CN110243286A - A kind of back drill offset detecting device and image acquiring device - Google Patents
A kind of back drill offset detecting device and image acquiring device Download PDFInfo
- Publication number
- CN110243286A CN110243286A CN201910581948.3A CN201910581948A CN110243286A CN 110243286 A CN110243286 A CN 110243286A CN 201910581948 A CN201910581948 A CN 201910581948A CN 110243286 A CN110243286 A CN 110243286A
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- China
- Prior art keywords
- light
- back drill
- drill hole
- light source
- image sensing
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The present invention provides a kind of back drill offset detecting device and image acquiring device.Wherein, back drill offset detecting device includes light source, image sensing element, optical path adjustment element and processing circuit.Light source is for emitting beam and irradiating the circuit board to be detected with back drill hole；Image sensing element is for receiving the light being reflected back from circuit board to be detected to generate image to be detected；Optical path adjustment element is used to adjust the optical path between light source and image sensing element；Processing circuit connects image sensing element, for obtaining image to be detected and being analyzed, to obtain testing result.Image detection can be carried out to the inside in back drill hole by using above scheme, be detected so as to the drilling quality to back drill hole.
Description
Technical field
The present invention relates to multilayer circuit board technical field, in particular to a kind of back drill offset detecting device and image obtain dress
It sets.
Background technique
In the production of existing multilayer circuit board, the conductive layer of multilayer laminated setting usually can be by running through multilayer conductive
The conductive through hole of layer is electrically connected.It, can be by being opened up on the basis of conductive through hole when needing to form preset circuit
Back drill hole so that the conductive layer of predetermined number of layers is electrically connected by this conductive through hole, and has opened up back drill hole
Conductive layer is electrically connected in the conductive through hole position with other conductive layer disconnections.
The drift rate in back drill hole will have a direct impact on the signal transmission of multilayer circuit board, it is therefore desirable to examine to back drill hole
It surveys, to confirm whether back drill hole meets the requirements.
Two kinds of detection methods are generallyd use when the detection in existing back drill hole to detect back drill hole.One is use to put
Big mirror carries out sight check, and this method detection effect inclined to back drill is poor, and personnel's technical ability dependence is strong；Another method is to adopt
With slice analysis, this method accurately can be biased capable analysis to back drill, but since slice analysis belongs to destructive testing, because
This can only be used as sampling Detection, can not general warranty back drill hole test effect.
Therefore, back drill hole that can not be all to circuit board when existing back drill hole is detected carries out rapidly and efficiently rate detection.
Summary of the invention
The present invention provides a kind of back drill offset detecting device and image acquiring device, is examined with solving back drill hole in the prior art
Back drill hole that can not be all to circuit board when survey carries out the problem of rapidly and efficiently rate detects.
One technical scheme adopted by the invention is that:
There is provided a kind of back drill offset detecting device, wherein include:
Light source, for emitting beam and irradiating the circuit board to be detected with back drill hole；
Image sensing element, for receiving the light being reflected back from the circuit board to be detected to generate mapping to be checked
Picture；
Optical path adjustment element, for adjusting the optical path between the light source and described image sensing element；
Processing circuit connects described image sensing element, for obtaining described image to be detected and being analyzed, to obtain
Testing result.
In order to solve the above technical problems, another technical solution used in the present invention is:
There is provided a kind of image acquiring device, wherein include:
Light source, for emitting beam and irradiating the circuit board to be detected with back drill hole；
Image sensing element, for receiving the light being reflected back from the circuit board to be detected to generate mapping to be checked
Picture；
Optical path adjustment element, for adjusting the optical path between the light source and described image sensing element.
The present invention imports in back drill hole by using the light that optical path adjustment element issues light source, or will be anti-in back drill hole
The light penetrated imports in the detector lens of image sensing element, so that the clearly image information in back drill hole is obtained, by figure
It as information processing and identifies, whereby it can be detected that whether the degrees of offset in back drill hole meets preset requirement.Pass through above-mentioned side
Case, can with the image information in the hole in all back drill holes on each circuit board of quick obtaining, by all image informations into
Row handle simultaneously identify, so as to rapidly and efficiently detect whether back drill hole meets the requirements on each circuit board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of multilayer circuit board in the prior art；
Fig. 2 is that multilayer circuit board shown in Fig. 1 opens up the structural schematic diagram behind back drill hole；
Fig. 3 is the structural schematic diagram of back drill offset detecting device first embodiment provided by the invention；
Fig. 4 is the structural schematic diagram of back drill offset detecting device second embodiment provided by the invention；
Fig. 5 is the structural schematic diagram of one embodiment of image acquiring device provided by the invention.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
FIG. 1 to FIG. 2 is please referred to, Fig. 1 is the structural schematic diagram of multilayer circuit board in the prior art；Fig. 2 is more shown in Fig. 1
Layer circuit board opens up the structural schematic diagram behind back drill hole.
