TWI691243B - Manufacturing method for printed circuit board - Google Patents

Abstract

There is provided a manufacturing method for a printed circuit board, including: forming first circuit patterns on one surface of a metal plate; forming an insulating layer on the one surface of the metal plate, the insulating layer covering the first circuit patterns; forming vias penetrating through the insulating layer and second circuit patterns; and selectively etching the metal plate to form conductor pads on a portion of the first circuit patterns.

Description

Printed circuit board manufacturing method [Cross-reference to related applications]

This application claims the priority and rights of Korean Patent Application No. 10-2014-0064632 filed by the Korean Intellectual Property Office on May 28, 2014, and the disclosure content of the application is incorporated herein by reference.

The invention relates to a method for manufacturing a printed circuit board.

The printed circuit board contains a circuit pattern formed of a conductive material such as copper deposited on an insulating material. Recently, according to the trend of miniaturization and thinning of electronic components, a printed circuit board having an embedded pattern structure in which a circuit pattern is embedded in an insulating material has been used.

[Related technical literature]

(Patent Document 1) Korean Patent Publication No. 2013-0057186

One aspect of the present invention can provide a method for manufacturing a printed circuit board having improved connectivity of components or other similar mounted on the printed circuit board, and having an embedded pattern structure with embedded circuit patterns .

According to one aspect of the present invention, a method of manufacturing a printed circuit board may include: forming a first circuit pattern on one surface of a metal plate; forming an insulating layer on one surface of the metal plate, the insulating layer covering the first circuit Pattern; and selectively etching the metal plate to form a conductor pad on a portion of the first circuit pattern.

The surface of the first circuit pattern may be coplanar with respect to the surface of the insulating layer, or may be positioned below the surface of the insulating layer, and the conductor pad may protrude from the surface of the insulating layer.

10: carrier substrate

11: External metal plate

12: Internal metal plate

13: The core part

20: The first anti-plating agent

21, 23: opening part

22: Second anti-plating agent

25: Anti-etching agent

30: Seed layer

50: Conductor pad

110: first circuit pattern

120: Second circuit pattern

150: Via

151: through hole

200: insulating layer

300: solder resist

500: accumulation layer

A: Printed circuit board

The following detailed description will be made in conjunction with the accompanying drawings to more clearly understand the above content of the present invention, as well as other aspects, features, and other advantages, among which: FIG. 1 is a drawing showing a printing made according to an exemplary embodiment of the present invention. A cross-sectional view of the structure of the circuit board; FIG. 2 is a cross-sectional view showing the structure of the printed circuit board manufactured according to another exemplary embodiment of the present invention; and FIGS. A schematic diagram of a method of manufacturing a printed circuit board of an exemplary embodiment of the invention.

Exemplary embodiments of the present invention will now be described in detail with reference to the attached drawings.

FIG. 1 is a diagram showing a printed circuit manufactured according to an exemplary embodiment of the present invention. Cross-sectional view of the structure of the road board.

Referring to FIG. 1, a printed circuit board according to an exemplary embodiment of the present invention may include an insulating layer 200, a first circuit pattern 110 embedded in the insulating layer 200 such that its surface is exposed to one surface of the insulating layer 200, and for connecting The conductor pad 50 of the external terminal selectively provided on a part of the first circuit pattern 110.

The first circuit pattern 110 may be embedded in the insulating layer 200 such that its surface exposed to one surface of the insulating layer 200 is coplanar with one surface of the insulating layer 200 or positioned below one surface of the insulating layer 200.

When an electronic component such as an integrated circuit (IC) or the like is installed, connection defects may occur in the first circuit pattern 110 embedded as described above. In particular, in the case where the first circuit pattern 110 is positioned lower than the insulating layer 200 such that a step is generated between the circuit pattern 110 and the insulating layer 200, the possibility of connection defects may become greater.

Therefore, in the printed circuit board of the exemplary embodiment of the present invention, the conductor pad 50 may be selectively provided on a portion of the first circuit pattern 110 embedded in the insulating layer 200.

The conductor pad 50 may be provided to protrude from one surface of the insulating layer 200. Therefore, the connectivity of components mounted thereon or the like can be improved.

The insulating layer 200 may have a second circuit pattern 120 disposed on another surface corresponding to one surface thereof, and may have a via hole 150 disposed therein to penetrate the first circuit pattern 110 and the second circuit pattern therethrough 120 are connected to each other.

The printed circuit board may have a solder resist 300 provided on the surface thereof, so that the circuit pattern for connecting the pad is exposed between the first circuit pattern 110 and the second circuit pattern 120.

2 is a cross-sectional view illustrating a structure of a printed circuit board manufactured according to an exemplary embodiment of the present invention.

Referring to FIG. 2, a printed circuit board according to another exemplary embodiment of the present invention may further include a build-up layer 500 stacked on the other surface of the insulating layer 200.

