CN207397373U - Multifunctional image sensor - Google Patents
Multifunctional image sensor Download PDFInfo
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- CN207397373U CN207397373U CN201721277071.1U CN201721277071U CN207397373U CN 207397373 U CN207397373 U CN 207397373U CN 201721277071 U CN201721277071 U CN 201721277071U CN 207397373 U CN207397373 U CN 207397373U
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Abstract
This application provides a kind of Multifunctional image sensors.The Multifunctional image sensor includes：Image detecting element, for detecting the optical image information of object to be detected, and image detecting element includes mounting portion；Thickness sensitivity unit, for detecting the thickness information of object to be detected, and the part-structure of Thickness sensitivity unit is arranged on the exposed surface of mounting portion.The Multifunctional image sensor is integrated with image detecting element and Thickness sensitivity unit, the detection of optical imagery of object to be detected and the detection of thickness can be realized simultaneously, and, film thickness detection unit in the Multifunctional image sensor is set directly on the mounting portion of image detecting element, so that the integrated morphology of the Multifunctional image sensor is fairly simple, and small volume, integrated level are higher.
Description
Technical field
This application involves field of image sensors, in particular to a kind of Multifunctional image sensor.
Background technology
Now in paper money discrimination field, mainly the optical imagery of bank note is read out and known using image detecting element
Not, detected for the thickness information of bank note, method relatively advanced at present is the film thickness sensor of my company's exploitation design, former
Reason is to detect banknote thickness information using the principle of electrostatic charge sensing.
At present, the different imaging sensor of above two is scanned and believes respectively as an individual detection device
Number processing, and then is effectively detected the optical image information and thickness information of bank note.If the two is carried out simple
It is larger applied in finance device, will result in the volume of finance device after combination, it is unfavorable for device miniaturization development, and increases
The cost of manufacture of finance device is added.Meanwhile both imaging sensors need to be mechanically connected combination, and must assure that away paper money
It is smooth, this will certainly add the difficulty of the Design of Mechanical Structure such as the paper feed passage of finance device.
Therefore, multifunctional image sensing a kind of small there is an urgent need for exploitation, reasonable in design, at low cost, highly integrated
Device is realized to being detected while banknote image information and thickness information.
Utility model content
The main purpose of the application is to provide a kind of Multifunctional image sensor, to solve not passing through in the prior art
The problem of imaging sensor realization of small volume is detected film thickness and optical imagery.
To achieve these goals, this application provides a kind of Multifunctional image sensor, the Multifunctional image sensors
Including：Image detecting element, for detecting the optical image information of object to be detected, and above-mentioned image detecting element includes installation
Portion；Thickness sensitivity unit, for detecting the thickness information of above-mentioned object to be detected, and the part-structure of above-mentioned Thickness sensitivity unit is set
It puts on the exposed surface of above-mentioned mounting portion.
Further, above-mentioned Thickness sensitivity unit includes common electrode, and above-mentioned common electrode is arranged on above-mentioned mounting portion
On exposed surface.
Further, above-mentioned image detecting element further includes framework, has multiple accommodating chambers, above-mentioned installation in above-mentioned framework
Portion is arranged on the outer surface of above-mentioned framework.
Further, above-mentioned framework further includes mounting groove, and above-mentioned mounting portion is arranged in above-mentioned mounting groove.
Further, above-mentioned image detecting element further includes：At least one light-transmitting plate, above-mentioned light-transmitting plate are arranged on above-mentioned frame
On the surface away from above-mentioned accommodating chamber of body, one of them above-mentioned light-transmitting plate is above-mentioned mounting portion, above-mentioned Thickness sensitivity unit
Part-structure is arranged on the surface away from above-mentioned framework of above-mentioned light-transmitting plate.
Further, above-mentioned framework tool is respectively the first accommodating chamber, the second accommodating chamber and the 3rd there are three above-mentioned accommodating chamber
Accommodating chamber, above-mentioned first accommodating chamber, above-mentioned second accommodating chamber and the mutually isolated setting of above-mentioned 3rd accommodating chamber, above-mentioned image detection
Unit further includes：Light source is arranged in above-mentioned first accommodating chamber, for being irradiated to above-mentioned object to be detected；Lens are arranged on
In above-mentioned second accommodating chamber and the one side of above-mentioned light source is arranged on, said lens are for reflection of the reception from above-mentioned object to be detected
Light.
Further, it is the first plane perpendicular to the surface of the short transverse of above-mentioned framework, is arranged on above-mentioned mounting portion
The part-structure of above-mentioned Thickness sensitivity unit is projected as the first view field in above-mentioned first plane, and above-mentioned light source is above-mentioned
The second view field is projected as in first plane, said lens are projected as the 3rd view field in above-mentioned first plane,
Above-mentioned second view field and above-mentioned first view field do not have a part overlapped, and above-mentioned 3rd view field and above-mentioned the
One view field does not have the part overlapped.