It can have the multilager base plate 110 and conductive layer 120 for successively replacing and being stacked when multilayer circuit board formation,
In, plurality of conductive layers 120 can be realized by conductive through hole 130 and is electrically connected, specifically can be by 130 inner wall of conductive through hole
Upper setting conductive metal layer 131 is to which plurality of conductive layers 120 to be electrically connected.
When needing to form preset processing circuit on multilayer circuit board, plurality of conductive layers 120 does not require to pass through
Conductive through hole 130 is electrically connected, therefore can will not be needed by the way of opening up back drill hole 140 through conductive through hole 130
The conductive layer 120 of electrical connection disconnects electrical connection in the position of conductive through hole 130.
Wherein, back drill hole 140 is opened up on the basis of conductive through hole 130, by drilling to conductive through hole 130
Broadening, so that the conductive metal layer 131 in the part hole section on 130 inner wall of conductive through hole is removed, to form back drill hole 140.Cause
This can break the plurality of conductive layers 120 for having opened up back drill hole 140 in the position of conductive through hole 130 with remaining conductive layer 120
Open electrical connection.
If back drill hole 140 deflection of borehole occurs, so as to will appear the conductive through hole 130 for having opened up back drill hole 140
Conductive metal layer 131 in hole section fails to completely remove, therefore will affect the signal transmission of multilayer circuit board, in some instances it may even be possible to can go out
The problem of existing multilayer circuit board short circuit.
Therefore, in the production of practical multilayer circuit board, it is also necessary to be detected to back drill hole.
Referring to Fig. 3, Fig. 3 is the structural schematic diagram of back drill offset detecting device first embodiment provided by the invention.
Back drill offset detecting device 200 includes light source 210, image sensing element 220, optical path adjustment element 230 and place
Manage circuit 240.Wherein, light source 210 is for emitting beam and irradiating the circuit board to be detected with back drill hole 251, image sensing
Element 220 is for receiving the light being reflected back from circuit board to be detected to generate image to be detected；Optical path adjustment element 230 is used for
Adjust the optical path between light source 210 and image sensing element 220；Processing circuit 240 connect image sensing element 220, with
In acquisition image to be detected and analyzed to obtain testing result.
Therefore, it is imported in back drill hole in the present invention by using the light that optical path adjustment element issues light source, or will back
The light of drilling internal reflection imports in the detector lens of image sensing element, so that the image information in back drill hole is clearly obtained,
It to Image Information Processing and is identified by processing circuit, it is preset to whereby it can be detected that whether the degrees of offset in back drill hole meets
It is required that.
In the present embodiment, optical path adjustment element 230 is located among the round of light, for the direction of propagation to light
It is adjusted.For example, can be used for the light of light source 210 importing 251 region of back drill hole, so that some light direct projection is arrived
In back drill hole 251, so that the image clearly in the back drill hole 251 that image sensing element 220 obtains is illustrated；Or
It can be used for for the light that 251 region of back drill hole is reflected back importeding into the detector lens of image sensing element 220, equally
It is also possible that image sensing element 220 can obtain the clear image in back drill hole 251.
Wherein, optical path adjustment element 230 is located among the round of light, specifically for reflecting from light source 210
Light penetrates the light being reflected back from 251 region of back drill hole to 251 region of back drill hole, eventually enters into light
Image sensing element 220.
In the present embodiment, optical path adjustment element 230 is half-reflection and half-transmission prism, and half-reflection and half-transmission prism includes the first table of intersection
Face 231, second surface 232, and the inclined-plane 233 intersected with first surface 231, second surface 232, inclined-plane 233 tilt court
To 251 region of light source 210 and back drill hole, 231 backlight 210 of first surface, second surface 232 is towards image sensing
Element 220；Wherein, inclined-plane 233 is for reflecting the light from light source 210 to 251 region of back drill hole, and penetrates from back
Drill the light that 251 regions are reflected back, and second surface 232 penetrates the light from inclined-plane 233.