Here, although a stacked layer 500 is stacked on the other surface of the insulating layer 200 as shown in FIG. 2, the present invention is not limited to this, but can be appropriately modified by those skilled in the art . For example, two or more stacked layers may be formed.

3 to 15 sequentially illustrate schematic diagrams of a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 3, the carrier substrate 10 may be prepared first.

The carrier substrate 10 may include a core portion 13, inner metal plates 12 provided on both surfaces of the core portion 13, and outer metal plates 11 provided on the inner metal plate 12.

Each of the inner metal plate 12 and the outer metal plate 11 may be formed of copper foil, but is not particularly limited thereto.

At least one of the joining surfaces between the inner metal plate 12 and the outer metal plate 11 can be surface-treated, so that the inner metal plate 12 and the outer metal plate 11 can be easily separated from each other.

Referring to FIG. 4, the first plating resist 20 having the opening portion 21 for forming the first circuit pattern 110 may be formed on the external metal plate 11.

The first plating resist 20 which is a general photoresist film may be a dry film resist or the like, but it is not particularly limited thereto.

The first plating resist 20 having the opening portion 21 can be applied by applying a photosensitive resist The etchant film is formed by forming a patterned mask and then performing an exposure and development process.

Referring to FIG. 5, conductive metal may be filled in the opening portion 21 to form the first circuit pattern 110.

The conductive metal can be filled by performing processes such as electroplating or other similar processes. Here, the conductive metal may be any metal having excellent electrical conductivity, such as copper (Cu).

Referring to FIG. 6, the first plating resist 20 may be removed.

Referring to FIG. 7, an insulating layer 200 covering the first circuit pattern 110 may be formed on the external metal plate 11 on which the first circuit pattern 110 is formed.

As the insulating layer 200, a resin insulating layer may be used.

As the material of the resin insulating layer, a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide resin, a resin having a reinforcing material such as glass fiber, or a prepreg impregnated with thermosetting resin and thermoplastic Inorganic filler in resin. In addition, thermosetting resins, photocurable resins, and the like can be used. However, the material of the resin insulating layer is not particularly limited to this.

Referring to FIG. 8, the through hole 151 may be formed in the insulating layer 200 to expose a portion of the first circuit pattern 110.

Here, the through hole 151 may be formed using mechanical drilling or laser drilling, but it is not particularly limited thereto.

Here, the laser drilling may be a CO ₂ laser drilling or a YAG laser drilling, but it is not limited thereto.

Although the through hole 151 shown in FIG. 8 has a tapered shape whose diameter decreases downward, the through hole 151 may have all shapes known in the related art, such as a tapered shape whose diameter increases downward. Cylinder shape and other similar ones.

Referring to FIG. 9, the seed layer 30 may be formed on the insulating layer 200 in which the through hole 151 is formed.

The seed layer 30 may be formed by performing electroless plating, but it is not particularly limited thereto.

Referring to FIG. 10, the second plating resist 22 having the opening portion 23 for forming the second circuit pattern 120 may be formed on the insulating layer 200 on which the seed layer 30 is formed.

Referring to FIG. 11, the via hole 151 may be filled to form the via hole 150, and the opening portion 23 may be filled to form the second circuit pattern 120.

The via hole 150 and the second circuit pattern 120 may be formed by filling a conductive metal using a process such as an electroplating process or the like. Here, the conductive metal may be any metal having excellent electrical conductivity, such as copper (Cu).

The first circuit pattern 110 and the second circuit pattern 120 may be electrically connected to each other through the via 150.

After the second circuit pattern 120 is formed, the second plating resist 22 may be removed.

The process of forming the via hole 150 and the second circuit pattern 120 may be repeated to form the build-up layer 500 on the insulating layer 200 (not shown). Here, the stacked stacked layers may be formed as two layers, three layers, four layers, or several layers within a range used by those skilled in the art.

Referring to FIG. 12, the inner metal plate 12 and the outer metal plate 11 may be separated from each other.

Here, the inner metal plate 12 and the outer metal plate 11 may be separated from each other using a blade, but it is not limited thereto. That is, all methods known in the art can be used.

Next, the separated outer metal plate 11 of the printed circuit board A may be selectively etched to selectively form a conductor pad on a part of the first circuit pattern 110 50.

Referring to FIG. 13, in an exemplary embodiment of the present invention, the anti-etching agent 25 may be formed on the other surface of the outer metal plate 11 corresponding to one surface on which the first circuit pattern 110 is formed above the outer metal plate 11 To selectively form the conductor pad 50.

The anti-etching agent 25 may be formed only in a local area where the first circuit pattern 110 is positioned in the local area where the conductor pad 50 is formed between the first circuit patterns 110.

Here, the width of the anti-etching agent 25 may be wider than the width of the first circuit pattern 110.

The anti-etching agent 25 which is a general photoresist film may be a dry film resist or the like, but it is not particularly limited thereto.

The anti-etching agent 25 can be selectively formed only in a local area by applying a photoresist film, forming a patterned mask, and then performing an exposure and development process, in which the local area is positioned The first circuit pattern 110 of the conductor pad 50.

Referring to FIG. 14, the outer metal plate 11 in the area where the anti-etchant 25 is not formed may be etched and removed to form the conductor pad 50.

The outer metal plate 11 in the area where the etchant 25 is not formed is removed, and the outer metal plate 11 in the area where the etchant 25 is formed remains unremoved so that the conductor pad 50 can be formed.

In the area where the external metal plate 11 is removed, the surface of the first circuit pattern 110 embedded in the insulating layer 200 may be exposed to one surface of the insulating layer 200. Here, the surface of the first circuit pattern 110 may be coplanar with the surface of the insulating layer 200, or positioned at Below the surface of the insulating layer 200. In the process of etching the external metal plate 11, the first circuit pattern 110 may be over-etched to generate a step between the first circuit pattern 110 and the insulating layer 200.

The selectively formed conductor pad 50 may be formed of a metal plate that remains unremoved in the outer metal plate 11.

The conductor pad 50 formed of a metal plate that remains unetched may protrude from the surface of the insulating layer 200, thereby improving the connectivity of components or the like mounted thereon.

The width of the conductor pad 50 may be the same or wider than the width of the first circuit pattern 110. The width of the conductor pad 50 can be controlled by adjusting the width of the etchant 25.

Referring to FIG. 15, the solder resist 300 may be formed on the surface of the printed circuit board A so that the circuit pattern for the connection pad between the first circuit pattern 110 and the second circuit pattern 120 is exposed.

As explained above, according to an exemplary embodiment of the present invention, when having an embedded pattern structure in which a circuit pattern is embedded, a protruding conductor pad is selectively formed, and the components mounted on it or other similar ones can be improved Connectivity.

Although exemplary embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and modifications can be made without departing from the scope of the invention as defined by the scope of the appended patent application and Variety.

50: Conductor pad

110: first circuit pattern

120: Second circuit pattern

150: Via

200: insulating layer

300: solder resist

Claims (10)

A method for manufacturing a printed circuit board, comprising: forming a first circuit pattern on one surface of a metal plate; forming an insulating layer on the one surface of the metal plate, the insulating layer covering the first circuit pattern; Forming a through hole passing through the insulating layer and the second circuit pattern; and selectively etching the metal plate to form a conductor pad protruding from the insulating layer; wherein the first circuit pattern is embedded in the insulation In the layer, so that the surface of the first circuit pattern is coplanar or lower than the surface of the insulating layer, and wherein a portion of the first circuit pattern is connected to the conductor pad. The method of manufacturing a printed circuit board as described in item 1 of the patent application range, wherein in the selective etching of the metal plate, an anti-etching agent is formed on the other surface corresponding to the one surface of the metal plate The metal plate is etched and removed in a local area on the surface, and in an area where the etchant is not formed. The method for manufacturing a printed circuit board as described in item 2 of the patent application range, wherein the local area where the etchant is formed on the other surface of the metal plate is where the conductor pad is to be formed on An area where the first circuit pattern is positioned between the first circuit patterns. The method for manufacturing a printed circuit board according to item 1 of the patent application range, wherein the conductor pad is formed of a metal plate in the metal plate that is kept unremoved by selectively etching the metal plate . The method for manufacturing a printed circuit board according to item 1 of the patent application range, wherein the width of the conductor pad is the same as or wider than the width of the first circuit pattern. A method of manufacturing a printed circuit board, comprising: forming a first circuit pattern on one surface of a metal plate; forming an insulating layer on the one surface of the metal plate, the insulating layer covering the first circuit pattern; And a conductor pad protruding from the insulating layer is selectively formed on a part of the first circuit pattern, wherein the conductor pad is formed of a metal plate remaining unremoved in the metal plate, wherein The first circuit pattern is embedded in the insulating layer so that the surface of the first circuit pattern is coplanar or lower than the surface of the insulating layer, and wherein a portion of the first circuit pattern is connected to Described conductive pad. A method of manufacturing a printed circuit board as described in item 6 of the patent application range, wherein in the selective formation of the conductor pad, a portion of the metal plate is kept from being selectively etched by the metal plate Remove. The method of manufacturing a printed circuit board as described in item 6 of the patent application range, wherein in the selective formation of the conductor pad, an etchant is formed on another surface corresponding to the one surface of the metal plate The metal plate is etched and removed in a localized area on a surface and in the area where the etchant is not formed. The method for manufacturing a printed circuit board as described in item 8 of the patent application range, wherein the local area where the anti-etching agent is formed on the other surface of the metal plate is the conductor pad to be formed on the An area where the first circuit pattern is positioned between the first circuit patterns. The method for manufacturing a printed circuit board as described in item 6 of the patent application range, wherein the width of the conductor pad is the same as or wider than that of the first circuit pattern degree.

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