200847864 九、發明說明： 【發明所屬之技術領域】 本發明涉及印刷電路板（PCB板）的製造技術領域， 具體的講’涉及一種在印刷電路板上深度鑽孔的方法。 【先前技術】 印刷電路板深度鑽孔是利用機械鑽孔的方式將一個貫 孔鑽成由一部分貫孔與一部分不貫孔組成的孔，不貫孔的 φ 深度通常控制在某兩個内層之間且深度精度控制在± 1 mn (千分之一寸）（如第1圖所示，L1…Ln:代表第1到n層）。 現有的印刷電路板深度鑽孔方法是採用夾頭導電回饋 系統’如第2圖所示，利用現行的深度鑽孔機台3在生産 板表面加上一張導電的鋁蓋板彳，鑽針2尾端通過導電開關 3，導電夾頭4與生産板相接，接通導電開關3，鑽針2接 觸鋁蓋板1時在機台内部形成控制回路，從鋁蓋板彳上表 面開始計算往下鑽設定的深度，在鑽針2接觸到鋁蓋板巧 鲁時，機台控制裝置會記錄下此時sp丨NDLE的2軸。然後， 機口控制裝置再根據下鑽深度的内部命令，通過光學尺控 制下鑽深度。 現有技術的缺點： (1 )、機台只能控制從金屬表面接觸點開始計算的下 鑽深度的精度而不能隨著板厚的變化而改變每次的下鑽深 度攸而達到所要求的作業量産板時所需要的±⑺"的深度 控制精度。 (2 )、因爲使用鋁蓋板存在鋁蓋板與生產板之間的結 5 200847864 合的差異，這也會影響鑽孔的精度。 由於存在上述缺陷，因此目前印刷電路板深度鑽孔作 業得到的不貫孔的深度精度一般只能控制在±2 ·5m·〖丨以上。 【發明内容】 本發明的目的是提供一種新的印刷電路板深度鑽孔方 法，該方法通過讓機台自動根據印刷電路板厚均勻性設定 下鑽深度，從而提升鑽孔的控制糈度，有效的控制板厚變 _ 異帶來的對深度鑽孔精度的影響。 爲了達到上述技術效果，本發明提供了下述技術方案： 印刷電路板深度鑽孔採用如下步驟： (1) 、確定印刷電路板與機台相接觸的平面爲標準平 面，由機台記錄下標準平面上印刷電路板的相對應的每個 點的貫際位置咼度Hn’並存儲入機台存儲軟體中； (2) 、選定目標層，設定標準下鑽深度[)1及標準板 厚H1存入存儲軟體中丄其餘各點的下鑽深度爲如= • D1*Hn/H1+補償值，根據點的下鑽深度Dn重新設定鑽孔 程式中的鑽孔參數，更新機台存儲軟體内的各參數； (3) 、將機台控制軟體中的程式控制指令根據值 做相應更改並執行鑽孔程式。 所述步驟（2)中的補償值應t滿足目標層*被鑽斷並 同時滿足目標層向上層方向上的殘留的孔銅的長度儘量保 持在同一長度。 μ 本發明效果在於： ⑴、可以降低板厚均勻性對精度産生的影響從而提 6 200847864 升鑽孔的控制精度； (2； 度的影響 【實施方式】 、可以有效的控制板厚變異帶來的對深度鑽孔精 用新型做進一 現結合附圖說明與具體實施方式 步說明： $ 實施例··如第3圖所示，I合後的印刷電路板（5)厚度 鲁是不均勾的，但是其是有一定的規律的，一般狀況下板厚 _呈現中間厚而兩邊薄的狀況，且變化比較均句。 假設客戶要求我們將深度控制在Lm + 1到Lm+2層之 間’則我們命名Lm + 1層爲目標層，Lm+2層爲目標層：一 層，^層爲目標層下-層。如第3圖所示，如果生產出來 的P刷電路板（5)的板厚均勻性較差而我們深鑽時仍使用舊 的方法’即使用同-種深度下鐵就容易將目標層鑽斷導致 冑4者使Lm + 1層往ι_η層方向計算的殘留孔銅的長度 矂長短不-。因此，需要讓機台自動偵測板子表面，計算出 此時的板子高度’根據不同位置的板厚自動狀下鑽深度。 具體步驟參見第4圖詳述如下： 首先，计异印刷電路板厚以及客戶要求的下鑽深度 值’然後安裝鑽針’（這裏鑽針❹固定鑽針T98，其參數 =定可知）’其次確定印刷電路板與機台相接觸的平面 :準平面由機台控制裝置（包括機台控制軟體MAP DAT 和機台存儲軟體BHGT)記錄下標準平面上印刷電路板的相 對應的每個點的實際位置高度Hi、h2、H3…Hn，並存 7 200847864 儲入機台存儲軟體mapdat中；機台控制裝置記鲦襟準平 面上印刷電路板的每個點的實際位置高度Hn的靼4 狂式指令 爲： Μ48 C#. ## % T01C00037 X#. ##γ#. ## χ#β ##γ#. ## Μ30 再次，選定目標層，根據客戶要求的下鑽深度值設定 標準下鑽深度D1及標準板厚Η1，此時板厚爲最厚位1， 而此時若仍以D1的深度在板邊下鑽（如第3圖中位置） 則會造成下鑽過深的狀況，深度已經鑽到目標居以下·因 此在板邊深度鑽孔則必須使用不同的下鑽深度，如第3 。 中 D3 值（D3<D2 = D1)。其中 D3 = D1*H3/H1+補償值，補^ 值是一個較小的用於微調的資料，目的是爲了保證匕阳+ 1 層不被鑽斷而且保證Lm + 1層往^層方向上殘留的孔銅的 長度要儘量保持在同-長度。機台控制裝置根據下鑽深度 D3重新設定鑽孔程式中的鑽孔參數，更新機台存儲軟體 8 200847864 • MAPDAT 内的各參數；根據各點的下鑽深度Dn重新設定鑽 孔程式中的鑽孔參數的程式控制指令爲： Τ0Τ0:#. ##; SU0T0+:#. ##; SUT0-:#·##; L0DI: #.##; Ζ0Β: #.##; ZZ: #.##; HH: #.##. 最後，機台控制裝置將控制軟體BHGT中的程式控制 指令根據Dn值做相應更改並執行鑽孔程式。更改的程式控 制指令爲； φ T##C#. ## M47, \P:Z112H4.05 M18Z#.# xi m#. ## • M30 通過以上程式控制的實現及執行，機台可以實現精確 量測板厚的功能並同時可以計算下鑽深度並精確的在電路 板（PCB)上做深度鑽孔控制。 測試例：使用此方法作業後，深度控制精度得到明顯 提高。結果如下： 編號 板厚 下鑽深 度值 使用新做法後深 度值 使用新做法前深度值 1.97 2.37 1 218. 1 116.4 2. 36 2. 76 1.77 2. 17 9 200847864 2 218, 5 117· 2 2. 21 3. 41 2. 12 3. 32 2. 12 3· 32 1.49 3. 49 3 222」 1 119.0 1. 15 3· 15 1.32 4. 32 3. 84 1.84 4 217· 1 114.0 3. 59 1.59 3. 38 1· 38 1·87 1.57 5 215. 4 115· 7 1.57 1.27 1. 90 1.60 1.87 3. 37 6 219·: 2 117.5 1. 77 3. 27 1·86 3. 36 3. 33 1. 13 7 211. 5 113· 8 3. 25 1.05 3. 41 1.21 1·08 2. 08 8 117.0 117.0 1.18 2. 18 1·63 2.63 1.92 -0·98 9 113. 1 113. 1 2. 07 -0. 83 2. 32 一 0·58 新做 標準 平均 CP 計算 法 RANGE 2. 76 差 0. 7896 值 2. 1611 值 2. 0429 原做 標準 平均 CP 法 RANGE 5. 30 差 1. 3605 值 2. 0537 值 1.2119 從以上測試資料可以看出，使用新的鑽孔方式後，深 度控制精度得到了明顯的提高’新做法的深度控制的 RANGE (變化範圍）明顯降低（由原來的5_3〇M|L降到 2.76MIL)’ CP值（精確度）也有明顯改善（由1 2^19提升 到 2.0429)。 【圖式簡單說明】 第1圖爲印刷電路板深度鑽孔的示意圖。 第2圖爲現有的深度鑽孔方法的示意圖。 10 200847864 第3圖爲本發明深度鑽孔方法的示意圖。 第4圖完成本發明深度鑽孔的流程圖。 