CN111122924B - Probe alignment apparatus - Google Patents
Probe alignment apparatus Download PDFInfo
- Publication number
- CN111122924B CN111122924B CN201811286959.0A CN201811286959A CN111122924B CN 111122924 B CN111122924 B CN 111122924B CN 201811286959 A CN201811286959 A CN 201811286959A CN 111122924 B CN111122924 B CN 111122924B
- Authority
- CN
- China
- Prior art keywords
- light
- probe
- image
- emitting surface
- alignment apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C11/00—Photogrammetry or videogrammetry, e.g. stereogrammetry; Photographic surveying
- G01C11/02—Picture taking arrangements specially adapted for photogrammetry or photographic surveying, e.g. controlling overlapping of pictures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a probe alignment device, which is used for aligning a probe element to an object to be detected. The probe alignment apparatus includes a light splitting device and an image sensing device. The light splitting element is arranged between the object to be detected and the probe element. The light splitting element has a first light emergent surface, a second light emergent surface and a light incident surface. The first light-emitting surface and the second light-emitting surface respectively face the probe element and the object to be tested. The image sensing device is arranged on a light incident surface of the light splitting element. The light splitting element transmits a probe element image received by the first light-emitting surface and an object image to be detected received by the second light-emitting surface to the outside through the light-incident surface. The image sensing device captures the probe element image and the object image to be detected for alignment.
Description
Technical Field
The present invention relates to the field of semiconductor testing, and more particularly, to a probe alignment apparatus.
Background
The semiconductor point test technique is to utilize the probe to contact directly with the test point of the object to be tested, to lead out the signal, and then to cooperate with the peripheral test instrument to achieve the test purpose. In order to make the probe accurately contact the test point, the alignment (alignment) of the probe is an important key of the semiconductor point testing technology.
FIG. 1 is a schematic diagram of a conventional probe alignment apparatus 10. As shown in fig. 1, a conventional probe alignment apparatus 10 requires two sets of image capture modules 12 and 14 for alignment. One set of image capturing modules 12 is used to scan an object 16 to be tested, such as a wafer, to obtain a scanned image of the surface of the object 16, and the other set of image capturing modules 14 is usually disposed beside the carrier 11 of the object 16 to obtain an image of a specific tip of the probe card 18. The two images are analyzed and compared through image processing to obtain the corresponding XY coordinates.
The two image capturing modules 12 and 14 are independent. Therefore, the conventional probe alignment apparatus 10 cannot obtain a scanning image (such as an electrode pad, a probe needle trace, etc.) of the surface of the object 16 to be measured and a tip image on the same axis for calibration, which easily affects the probe alignment accuracy.
Disclosure of Invention
In view of the above, a primary objective of the present invention is to provide a probe alignment apparatus, which can align the surface image, the probe needle trace and the tip image of the object to be tested on the same axis to improve the accuracy of probe alignment.
The probe alignment equipment of the invention is used for aligning a probe element to an object to be detected. The probe alignment apparatus includes a light splitting device and an image sensing device. The light splitting element is arranged between the object to be detected and the probe element. The light splitting element is provided with a first light-emitting surface, a second light-emitting surface and a light-entering surface. The first light-emitting surface and the second light-emitting surface respectively face the probe element and the object to be tested. The image sensing device is arranged on the light incident surface of the light splitting element. The light splitting element transmits a probe element image received by the first light-emitting surface and an object image to be detected received by the second light-emitting surface to the outside through the light-incident surface. The image sensing device captures the probe element image and the object image to be detected for alignment.
The probe alignment equipment provided by the invention can align the surface image, the probe needle trace and the needle point image of the object to be detected on the same axis. Therefore, on one hand, the alignment accuracy of the probe can be improved, and on the other hand, the complexity of image analysis and calculation is also reduced.
The present invention will be further described with reference to the following embodiments and drawings.
Drawings
FIG. 1 is a schematic diagram of a conventional probe alignment apparatus.
FIG. 2 is a schematic diagram of a first embodiment of the probe alignment apparatus of the present invention.
FIG. 3 is a schematic diagram of a second embodiment of the probe alignment apparatus of the present invention.
FIG. 4 is a schematic diagram of a third embodiment of the probe alignment apparatus of the present invention.
FIG. 5 is a schematic view of a fourth embodiment of the probe alignment apparatus of the present invention.
