TWI610604B - Protecting structure for drilling holes on printed circuit board and manufacturing method of printed circuit board having the same - Google Patents
Protecting structure for drilling holes on printed circuit board and manufacturing method of printed circuit board having the same Download PDFInfo
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- TWI610604B TWI610604B TW105126275A TW105126275A TWI610604B TW I610604 B TWI610604 B TW I610604B TW 105126275 A TW105126275 A TW 105126275A TW 105126275 A TW105126275 A TW 105126275A TW I610604 B TWI610604 B TW I610604B
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Abstract
一種電路板鑽孔保護結構，包含有一電路板基材以及一銅金屬基材層形成於電路板基材之上。其中，銅金屬基材層包含有一凸起部與一凹陷部。凹陷部係由薄化後的銅金屬基材層所形成，用以降低鑽針鑽孔時所施加於電路板基材的應力。此外，具有此電路板鑽孔保護結構的印刷電路板製造方法亦在此揭露。 A circuit board drilling protection structure comprising a circuit board substrate and a copper metal substrate layer formed on the circuit board substrate. Wherein, the copper metal substrate layer comprises a convex portion and a concave portion. The depressed portion is formed by a thinned copper metal substrate layer for reducing stress applied to the substrate of the circuit board when the drill is drilled. In addition, a printed circuit board manufacturing method having such a board drilling protection structure is also disclosed herein.
Description
本揭露中所述實施例內容是有關於一種電路板鑽孔保護結構及此電路板製造方法。特別地，本揭露中所述實施例內容是有關於一種印刷電路板鑽孔保護結構及此印刷電路板製造方法。 The embodiment described in the disclosure relates to a circuit board drilling protection structure and a method of manufacturing the same. In particular, the embodiments described in the present disclosure relate to a printed circuit board drilling protection structure and a method of manufacturing the same.
印刷電路板(printed circuit board；PCB)是依電路設計將連接電路零件的電子佈線製成圖形(pattern)，再經過特定的機械加工、處理等製程，於絕緣體上使電子導體重現所構成之電路板，主要目的是藉由電路板上的電路讓配置於電路板上的電子零件發揮功能。 A printed circuit board (PCB) is a circuit designed to pattern electronic wiring of circuit components, and then subjected to a specific machining, processing, etc., to reproduce the electronic conductor on the insulator. The main purpose of the board is to make the electronic components placed on the board function by the circuit on the board.
在現有多層印刷電路板製程中，對於導通孔的處理有不同的方法，例如以機械鑽孔一次鑽通PCB各層，也就是連同樹脂層例如酚醛樹脂或環氧樹脂與銅箔層一起鑽通而成孔。層間導通連結是先經過多個層板之堆疊壓合，再於預定位 置進行全穿孔形成導通孔(via)。之後以銅包覆電鍍形成導電的銅金屬薄膜於導通孔之孔壁及周圍，然後進行樹脂塞孔及覆蓋銅等步驟，進而進行線路蝕刻，以達到所需的電路板及線路配置。 In the existing multilayer printed circuit board process, there are different methods for the treatment of the via holes, such as mechanical drilling to drill through the layers of the PCB at a time, that is, together with a resin layer such as a phenolic resin or an epoxy resin and a copper foil layer. Holes. The interlayer conduction connection is first performed by stacking multiple layers, and then pre-positioned The perforation is performed to form a via. Then, a copper-clad metal film is formed by copper-clad plating to form a conductive copper metal film on and around the via hole of the via hole, and then a resin plug hole and a copper covering step are performed, thereby performing line etching to achieve a desired circuit board and line configuration.
隨著電子產品的微小化趨勢以及電子產業的進步，鑽孔的精度要求的越來越精確，銅包覆電鍍的品質要求也越來越高，如何能提供合適的電路板製造方法，以達到所需的品質要求，為電路板的生產者所殷殷企盼。 With the miniaturization trend of electronic products and the advancement of the electronics industry, the precision of drilling is becoming more and more precise, and the quality requirements of copper-clad plating are getting higher and higher. How to provide a suitable circuit board manufacturing method to achieve The required quality requirements are highly anticipated by the producers of the board.
有鑒於此，本揭露內容提出一種電路板鑽孔保護結構及具有此鑽孔保護結構之印刷電路板製造方法。 In view of this, the present disclosure proposes a circuit board drilling protection structure and a printed circuit board manufacturing method having the same.