【主要元件符號說明】 (1) 鋁蓋板 (2) 鑽針 (3) 導電開關 (4) 導電夾頭 (5) 印刷電路板BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of manufacturing a printed circuit board (PCB), and in particular relates to a method of deep drilling on a printed circuit board. [Prior Art] Deep drilling of printed circuit boards is to use a mechanical drilling method to drill a through hole into a hole composed of a part of through holes and a part of non-through holes. The depth of the through holes is usually controlled in a certain two inner layers. The depth accuracy is controlled at ± 1 mn (thousandths of an inch) (as shown in Figure 1, L1...Ln: represents the 1st to nth layers). The existing method for deep drilling of printed circuit boards is to use a chuck conductive feedback system. As shown in Fig. 2, a current conductive aluminum cover plate is used on the surface of the production board by using the current deep drilling machine 3, and the drill needle is used. The tail end of the 2 is passed through the conductive switch 3, and the conductive chuck 4 is connected to the production plate, and the conductive switch 3 is turned on. When the drill pin 2 contacts the aluminum cover plate 1, a control loop is formed inside the machine, and the calculation is started from the upper surface of the aluminum cover plate. Drill down the set depth. When the drill needle 2 touches the aluminum cover, the machine control device will record the 2 axes of the sp丨NDLE at this time. Then, the port control device controls the drilling depth through the optical ruler according to the internal command of the drilling depth. Disadvantages of the prior art: (1) The machine can only control the accuracy of the drilling depth calculated from the contact point of the metal surface and cannot change the depth of each drilling as the thickness of the plate changes to achieve the required operation. The depth control accuracy of ±(7)" required for mass production. (2) Because of the difference between the aluminum cover plate and the joint between the aluminum cover plate and the production plate, this will also affect the accuracy of the drill hole. Due to the above-mentioned defects, the depth accuracy of the through-holes obtained by the deep drilling operation of the printed circuit board can generally only be controlled at ±2 · 5 m · 丨 above. SUMMARY OF THE INVENTION It is an object of the present invention to provide a new method for deep drilling a printed circuit board, which improves the control precision of the drill hole by allowing the machine to automatically set the drilling depth according to the uniformity of the printed circuit board thickness, thereby effectively The thickness of the control panel varies depending on the accuracy of the depth drilling. In order to achieve the above technical effects, the present invention provides the following technical solutions: The deep drilling of the printed circuit board uses the following steps: (1), determining that the plane in contact with the printed circuit board and the machine table is a standard plane, and the standard is recorded by the machine. The corresponding position of each printed circuit board on the plane is the degree of humidity Hn' and stored in the machine memory software; (2), the selected target layer, set