Wherein, the reference numbers:
10,100,200,300,400 probe alignment apparatus
12,14 image capturing module
16,30 test substance
18 probe card
20 Probe element
11,110 stage
120 light source
140 light-splitting element
160 light reflecting element
180 image sensing device
270 light path changing element
272,274 shield
370 light shielding element
430 ring light source
A1 first light-emitting surface
A2 second light-emitting surface
A3 incident surface
A4 semi-penetrating reflecting surface
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to scale, which is intended merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
FIG. 2 is a schematic diagram of a first embodiment of the probe alignment apparatus 100 of the present invention. The probe alignment apparatus 100 is used to align a probe device 20, such as a probe card (probe card), with an object 30, such as a wafer (wafer), a chip or a circuit. Specifically, the probe alignment apparatus 100 is used to align the tips of the probe elements 20 with the contact pads on the object 30 for performing a subsequent spot-test procedure.
As shown in the figure, the probe alignment apparatus 100 includes a carrier 110, a light source 120, a light splitting element 140, a light reflecting element 160, and an image sensing device 180.
The carrier 110 is used for fixing the object 30. In one embodiment, the carrier 110 is a movable carrier that is movable in a horizontal direction. The light source 120 is used for generating light to be projected to the probe device 20 and the object 30 to be tested so as to generate an image of the probe device 20 and the object 30 to be tested.
The light splitting element 140 is disposed between the object 30 and the probe element 20. The light splitting element 140 has a first light emitting surface a1, a second light emitting surface a2, and a light incident surface A3. The first light-emitting surface a1 and the second light-emitting surface a2 face the probe element 20 and the object 30 to be tested, respectively.
In this embodiment, the light source 120 of the probe alignment apparatus 100 is a coaxial light source. That is, the light source 120 is aligned with the light incident surface a3 of the light splitting element 140, and the light generated by the light source 120 is split into two beams by the light splitting element 140 and is projected onto the probe element 20 and the object 30 to be measured (as shown by the arrows in the figure).
In the embodiment, the first light-emitting surface a1 and the second light-emitting surface a2 are located at two opposite sides (i.e., the upper and lower sides in fig. 2) of the light-splitting element 140. In one embodiment, the beam splitter 140 is a beam splitter (e.g., a light-transmitting cube shown in the figure). The transparent block is composed of two triangular transparent prisms. The joint surfaces of the two triangular light-transmitting prisms form a semi-penetrating reflecting surface A4 to achieve the purpose of light splitting.
The light reflection element 160 is disposed on the opposite side of the light incident surface a3 of the light splitting element 140. After the light generated by the light source 120 is projected to the transflective surface a4, a portion of the light is reflected upward to the first light emitting surface a1 through the transflective surface a4 and is projected to the probe device 20 through the first light emitting surface a1, and a portion of the light is projected to the light reflecting element 160, such as a light reflecting coating, through the transflective surface a4, is reflected back to the transflective surface a4 and is reflected downward to the second light emitting surface a2 through the transflective surface a4 to be projected to the object 30.
Due to the reversibility of the light path, the reflected light beams from the probe device 20 and the object 30 enter the light splitting device 140 through the first light emitting surface a1 and the second light emitting surface a2, respectively, and form the same light beam which is projected outward from the light incident surface A3. Accordingly, the light splitting element 140 can receive the images from the first light emitting surface a1 and the second light emitting surface a2, so that the images from the first light emitting surface a1 and the second light emitting surface a2 converge at the same axial center position and are projected outward from the light incident surface A3.
It should be noted that the light-emitting surface and the light-entering surface are defined according to the state of the light splitting element 140 for light splitting. In this embodiment, the light incident surface also emits light, and the light emitting surface also emits light.
The image sensor 180 is disposed on the light incident surface A3 of the light splitter 140 for receiving images from the first light emitting surface a1 and the second light emitting surface a 2. The image sensor device 180 may be a photo-coupled device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) device. Further, the light splitting element 140 transmits an image of the probe device received by the first light emitting surface a1 and an image of the object to be measured received by the second light emitting surface a2 to the outside through the light incident surface A3. The image sensor 180 captures the probe device image and the object image for alignment. In one embodiment, the image sensor 180 captures the probe device image and the object image simultaneously for alignment, for example, the two images are overlapped for comparison. However, the present invention is not limited thereto. In another embodiment, the image sensor 180 can capture the image of the object to be tested for analysis, and then capture the image of the probe device for alignment.