Further, above-mentioned imaging sensor includes two spaced above-mentioned light-transmitting plates, is respectively the first light-transmitting plate
With the second light-transmitting plate, wherein, above-mentioned second light-transmitting plate is above-mentioned mounting portion, and above-mentioned first light-transmitting plate is in above-mentioned first plane
Be projected as the 4th view field, above-mentioned second view field and above-mentioned 3rd view field are located at above-mentioned 4th view field
Inside.
Further, it is the first plane perpendicular to the surface of the short transverse of above-mentioned framework, is arranged on above-mentioned mounting portion
The part-structure of above-mentioned Thickness sensitivity unit is projected as the first view field in above-mentioned first plane, and above-mentioned light source is above-mentioned
The second view field is projected as in first plane, said lens are projected as the 3rd view field in above-mentioned first plane,
Above-mentioned second view field and above-mentioned 3rd view field are located at the inside of above-mentioned first view field, and above-mentioned are arranged on
The part-structure for stating the above-mentioned Thickness sensitivity unit of mounting portion is transparent configuration.
Further, above-mentioned image detecting element further includes：Wiring board is arranged in above-mentioned 3rd accommodating chamber and is arranged on
The one side away from above-mentioned light-transmitting plate of said lens；Multiple optical detection chips are arranged on above-mentioned in above-mentioned 3rd accommodating chamber
On wiring board and between above-mentioned wiring board and said lens, and each above-mentioned optical detection chip has photosensitive window, above-mentioned
Photosensitive window is used to receive emergent light of the reflected light of above-mentioned object to be detected after said lens, each above-mentioned optical detection chip
For the optical information of emergent light to be converted into electric signal, multiple above-mentioned optical detection chips are alternatively arranged along the first direction, above-mentioned
First direction is vertical with the moving direction of above-mentioned object to be detected.
Further, above-mentioned Thickness sensitivity unit further includes：Electrode portion is detected, on the thickness direction of above-mentioned common electrode
With above-mentioned common electrode interval and being oppositely arranged, and above-mentioned detection electrode portion includes spaced multiple film thickness in a second direction
Detection chip, above-mentioned second direction are hung down with the moving direction of above-mentioned object to be detected and the thickness direction of above-mentioned common electrode
Directly.
Further, above-mentioned Thickness sensitivity unit further includes：Protective film is arranged on the separate above-mentioned peace of above-mentioned common electrode
On the surface in dress portion.
Further, the resolution ratio phase of above-mentioned image detecting element and above-mentioned Thickness sensitivity unit on main scanning direction
Together, the form of the control signal of above-mentioned image detecting element and the control signal of above-mentioned Thickness sensitivity unit is identical and above-mentioned
The detection signal of the output of image detecting element is identical with the form of the detection signal of the output of above-mentioned Thickness sensitivity unit,
In, above-mentioned main scanning direction and the moving direction of above-mentioned object to be detected and the thickness direction of above-mentioned common electrode are vertical.
Further, above-mentioned common electrode is ito thin film electrode.
Using the technical solution of the application, above-mentioned Multifunctional image sensor is integrated with image detecting element and thickness
Detection unit can realize the detection of optical imagery of object to be detected and the detection of thickness, also, the multifunctional image simultaneously
Film thickness detection unit in sensor is set directly on the mounting portion of image detecting element so that the Multifunctional image sensor
Integrated morphology it is fairly simple, and small volume, integrated level are higher.
Description of the drawings
The accompanying drawings which form a part of this application are used for providing further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation do not form the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 shows the structure diagram of 1 Multifunctional image sensor according to an embodiment of the present application；
Fig. 2 shows the partial structurtes top view of the Multifunctional image sensor in Fig. 1；
Fig. 3 shows the structure diagram of the Multifunctional image sensor in embodiments herein 2；
Fig. 4 shows the partial structurtes top view of the Multifunctional image sensor in Fig. 3；And
Fig. 5 shows the structure diagram of the Multifunctional image sensor in embodiments herein 3.
Wherein, above-mentioned attached drawing is marked including the following drawings：
11st, framework；12nd, wiring board；13rd, optical detection chip；14th, lens；15th, light source；16th, light-transmitting plate；161st, first
Light-transmitting plate；162nd, the second light-transmitting plate；21st, common electrode；22nd, protective film；23rd, electrode portion is detected；231st, film thickness detection chip.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.It is unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " bag
Include " when, indicate existing characteristics, step, operation, device, component and/or combination thereof.
It should be understood that when element (such as layer, film, region or substrate) be described as another element " on " when, this yuan
Intermediary element can may be present directly on another element or also in part.Moreover, in specification and following claims
In, when description has element " connected " to another element, which " can be directly connected to " to another element or by the 3rd
Element " electrical connection " is to another element.
As background technology is introduced, can not be realized in the prior art by the imaging sensor of small volume to film
Thickness and optical imagery are detected, in order to solve the problems, such as that as above, present applicant proposes a kind of Multifunctional image sensors.