本揭露內容之一實施態樣是有關於一種鑽孔保護結構，包含有一電路板基材以及一銅金屬基材層形成於電路板基材之上。其中，銅金屬基材層形成有一預定的圖案，包含有一凹陷部係由銅金屬基材層蝕刻後所保留一預定厚度的銅金屬所構成，用以降低一鑽針進行鑽孔時所施加於電路板基材的應力，並構成預定的圖案的一包覆區。而凸起部圍繞凹陷部，以在凸起部內側形成預定的圖案的包覆區。 One aspect of the disclosure is directed to a drill protection structure comprising a circuit board substrate and a copper metal substrate layer formed over the circuit board substrate. Wherein, the copper metal substrate layer is formed with a predetermined pattern, and comprises a depressed portion which is formed by etching a copper metal substrate layer and retaining a predetermined thickness of copper metal to reduce the application of a drill to the drilling hole. The stress of the board substrate and constitutes a cladding area of the predetermined pattern. The raised portion surrounds the recessed portion to form a cladding region of a predetermined pattern inside the raised portion.
在一或多個實施例中，上述之凹陷部的厚度約為2.5微米至5微米。 In one or more embodiments, the recess has a thickness of between about 2.5 microns and about 5 microns.
在一或多個實施例中，上述之預定的圖案更包含有一導引區以導引鑽針進行鑽孔時行進的方向，以及一應力緩衝區凸起於凹陷部，並形成於導引區的外圍，用以緩衝鑽針鑽 孔時所施加於電路板基材的應力。其中，應力緩衝區係銅金屬基材層所構成之另一凸起部。 In one or more embodiments, the predetermined pattern further includes a guiding area for guiding a direction in which the drilling needle travels while drilling, and a stress buffer is protruded from the recess and formed in the guiding area. Peripheral to buffer the drill The stress applied to the substrate of the board during the hole. Wherein, the stress buffer is another convex portion formed by the copper metal substrate layer.
在一或多個實施例中，上述之應力緩衝區的直徑小於鑽針的直徑，且包覆區的直徑大於鑽針的直徑約50微米以上。 In one or more embodiments, the diameter of the stress buffer is less than the diameter of the drill, and the diameter of the cladding is greater than about 50 microns above the diameter of the drill.
在一或多個實施例中，上述之鑽孔保護結構更包含一保護層形成預定的圖案之上。 In one or more embodiments, the drilling protection structure further includes a protective layer formed over a predetermined pattern.
本揭露內容之另一實施態樣是有關於一種印刷電路板之製造方法，包含有下列步驟，提供一電路板基材，形成一銅金屬基材層於電路板基材之上，以及圖案化銅金屬基材層，以形成有一預定的圖案。其中預定的圖案至少包含有一凸出部與一凹陷部，凹陷部並構成上述之預定的圖案的包覆區。 Another embodiment of the present disclosure relates to a method of fabricating a printed circuit board comprising the steps of providing a circuit board substrate, forming a copper metal substrate layer on the circuit board substrate, and patterning A layer of copper metal substrate to form a predetermined pattern. The predetermined pattern includes at least a protrusion and a recess, and the recess forms a cladding area of the predetermined pattern.
在一或多個實施例中，預定的圖案更包含有上述之導引區以及應力緩衝區。 In one or more embodiments, the predetermined pattern further includes the above-described guiding area and the stress buffer.
在一或多個實施例中，上述之圖案化銅金屬基材層步驟更包含有形成一光阻層於銅金屬基材層之上，圖案化光阻層，以及蝕刻銅金屬基材層以在凹陷部保留厚度約為2.5微米至5微米的銅金屬基材層。 In one or more embodiments, the step of patterning the copper metal substrate layer further includes forming a photoresist layer on the copper metal substrate layer, patterning the photoresist layer, and etching the copper metal substrate layer to A copper metal substrate layer having a thickness of about 2.5 microns to 5 microns is retained in the recess.
在一或多個實施例中，上述之應力緩衝區的直徑小於鑽針的直徑，且包覆區的直徑大於鑽針的直徑約50微米以上。 In one or more embodiments, the diameter of the stress buffer is less than the diameter of the drill, and the diameter of the cladding is greater than about 50 microns above the diameter of the drill.
在一或多個實施例中，上述之印刷電路板之製造方法，更包含有形成一保護層於預定的圖案之上。 In one or more embodiments, the above method for manufacturing a printed circuit board further includes forming a protective layer over a predetermined pattern.
綜上所述，本揭露中的印刷電路板之製造方法及 其鑽孔保護結構可以利用預定的圖案，保留部份厚度的銅金屬基材層，以降低電路板基材所承受鑽針之鑽頂所施加於電路板基材的應力，更可利用導引區更精確地進行電路板基材的鑽孔，亦可以再利用應力緩衝區進一步降低電路板基材所承受鑽針之鑽頂所施加於電路板基材的應力。而包覆區更可以方便後續電鍍製程形成所需的包覆層。此外，更可以於預定的圖案上，形成保護層以進一步避免電路板基材的損壞，有效提升導通孔的品質。 In summary, the method for manufacturing a printed circuit board of the present disclosure The drilling protection structure can utilize a predetermined pattern to retain a portion of the thickness of the copper metal substrate layer to reduce the stress applied to the circuit board substrate by the drill string of the circuit board substrate, and the guiding can be utilized. The region more accurately drills the board substrate, and the stress buffer can be used to further reduce the stress applied to the board substrate by the drill string of the board substrate. The cladding region can further facilitate the subsequent plating process to form the desired cladding layer. In addition, a protective layer can be formed on the predetermined pattern to further avoid damage of the circuit board substrate and effectively improve the quality of the via hole.
100~200‧‧‧步驟 100~200‧‧‧Steps
210‧‧‧電路板基材 210‧‧‧Circuit board substrate
220‧‧‧預定的圖案 220‧‧‧Prescribed pattern
222‧‧‧包覆區 222‧‧‧Covered area
234‧‧‧鑽頂 234‧‧‧ drill top
240‧‧‧銅金屬基材層 240‧‧‧ copper metal substrate layer
241‧‧‧凹陷部 241‧‧‧Depression
242‧‧‧凸起部 242‧‧‧ raised parts
223‧‧‧直徑 223‧‧‧diameter
224‧‧‧應力緩衝區 224‧‧‧stress buffer
225‧‧‧直徑 225‧‧‧diameter
226‧‧‧導引區 226‧‧‧ Guide area
227‧‧‧直徑 227‧‧‧diameter
230‧‧‧鑽針 230‧‧‧Drills
232‧‧‧直徑 232‧‧‧diameter
244‧‧‧厚度 244‧‧‧ thickness
246‧‧‧厚度 246‧‧‧ thickness
302‧‧‧多邊形導引區 302‧‧‧Polygonal guiding area
304‧‧‧三角形導引區 304‧‧‧Triangulation area
306‧‧‧十字形導引區 306‧‧‧Cross-shaped guiding area
308‧‧‧四邊形導引區 308‧‧‧ Quadrilateral guiding area
310‧‧‧圓形導引區 310‧‧‧Circular guiding area
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：第1圖是依照本揭露一些實施例所繪示的一種印刷電路板之製造方法的流程示意圖。 The above and other objects, features, advantages and embodiments of the present disclosure will be more apparent and understood. The description of the drawings is as follows. FIG. 1 is a diagram of a printed circuit board according to some embodiments of the present disclosure. Schematic diagram of the process.
第2A圖是依照本揭露一些實施例所繪示的一種鑽孔保護結構的正視示意圖。 2A is a front elevational view of a drill protection structure in accordance with some embodiments of the present disclosure.
第2B圖是依照本揭露一些實施例所繪示的一種鑽孔保護結構的側視示意圖。 2B is a side view of a drill protection structure in accordance with some embodiments of the present disclosure.
第2C圖是依照本揭露另一些實施例所繪示的一種鑽孔保護結構的側視示意圖。 2C is a side view of a drill protection structure in accordance with other embodiments of the present disclosure.
第3圖是依照本揭露一些實施例所繪示的一種鑽孔保護結構的導引區示意圖。 FIG. 3 is a schematic diagram of a guiding area of a drill protection structure according to some embodiments of the present disclosure.