Accordingly, the image from the first light emitting surface a1 is projected to the light incident surface A3 of the light splitter 140 by the reflection of the semi-transparent reflection surface a 4; the image from the second light emitting surface a2 is reflected by the semi-transmissive reflective surface a4, projected to the light reflective element 160, and then reflected by the light reflective element 160, projected to the light incident surface A3 of the light splitting element 140.
It should be noted that, in the present embodiment, the image sensing device 180 can be used for not only obtaining the probe device image for alignment, but also scanning the object 30 to obtain the scanning image of the surface of the object 30. Therefore, the probe alignment apparatus 100 can obtain the scanning image (such as the electrode pads, the probe stitches, etc.) of the surface of the object 30 to be tested and the tip image of the probe element 20 on the same axis for calibration, so as to improve the accuracy of probe alignment. In addition, since the probe alignment apparatus 100 can obtain the scanning image and the tip image of the surface of the object 30 to be measured on the same axis for comparison and calibration, the probe alignment apparatus 100 can also reduce the dependence of the point measurement alignment procedure on the software image processing, and even directly overlay the probe element image and the object image for alignment, so as to simplify the point measurement alignment procedure and reduce the equipment cost.
In one embodiment, the light source 120, the light splitting element 140, the light reflecting element 160 and the image sensing device 180 are integrated into a single image capturing module, and the image capturing module and the carrier 110 are independent from each other. When the scan image of the surface of the object 30 needs to be obtained, the carrier 110 can be controlled to move, so as to change the relative position between the object 30 and the image capturing module (especially, the second light emitting surface a2), so as to obtain the scan image of the surface of the object 30. When the probe device image needs to be obtained for alignment, the probe device 20 or the image capturing module can be controlled to move.
Figure 3 is a schematic diagram of a second embodiment of a probe alignment apparatus 200 of the present invention. Compared to the embodiment shown in fig. 2, the probe alignment apparatus 200 of the present embodiment further includes a light path changing element 270 disposed on the light splitting element 140 for selectively shielding the first light-emitting surface a1 or the second light-emitting surface a 2. In one embodiment, as shown in the figure, the light path changing element 270 includes two shielding plates 272 and 274, and the two shielding plates 272 and 274 are movably disposed on the upper and lower sides of the light splitting element 140 for selectively shielding the first light emitting surface a1 or the second light emitting surface a 2.
When the image sensing device 180 needs to capture the object image from the second light emitting surface a2 for analysis, for example, when the surface of the object 30 needs to be scanned, the shielding plate 272 of the light path changing element 270 may be used to shield the first light emitting surface a1, so as to prevent the probe element image from the first light emitting surface a1 from interfering with the captured object image. On the contrary, when the image sensor 180 needs to capture the probe device image from the first light-emitting surface a1 for alignment, the shielding plate 274 of the light path changing element 270 can be used to shield the second light-emitting surface a2, so as to prevent the object image from the second light-emitting surface a2 from interfering with the captured probe device image.
FIG. 4 is a schematic diagram of a third embodiment of a probe alignment apparatus 300 of the present invention. Compared to the embodiment of fig. 2, the probe alignment apparatus 300 of the present embodiment further includes a light shielding element 370 movably disposed on the light splitting element 140 for selectively shielding the first light emitting surface a 1. In one embodiment, the light shielding element 370 is a shutter.
When the image sensor 180 needs to capture the object image from the second light-emitting surface a2 for analysis, for example, when the surface of the object 30 needs to be scanned, the light shielding element 370 can be used to shield the first light-emitting surface a1, so as to prevent the probe element image from the first light-emitting surface a1 from interfering with the captured object image. When the image sensor device 180 needs to capture the probe device image for alignment, the light shielding device 370 can be removed to obtain the probe device image from the first light emitting surface a 1.
Figure 5 is a schematic diagram of a third embodiment of a probe alignment apparatus 400 of the present invention. Compared to the embodiment of fig. 4, the probe alignment apparatus 400 of the present embodiment further includes a ring light source 430 disposed between the light splitting device 140 and the probe device 20. In the present embodiment, the ring light source 430 is used as an auxiliary light source to project light to the probe element 20. The opening in the center of the ring light source 430 prevents the probe element image from the probe element 20 from being blocked. By using the ring light source 430, the brightness and contrast of the probe element image can be improved, which is helpful for improving the accuracy of probe alignment.
In the above embodiment, the ring light source 430 is disposed between the light splitting element 140 and the probe element 20 to project light to the probe element 20. However, the present invention is not limited thereto. In another embodiment, the ring light source may be disposed between the light splitting element 140 and the object 30 to project light to the object 30. In addition, in another embodiment, a ring light source with two-sided light emission may be provided to project light to the probe device 20 and the object 30 to be tested, instead of the light source 120 shown in the figure.