In a kind of typical embodiment of the application, provide a kind of Multifunctional image sensor, such as Fig. 1, Fig. 3 and
Shown in Fig. 5, which includes image detecting element and Thickness sensitivity unit, and image detecting element is to be detected for detecting
The optical image information of object, and above-mentioned image detecting element includes mounting portion；Thickness sensitivity unit is above-mentioned to be detected for detecting
The thickness information of object, and the part-structure of above-mentioned Thickness sensitivity unit is arranged on the exposed surface of above-mentioned mounting portion.
Above-mentioned Multifunctional image sensor is integrated with image detecting element and Thickness sensitivity unit, can realize simultaneously
The detection of the optical imagery of object to be detected and the detection of thickness, also, the film thickness detection in the Multifunctional image sensor is single
Member is set directly on the mounting portion of image detecting element so that and the integrated morphology of the Multifunctional image sensor is fairly simple,
And small volume, integrated level are higher.
It is the Thickness sensitivity unit of any structure in the prior art in above-mentioned Thickness sensitivity unit, mainly includes public
Electrode portion and detection electrode portion 23, the part-structure being arranged on the surface of above-mentioned mounting portion of the application can be thickness inspection
Any a part of structure in unit is surveyed, those skilled in the art can select to set suitable part-structure according to actual conditions
It puts on the surface of mounting portion, such as public electrode portion is arranged on the surface of mounting portion, can also will detect electrode portion 23
It is arranged on the surface of mounting portion.
In a kind of embodiment of the application, as shown in Fig. 1, Fig. 3 and Fig. 5, above-mentioned Thickness sensitivity unit includes common electricity
Pole 21, above-mentioned common electrode 21 are arranged on the exposed surface of above-mentioned mounting portion.Such set-up mode is more advantageous to improving and be somebody's turn to do
The integrated level of Multifunctional image sensor simultaneously reduces its volume, and it is possible to be further ensured that the Multifunctional image sensor has
There is preferable performance.
In order to further ensure the Multifunctional image sensor is not easy to be damaged, there is good reliability and service life,
In a kind of embodiment of the application, as shown in Fig. 1, Fig. 3 and Fig. 5, above-mentioned image detecting element further includes framework 11, the framework
11, for protecting the other structures in image detecting element, have multiple accommodating chambers, above-mentioned mounting portion is set in above-mentioned framework 11
On the outer surface of above-mentioned framework 11.
In another embodiment of the application, the setting in portion in order to facilitate the installation of is above-mentioned as shown in Fig. 1, Fig. 3 and Fig. 5
Framework 11 further includes mounting groove, and above-mentioned mounting portion is arranged in above-mentioned mounting groove.
For the setting of the part-structure of more convenient Thickness sensitivity unit, also, it is more to further improve integrated level reduction
The volume and weight of function image sensor, in a kind of embodiment of the application, as shown in Fig. 1, Fig. 3 and Fig. 5, above-mentioned image
Detection unit further includes at least one light-transmitting plate 16, and above-mentioned light-transmitting plate 16 is arranged on the separate above-mentioned accommodating chamber of above-mentioned framework 11
On surface, one of those above-mentioned light-transmitting plate 16 is above-mentioned mounting portion, and the part-structure of above-mentioned Thickness sensitivity unit is arranged on
It states on the surface away from above-mentioned framework 11 of light-transmitting plate 16.
The material of the above-mentioned light-transmitting plate 16 of the application can be any light transmissive material of the prior art, such as can be glass
Glass and/or light-transmissive resin etc..
Certainly, the mounting portion of the application may not be light-transmitting plate 16, such as the second light-transmitting plate 162 shown in Fig. 3 is replaced
It is changed to the peace transfer part of other materials, such as a kind of lighttight installing plate.
The common electrode 21 of the application can be any common electrode 21 (i.e. public electrode) of the prior art, such as
Can be ito thin film electrode, specifically, which can be produced on by modes such as vacuum sputtering or high temperature sinterings
On the heat safe light-transmitting plate 16 such as glass, the 16 grade bases of light-transmitting plate of light-transmissive resin can also be produced on by modes such as vacuum sputterings
On body material, then etched by chemical solvent, the modes such as mechanical grinding produce required ito thin film electrode shape.
Wherein, in structure shown in FIG. 1, image detecting element only includes a light-transmitting plate 16, and the light-transmitting plate 16 is set
On the surface of the separate accommodating chamber of framework 11, which is used as mounting portion, and common electrode 21 is arranged on the light-transmitting plate 16
On separate framework 11 surface on, also, as shown in Figure 1 and Figure 2, common electrode 21 is the light-transmitting plate for being covered in part
Setting on 16 surface to avoid common electrode 21 influences the light path of image detecting element, and then influences image detecting element
Testing result.
In another embodiment of the application, as shown in Fig. 1, Fig. 3 and Fig. 5, there are three above-mentioned accommodating chambers, is respectively the
One accommodating chamber, the second accommodating chamber and the 3rd accommodating chamber, above-mentioned first accommodating chamber, above-mentioned second accommodating chamber and above-mentioned 3rd accommodating chamber
Mutually isolated setting, above-mentioned image detecting element further include light source 15 and lens 14, and light source 15 is arranged on above-mentioned first accommodating chamber
In, for being irradiated to above-mentioned object to be detected；Lens 14 are arranged in above-mentioned second accommodating chamber and are arranged on above-mentioned light source 15
One side, said lens 14 for receive the reflected light from above-mentioned object to be detected.