Specifically, the light that light source 210 issues is irradiated on inclined-plane 233, by the reflection on inclined-plane 233, so as to
The direction of propagation of light will be changed, so that light is irradiated to 251 region of back drill hole；251 region of back drill hole (packet
Include in back drill hole 251) reflection light be then irradiated on inclined-plane 233 and penetrate inclined-plane 233 after, inject image sensing element
In 220 detector lens.
In the present embodiment, angle (the i.e. adjustment light source for the light that setting inclined-plane 233 and light source 210 issue can be passed through
Incidence angle of 210 light issued to inclined-plane 233) so that the light that light source 210 issues is all-trans at inclined-plane 233
251 region of back drill hole is irradiated to after penetrating.Wherein, it may also be ensured that the angle for the light that inclined-plane 233 and light source 210 issue not
Become, by adjusting Plane Angle where the opening in inclined-plane 233 and back drill hole 251, so that 251 location of back drill hole
The light of domain reflection enters in image sensing element 220 after can penetrating inclined-plane 233.
Wherein, the optical axis y of the image sensing element 220 and hole axle x in back drill hole 251 can be arranged in parallel, i.e. image sensing
The camera lens of element 220 can be with the hole axle x in face back drill hole 251, to receive the light from 251 internal reflection of back drill hole；At other
Embodiment in, can also set not parallel for the optical axis y of image sensing element 220 and the hole axle x in back drill hole 251.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram of back drill offset detecting device second embodiment provided by the invention.
It is identical as the first embodiment of previously described back drill offset detecting device 200 in the present embodiment, optical path adjustment member
Part 230 is similarly positioned among the round of light.
Its distinctive points is, in the present embodiment, second surface 232 is arranged in back to the side on inclined-plane 233, light in light source 210
Source 210 shines directly on second surface 232, and after optical path adjustment element 230, is irradiated to the area where back drill hole 251
Domain；The region reflection that inclined-plane 233 is arranged in back to the side of first surface 231, where back drill hole 251 in image sensing element 220
Light can be by the reflection on inclined-plane 233, hence into image sensing element 220.
Likewise, can also be by adjusting the angle on inclined-plane 233 and 250 surface of circuit board to be detected, so that back drill
The light of region reflection where hole 251 is totally reflected after being irradiated on inclined-plane 233, so where back drill hole 251
The light of region reflection enters in image sensing element 220 after being reflected by inclined-plane 233.
Wherein, the optical axis z of light source 210 can be arranged in parallel with the hole axle in back drill hole 251, that is, the light that light source 210 issues
It can be irradiated in back drill hole 251 along the hole axis direction in back drill hole 251；In other examples, it may be set to be injustice
Row.
In the above-described embodiments, light source 210, image sensing element 220 and optical path adjustment element 230 are respectively positioned on to be checked
250 side of slowdown monitoring circuit plate.It is detected with the back drill hole 251 for treating 250 side of detection circuit board.In other embodiments
In, it can also be by the way that light source 210 as previously described, image sensing be respectively set in the opposite sides of circuit board 250 to be detected
Element 220 and optical path adjustment element 230 are carried out with treating the back drill hole 251 of the opposite two sides of detection circuit board 250 respectively
Detection.
Wherein, image sensing element 220 can be high-precision CCD (Charge Coupled Device, Charged Couple
Device) sensor.The light reflected in back drill hole 251 is received by the detector lens of ccd sensor, so as to back drill hole 251
Interior image information is acquired.Wherein, CCD is a kind of particular semiconductor device, including multiple photosensitive elements, each photosensitive
Element forms a pixel, light can be converted into electric signal.CCD is a kind of for detecting the silicon wafer of light, by clock pulses electricity
The solid electronic device that storage and transmitting charge information are realized to generate and control the variation of semiconductor potential well is pressed, than traditional
Egative film more can sensitively detect the variation of light.CCD is the dynamic shift register that different conditions are indicated with the quantity of electric charge.It is
It is made of one group of regularly arranged Metal-oxide-semicondutor (MOS) capacitor element and input, output circuit.Traditional consolidates
The existing way of information is usually to use current or voltage in state electronic device, is then with charge, therefore CCD is to letter and in CCD
The expression of breath has higher sensitivity.Solid state image, information processing and a large amount of storages are the three big main applications of CCD, various
Linear array, matrix CCD are successfully used for the fields such as astronomy, remote sensing, fax, camera shooting.And CCD is mainly applied in the present invention
Solid state image, camera function.
