilling method of a kind of easy and simple to handle, drilling depth PCB accurately, can effectively control stub and remain surplus, prevent stub and remained long or too short problem, with ensure that PCB on Signal transmissions better reliability.
The embodiment of first aspect present invention provides the back drilling method of a kind of PCB, comprising:
Described PCB is positioned on the machine platform of rig and measures the actual (real) thickness H of described PCB1;
Actual (real) thickness H according to described PCB1, theoretical thickness H2With theory boring control depth H3, determine the actual boring control depth H of described PCB;
Actual boring control depth H according to the described PCB determined, described PCB is holed by described drill control drill bit.
The back drilling method of PCB provided by the invention, easy and simple to handle, drilling depth is precisely and efficiency height, can effectively control stub and remain surplus, prevent stub from remaining long or too short, caused signal to reflect in transmitting procedure to eliminate because stub remained long or too short, scattering, the problem such as delay, thus avoid signal " distortion ".
The back drilling method of PCB provided by the invention, the thick homogeneity of dynamic compensation plate is brought under existing production model thickness (or the degree of depth, highly) error, the severity control precision of (PCB control is dark bores) rig can be effectively promoted under the prerequisite of guaranteed efficiency, also just be equivalent to improve the working accuracy holed so that the quality (that is: reliability) of product effectively promotes.
According to one embodiment of present invention, the actual boring control depth H of described PCB is according to formula H=H3+H1-H2Draw.
According to one embodiment of present invention, the actual boring control depth H of described PCB is according to formula H=H3*H1/H2Draw.
According to one embodiment of present invention, the actual (real) thickness H of the described PCB recorded1For the thickness of position hole to be drilled on described PCB.
According to one embodiment of present invention, laser measurement module is adopted to measure the actual (real) thickness H of described PCB1��
According to one embodiment of present invention, described laser measurement module is fixed on the drill bit of described rig, and the transmitting end of described laser measurement module is towards described PCB.
According to one embodiment of present invention, described PCB is fixed on the upper table surface of described machine platform by mushroom head, and the light of the transmitting end transmitting of described laser measurement module is perpendicular to the upper table surface of described machine platform.
The embodiment of second aspect present invention provides a kind of rig, comprising: machine platform, and PCB is positioned on described machine platform; Drill bit, is arranged on the top of described machine platform and described PCB, for being holed by described PCB; With measurement module, it is arranged on the top of described machine platform and described PCB, for measuring the thickness of described PCB; Wherein, described rig adopts the back drilling method of the PCB described in above-mentioned any embodiment to be holed by described PCB.
Rig provided by the invention, structure is simple, drilling depth is accurate, meets the boring requirement of PCB better so that the performance of the product made is promoted.
According to one embodiment of present invention, described rig also comprises: backing plate, is fixed on the upper table surface of described machine platform, and described PCB is positioned on the upper face of described backing plate; Metal cover board, is arranged on the upper face of described PCB; With mushroom head, it is fixed on the upper table surface of described machine platform, and its upper end compresses the upper face of described metal cover board; Wherein, described metal cover board, described mushroom head, described drill bit and the electrical connection of described measurement module.
According to one embodiment of present invention, described measurement module is laser measurement module.
In sum, the back drilling method of PCB provided by the invention, the thick homogeneity of dynamic compensation plate is brought under existing production model thickness (or the degree of depth, highly) error, the severity control precision of (PCB control is dark bores) rig can be effectively promoted under the prerequisite of guaranteed efficiency, also just be equivalent to improve the working accuracy holed so that the quality (that is: reliability) of product effectively promotes.
The additional aspect of the present invention and advantage become obvious by description part below, or are recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage from accompanying drawing below combining to the description of embodiment becoming obviously and it should be readily understood that wherein:
Fig. 1 is the schema of a back drilling method embodiment of PCB of the present invention;
Fig. 2 is the local structure cross-sectional schematic of a rig embodiment of the present invention.
Wherein, in Fig. 1 and Fig. 2 Reference numeral and name of parts be referred to as between corresponding relation be:
1 machine platform, 2 drill bits, 3 backing plates, 4 metal cover boards, 5 mushroom heads, 61 laser ranging devices, 62 data handlers, 7 Controlling System, 8CBD module, 9PCB.
Embodiment
In order to more clearly understand above-mentioned purpose, the feature and advantage of the present invention, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail. It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understanding the present invention; but; the present invention can also adopt other to be different from mode described here to implement, and therefore, protection scope of the present invention is by the restriction of following public specific embodiment.