the standard drilling depth [) 1 and the standard thickness H1 Stored in the storage software, the remaining depth of each point is as follows = • D1*Hn/H1+ compensation value, the drilling parameters in the drilling program are reset according to the drilling depth Dn of the point, and the machine storage software is updated. Each parameter; (3) The program control command in the machine control software is changed according to the value and the drilling program is executed. The compensation value in the step (2) should satisfy the fact that the target layer* is drilled and simultaneously satisfies the length of the residual hole copper in the direction of the upper layer of the target layer as much as possible. μ The effect of the invention lies in: (1) The influence of the uniformity of the thickness of the plate on the accuracy can be reduced, and the control precision of the 200847864 liter drill hole can be improved; (2; the influence of the degree [implementation method] can effectively control the variation of the plate thickness A new type of deep drilling is used in combination with the description of the drawings and the specific implementation steps: $Examples·· As shown in Fig. 3, the thickness of the printed circuit board (5) after I is not uneven However, it has a certain regularity. Under normal conditions, the thickness of the plate is thicker and the sides are thinner, and the changes are more uniform. Suppose the customer asks us to control the depth between Lm + 1 and Lm+2. 'We then named Lm + 1 as the target layer, Lm + 2 as the target layer: one layer, and the ^ layer as the target layer under the layer. As shown in Figure 3, if the P brush circuit board (5) is produced The uniformity of the thickness of the plate is poor and we still use the old method when we drilled deeply. That is, it is easy to use the same depth of the iron to break the target layer, resulting in the residual hole copper calculated by the Lm + 1 layer toward the ι_η layer. The length is not long. Therefore, the machine needs to be automatically detected. Sub-surface, calculate the height of the board at this time 'Automatically drill down according to the thickness of the plate at different positions. The detailed steps are detailed in Figure 4 as follows: First, the difference between the printed circuit board thickness and the customer's required drilling depth value' Then install the drill pin '(where the drill pin fixes the drill pin T98, its parameter = can be known)' secondly determines the plane where the printed circuit board is in contact with the machine table: the quasi-plane is controlled by the machine (including the machine control software MAP DAT) And the machine storage software BHGT) records the actual position height Hi, h2, H3...Hn of each point corresponding to the printed circuit board on the standard plane, and saves 7 200847864 stored in the machine storage software mapdat; machine control device The 狂4 mad command of the actual position height Hn of each point of the printed circuit board on the quasi-plane is: Μ48 C#. ## % T01C00037 X#. ##γ#. ## χ#β ##γ#. ## Μ30 Again, select the target layer and set the standard drilling depth D1 and the standard plate thickness Η1 according to the