The probe alignment equipment provided by the invention can align the surface image, the probe needle trace and the needle point image of the object to be detected on the same axis. Therefore, on one hand, the alignment accuracy of the probe can be improved, and on the other hand, the complexity of image analysis and calculation is also reduced.
The above description is only for the preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (9)
1. A probe alignment apparatus for aligning a probe device to an object to be tested, the probe alignment apparatus comprising:
a light splitting element arranged between the object to be detected and the probe element, the light splitting element having a first light-emitting surface, a second light-emitting surface and a light-in surface, the first light-emitting surface and the second light-emitting surface respectively facing the probe element and the object to be detected, the light splitting element being composed of two triangular light-transmitting prisms, and the joint surfaces of the two triangular light-transmitting prisms constituting a semi-penetrating reflecting surface, so that the light passing through the light-in surface is reflected by the semi-penetrating reflecting surface and projected to the probe element;
an image sensing device arranged on the light incident surface of the light splitting element; and
a light reflection element arranged at the opposite side of the light incident surface of the light splitting element so that part of the light penetrating through the semi-penetrating reflection surface is reflected back to the semi-penetrating reflection surface through the light reflection element and projected to the object to be measured;
the light splitting element transmits a probe element image received by the first light-emitting surface and an object image to be detected received by the second light-emitting surface to the outside through the light-in surface, and the image sensing device is used for capturing the probe element image and the object image to be detected for alignment.
2. The probe alignment apparatus according to claim 1, wherein the first light-emitting surface and the second light-emitting surface are located on opposite sides of the beam splitter.
3. The probe alignment apparatus of claim 1, wherein the beam splitting element is a beam splitter.
4. The probe alignment apparatus of claim 1, further comprising a light path changing element movably disposed on the beam splitter for selectively shielding the first light-emitting surface or the second light-emitting surface.
5. The probe alignment apparatus according to claim 1, further comprising a light shielding element movably disposed on the beam splitter for selectively shielding the first light-exiting surface.
6. The apparatus of claim 1, further comprising a light source aligned to the light incident surface of the light splitting element to project light to the probe element and the object to be measured through the light splitting element.
7. The probe alignment apparatus of claim 6, wherein the light source is a coaxial light source.
8. The apparatus of claim 6, further comprising a ring light source disposed between the beam splitter and the probe device for projecting light to the probe device, or disposed between the beam splitter and the test object for projecting light to the test object.
9. The probe alignment apparatus of claim 1, wherein the image sensor is configured to scan the object to be tested through the beam splitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811286959.0A CN111122924B (en) | 2018-10-31 | 2018-10-31 | Probe alignment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811286959.0A CN111122924B (en) | 2018-10-31 | 2018-10-31 | Probe alignment apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111122924A CN111122924A (en) | 2020-05-08 |
| CN111122924B true CN111122924B (en) | 2022-05-17 |
Family
ID=70485707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811286959.0A Active CN111122924B (en) | 2018-10-31 | 2018-10-31 | Probe alignment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111122924B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117075022A (en) * | 2023-10-16 | 2023-11-17 | 深圳市道格特科技有限公司 | Multi-performance test universal equipment for probe card |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1295242A (en) * | 2000-12-08 | 2001-05-16 | 中国科学院上海光学精密机械研究所 | Device for detecting small light spot of objective lens of optical disc |
| CN2577274Y (en) * | 2002-10-24 | 2003-10-01 | 中国科学院上海光学精密机械研究所 | Observation device of scanning probe microscope |
| TW200945465A (en) * | 2008-04-25 | 2009-11-01 | Chroma Ate Inc | Intermediary optical sensing device and high-precision semiconductor device testing machine |
| CN104006891A (en) * | 2014-05-29 | 2014-08-27 | 清华大学 | Device for measuring nano-scale light field phase distribution |