In a kind of embodiment of the application, as shown in Figures 1 to 4, short transverse perpendicular to above-mentioned framework 11 is defined
Surface is the first plane, is arranged on the part-structure of above-mentioned Thickness sensitivity unit of above-mentioned mounting portion in above-mentioned first plane
The first view field is projected as, above-mentioned light source 15 is projected as the second view field, said lens 14 in above-mentioned first plane
The 3rd view field is projected as in above-mentioned first plane, above-mentioned second view field does not have with above-mentioned first view field
The part of coincidence, and above-mentioned 3rd view field does not have the part overlapped with above-mentioned first view field, for example, Fig. 1 and Fig. 3
In shown structure, common electrode 21 avoids above-mentioned light source 15 and lens 14 are set, i.e., common electrode 21 corresponding first is thrown
Shadow zone domain and 15 corresponding second view field of light source do not have a part overlapped, and with 14 corresponding 3rd view field of lens
Part without coincidence.Wherein, the short transverse of framework is represented with straight line m with the arrow, in Fig. 1 with with the arrow straight
Line n represents the moving direction of determinand.
In the another embodiment of the application, as shown in figure 3, above-mentioned imaging sensor is spaced above-mentioned including two
Light-transmitting plate 16, respectively the first light-transmitting plate 161 and the second light-transmitting plate 162, wherein, above-mentioned second light-transmitting plate 162 is above-mentioned installation
Portion, and above-mentioned first light-transmitting plate 161 is projected as the 4th view field in above-mentioned first plane, above-mentioned 3rd view field with
And above-mentioned second view field is located at the inside of above-mentioned 4th view field, which can further avoid
Part-structure in the Thickness sensitivity unit being arranged on the second light-transmitting plate 162 causes bad shadow to the light path of image detecting element
It rings, further improves the accuracy of the detection of image detecting element.
In another embodiment of the application, as shown in figure 5, being the perpendicular to the surface of the short transverse of above-mentioned framework 11
One plane, the part-structure for being arranged on the above-mentioned Thickness sensitivity unit of above-mentioned mounting portion are projected as in above-mentioned first plane
One view field, above-mentioned light source 15 are projected as the second view field in above-mentioned first plane, and said lens 14 are above-mentioned
The 3rd view field is projected as in one plane, above-mentioned second view field and above-mentioned 3rd view field are located at above-mentioned first
The inside of view field, and the part-structure of the above-mentioned above-mentioned Thickness sensitivity unit for being arranged on above-mentioned mounting portion is transparent configuration,
Since the part-structure in the Thickness sensitivity unit that is arranged on mounting portion is arranged in the optical path area of image detecting element, it is
The part-structure is avoided to influence the light path of image detecting element, and then influences the detection accuracy of image detecting element, at this
In embodiment, the part-structure of the above-mentioned above-mentioned Thickness sensitivity unit for being arranged on above-mentioned mounting portion is transparent configuration, when being arranged on
When structure on mounting portion is common electrode 21, common electrode 21 is transparent electrode, such as ito transparent electrode.
As shown in Fig. 1, Fig. 3 and Fig. 5, above-mentioned image detecting element further includes wiring board 12 and multiple optical detection cores
Piece 13, wiring board 12 are arranged in above-mentioned 3rd accommodating chamber and are arranged on one away from above-mentioned light-transmitting plate 16 of said lens 14
Side；Optical detection chip 13 be arranged on the above-mentioned wiring board 12 in above-mentioned 3rd accommodating chamber and positioned at above-mentioned wiring board 12 with it is upper
Between stating lens 14, and each above-mentioned optical detection chip 13 has photosensitive window, and above-mentioned photosensitive window is above-mentioned to be checked for receiving
Emergent light of the reflected light of object after lens 14 is surveyed, each above-mentioned optical detection chip 13 is used to convert the optical information of emergent light
For electric signal, multiple above-mentioned optical detection chips 13 are alternatively arranged along the first direction, above-mentioned first direction and above-mentioned object to be detected
Moving direction it is vertical.
The detection process of the image detecting element of the application is：Determinand is moved in the top of light-transmitting plate 16, and light source 15 is sent out
Light extraction is irradiated to through light-transmitting plate 16 on determinand, and image, word on determinand etc. generate reflected light, these reflected lights are again
Through light-transmitting plate 16, into lens 14, the reflected light come out from 14 other end of lens is irradiated to the photosensitive of optical detection chip 13
On window, photosensitive window is photosensitive, and 13 optical signals received of optical detection chip are converted into electric signal.Determinand not offset
Dynamic, recorded image, the optical information of word will be read continuously and take off thereon, and the optical image information for completing bank note is swept
Retouch process.
In the another embodiment of the application, as shown in Fig. 1, Fig. 3 and Fig. 5, above-mentioned Thickness sensitivity unit further includes inspection
Go out electrode portion 23, be spaced and be oppositely arranged with above-mentioned common electrode 21 on the thickness direction of above-mentioned common electrode 21, and it is above-mentioned
Electrode portion 23 is detected including spaced multiple film thickness detection chips 231, above-mentioned second direction are treated with above-mentioned in a second direction
The thickness direction of the moving direction of detectable substance and above-mentioned common electrode 21 is vertical, film thickness detection chip 231 and common electrode
Interval between 21 forms the movable passageway of object to be detected.Above-mentioned first direction and second direction are same direction, common electrode
Thickness direction it is consistent with the short transverse of framework.
The above-mentioned detection electrode portion 23 of the application is not limited to above-mentioned structure, and those skilled in the art can be according to reality
Detection electrode portion 23 of the situation selection with suitable construction, just repeats no more herein.
The detection process of the film thickness detection unit of the application is：Determinand is in common electrode 21 and film thickness detection chip 231
Between passage in move, on common electrode 21 plus certain voltage signal, between common electrode 21 and film thickness detection chip 231
Electric field is formed, film thickness detection chip 231 is charged, when determinand passes through film thickness 231 top of detection chip, film thickness detection chip
Dielectric constant between 231 and common electrode 21 changes, and the amount of charge that film thickness detection chip 231 senses changes, from
And the output voltage of film thickness detection chip 231 is made to change, it can be identified and treated by the variable quantity for measuring this voltage
The thickness of object is surveyed, and then generates thickness chart picture.Determinand constantly moves, and the thickness of determinand can be detected continuously.
It during in order to which common electrode 21 being protected to prevent that object to be detected from passing through movable passageway, is contacted with common electrode 21, and then wears common electricity
The damage of common electrode 2121 is caused in pole 21, as shown in Fig. 1, Fig. 3 and Fig. 5, in a kind of embodiment of the application, and above-mentioned thickness
Degree detection unit further includes protective film 22, is arranged on the surface away from above-mentioned mounting portion of above-mentioned common electrode 21, for protecting
Protect above-mentioned common electrode 21.
Protective film 22 may be employed that wearability is good and corrosion-resistant good insulating materials, by vacuum sputtering, spraying, printing or
The modes such as person's high temperature sintering are made；Good conductivity, wearability can also be used good and corrosion-resistant good conductive material, passed through
The modes such as spraying, plating or printing are made.Those skilled in the art can select suitable material shape according to actual conditions
Into the protective film 22 of the application, for example, selection Si3N4-SiO2Based material forms protective film 22.
In another embodiment of the application, above-mentioned image detecting element and above-mentioned Thickness sensitivity unit are in main scanning side
Upward resolution ratio is identical, so that the precision phase of Thickness sensitivity and the optical imagery detection of the Multifunctional image sensor
Together, wherein, above-mentioned main scanning direction and the moving direction of above-mentioned object to be detected and the thickness direction of above-mentioned common electrode 21 are equal
Vertically, main scanning direction and above-mentioned first direction and second direction all same.Specifically, when image detecting element is including more
A optical detection chip 13, and when Thickness sensitivity unit includes multiple film thickness detection chips 231, each optical detection chip 13
The resolution ratio of resolution ratio and film thickness detection chip 231 is identical.For example, the two resolution ratio is all 100DPI.
In order to be further simplified the data handling procedure of the Multifunctional image sensor, and cause multifunctional image sensing
The corresponding Thickness sensitivity signal of device synchronism output and optical imagery detection signal, in a kind of embodiment of the application, above-mentioned figure
As the control signal of detection unit is identical with the control signal of above-mentioned Thickness sensitivity unit, and the inspection of the output of image detecting element
It is identical with the form for the detection signal that above-mentioned Thickness sensitivity unit exports to survey signal, the form of the detection signal of output is identical to be referred to
The Thickness sensitivity signal of output is analog signal either digital signal with optical imagery detection signal.For example, Thickness sensitivity
The unit power supply identical with image detecting element use and earth signal are powered, and are such as powered using 3.3V；Using identical
CLK clock reference signals and SI controls model are driven, and reference voltage is identical VREF voltages, and output signal is phase apposition
The analog signal of formula.
In another embodiment of the application, above-mentioned common electrode 21 is ito thin film electrode, and ito thin film electrode is transparent
Electrode can better ensure that common electrode does not influence the light path of image detecting element, so as to further improve image detection
The detection accuracy of unit, also, ito thin film electrode material in itself and its special manufacture craft determine surface conformance
High, conductivity distribution is highly uniform, and when applying certain voltage on ito thin film electrode, voltage thereon is relatively stablized, and then
So that the detection signal stabilization of Thickness sensitivity unit, will not occur saltus step, the detection to the thickness of determinand is further ensured
With higher accuracy.