下文係舉實施例配合所附圖式進行詳細說明，但所提供之實施例並非用以限制本揭露所涵蓋的範圍，而結構運作之描述非用以限制其執行之順序，任何由元件重新組合之結構，所產生具有均等功效的裝置，皆為本揭露所涵蓋的範圍。另外，圖式僅以說明為目的，並未依照原尺寸作圖。為使便於理解，下述說明中相同元件或相似元件將以相同之符號標示來說明。 The following is a detailed description of the embodiments, but the embodiments are not intended to limit the scope of the disclosure, and the description of the structural operation is not intended to limit the order of execution, and any components are recombined. The structure and the device with equal efficiency are all covered by the disclosure. In addition, the drawings are for illustrative purposes only and are not drawn to the original dimensions. For the sake of understanding, the same or similar elements in the following description will be denoted by the same reference numerals.
另外，在全篇說明書與申請專利範圍所使用之用詞(terms)，除有特別註明外，通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論，以提供本領域技術人員在有關本揭露之描述上額外的引導。 In addition, the terms used in the entire specification and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each word used in the field, in the content disclosed herein and in the special content. . Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.
關於本文中所使用之『第一』、『第二』、...等，並非特別指稱次序或順位的意思，亦非用以限定本發明，其僅僅是為了區別以相同技術用語描述的元件或操作而已。 The terms "first", "second", etc., as used herein, are not intended to refer to the order or the order, and are not intended to limit the invention, only to distinguish the elements described in the same technical terms. Or just operate.
其次，在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等，均為開放性的用語，即意指包含但不限於。 Secondly, the terms "including", "including", "having", "containing", and the like, as used herein, are all open terms, meaning, but not limited to.
第1圖是依照本揭露一些實施例所繪示的一種印刷電路板之製造方法。如圖中所示，本發明所揭露之電路板的製造方法說明如下。第2A圖則是依照本揭露一些實施例所繪示的電路板製造時所使用的鑽孔保護結構的正視示意圖，第2B圖是其側視示意圖，而第2C圖則為另一些實施例所繪示的電路板製造時所使用的鑽孔保護結構的側視示意圖。 FIG. 1 is a diagram of a method of fabricating a printed circuit board according to some embodiments of the present disclosure. As shown in the figure, a method of manufacturing a circuit board disclosed in the present invention will be described below. FIG. 2A is a front view of a drilling protection structure used in the manufacture of a circuit board according to some embodiments of the present disclosure, FIG. 2B is a side view thereof, and FIG. 2C is another embodiment. A schematic side view of the drilled protection structure used in the manufacture of the circuit board.
同時參閱第1圖與第2A至2C圖，如圖中所示，步驟100，首先提供一電路板基材210，然後，步驟110，形成一銅金屬基材層240於電路板基材210上。步驟120，形成一光阻層於銅金屬基材層240上。接著，步驟130，圖案化光阻層。接著，步驟140，移除部份的銅金屬基材層240，以形成一預定的圖案220。其中，移除部份的銅金屬基材層240係利用圖案化的光阻層為罩幕，進行該銅金屬基材層240的蝕刻。然後，步驟150，去除光阻層。 Referring also to FIG. 1 and FIGS. 2A to 2C, as shown in the figure, in step 100, a circuit board substrate 210 is first provided, and then, in step 110, a copper metal substrate layer 240 is formed on the circuit board substrate 210. . Step 120, forming a photoresist layer on the copper metal substrate layer 240. Next, in step 130, the photoresist layer is patterned. Next, in step 140, a portion of the copper metal substrate layer 240 is removed to form a predetermined pattern 220. The removed portion of the copper metal substrate layer 240 is etched using the patterned photoresist layer as a mask to etch the copper metal substrate layer 240. Then, in step 150, the photoresist layer is removed.
接著，參閱步驟160，利用鑽針230與預定的圖案220，進行電路板基材210的鑽孔。 Next, referring to step 160, the drilling of the circuit board substrate 210 is performed using the drill 230 and the predetermined pattern 220.
在此先參閱第2C圖，預定的圖案220包含有一凹陷部241以及一凸起部242，凹陷部241係由銅金屬基材層240經蝕刻後所保留一預定厚度246的銅金屬所構成，例如是保留有2.5微米以上的銅金屬基材層240，較佳地約為保留2.5微米至5微米的銅金屬基材層240。凸起部242則圍繞凹陷部241的外側，凸起部242的內側則可構成一包覆區222，用以提供後續的製程中形成包覆層所需的空間，以在後續製程中形成所需的包覆層，例如是包覆銅鍍層，進而提高電路板中導通孔(Via)的品質與可靠度。凹陷部241所保留的銅金屬基材層240則可以有效地降低一鑽針進行鑽孔時所施加於該電路板基材的應力。凸起部242的厚度244則大於凹陷部241的厚度246，凸起部242的厚度244可以是保留銅金屬基材層240未被蝕刻的厚度，然本發明並不限定於此。 Referring to FIG. 2C, the predetermined pattern 220 includes a recessed portion 241 and a raised portion 242 formed by a copper metal having a predetermined thickness 246 retained by the copper metal substrate layer 240 after etching. For example, a copper metal substrate layer 240 of 2.5 microns or more is retained, preferably about 2.5 microns to 5 microns of copper metal substrate layer 240. The convex portion 242 surrounds the outer side of the concave portion 241, and the inner side of the convex portion 242 can constitute a cladding portion 222 for providing a space required for forming a cladding layer in a subsequent process to form a subsequent process. The required cladding layer, for example, is coated with a copper plating layer to improve the quality and reliability of the vias in the circuit board. The copper metal substrate layer 240 retained by the recess 241 can effectively reduce the stress applied to the substrate of the circuit board when a drill is drilled. The thickness 244 of the raised portion 242 is greater than the thickness 246 of the recessed portion 241, and the thickness 244 of the raised portion 242 may be a thickness that leaves the copper metal substrate layer 240 unetched, although the invention is not limited thereto.
再參閱第2A圖及第2B圖，預定的圖案220更可以 有三環式的鑽孔輔助區，由內而外，分別是導引區226，其有效地導引鑽針230的鑽頂234使其精準地鑽入電路板基材210中正確的位置。導引區226的外側形成有一應力緩衝區224，應力緩衝區224的作用在於進一步降低並緩衝鑽針230直接施加於電路板基材210上的應力，有效地分散鑽針230施加於電路板基材210上的力量。應力緩衝區224係銅金屬基材層240於蝕刻製程時，受到光阻層的保護，而未被移除所形成之另一凸起部242，然本發明並不限定於此，本發明亦可以利用另一製程以形成所需的應力緩衝區224於凹陷部241之中。 Referring to FIGS. 2A and 2B, the predetermined pattern 220 can be further A three-ring drilling auxiliary zone, from the inside out, is a guiding zone 226 that effectively guides the drill bit 234 of the drill bit 230 to accurately drill into the correct position in the circuit board substrate 210. A stress buffer 224 is formed on the outer side of the guiding region 226. The stress buffer 224 functions to further reduce and buffer the stress directly applied to the circuit board substrate 210 by the drilling pin 230, and effectively distribute the drilling pin 230 to the circuit board base. The strength of the material 210. The stress buffer 224 is a copper metal substrate layer 240 that is protected by the photoresist layer during the etching process, and is not removed by the other convex portion 242. However, the present invention is not limited thereto, and the present invention is also not limited thereto. Another process can be utilized to form the desired stress buffer 224 in the recess 241.
應力緩衝區224的在外側則形成有一包覆區222，其功能即在於提供形成包覆層所需的空間，以在後續製程中形成所需的包覆層，例如是包覆銅鍍層，進而提高電路板中導通孔(Via)的品質與可靠度。預定的圖案220係利用光學微影等製程，將銅金屬基材層240的部份材料去除，例如是將導引區226及包覆區222的銅金屬材料部份移除，以形成凹陷的導引區226及包覆區222，以及位於兩者之間凸起的應力緩衝區224。凹陷的導引區226及包覆區222的厚度246小於應力緩衝區224的厚度244，亦即凹陷部241的導引區226及包覆區222的厚度246係由銅金屬基材層240經蝕刻後所保留一預定厚度246的銅金屬所構成，例如是保留有2.5微米以上的銅金屬基材層240，較佳地約為保留2.5微米至5微米的銅金屬基材層240。凸起部242則除圍繞凹陷部241的外側，亦可在凹陷部241中形成另一凸起部242，應力緩衝區224，其厚度244則可以是保留銅金屬基材層240未被蝕刻的厚度，然本發明並不限定於 此。 The outer side of the stress buffer 224 is formed with a cladding region 222, which functions to provide a space required for forming a cladding layer to form a desired cladding layer in a subsequent process, such as coating a copper plating layer. Improve the quality and reliability of the vias in the board. The predetermined pattern 220 is used to remove a portion of the material of the copper metal substrate layer 240 by using a process such as optical lithography, for example, removing the copper metal material portion of the guiding region 226 and the cladding region 222 to form a recess. Guide region 226 and cladding region 222, and a stress buffer 224 that is convex between the two. The thickness 246 of the recessed guiding region 226 and the cladding region 222 is smaller than the thickness 244 of the stress buffer 224, that is, the guiding portion 226 of the recess 241 and the thickness 246 of the cladding region 222 are formed by the copper metal substrate layer 240. A copper metal of a predetermined thickness 246 is retained after etching, for example, a copper metal substrate layer 240 having a thickness of 2.5 microns or more, preferably about 2.5 microns to 5 microns. The protrusion 242 may form another protrusion 242 in the recess 241 except for the outer side of the recess 241. The thickness 244 may be such that the copper metal substrate layer 240 is not etched. Thickness, but the invention is not limited to this.
接著進入步驟170，進行電鍍製程，例如是利用銅包覆電鍍上述的鑽孔，以在內壁及鑽孔的周圍包覆區222形成所需厚度的連續包覆銅鍍層。步驟180，接著進行塞孔的製程，可以利用樹脂塞孔，亦或者是利用防焊漆塞孔，其均不脫離本發明之精神與範圍。 Next, proceeding to step 170, an electroplating process is performed, for example, by plating the above-mentioned drill holes with copper cladding to form a continuous coating copper plating layer of a desired thickness on the inner wall and the surrounding cladding region 222 of the drilled holes. In step 180, the process of plugging may be performed, either by using a resin plug or by using a solder resist plug, without departing from the spirit and scope of the present invention.
接著，步驟190，進行覆蓋電鍍(cap plating)，例如是銅覆蓋電鍍(copper cap plating)，以形成所需的銅包覆層(copper cap)。本發明可以有效提高導通孔的導電性能與可靠度，而其中所形成之導通孔可以是通孔(Plating Through Hole；PTH)、盲孔(Blind Via Hole；BVH)或埋孔(Buried Via Hole；BVH)。 Next, in step 190, cap plating, such as copper cap plating, is performed to form a desired copper cap. The invention can effectively improve the conductivity and reliability of the via hole, and the via hole formed therein can be a through hole (PTH), a blind hole (BVH) or a buried hole (Buried Via Hole; BVH).
步驟200，使用上述之電路板基材製作所需線路，以供電子產品使用。 In step 200, the desired circuit is fabricated using the above-described circuit board substrate for use in an electronic product.
在一或多個實施例中，當鑽針230的直徑232為一預定的大小時，導引區226的直徑227小於鑽針230的直徑232，而應力緩衝區224的直徑225較佳地亦小於鑽針230的直徑232，包覆區222的直徑223則大於鑽針230的直徑232。在一或多個實施例中，導引區226的直徑227約可介於25至100微米，較佳地介於50至75微米，可視鑽針230的直徑232大小來決定，而應力緩衝區224的直徑225可以比鑽針230的直徑232小25微米至75微米，例如是50微米。包覆區222的直徑223則可以是大於鑽針230的直徑232約25微米以上，較佳地是大於50微米以上，然本發明並不限定於此。 In one or more embodiments, when the diameter 232 of the drill bit 230 is a predetermined size, the diameter 227 of the guide region 226 is smaller than the diameter 232 of the drill pin 230, and the diameter 225 of the stress buffer 224 is preferably also Less than the diameter 232 of the drill pin 230, the diameter 223 of the cladding region 222 is greater than the diameter 232 of the drill pin 230. In one or more embodiments, the diameter 227 of the guide region 226 can be between about 25 and 100 microns, preferably between 50 and 75 microns, depending on the diameter 232 of the visual drill 230, and the stress buffer. The diameter 225 of the 224 can be 25 microns to 75 microns smaller than the diameter 232 of the burr 230, such as 50 microns. The diameter 223 of the cladding region 222 may be greater than the diameter 232 of the drill 230 by about 25 microns or more, preferably greater than 50 microns, although the invention is not limited thereto.
本發明之電路板的製造方法利用包覆層提高導通孔的導電品質與性能及可靠度，更利用銅金屬基材層所構成的預定的圖案，以更精確地進行電路板基材的鑽孔，同時利用如第3圖中的各種不同形狀的導引區導引鑽針鑽孔的正確位置，例如是圖中所示的多邊形導引區302、三角形導引區304、十字形導引區306、四邊形導引區308以及圓形導引區310，然本發明並不限定於此。本發明再利用應力緩衝區降低電路板基材所承受鑽針之鑽頂所施加於電路板基材的應力，而包覆區更可以方便後續電鍍製程形成所需的包覆層。 The manufacturing method of the circuit board of the present invention utilizes the cladding layer to improve the conductive quality and performance and reliability of the via hole, and further utilizes a predetermined pattern formed by the copper metal substrate layer to more accurately drill the circuit board substrate. At the same time, the correct position of the drill hole is guided by the guiding regions of various shapes as shown in FIG. 3, for example, the polygonal guiding area 302, the triangular guiding area 304, and the cross guiding area shown in the figure. 306, the quadrilateral guiding area 308 and the circular guiding area 310, but the invention is not limited thereto. The invention further utilizes the stress buffer to reduce the stress applied to the substrate of the circuit board by the drill string of the drilled substrate of the circuit board substrate, and the cladding region can facilitate the formation of the required cladding layer by the subsequent electroplating process.
值得注意的是，在步驟150之後，更可以形成一保護層於預定的圖案220之上，以進一步地保護電路板基材210，使其在步驟160鑽針進行鑽孔時，更可以避免電路板基材210的損壞，有效提升鑽孔的品質。由於保護層係利用例如是毯覆式(conformal)的形成於預定的圖案220之上，故其並不會影響鑽針鑽孔精度，且能更進一步提供電路板基材210的保護。 It should be noted that after step 150, a protective layer may be formed over the predetermined pattern 220 to further protect the circuit board substrate 210 so that the circuit can be avoided when the drilling of the boring needle in step 160 is performed. The damage of the board substrate 210 effectively improves the quality of the hole. Since the protective layer is formed on the predetermined pattern 220 by, for example, a conformal, it does not affect the drilling precision of the drill, and the protection of the circuit board substrate 210 can be further provided.
其中，上述之保護層較佳地可以是乾膜保護層例如是一光阻保護層、化學錫保護層、電鍍錫保護層、金屬合金保護層、鎳鉻合金保護層、化學銅保護層或者是電鍍銅保護層選擇其一或其組合。 Wherein, the protective layer may preferably be a dry film protective layer such as a photoresist protective layer, a tin oxide protective layer, a tin plating protective layer, a metal alloy protective layer, a nickel-chromium alloy protective layer, a chemical copper protective layer or The electroplated copper protective layer is selected from one or a combination thereof.
當保護層協助鑽針230鑽孔完成後，部份的保護層可以無須進行去除，其不影響後續的電路板製程，而部份的保護層則可以用合適的製程進行保護層的去除。例如乾膜保護層可以使用去膜製程加以去除，化學錫保護層則可以使用剝錫 的方式進行去除，電鍍錫保護層亦可以使用剝錫的方式進行去除，金屬合金保護層則可以無須去除，鎳鉻合金保護層亦可以選擇不去除，化學銅保護層及電鍍銅保護層則可以使用蝕刻方式加以去除，然本發明並不限定於此。 When the protective layer assists the drilling of the drill bit 230, part of the protective layer can be removed without affecting the subsequent circuit board process, and part of the protective layer can be removed by a suitable process. For example, the dry film protective layer can be removed by a stripping process, and the chemical tin protective layer can be stripped of tin. The method of removing the tin plating layer can also be removed by stripping, the metal alloy protective layer can be removed without removing the nickel-chromium alloy protective layer, and the chemical copper protective layer and the electroplated copper protective layer can be removed. It is removed by etching, but the present invention is not limited thereto.
