CN105973177B - A kind of lossless detection method and PCB lossless detection method of back drill stub - Google Patents
A kind of lossless detection method and PCB lossless detection method of back drill stub Download PDFInfo
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- CN105973177B CN105973177B CN201610564812.8A CN201610564812A CN105973177B CN 105973177 B CN105973177 B CN 105973177B CN 201610564812 A CN201610564812 A CN 201610564812A CN 105973177 B CN105973177 B CN 105973177B
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- back drill
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Drilling And Boring (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
Abstract
The invention discloses a kind of lossless detection methods of back drill stub, comprising the following steps: S1, the hole center position O corresponding to the surface layer PCB for determining back drill hole to be detected；S2, the alignment lens position O by ultrasonic scanner；S3, control ultrasonic scanner are scanned back drill hole to be detected, are taken up an official post the meaning one measurement point and surface layer PCB distance H1 with obtaining the nonmetallic hole bottom face in back drill hole to be detected；S4, control ultrasonic scanner are scanned back drill hole to be detected periphery, to obtain pad and the surface layer PCB distance H2；S5, stub length H, i.e. H=H2-H1 are calculated according to distance H1 and distance H2；S6, as 0≤H≤m, be judged as that stub length H is not exceeded, as H > m, be judged as that stub length H is exceeded, the m is default stub length.The present invention quickly can accurately detect stub length.The invention also discloses a kind of PCB lossless detection methods, can carry out quality monitoring to PCB.
Description
Technical field
The present invention relates to the lossless detection methods and the non-destructive testing side PCB of detection method more particularly to a kind of back drill stub
Method.
Background technique
Consider processing cost and signal transmission effect, mostly uses back drill technology at present to improve the transmission matter of high speed signal
Amount.Back drill is using the processing of the deep-controlled function realization via hole of drilling machine, i.e., by control drill along the lower brill of via hole axial direction, directly
It is approached to drill point of a knife or just gets into unique pad in via hole and (be located on lower brill cut-off destination layer) surface, to remove
Useless metal bore portion in hole, so that the back drill hole 1 formed is made of metal aperture 12 and 11 two parts of nonmetallic hole, such as Fig. 1
It is shown.
In current back drill technology, since the drill of use is with the point of a knife of different cone angle and used equipment
Precision is not high, therefore, after lower brill, is difficult the destination layer for getting into drill just where pad 3, and makes nonmetallic hole 11 and weldering
Still there are the useless metal apertures in part between disk 3, and the useless metal bore portion not removed will form stub, which can shadow
Through hole impedance is rung, and its longer influence to through hole impedance of stub length is more significant, therefore, it is necessary in the premise for not damaging via hole
Under the stub length after back drill is detected, in order to monitor back drill quality and be adjusted to technological parameter.In addition, existing
It is usually that slicing treatment is carried out to the PCB where back drill hole in the detection method of stub length, in a manner of damaging back drill hole pair
Stub length is directly measured, to cause very big waste, and is also difficult to realize and is carried out entirely to back drills all on PCB hole
Measurement.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide a kind of non-destructive testings of back drill stub
Method whether exceeded to stub length can carry out quickly accurate detection, and not will cause damage to PCB；The purpose of the present invention
Two be to provide a kind of lossless detection method that can be detected to the stub length in all back drill holes on PCB.
An object of the present invention is implemented with the following technical solutions:
A kind of lossless detection method of back drill stub, comprising the following steps:
S1, the hole center position O corresponding to the surface layer PCB for determining back drill hole to be detected；
S2, the alignment lens position O by ultrasonic scanner；
S3, control ultrasonic scanner are scanned back drill hole to be detected, to obtain the nonmetallic of back drill hole to be detected
Hole bottom face is taken up an official post the meaning one measurement point and surface layer PCB distance H1；
S4, control ultrasonic scanner are scanned back drill hole to be detected periphery, with obtain pad and the surface layer PCB away from
From H2；
S5, stub length H, i.e. H=H2-H1 are calculated according to distance H1 and distance H2；
S6, as 0≤H≤m, be judged as that stub length H is not exceeded, as H > m, be judged as that stub length H is exceeded,
In, the m is default stub length.