The embodiment of first aspect present invention provides the back drilling method of a kind of PCB, as shown in Figure 1, comprising:
102, described PCB is positioned on the machine platform of rig and measures the actual (real) thickness H of described PCB1;
104, according to the actual (real) thickness H of described PCB1, theoretical thickness H2With theory boring control depth H3, determine the actual boring control depth H of described PCB;
106, according to the actual boring of the described PCB determined control depth H, described PCB is holed by described drill control drill bit.
The back drilling method of PCB provided by the invention, easy and simple to handle, drilling depth is precisely and efficiency height, can effectively control stub and remain surplus, prevent stub from remaining long or too short, caused signal to reflect in transmitting procedure to eliminate because stub remained long or too short, scattering, the problem such as delay, thus avoid signal " distortion ".
The back drilling method of PCB provided by the invention, the thick homogeneity of dynamic compensation plate is brought under existing production model thickness (or the degree of depth, highly) error, the severity control precision of (PCB control is dark bores) rig can be effectively promoted under the prerequisite of guaranteed efficiency, also just be equivalent to improve the working accuracy holed so that the quality (that is: reliability) of product effectively promotes.
In one embodiment of the present of invention, the actual boring control depth H of described PCB is according to formula H=H3+H1-H2Draw.
According to one embodiment of present invention, the actual boring control depth H of described PCB is according to formula H=H3*H1/H2Draw.
Certainly, above-described embodiment can also be: the actual (real) thickness H of the described PCB recorded1For the thickness of position hole to be drilled on described PCB.
Above-mentioned two kinds of bore modes, can all carry out the actual (real) thickness H1 of one-shot measurement PCB when boring every time and Equivalent Conversion becomes actual boring control depth H; Can also compensate and realize (that is: each region carry out the actual (real) thickness H1 of one-shot measurement PCB and Equivalent Conversion becomes actual boring control depth H) etc. in subregion on (PCB) plate face, can determine according to product specific requirement, and eventually through software kit subcontrol to calculate actual boring control depth H, this process does not affect the working (machining) efficiency of rig, meets the demand of enterprise better.
Wherein, laser measurement module is adopted to measure the actual (real) thickness H of described PCB1��
It is specially: optically focused is measured module and is positioned at the setting position above machine platform, and just to the upper table surface of machine platform, measure the distance of the upper table surface of distance machine platform, then, PCB (keeping flat) is fixed on the upper table surface of machine platform, measure the distance of distance PCB upper face, obtained the plate thickness of the PCB of surveyed position by the difference of two distances.
Preferably, described laser measurement module is fixed on the drill bit of described rig, and the transmitting end of described laser measurement module is towards described PCB, and such laser measurement module just can move along with head, is convenient to the plate thickness to different positions on PCB and measures.
Certainly, laser measurement module also can be fixed on other suitable positions (can realize measuring), it is possible to realizes the object of the application, and its objective entrusts the design philosophy from the present invention, should belong to the object of the application.
Preferably, described PCB is fixed on the upper table surface of described machine platform by mushroom head, and the light of the transmitting end transmitting of described laser measurement module is perpendicular to the upper table surface of described machine platform.
Certainly, it is also possible to select other parts to be fixed by PCB, such as screw, spacing card etc., all can realizing the object of the application, its objective does not depart from the design philosophy of the present invention, should belong in the protection domain of the application.
Wherein, laser measurement module comprises laser ranging device and data handler, and laser ranging device is fixed on described drill bit, and is electrically connected with described rig by described data handler.
The embodiment of second aspect present invention provides a kind of rig, as shown in Figure 2, comprising: machine platform 1, PCB9 is positioned on described machine platform 1; Drill bit 2, is arranged on the top of described machine platform 1 and described PCB9, for being holed by described PCB9; With measurement module, it is arranged on the top of described machine platform 1 and described PCB9, for measuring the thickness of described PCB9; Wherein, described rig adopts the back drilling method of the PCB described in above-mentioned any embodiment to be holed by described PCB9.
Rig provided by the invention, structure is simple, drilling depth is accurate, meets the boring requirement of PCB9 better so that the performance of the product made is promoted.
Preferably, described rig also comprises: backing plate 3, is fixed on the upper table surface of described machine platform 1, and described PCB9 is positioned on the upper face of described backing plate 3; Metal cover board 4, is arranged on the upper face of described PCB9; With mushroom 5, it is fixed on the upper table surface of described machine platform 1, and its upper end compresses the upper face of described metal cover board 4; Wherein, described metal cover board 4, described mushroom 5, described drill bit 2 and the electrical connection of described measurement module.
When drill bit 2 contacts with metal cover board 4, rig 2 and metal cover board 4 circuit turn-on on rig, now generates the signal of circuit turn-on on motor, now, can control described drill bit and start boring (degree of depth namely holed is H).
Wherein, described measurement module is laser measurement module.
Specifically, described laser measurement module comprises laser ranging device 61 and data handler 62, and laser ranging device 61 is fixed on described drill bit 2 and is electrically connected with described rig by described data handler 62.
On rig, the circuit connecting relation of each parts is: drill bit 2 is connected with the Controlling System 7 of rig by CBD module 8; Laser ranging device 61 is connected with the Controlling System 7 of rig by data handler 62;Mushroom 5 is also connected with the Controlling System 7 of rig.
Wherein, CBD module 8 and data handler 62 can also be made into one with Controlling System 7; Or Controlling System 7 possesses the function (to substitute CBD module 8 and data handler 62) of CBD module 8 and data handler 62; all can realize the object of the application; its objective does not depart from the design philosophy of the present invention, should belong to the protection domain of the application.
In sum, the back drilling method of PCB provided by the invention, the thick homogeneity of dynamic compensation plate is brought under existing production model thickness (or the degree of depth, highly) error, the severity control precision of (PCB control is dark bores) rig can be effectively promoted under the prerequisite of guaranteed efficiency, also just be equivalent to improve the working accuracy holed so that the quality (that is: reliability) of product effectively promotes.
In describing the invention, term " installation ", " being connected ", " connection ", " fixing " etc. all should be interpreted broadly, and such as, " connection " can be fixedly connected with, it is also possible to is removably connect, or connects integratedly; Can be directly be connected, it is also possible to be indirectly connected by intermediary. For the ordinary skill in the art, it is possible to understand above-mentioned term concrete implication in the present invention according to particular case.
In the description of this specification sheets, at least one embodiment that the description of term " embodiment " etc. means to be contained in the present invention in conjunction with concrete feature, structure, material or feature that this embodiment or example describe or example. In this manual, the schematic representation of above-mentioned term is not necessarily referred to identical embodiment or example. And, the concrete feature of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations. Within the spirit and principles in the present invention all, any amendment of doing, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the back drilling method of a PCB, it is characterised in that, comprising:
Described PCB is positioned on the machine platform of rig and measures the actual (real) thickness H of described PCB1;
Actual (real) thickness H according to described PCB1, theoretical thickness H2With theory boring control depth H3, determine the actual boring control depth H of described PCB;
Actual boring control depth H according to the described PCB determined, described PCB is holed by described drill control drill bit.
2. the back drilling method of PCB according to claim 1, it is characterised in that,
The actual boring control depth H of described PCB is according to formula H=H3+H1-H2Draw.
3. the back drilling method of described PCB according to claim 1, it is characterised in that,
The actual boring control depth H of described PCB is according to formula H=H3*H1/H2Draw.
4. the back drilling method of PCB according to any one of claim 1 to 3, it is characterised in that,
The actual (real) thickness H1 of the described PCB recorded is the thickness of position hole to be drilled on described PCB.
5. the back drilling method of PCB according to claim 4, it is characterised in that,
Laser measurement module is adopted to measure the actual (real) thickness H of described PCB1��
6. the back drilling method of PCB according to claim 5, it is characterised in that,
Described laser measurement module is fixed on the drill bit of described rig, and the transmitting end of described laser measurement module is towards described PCB.
7. the back drilling method of PCB according to claim 6, it is characterised in that,
Described PCB is fixed on the upper table surface of described machine platform by mushroom head, and the light of the transmitting end transmitting of described laser measurement module is perpendicular to the upper table surface of described machine platform.
8. a rig, it is characterised in that, comprising:
Machine platform, PCB is positioned on described machine platform;
Drill bit, is arranged on the top of described machine platform and described PCB, for being holed by described PCB; With
Measure module, it is arranged on the top of described machine platform and described PCB, for measuring the thickness of described PCB;
Wherein, described rig adopt the back drilling method of PCB as according to any one of claim 1 to 7 to as described in PCB hole.
9. rig according to claim 8, it is characterised in that, also comprise:
Backing plate, is fixed on the upper table surface of described machine platform, and described PCB is positioned on the upper face of described backing plate;
Metal cover board, is arranged on the upper face of described PCB; With
Mushroom head, is fixed on the upper table surface of described machine platform, and its upper end compresses the upper face of described metal cover board;
Wherein, described metal cover board, described mushroom head, described drill bit and the electrical connection of described measurement module.
10. rig according to claim 9, it is characterised in that,
Described measurement module is laser measurement module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410727959.5A CN105643711A (en) | 2014-12-03 | 2014-12-03 | Backdrill method for PCB and drilling machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410727959.5A CN105643711A (en) | 2014-12-03 | 2014-12-03 | Backdrill method for PCB and drilling machine |
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| CN105643711A true CN105643711A (en) | 2016-06-08 |
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| CN201410727959.5A Pending CN105643711A (en) | 2014-12-03 | 2014-12-03 | Backdrill method for PCB and drilling machine |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105430913A (en) * | 2015-11-30 | 2016-03-23 | 重庆方正高密电子有限公司 | Drilling method for printed circuit board |
| CN105973177A (en) * | 2016-07-15 | 2016-09-28 | 广州兴森快捷电路科技有限公司 | Back drill stump nondestructive detection method and PCB nondestructive detection method |
| CN106304654A (en) * | 2016-11-01 | 2017-01-04 | 生益电子股份有限公司 | A kind of method promoting back drill STUB precision and the PCB of employing the method |
| CN106851989A (en) * | 2017-03-20 | 2017-06-13 | 汕头超声印制板（二厂）有限公司 | It is a kind of to leak the heavy processing method for boring backboard |
| CN109640528A (en) * | 2018-12-28 | 2019-04-16 | 郑州云海信息技术有限公司 | A method of improving PCB back drill precision |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
| CN110017804A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of thickness measurement system of PCB |
| CN112492759A (en) * | 2020-12-01 | 2021-03-12 | 维嘉数控科技（苏州）有限公司 | Back drilling processing method and drilling system for circuit board |
| CN112536923A (en) * | 2020-11-11 | 2021-03-23 | 东莞市盛雄激光先进装备股份有限公司 | Precision punching equipment and method |
| CN113079640A (en) * | 2021-02-01 | 2021-07-06 | 广州广合科技股份有限公司 | Method for determining back drilling depth of printed circuit board |
| CN113111292A (en) * | 2021-03-01 | 2021-07-13 | 广州广合科技股份有限公司 | Method for automatically calculating back drilling depth, electronic equipment and storage medium |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430913A (en) * | 2015-11-30 | 2016-03-23 | 重庆方正高密电子有限公司 | Drilling method for printed circuit board |
| CN105973177B (en) * | 2016-07-15 | 2019-07-12 | 广州兴森快捷电路科技有限公司 | A kind of lossless detection method and PCB lossless detection method of back drill stub |
| CN105973177A (en) * | 2016-07-15 | 2016-09-28 | 广州兴森快捷电路科技有限公司 | Back drill stump nondestructive detection method and PCB nondestructive detection method |
| CN106304654A (en) * | 2016-11-01 | 2017-01-04 | 生益电子股份有限公司 | A kind of method promoting back drill STUB precision and the PCB of employing the method |
| CN106304654B (en) * | 2016-11-01 | 2019-03-05 | 生益电子股份有限公司 | A kind of method promoting back drill STUB precision and the PCB using this method |
| CN106851989A (en) * | 2017-03-20 | 2017-06-13 | 汕头超声印制板（二厂）有限公司 | It is a kind of to leak the heavy processing method for boring backboard |
| CN110022648A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of back drilling method and system of PCB |
| CN110017804A (en) * | 2018-01-08 | 2019-07-16 | 深南电路股份有限公司 | A kind of thickness measurement system of PCB |
| CN109640528A (en) * | 2018-12-28 | 2019-04-16 | 郑州云海信息技术有限公司 | A method of improving PCB back drill precision |
| CN109640528B (en) * | 2018-12-28 | 2021-05-25 | 郑州云海信息技术有限公司 | Method for improving PCB back drilling precision |
| CN112536923A (en) * | 2020-11-11 | 2021-03-23 | 东莞市盛雄激光先进装备股份有限公司 | Precision punching equipment and method |
| CN112492759A (en) * | 2020-12-01 | 2021-03-12 | 维嘉数控科技（苏州）有限公司 | Back drilling processing method and drilling system for circuit board |
| CN113079640A (en) * | 2021-02-01 | 2021-07-06 | 广州广合科技股份有限公司 | Method for determining back drilling depth of printed circuit board |
| CN113079640B (en) * | 2021-02-01 | 2022-05-13 | 广州广合科技股份有限公司 | Method for determining back drilling depth of printed circuit board |
| CN113111292A (en) * | 2021-03-01 | 2021-07-13 | 广州广合科技股份有限公司 | Method for automatically calculating back drilling depth, electronic equipment and storage medium |
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Application publication date: 20160608 |
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