綜上所述，本揭露中的印刷電路板之製造方法及其鑽孔保護結構利用預定的圖案，以降低電路板基材的鑽孔施加於電路板基材的應力，且藉由導引區的設置更精確地進行電路板基材的鑽孔，亦可以再利用應力緩衝區進一步降低電路板基材所承受鑽針之鑽頂所施加於電路板基材的應力，而包覆區更可以方便後續銅包覆電鍍製程形成所需的包覆銅鍍層，以提高導通孔的導電性能及可靠度。此外，若於預定的圖案上進一步形成保護層更可以避免電路板基材的損壞，有效提升導通孔的品質。 In summary, the manufacturing method of the printed circuit board and the drilling protection structure thereof in the present disclosure utilize a predetermined pattern to reduce the stress applied to the circuit board substrate by the drilling of the circuit board substrate, and by the guiding area The setting can more accurately drill the substrate of the circuit board, and the stress buffer can be further used to further reduce the stress applied to the substrate of the circuit board by the drill string of the circuit board substrate, and the cladding area can be further It is convenient for the subsequent copper-clad plating process to form the required cladding copper plating layer to improve the conductivity and reliability of the via holes. In addition, if the protective layer is further formed on the predetermined pattern, the damage of the circuit board substrate can be avoided, and the quality of the via hole can be effectively improved.
雖然本揭露已以實施方式揭露如上，然其並非用以限定本揭露，任何本領域具通常知識者，在不脫離本揭露之精神和範圍內，當可作各種之更動與潤飾，因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, and is not intended to limit the disclosure. Any one of ordinary skill in the art can make various changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection is subject to the definition of the scope of the patent application.
210‧‧‧電路板基材 210‧‧‧Circuit board substrate
220‧‧‧預定的圖案 220‧‧‧Prescribed pattern
222‧‧‧包覆區 222‧‧‧Covered area
223‧‧‧直徑 223‧‧‧diameter
230‧‧‧鑽針 230‧‧‧Drills
232‧‧‧直徑 232‧‧‧diameter
234‧‧‧鑽頂 234‧‧‧ drill top
240‧‧‧銅金屬基材層 240‧‧‧ copper metal substrate layer
241‧‧‧凹陷部 241‧‧‧Depression
242‧‧‧凸起部 242‧‧‧ raised parts
244‧‧‧厚度 244‧‧‧ thickness
246‧‧‧厚度 246‧‧‧ thickness
Claims (10)
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| TW105126275A TWI610604B (en) | 2016-08-17 | 2016-08-17 | Protecting structure for drilling holes on printed circuit board and manufacturing method of printed circuit board having the same |
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| Application Number | Priority Date | Filing Date | Title |
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| TW105126275A TWI610604B (en) | 2016-08-17 | 2016-08-17 | Protecting structure for drilling holes on printed circuit board and manufacturing method of printed circuit board having the same |
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| TWI610604B true TWI610604B (en) | 2018-01-01 |
| TW201811135A TW201811135A (en) | 2018-03-16 |
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|---|---|---|---|---|
| US6960050B2 (en) * | 1997-03-09 | 2005-11-01 | Westwind Air Bearings Limited | Hole forming system with ganged spindle set |
| TW200611773A (en) * | 2004-10-08 | 2006-04-16 | Hon Hai Prec Ind Co Ltd | A method and system for laser drilling hole on a felxible printed circuit board |
| TW200847864A (en) * | 2007-05-29 | 2008-12-01 | Wus Printed Circuit Kunshan Co Ltd | Deep-drilling method for printed circuit board |
| TW201016092A (en) * | 2008-10-02 | 2010-04-16 | Compeq Mfg Company Limlted | Hole-drilling method using laser for printed circuit board |
| TW201101944A (en) * | 2009-06-26 | 2011-01-01 | Hon Hai Prec Ind Co Ltd | Printed circuit board and method for drilling via therein |
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| US9301407B2 (en) * | 2013-07-03 | 2016-03-29 | Taiyo Yuden Co., Ltd. | Method of manufacturing substrate having cavity |
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|---|---|---|---|---|
| US6960050B2 (en) * | 1997-03-09 | 2005-11-01 | Westwind Air Bearings Limited | Hole forming system with ganged spindle set |
| TW200611773A (en) * | 2004-10-08 | 2006-04-16 | Hon Hai Prec Ind Co Ltd | A method and system for laser drilling hole on a felxible printed circuit board |
| US7170912B2 (en) * | 2004-10-08 | 2007-01-30 | Hon Hai Precision Industry Co., Ltd. | Laser drilling system and method for flexible printed circuit board |
| TWI392415B (en) * | 2007-04-25 | 2013-04-01 | Machvision Inc | Drilling quality monitoring method for pcb drilling shop |
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| US9301407B2 (en) * | 2013-07-03 | 2016-03-29 | Taiyo Yuden Co., Ltd. | Method of manufacturing substrate having cavity |
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| TW201811135A (en) | 2018-03-16 |
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