Object to be detected in the application can be any laminar object of the prior art, for example, can be bank note,
Bill, plastic film either textile fabric etc..Those skilled in the art can be according to actual conditions using the above-mentioned of the application
The suitable object to be detected of Multifunctional image sensor detection.
In order to enable those skilled in the art can clearly understand the technical solution of the application, below with reference to tool
The embodiment of body illustrates the technical solution of the application.
Embodiment 1
As shown in Figure 1, the Multifunctional image sensor includes Thickness sensitivity unit and image detecting element, wherein, figure
As detection unit include framework 11, wiring board 12, multiple optical detection chips 13 spaced along the first direction, light source 15,
Lens 14 and a light-transmitting plate 16.Thickness sensitivity unit includes common electrode 21, protective film 22 and detection electrode portion 23,
In, common electrode 21 is arranged on light-transmitting plate 16, and light-transmitting plate 16 avoids light source 15 and lens 14 are set, i.e. common electrode 21
Corresponding first view field does not have with 14 corresponding 3rd view field of lens and 15 corresponding second view field of light source
There is the part of coincidence, common electrode 21 is ito thin film electrode.
Wherein, the first plane is surface with the short transverse perpendicular to above-mentioned framework 11, first direction with it is above-mentioned to be checked
Survey that the moving direction of object is vertical and vertical with the short transverse of above-mentioned framework 11, above-mentioned detection electrode portion 23 includes multiple along the
The film thickness detection chip 231 of one direction arrangement.Wherein, the first plane is the table with the short transverse perpendicular to above-mentioned framework 11
Face, first direction are vertical with the moving direction of above-mentioned object to be detected and vertical with the short transverse of above-mentioned framework 11.It is specific each
The position relationship of a structure is shown in Fig. 1.
Object to be detected in the embodiment is bank note, using the thickness and light of Multifunctional image sensor detection bank note
When learning image, image detecting element is read out the optical image information of bank note identification, and Thickness sensitivity unit is to the thickness of bank note
Degree information is read out identification, and resolution ratio of the optical detection chip 13 with Thickness sensitivity chip in a first direction is identical.Image
Detection unit is identical with the control signal of Thickness sensitivity unit, and the output format for detecting signal is also identical.The two resolution ratio is all
100DPI；It is powered, is specifically powered using 3.3V, using identical CLK clock references using identical power supply and earth signal
Signal and SI controls model are driven, and reference voltage is identical VREF voltages, and output signal is believed for the simulation of same format
Number.
The Multifunctional image sensor integrates optical image information and reads and thickness information identification, the multifunctional image
The film thickness sensor of sensor uses ito thin film electrode, and ito thin film electrode is arranged at the light-transmitting plate 16 of image detecting element
On, detection electrode portion 23 includes film thickness detection chip 231, and therefore, which has detection sensitivity height, detection
The high advantage of precision, the Multifunctional image sensor ito thin film electrode are arranged on the light-transmitting plate 16 of image detecting element, realize
Seamless connection between the common electrode 21 of image detecting element and film thickness sensor, it is rational in infrastructure compact, it ensure that away paper money
It is smooth, the volume of the Multifunctional image sensor is greatly reduced, for the miniaturization of finance device complete machine highly significant, simultaneously
It is low using the Multifunctional image sensor production cost of ito thin film electrode, it makes simply, substantially reduces multifunctional image sensing
The fabrication cycle of device is suitable for high-volume and makes production.
Embodiment 2
As shown in figure 3, the Multifunctional image sensor includes Thickness sensitivity unit and image detecting element, wherein, figure
As detection unit include framework 11, wiring board 12, multiple optical detection chips 13 spaced along the first direction, light source 15,
Lens 14, the first light-transmitting plate 161 and the second light-transmitting plate 162.Thickness sensitivity unit includes common electrode 21, protective film 22 and inspection
Go out electrode portion 23, wherein, common electrode 21 is arranged on the second light-transmitting plate 162, and the second light-transmitting plate 162 and common electrode 21
It avoids light source 15 and lens 14 is set, i.e., 21 corresponding first view field of common electrode projects with lens 14 the corresponding 3rd
Region and 15 corresponding second view field of light source do not have the part overlapped, and common electrode 21 is ito thin film electrode.
Wherein, the first plane is surface with the short transverse perpendicular to above-mentioned framework, first direction with it is above-mentioned to be detected
The moving direction of object is vertical and vertical with the short transverse of above-mentioned framework, and above-mentioned detection electrode portion 23 includes multiple along first party
To the film thickness detection chip 231 of arrangement.Wherein, first direction it is vertical with the moving direction of above-mentioned object to be detected and with above-mentioned framework
Short transverse it is vertical.The position relationship of specific each structure is shown in Fig. 3.