customer's required drilling depth value. At this time, the plate thickness is the thickest position 1, and at this time, if the depth is still D1 Drilling down (as in position 3) will create In the case of deep drilling, the depth has been drilled below the target. Therefore, drilling at the edge of the board must use different depths of drilling, such as the third D3 value (D3<D2 = D1), where D3 = D1*H3/H1+ compensation value, the complement value is a small data for fine adjustment, the purpose is to ensure that the Puyang + 1 layer is not drilled and the hole copper remaining in the Lm + 1 layer to the layer direction The length of the machine should be kept at the same length. The machine control device resets the drilling parameters in the drilling program according to the drilling depth D3, and updates the parameters of the machine storage software 8 200847864 • MAPDAT; The program control command for the depth Dn to reset the drilling parameters in the drilling program is: Τ0Τ0:#. ##; SU0T0+:#. ##; SUT0-:#·##; L0DI: #.##; Ζ0Β: # .##; ZZ: #.##; HH: #.##. Finally, the machine control device changes the program control command in the control software BHGT according to the Dn value and executes the drilling program. The changed program control instruction is; φ T##C#. ## M47, \P:Z112H4.05 M18Z#.# xi m#. ## • M30 Through the implementation and execution of the above program control, the machine can achieve precise quantity Measure the thickness of the board and at the same time calculate the depth of the drill and accurately drill the hole on the board (PCB). Test example: After using this method, the depth control accuracy is significantly improved. The results are as follows: No. Plate thickness Drilling depth value After using the new practice depth value using the new method before the depth value 1.97 2.37 1 218. 1 116.4 2. 36 2. 76 1.77 2. 17 9 200847864 2 218, 5 117· 2 2. 21 3. 41 2. 12 3. 32 2. 12 3· 32 1.49 3. 49 3 222” 1 119.0 1. 15 3· 15 1.32 4. 32 3. 84 1.84 4 217· 1 114.0 3. 59 1.59 3. 38 1· 38 1·87 1.57 5 215. 4 115· 7 1.57 1.27 1. 90 1.60 1.87 3. 37 6 219·: 2 117.5 1. 77 3. 27 1·86 3. 36 3. 33 1. 13 7 211. 5 113· 8 3. 25 1.05 3. 41 1.21 1·08 2. 08 8 117.0 117.0 1.18 2. 18 1·63 2.63 1.92 -0·98 9 113. 1 113. 1 2. 07 -0. 83 2. 32 0 0·58 New standard averaging CP RANGE 2. 76 Difference 0. 7896 Value 2. 1611 Value 2. 0429 Original standard average CP method RANGE 5. 30 Difference 1. 3605 Value 2. 0537 Value 1.2119 It can be seen from the above test data that the depth control accuracy has been significantly improved after using the new drilling method. E (variation range) is significantly reduced (from the original 5_3 〇M|L to 2.76 MIL)' CP value (accuracy) also improved significantly (from 1 2^19 to 2.0429). [Simple description of the diagram] Figure 1 is a schematic diagram of deep drilling of printed circuit boards. Figure 2 is a schematic illustration of a prior art deep drilling method. 10 200847864 FIG. 3 is a schematic view of a deep drilling method of the present invention. Figure 4 is a flow chart showing the deep drilling of the present invention. [Main component symbol description] (1) Aluminum cover (2) Drill (3) Conductive switch (4) Conductor chuck (5) Printed circuit board
1111