In the present embodiment, light source 210 can be linear light source, can be with emitting parallel light.Light in other examples
Source 210 is also possible to astigmatism light source, the light that light source 210 issues at least with different first direction and second direction be irradiated to
In the back drill hole 251 of detection circuit board 250, so that the light that light source 210 issues can sufficiently illuminate in back drill hole 251
All areas.Wherein, light source 210 can be LED light, or other are from the device of main light emission, it is not limited here.
In the present embodiment, after image sensing element 220 completes the Image Acquisition to back drill hole 251, processing circuit 240 can
With the concentricity of the conductive hole 252 by comparison back drill hole 251 corresponding thereto, to judge whether back drill hole 251 occurs partially
Shifting problem.Wherein, processing circuit 240 can be a functional module of controller.Processing circuit 240 can be with image sensing element
Part 220 is electrically connected.Or in other embodiments, processing circuit 240 can be wirelessly connected with image sensing element 220.
It includes: that back drill hole 251 is coaxially set with conductive hole 252 that processing circuit 240, which judges whether back drill hole 251 shifts,
It sets or the deviation of the hole axle of the two is in default range, it can be said that bright back drill hole 251 does not shift or it is inclined
It moves in default range, i.e., back drill hole 251 is qualification；When the deviation in back drill hole 251 and the hole axle of conductive hole 252 has exceeded
Preset range, for example, back drill hole 251 and conductive hole 252 side spacing is minimum or back drill hole 251 and 252 phase of conductive hole
When cutting or intersecting, it can be said that bright back drill hole 251 has been shifted out preset range, i.e. back drill hole 251 is unqualified.
Further, the present invention also provides a kind of image acquiring devices, referring to Fig. 5, being image provided by the invention
The structural schematic diagram of one embodiment of acquisition device.
Wherein, image acquiring device 30 includes: light source 310, image sensing element 320 and optical path adjustment element 330.Light
Source 310 is for emitting beam and irradiating the circuit board to be detected with back drill hole；Image sensing element 320 is for receiving to be checked
The light that slowdown monitoring circuit plate is reflected back is to generate image to be detected；Optical path adjustment element 330 is for adjusting light source 310 and image sensing
Optical path between element 320.Image acquiring device 30, which can be used for being mounted on, treats detection circuit board on preset detection base station
Back drill hole detected, to confirm whether the back drill hole qualified.
Wherein, light source 310, image sensing element 320 and optical path adjustment element 330 can with above described in embodiment
Light source 210, image sensing element 220 and optical path adjustment element 230 it is identical, and light source 310, image sensing element 320 with
And optical path adjustment element 330 be arranged position can also with light source 210, image sensing element 220 described in embodiment above and
Optical path adjustment element 230 it is identical, this will not be repeated here.Wherein, light source 310, image sensing element 320 and optical path adjustment
Setting can be fixed by using a shell in element 330, to form the image acquiring device of an integral type；Or
In other embodiments, light source 310, image sensing element 320 and optical path adjustment element 330 can also be separately fixed at difference
Pedestal on, so as to formed can respectively to light source 310, image sensing element 320 and optical path adjustment element 330 into
The image-taking system that row is individually adjusted, it is not limited here.
Further, image sensing element 320 can equally be connect with preset processing circuit, be received by processing circuit
Image to be detected that image sensing element 320 generates, and then to image to be detected into judgement, so as to judge back detected
Whether the shift phenomenon of drilling is in preset deviation range.
In conclusion the present invention imports in back drill hole by using the light that optical path adjustment element issues light source, or will
The light of back drill hole internal reflection imports in the detector lens of image sensing element, to clearly obtain the image letter in back drill hole
Breath whereby it can be detected that whether the degrees of offset in back drill hole meets preset requirement by Image Information Processing and identifying.
It through the above scheme, can be with the image information in the hole in all back drill holes on each circuit board of quick obtaining, by all
Image information is handled and is identified, so as to the offset journey for detecting all back drill holes on each circuit board rapidly and efficiently
Whether degree meets the requirements.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, all to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (12)
1. a kind of back drill offset detecting device characterized by comprising
Light source, for emitting beam and irradiating the circuit board to be detected with back drill hole；
Image sensing element, for receiving the light being reflected back from the circuit board to be detected to generate image to be detected；
Optical path adjustment element, for adjusting the optical path between the light source and described image sensing element；
Processing circuit connects described image sensing element, for obtaining described image to be detected and being analyzed, to be detected
As a result.
2. the apparatus according to claim 1, it is characterised in that:
The optical path adjustment element is located among the round of the light, specifically for reflecting from described in the light source
Light penetrates the light being reflected back from back drill hole region to back drill hole region, makes the light
Line eventually enters into described image sensing element.
3. the apparatus of claim 2, it is characterised in that:
The optical path adjustment element is half-reflection and half-transmission prism, and the half-reflection and half-transmission member prism includes the first surface of intersection, second
Surface, and the inclined-plane intersected with the first surface, the second surface, inclined-plane inclination towards the light source and
Back drill hole region, the first surface is backwards to the light source, and the second surface is towards described image sensing element；
Wherein, the inclined-plane is for reflecting the light from the light source to back drill hole region, and penetrate from
The light that back drill hole region is reflected back, the second surface penetrate the light from the inclined-plane.
4. the apparatus according to claim 1, it is characterised in that:
The optical path adjustment element is located among the round of the light, specifically for penetrating from described in the light source
Light makes it expose to back drill hole region, and the light that reflection is reflected back from back drill hole region,
The light is set to eventually enter into described image sensing element.
5. device according to claim 4, it is characterised in that:
The optical path adjustment element is half-reflection and half-transmission prism, and the half-reflection and half-transmission member prism includes the first surface of intersection, second
Surface, and the inclined-plane intersected with the first surface, the second surface, the inclined-plane inclination are sensed towards described image
Element and back drill hole region, the first surface is towards the light source, and the second surface is backwards to described image
Sensing element；
Wherein, the first surface penetrates the light from the light source, and the inclined-plane is for penetrating from described the
The light on one surface makes it be incident to back drill hole region, and reflects and reflect from back drill hole region
The light returned, makes it eventually enter into described image sensing element.
6. the apparatus according to claim 1, it is characterised in that:
The optical axis of the light source and the hole axle in the back drill hole are not parallel；
The optical path adjustment element is located among the round of the light, the light refraction specifically for emitting light source or
It is reflected into back drill hole region.
7. the apparatus according to claim 1, it is characterised in that:
The optical axis of the light source is parallel with the hole axle in the back drill hole；
The optical path adjustment element is located among the round of the light, the light refraction specifically for emitting light source or
It is reflected into back drill hole region.
8. the apparatus according to claim 1, it is characterised in that:
The optical axis of described image sensing element and the hole axle in the back drill hole are not parallel；
The optical path adjustment element is located among the round of the light, is specifically used for anti-from back drill hole region
The light refraction being emitted back towards to or be again reflected into described image sensing element.
9. the apparatus according to claim 1, it is characterised in that:
The optical axis of described image sensing element is parallel with the hole axle in the back drill hole；
The optical path adjustment element is located among the round of the light, is specifically used for anti-from back drill hole region
The light refraction being emitted back towards to or be again reflected into described image sensing element.
10. device according to any one of claims 1 to 9, it is characterised in that:
The light source, described image sensing element and the optical path adjustment element are respectively positioned on the circuit board side to be detected.
11. device according to any one of claims 1 to 9, which is characterized in that
The light source is specifically used for issuing the light, and at least irradiates institute with the different first direction in direction and second direction
State the back drill hole of circuit board to be detected.
12. a kind of image acquiring device characterized by comprising
Light source, for emitting beam and irradiating the circuit board to be detected with back drill hole；
Image sensing element, for receiving the light being reflected back from the circuit board to be detected to generate image to be detected；
Optical path adjustment element, for adjusting the optical path between the light source and described image sensing element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581948.3A CN110243286A (en) | 2019-06-30 | 2019-06-30 | A kind of back drill offset detecting device and image acquiring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910581948.3A CN110243286A (en) | 2019-06-30 | 2019-06-30 | A kind of back drill offset detecting device and image acquiring device |
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| CN110243286A true CN110243286A (en) | 2019-09-17 |
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| CN201910581948.3A Pending CN110243286A (en) | 2019-06-30 | 2019-06-30 | A kind of back drill offset detecting device and image acquiring device |
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| CN112762865A (en) * | 2020-12-28 | 2021-05-07 | 苏州维嘉科技股份有限公司 | Back drilling hole detection equipment and method |
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