The Multifunctional image sensor of the present embodiment includes two independent light-transmitting plates 16, i.e. the first light-transmitting plate 161 and the
Two light-transmitting plates 162 can effectively avoid common electrode 21 and protective film 22 from impacting the light path of image detecting element, and
Since ito thin film electrode and protective film 22 are arranged on the second light-transmitting plate 162, it makes simple, it is easy to accomplish, also make
Demolition and maintenance can individually be carried out by obtaining image detecting element and Thickness sensitivity unit.First light-transmitting plate 161 and the second light-transmitting plate 162
Different host materials can be selected to make as needed, while be examined according to the reading position and thickness for connecing image detecting element
Survey the interchannel of unit away from needs, two light-transmitting plates 16 could be provided as different thickness, are independent of each other therebetween.
Embodiment 3
As shown in figure 5, the Multifunctional image sensor includes Thickness sensitivity unit and image detecting element, wherein, figure
As detection unit include framework 11, wiring board 12, multiple optical detection chips 13 spaced along the first direction, light source 15,
Lens 14 and light-transmitting plate 16.Thickness sensitivity unit includes common electrode 21, protective film 22 and detection electrode portion 23, wherein,
Common electrode 21 is arranged on light-transmitting plate 16, and the surface of the separate framework 11 of light-transmitting plate 16 is completely covered, and common electrode 21
For ito thin film electrode, protective film 22 is Si3N4-SiO2The transparent protective film that based material is formed.
Wherein, first direction is vertical and vertical with the short transverse of above-mentioned framework with the moving direction of above-mentioned object to be detected,
Above-mentioned detection electrode portion 23 includes multiple film thickness detection chips 231 arranged in the first direction.Wherein, the first plane is with hanging down
Directly in the surface of the short transverse of above-mentioned framework, first direction it is vertical with the moving direction of above-mentioned object to be detected and with above-mentioned framework
Short transverse it is vertical.The position relationship of specific each structure is shown in Fig. 5.
In the Multifunctional image sensor, common electrode 21 is completely covered on to the table of the separate framework 11 of light-transmitting plate 16
Face, and protective layer is completely covered the surface of the separate light-transmitting plate 16 of common electrode 21, the light-transmitting plate 16 of Multifunctional image sensor,
Ito thin film electrode and 22 production process of protective film are simple, at low cost, it is easy to accomplish.Simultaneously as the separate framework of light-transmitting plate 16
The entire plane domain on 11 surface is provided with ito thin film electrode, is conducive to improve the voltage stability of ito thin film electrode, into
And improve the detection sensitivity of Thickness sensitivity unit.Ito thin film electrode can be selected with protective film 22 to image detecting element light path
It does not influence, and 15 luminous intensity of image detecting element light source is made without the transparent material decayed；If ito thin film electrode
Have an impact with protective film 22 to image detecting element refraction of light path rate, can figure be adjusted to the refracting characteristic of light path according to material
As the internal structure of detection unit, ensure effective reading to the optical imagery of bank note to be detected, and according to material to light source 15
The attenuation degree of brightness is taken and improves the measures such as 15 brightness of light source to ensure reading of the image detecting element to banknote image information
Sensitivity.
It can be seen from the above description that the application the above embodiments realize following technique effect：
The Multifunctional image sensor of the application is integrated with image detecting element and Thickness sensitivity unit, can be real simultaneously
The existing detection of optical imagery of object to be detected and the detection of thickness, also, the film thickness detection in the Multifunctional image sensor
Unit is set directly on the mounting portion of image detecting element so that the integrated morphology of the Multifunctional image sensor is simpler
It is single, and small volume, integrated level are higher.
The foregoing is merely the preferred embodiments of the application, are not limited to the application, for the skill of this field
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent substitution, improvement etc., should be included within the protection domain of the application.
Claims (14)
1. a kind of Multifunctional image sensor, which is characterized in that the Multifunctional image sensor includes：
Image detecting element, for detecting the optical image information of object to be detected, and described image detection unit includes mounting portion；
And
Thickness sensitivity unit, for detecting the thickness information of the object to be detected, and the part-structure of the Thickness sensitivity unit
It is arranged on the exposed surface of the mounting portion.
2. Multifunctional image sensor according to claim 1, which is characterized in that the Thickness sensitivity unit includes common
Electrode (21), the common electrode (21) are arranged on the exposed surface of the mounting portion.
3. Multifunctional image sensor according to claim 1 or 2, which is characterized in that described image detection unit includes
Also framework (11), the framework (11) is interior to have multiple accommodating chambers, and the mounting portion is arranged on the outer surface of the framework (11)
On.
4. Multifunctional image sensor according to claim 3, which is characterized in that the framework (11) further includes installation
Slot, the mounting portion are arranged in the mounting groove.
5. Multifunctional image sensor according to claim 3, which is characterized in that described image detection unit further includes：
At least one light-transmitting plate (16), the light-transmitting plate (16) are arranged on the surface away from the accommodating chamber of the framework (11)
On, one of them described light-transmitting plate (16) is the mounting portion, and the part-structure of the Thickness sensitivity unit is arranged on described
On the surface away from the framework (11) of tabula rasa (16).
6. Multifunctional image sensor according to claim 5, which is characterized in that there are three described for framework (11) tool
Accommodating chamber, respectively the first accommodating chamber, the second accommodating chamber and the 3rd accommodating chamber, first accommodating chamber, second accommodating chamber
With the mutually isolated setting of the 3rd accommodating chamber, described image detection unit further includes：
Light source (15) is arranged in first accommodating chamber, for being irradiated to the object to be detected；And
Lens (14) are arranged in second accommodating chamber and are arranged on the one side of the light source (15), and the lens (14) are used
In reflected light of the reception from the object to be detected.
7. Multifunctional image sensor according to claim 6, which is characterized in that the height perpendicular to the framework (11)
The surface in direction is the first plane, and the part-structure for being arranged on the Thickness sensitivity unit of the mounting portion is flat described first
The first view field is projected as on face, the light source (15) is projected as the second view field, institute in first plane
It states lens (14) and is projected as the 3rd view field, second view field and the described first projection in first plane
Region does not have the part overlapped, and the 3rd view field does not have the part overlapped with first view field.
8. Multifunctional image sensor according to claim 7, which is characterized in that described image sensor is included between two
Every the light-transmitting plate (16) of setting, respectively the first light-transmitting plate (161) and the second light-transmitting plate (162), wherein, described second thoroughly
Tabula rasa (162) is the mounting portion, and first light-transmitting plate (161) is projected as the 4th projected area in first plane
Domain, second view field and the 3rd view field are located at the inside of the 4th view field.
9. Multifunctional image sensor according to claim 6, which is characterized in that the height perpendicular to the framework (11)
The surface in direction is the first plane, and the part-structure for being arranged on the Thickness sensitivity unit of the mounting portion is flat described first
The first view field is projected as on face, the light source (15) is projected as the second view field, institute in first plane
It states lens (14) and is projected as the 3rd view field in first plane, second view field and the described 3rd throw
Shadow zone domain is located at the inside of first view field, and the portion of the Thickness sensitivity unit for being arranged on the mounting portion
Separation structure is transparent configuration.
10. Multifunctional image sensor according to claim 6, which is characterized in that described image detection unit further includes：
Wiring board (12) is arranged in the 3rd accommodating chamber and is arranged on the separate light-transmitting plate (16) of the lens (14)
One side；And
Multiple optical detection chips (13) are arranged on the wiring board (12) in the 3rd accommodating chamber and positioned at the line
Between road plate (12) and the lens (14), and each optical detection chip (13) has photosensitive window, the photosensitive window
For receiving emergent light of the reflected light of the object to be detected after the lens (14), each optical detection chip (13)
For the optical information of emergent light to be converted into electric signal, multiple optical detection chips (13) are alternatively arranged along the first direction,
The first direction is vertical with the moving direction of the object to be detected.
11. Multifunctional image sensor according to claim 2, which is characterized in that the Thickness sensitivity unit further includes：
Electrode portion (23) is detected, is spaced on the thickness direction of the common electrode (21) with the common electrode (21) and opposite
It sets, and the detection electrode portion (23) includes spaced multiple film thickness detection chips (231) in a second direction, described the
Two directions and the moving direction of the object to be detected and the thickness direction of the common electrode (21) are vertical.
12. Multifunctional image sensor according to claim 2, which is characterized in that the Thickness sensitivity unit further includes：
Protective film (22) is arranged on the surface away from the mounting portion of the common electrode (21).
13. Multifunctional image sensor according to claim 2, which is characterized in that described image detection unit and institute
It is identical to state resolution ratio of the Thickness sensitivity unit on main scanning direction, the control signal of described image detection unit and the thickness
It is identical to spend the form of the control signal of detection unit, and the detection signal of the output of described image detection unit is examined with the thickness
It is identical to survey the form of the detection signal of the output of unit, wherein, the moving direction of the main scanning direction and the object to be detected
And the thickness direction of the common electrode (21) is vertical.
14. Multifunctional image sensor according to claim 2, which is characterized in that the common electrode (21) is thin for ITO
Membrane electrode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721277071.1U CN207397373U (en) | 2017-09-29 | 2017-09-29 | Multifunctional image sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721277071.1U CN207397373U (en) | 2017-09-29 | 2017-09-29 | Multifunctional image sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107610315A (en) * | 2017-09-29 | 2018-01-19 | 威海华菱光电股份有限公司 | Multifunctional image sensor |
| CN110491014A (en) * | 2019-08-26 | 2019-11-22 | 深圳市合众金融设备服务有限公司 | Automatically estimate paper money case and estimate paper money method automatically |
-
2017
- 2017-09-29 CN CN201721277071.1U patent/CN207397373U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107610315A (en) * | 2017-09-29 | 2018-01-19 | 威海华菱光电股份有限公司 | Multifunctional image sensor |
| WO2019062421A1 (en) * | 2017-09-29 | 2019-04-04 | 威海华菱光电股份有限公司 | Multifunctional image sensor |
| CN110491014A (en) * | 2019-08-26 | 2019-11-22 | 深圳市合众金融设备服务有限公司 | Automatically estimate paper money case and estimate paper money method automatically |
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