Preferably, the nonmetallic hole bottom face in the back drill hole to be detected of the lossless detection method of above-mentioned a kind of back drill stub
Any point of inner edge is chosen as the measurement point.
Preferably, a kind of bond pad surface of the lossless detection method of above-mentioned back drill stub in step s 4, which is chosen, a little makees
For the first test point, first test point is on the extended line of the measurement point and the back drill hole line of centres, first test point
It is pad and the surface layer PCB distance H2 at a distance from the surface layer PCB.
Preferably, a kind of measuring point of the lossless detection method of above-mentioned back drill stub includes being located at back to be detected
Four quadrantal points of the nonmetallic hole bottom face inner edge of drilling, all quadrants point with the surface layer PCB at a distance from for the measuring point and
The distance H1 on the surface layer PCB.
Preferably, a kind of bond pad surface of the lossless detection method of above-mentioned back drill stub in step s 4 chooses four points
Respectively as the second test point, which corresponds with four quadrantal points respectively, and in corresponding quadrantal points
On the extended line of the back drill hole line of centres, each second test point is pad at a distance from the surface layer PCB at a distance from the surface layer PCB
H2。
Preferably, a kind of lossless detection method of above-mentioned back drill stub is not when stub length H is exceeded, ultrasonic scanning
Instrument is not alarmed；When stub length H is exceeded, ultrasonic scanner alarm.
The second object of the present invention is implemented with the following technical solutions:
A kind of PCB lossless detection method, comprising the following steps:
Z1, the scan path for determining ultrasonic scanner；
Z2, the camera lens for controlling ultrasonic scanner successively detect each back drill hole according to scan path, the detection side
Method uses the lossless detection method in back drill hole as claimed in any one of claims 1 to 6.
Compared with prior art, the beneficial effects of the present invention are:
A kind of lossless detection method of stub length of the invention is to be checked by the camera lens rapid alignment of ultrasonic scanner
Survey hole center position O corresponding to the surface layer PCB in back drill hole, and the nonmetallic hole bottom face by detecting back drill hole to be detected
Measuring point and the surface layer PCB distance H1 and pad and the surface layer PCB distance H2, pass through calculate distance H2 and distance H1
Difference to obtain stub length H, and it is long so as to the measured stub of quickly accurate detection according to the stub length m of setting
Whether degree is exceeded, and will not cause to damage to PCB.
A kind of PCB lossless detection method of the invention then can be according to the drilling sequences in the back drill hole on PCB one by one to PCB
On the stub length in all back drill holes carry out quickly accurate detection, and PCB will not be damaged, to carry out to PCB mass fine
Ground monitoring.
Detailed description of the invention
Fig. 1 is the cross-sectional view in the back drill hole that the present invention uses；
Fig. 2 is the schematic diagram that the present invention chooses test point and measuring point；
In figure: 1, back drill hole；11, nonmetallic hole；12, metal aperture；2, stub；3, pad；4, quadrantal points；5, the second test
Point.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention:
Referring to Figure 1 and Fig. 2, a kind of lossless detection method of back drill stub 2, comprising the following steps:
S1, the hole center position O corresponding to the surface layer PCB for determining back drill hole 1 to be detected, position O can be from production
It is obtained in the engineering datas such as used design drawing or CAM data when PCB, specific position O is in the two dimension where the surface layer PCB
A corresponding coordinate in plane；
S2, the alignment lens position O by ultrasonic scanner can input the corresponding coordinate of position O super during being somebody's turn to do
Ultra sonic scanner instrument, the camera lens for directly controlling ultrasonic scanner reaches designated position, to improve working efficiency and detection accuracy；
S3, after the alignment lens position O of ultrasonic scanner, control ultrasonic scanner to back drill hole 1 to be detected into
Row scans, any one measurement point and the surface layer PCB distance H1 on 11 bottom face of nonmetallic hole to obtain back drill hole 1 to be detected,
Wherein nonmetallic 11 bottom faces of hole, that is, stub, 2 top, correspondingly, distance H1 is also 1 top of stub at a distance from the surface layer PCB；
S4, control ultrasonic scanner are scanned 1 periphery of back drill hole to be detected, to obtain pad 3 and the surface layer PCB
Distance H2；
In above-mentioned steps S3 and S4, due to using ultrasonic scanner, which can be on the basis of lossless to multiple
The structure of condensation material, underbead crack damage carry out position, the measurement of size and 3D visual analyzing.Therefore in the detection process not
The surface layer PCB and internal layer can be caused to damage.
S5,2 length H of stub, i.e. H=H2-H1 are calculated according to distance H1 and distance H2；
S6, judge whether 2 length H of stub is exceeded, i.e., as 0≤H≤m, 2 length H of stub is not exceeded, and ultrasonic wave is swept at this time
Instrument is retouched not alarm；As H > m, 2 length H of stub is exceeded, and ultrasonic scanner is alarmed at this time, to remind staff in time；Institute
Stating m is default 2 length of stub.Consider overall cost, requirement of each producer to 2 length of PCB stub is different, therefore, presets residual
2 length m of stake can be set according to specific needs, to meet different manufacturers to the testing requirements of 2 length H of stub.And by above-mentioned
Each step whether exceeded to 2 length of stub can carry out quickly accurate detection, and not will cause damage to PCB.
It can be any one of 1 bottom face inner edge of back drill hole to be detected by the measuring point to improve detection accuracy
Point A is selected as test point.Further, can also 3 surface of pad in step s 4 choose and be a little used as the first test point, and make
First test point is on the extended line of the measurement point and the back drill hole line of centres, and first test point and the surface layer PCB
The distance as surface layer pad 3 and PCB distance H2.
And in order to further increase detection accuracy, the different parts of the same 1 bottom face inner edge of back drill hole can be carried out
Repeatedly measurement, making the measuring point as a preferred embodiment, in the present embodiment includes the non-gold positioned at back drill hole 1 to be detected
Belong to four quadrantal points 4 of 11 bottom face inner edge of hole, and all quadrants point 4 is the measuring point and PCB table at a distance from the surface layer PCB
The distance H1 of layer.Further, 3 surface of pad in step s 4 chooses at four o'clock respectively as the second test point 5, this second
Test point 5 is corresponded with four quadrantal points 4 respectively, and in the extension of corresponding quadrantal points 4 and the back drill hole line of centres
It is the surface layer pad 3 and PCB distance H2 at a distance from each surface layer second test point 5 and PCB on line.
A kind of PCB lossless detection method, comprising the following steps:
Z1, the scan path for determining ultrasonic scanner, in order to improve efficiency, scan path in the present embodiment can be from
It is obtained in above-mentioned engineering data, it is consistent with the drilling sequences in back drill each on PCB hole, naturally it is also possible to set by other means；
Z2, the camera lens for controlling ultrasonic scanner successively detect each back drill hole 1 according to drilling sequences, the detection side
Method uses the lossless detection method in back drill hole 1 as claimed in any one of claims 1 to 6.
Above-mentioned PCB lossless detection method can be such that ultrasonic scanner disposably carries out to all back drill holes 1 on PCB
Non-destructive testing, so that the quality to PCB is monitored well.And it is each in the operating path and engineering data of ultrasonic scanner
The drilling sequences in back drill hole 1 are corresponding, and the camera lens of ultrasonic scanner is positioned with the hole center in each back drill hole 1 on the surface layer PCB
Subject to position, therefore easily ultrasonic scanner can be configured, and guarantee all back drill holes 1 on PCB all
It can detect.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection scope of the claims in the present invention
Within.
Claims (5)
1. a kind of lossless detection method of back drill stub, which comprises the following steps:
S1, the hole center position O corresponding to the surface layer PCB for determining back drill hole to be detected；
S2, the alignment lens position O by ultrasonic scanner；
S3, control ultrasonic scanner are scanned back drill hole to be detected, to obtain the nonmetallic bottom hole in back drill hole to be detected
Any one measurement point and the surface layer PCB distance H1 on end face, measuring point include the nonmetallic bottom hole positioned at back drill hole to be detected
Four quadrantal points of end face inner edge, all quadrants point are the measuring point and the surface layer PCB distance H1 at a distance from the surface layer PCB；
S4, control ultrasonic scanner are scanned back drill hole to be detected periphery, to obtain pad at a distance from the surface layer PCB
H2, bond pad surface in step s 4 choose at four o'clock respectively as the second test point, and second test point is respectively with described four
A quadrantal points corresponds, and on the extended line of corresponding quadrantal points and the back drill hole line of centres, each second test point and PCB
The distance on surface layer is pad and the surface layer PCB distance H2；
S5, stub length H, i.e. H=H2-H1 are calculated according to distance H1 and distance H2；
S6, as 0≤H≤m, be judged as that stub length H is not exceeded, as H > m, be judged as that stub length H is exceeded, wherein institute
Stating m is default stub length.
2. a kind of lossless detection method of back drill stub according to claim 1, which is characterized in that back drill hole to be detected
Any point of nonmetallic hole bottom face inner edge is chosen as the measurement point.
3. a kind of lossless detection method of back drill stub according to claim 2, which is characterized in that weldering in step s 4
Panel surface, which is chosen, is a little used as the first test point, extended line of first test point in the measurement point and the back drill hole line of centres
On, which is pad and the surface layer PCB distance H2 at a distance from the surface layer PCB.
4. a kind of lossless detection method of back drill stub according to claim 1, which is characterized in that when stub length H not
When exceeded, ultrasonic scanner is not alarmed；When stub length H is exceeded, ultrasonic scanner alarm.
5. a kind of PCB lossless detection method, which comprises the following steps:
Z1, the scan path for determining ultrasonic scanner；
Z2, the camera lens for controlling ultrasonic scanner successively detect each back drill hole according to scan path, which adopts
The lossless detection method of the back drill stub described in claim 1-4 any one.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610564812.8A CN105973177B (en) | 2016-07-15 | 2016-07-15 | A kind of lossless detection method and PCB lossless detection method of back drill stub |
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|---|---|---|---|
| CN201610564812.8A CN105973177B (en) | 2016-07-15 | 2016-07-15 | A kind of lossless detection method and PCB lossless detection method of back drill stub |
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| CN105973177B true CN105973177B (en) | 2019-07-12 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108712831B (en) * | 2018-07-02 | 2020-01-14 | 华南理工大学 | Back-drilled PCB section microscopic image process parameter extraction method |
| CN110243286A (en) * | 2019-06-30 | 2019-09-17 | 深南电路股份有限公司 | A kind of back drill offset detecting device and image acquiring device |
| CN113256558A (en) * | 2021-04-12 | 2021-08-13 | 珠海欣泰电子科技有限公司 | Stub detection method, device and system |
| CN113295768A (en) * | 2021-04-30 | 2021-08-24 | 生益电子股份有限公司 | Hole filling hole detection method, system and device |
| CN114923404B (en) * | 2022-04-15 | 2023-08-18 | 深圳市一博科技股份有限公司 | Golden finger bonding pad length testing method |
| CN117274254B (en) * | 2023-11-21 | 2024-04-19 | 广州广合科技股份有限公司 | PCB back drilling quality nondestructive testing and defect judging method |
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| CN1852784A (en) * | 2003-09-19 | 2006-10-25 | 通道系统集团公司 | Closed loop backdrilling system |
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