| TW201437605A (en) * | 2013-03-27 | 2014-10-01 | Academia Sinica | Optical detection system and interference controlling method thereof |
| CN104536148A (en) * | 2014-12-20 | 2015-04-22 | 中国科学院西安光学精密机械研究所 | Device and method for realizing rapid alignment of light beams of mirror surface position indicator |
| CN204807597U (en) * | 2015-01-12 | 2015-11-25 | 豪勉科技股份有限公司 | Equipment capable of automatically adjusting point measurement position according to images of object to be measured and needle point |
| DE102015013770A1 (en) * | 2014-10-23 | 2016-04-28 | Cognex Corporation | System and method for calibrating an image processing system with respect to a probe |
| CN207613757U (en) * | 2017-05-05 | 2018-07-17 | 中国人民武装警察部队总医院 | Fluorescent endoscopic imgaing system |
| CN109950191A (en) * | 2019-03-20 | 2019-06-28 | 纳研科技(上海)有限公司 | A kind of vision system and alignment methods of double-sided alignment |
-
2018
- 2018-10-31 CN CN201811286959.0A patent/CN111122924B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1295242A (en) * | 2000-12-08 | 2001-05-16 | 中国科学院上海光学精密机械研究所 | Device for detecting small light spot of objective lens of optical disc |
| CN2577274Y (en) * | 2002-10-24 | 2003-10-01 | 中国科学院上海光学精密机械研究所 | Observation device of scanning probe microscope |
| TW200945465A (en) * | 2008-04-25 | 2009-11-01 | Chroma Ate Inc | Intermediary optical sensing device and high-precision semiconductor device testing machine |
| TW201437605A (en) * | 2013-03-27 | 2014-10-01 | Academia Sinica | Optical detection system and interference controlling method thereof |
| CN104006891A (en) * | 2014-05-29 | 2014-08-27 | 清华大学 | Device for measuring nano-scale light field phase distribution |
| DE102015013770A1 (en) * | 2014-10-23 | 2016-04-28 | Cognex Corporation | System and method for calibrating an image processing system with respect to a probe |
| CN104536148A (en) * | 2014-12-20 | 2015-04-22 | 中国科学院西安光学精密机械研究所 | Device and method for realizing rapid alignment of light beams of mirror surface position indicator |
| CN204807597U (en) * | 2015-01-12 | 2015-11-25 | 豪勉科技股份有限公司 | Equipment capable of automatically adjusting point measurement position according to images of object to be measured and needle point |
| CN207613757U (en) * | 2017-05-05 | 2018-07-17 | 中国人民武装警察部队总医院 | Fluorescent endoscopic imgaing system |
| CN109950191A (en) * | 2019-03-20 | 2019-06-28 | 纳研科技(上海)有限公司 | A kind of vision system and alignment methods of double-sided alignment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111122924A (en) | 2020-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101074560B1 (en) | Microscope and sample observing method | |
| KR101808388B1 (en) | Probe apparatus and probe method | |
| US20040109170A1 (en) | Confocal distance sensor | |
| KR20030082992A (en) | Probing method and device | |
| KR101185205B1 (en) | Probing apparatus with on-probe device-mapping function | |
| US11402200B2 (en) | Measuring device, observing device and measuring method | |
| US20160364854A1 (en) | Inspection system and method for defect analysis of wire connections | |
| JP2010522441A (en) | Semiconductor wafer foreign matter inspection and repair system and method | |
| TW201716770A (en) | Substrate detection device and method thereof | |
| TWI674413B (en) | Probe pin alignment apparatus | |
| CN111122924B (en) | Probe alignment apparatus | |
| TWI673528B (en) | Solid state immersion lens holder and image acquisition device | |
| JP6684992B2 (en) | Projection inspection device and bump inspection device | |
| US11967061B2 (en) | Semiconductor apparatus examination method and semiconductor apparatus examination apparatus | |
| JP2010190668A (en) | Method of optical inspection and optical inspection device | |
| CN114543706A (en) | Differential light line-cutting and profile-scanning technique based on incoherent light source multi-angle projection | |
| US6842260B2 (en) | Imaging system and method for positioning a measuring tip onto a contact region of a microchip | |
| CN215525579U (en) | Detection equipment | |
| JP2001513594A (en) | Method and apparatus for position detection and / or coplanarity inspection and / or separation inspection of device terminals | |
| CN117238785A (en) | Detection device and detection equipment | |
| JPH02272514A (en) | Method for positioning optical cutting microscope device and its optical means | |
| TW202210825A (en) | Method and device for inspecting object defects capable of directly capturing a grating image that is refracted to and then reflected by only a single light source, thereby avoiding interference caused by direct illumination of the light source | |
| TWI407781B (en) | Testing line-pairs chart board, system and method for testing an optical resolution of a lens | |
| JPH04155844A (en) | Semiconductor inspecting device | |
| JP2006319257A (en) | Inspecting device for light emitting element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |