201016092 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種印刷電路板之鑽孔方法，特指於銅 泊先進打化學蝕刻處理，而後再以雷射擊穿銅箔以及基板 而完成鐵孔之方法。 【先前技術】 印刷電路板主要係使用一絕緣材料作為基板，於該基 ❿板上並佈置有由導電材質所形成的線路，其可供電子元件 安裝，並藉由線路提供電子元件之間的電性連接’而目前 該線路之形成方法，主要係由於基板上覆蓋一銅箱，再以 餘刻之方式形成所設計之線路。 隨著高性能化、高密度化之需求，印刷電路板逐漸朝 多層化發展，而為使各層之間能形成電性連接，於印刷電 路板上係形成有通孔等，並於孔内形成有導電材質，藉以 達成連接各層印刷電路板之線路的目的。 〇 目前於印刷電路板上之鑽孔方法主要係使用加工速度 快且可形成較小孔徑的雷射鑽孔法，而所使用雷射種類係 有二氧化碳（cod雷射以及石榴石（ND:YAG)雷射等，其中使 用二氧化碳雷射者，由於銅箔表面具有一較高的亮度，對 一軋化碳雷射光的吸收率相當的低，導致必須預先將欲鑽 孔位置的銅箔去除，亦即形成所謂的鋼窗（Conformal Mask)，再以二氧化碳雷射擊穿基板，達到鑽孔的目的， 然而製作該銅窗必須多進行一道影像轉移製程，並且有一 旦鋼窗位置產生偏差，將連帶造成基板上鑽孔位置產生偏 5 201016092 差之缺點，而使用石榴石雷射者，由於其能量較強，可在 不形成銅窗的情況下直接擊穿銅荡以及基板完成鑽孔之目 的，惟石榴石雷射鑽孔機有加工速度較二氧化碳雷射鑽孔 機為慢且機台費用昂貴之缺點。 為解決上述問題點，於發明專利公告第457157號專 利案揭s 了一 τ直接使用=氧化碳雷射對覆蓋有銅猪之機 板進行鑽孔的方法，其係利用一蝕刻液對欲鑽孔位置之銅 〇箱表面進行化學蝕刻，其蝕刻量約為l.Silvm，使原本呈 光滑狀的銅箱表面粗化，並顯現呈一顏色較未處理之銅猪 為深的棕色，當雷射照射於銅落上時，經粗化且顏色較深 的銅箱表面可具有較高的雷射光吸收率，因此經化學钱刻 處理後即使使用二氧化碳雷射仍可擊穿銅荡以及基板而達 到鑽孔之目的。 然而，該現有技術中，化學蝕刻對銅箱之蝕刻量為15 ，因此該製程係適用於一銅箔厚度介於一定範圍(約 ©為5至7“）内之基板，當銅箱厚度超出該範圍時，該前 案所汉计之製程對銅箱之姓刻量將使銅箱在化學钱刻後仍 ―子有相田的厚度’在使用二氧化碳雷射進行鑽孔時將有 :量不足而無法擊穿銅之現象’又超薄銅箱由於成形不 而價格非常昂貴，使用超薄銅羯將增加生產成本，因此 何使用-厚度較厚的㈣而仍可直接以二氧化碳雷射進 仃鑽孔，確為有待解決之問題。 【發明内容】 為解決上述有待解決之問題點，本發明藉由於銅猪表 6 201016092 面進行4匕學钱刻處理，期望使厚度大於前案之化學钱刻 方法可應料厚度範®的㈣在經處理後仍可直接使用一 能量較弱的雷射例如二氧化碳雷射來擊穿以達成鐵孔之目 的0 為達成上述發明目的，本發明提供一至少於一側板面 上覆蓋有㈣的基板’該基板由絕緣材質所製A，該銅猪 之厚度為12至18“’銅箱表面先進行—酸、驗清洗並中 和及洗淨’隨後以-含有機物、硫酸（11肌）、雙氧水⑽2) 以及銅離子之蝕刻液對銅荡進行化學蝕刻，其中該有機物 可均句分散並吸附於銅箱表面，而硫酸(Μ〇4)以及雙氧水 (Η202)係蝕刻銅箱表面未為有機物吸附的位置，使銅箱表 面形成有許多微孔，腐#反應之反應式係如下所述：201016092 IX. Description of the invention: [Technical field of the invention] The present invention relates to a method for drilling a printed circuit board, which is specifically directed to a copper chemical etching process, and then the iron is fired through the copper foil and the substrate to complete the iron. The method of the hole. [Prior Art] A printed circuit board mainly uses an insulating material as a substrate on which a circuit formed of a conductive material is disposed, which can be mounted by electronic components and provided between the electronic components by a line. Electrical connection 'The current method of forming the line is mainly due to the fact that the substrate is covered with a copper box, and the designed circuit is formed in the same manner. With the demand for high performance and high density, printed circuit boards are gradually becoming more multi-layered, and in order to make electrical connections between the layers, through holes are formed on the printed circuit board, and formed in the holes. There is a conductive material to achieve the purpose of connecting the circuits of the printed circuit boards of each layer. 〇The current drilling method on the printed circuit board mainly uses laser drilling method with high processing speed and small aperture, and the laser type used is carbon dioxide (cod laser and garnet (ND: YAG). Laser, etc., in which a carbon dioxide laser is used, since the surface of the copper foil has a high brightness, the absorption rate of a rolled carbon laser light is relatively low, so that the copper foil to be drilled must be removed in advance. That is to say, a so-called Conformal Mask is formed, and then the carbon dioxide is fired through the substrate to achieve the purpose of drilling. However, the copper window must be subjected to an image transfer process, and once the position of the steel window is deviated, it will be associated. The disadvantage of the hole position on the substrate is 5 201016092, and the use of garnet laser, due to its strong energy, can directly penetrate the copper slab and the substrate to complete the drilling without forming a copper window. However, the garnet laser drilling machine has the disadvantage that the processing speed is slower than that of the carbon dioxide laser drilling machine and the machine is expensive. To solve the above problems, the invention patent notice Patent No. 457,157 discloses a method for drilling a copper-covered machine board by direct use of a oxidized carbon laser, which uses an etching solution to chemically etch the surface of the copper box to be drilled. The etching amount is about 1.Silvm, which roughens the surface of the originally smooth copper box and shows a brown color which is darker than the untreated copper pig. When the laser is irradiated onto the copper, it is roughened. The darker copper box surface can have a higher laser light absorption rate, so even after using the carbon dioxide laser, it can penetrate the copper slab and the substrate to achieve the purpose of drilling. The chemical etching has a etching amount of 15 for the copper box, so the process is suitable for a substrate having a copper foil thickness within a certain range (about 5 to 7", when the thickness of the copper box exceeds the range, In the previous case, the process of the Chinese version of the copper box will make the copper box still have the thickness of the phase after the chemical money. When drilling with a carbon dioxide laser, there will be: insufficient amount to penetrate the copper. The phenomenon's ultra-thin copper box is not formed The price is very expensive, the use of ultra-thin copper enamel will increase the production cost, so how to use - thicker (four) and still directly into the carbon dioxide laser drilling hole, is a problem to be solved. The problem to be solved is that the invention is processed by the copper pig table 6 201016092 face, and it is expected that the thickness of the method can be made larger than the chemical money engraving method of the previous case (4). In order to achieve the above object, a weaker laser such as a carbon dioxide laser is used for the purpose of achieving the purpose of achieving the iron hole. The present invention provides a substrate which is covered with at least one side of the board surface (the fourth substrate) is made of an insulating material. System A, the thickness of the copper pig is 12 to 18" 'the surface of the copper box is first - acid, cleaned and neutralized and washed" followed by - containing organic matter, sulfuric acid (11 muscle), hydrogen peroxide (10) 2) and copper ions The etching solution chemically etches the copper splatter, wherein the organic substance can be uniformly dispersed and adsorbed on the surface of the copper box, and the surface of the etched copper box of sulfuric acid (Μ〇4) and hydrogen peroxide (Η202) is not adsorbed by organic matter. , Formed on the surface of the copper box has many pores, the reaction of the reaction formula-based rot # follows:
Cu + H202—Cu0 + H20 Cu+H2S04— Cu2++S042_+h2〇 銅荡之蝕刻量係控制為2.5至4.5" m之間(以重量變 化計算）’經化學姓刻處理後的銅笛，其表面係呈多孔狀 且顏色較處理前為深而呈現為深棕色； 於化學㈣完成後’係以__雷射鑽孔機進行鑽孔加 工’以雷射照射於該銅箱表面上欲進行鑽孔之部位，將銅 箔及基板擊穿而達到鑽孔的目的。 本發明之優點在於，由於照射於鋼箔表面的雷射光束 並非直接反射而逸散，而县却八土去 叩疋0卩分先束可進入於微孔内，並 於微孔内反射、折射’ &雷射之能量可為銅賴吸收，因 此即使使用能量較弱的雷射例如二氧化碳雷射，仍可擊穿 7 201016092 銅箔以及基板，而達到鑽孔之目的’因此本發明可應用於 一覆蓋有厚度為12至i8#m的銅箔的基板上，使該基板 能夠以加工速度較快的二氧化碳雷射加工機進行鑽孔加 工’並且使基板可使用厚度較厚的銅箔而達到節省成本之 功效。 【實施方式】 請參見第一圖所示，本發明首先提供一於一側板面上 覆蓋有銅箔（12)的一基板（11)，該基板（11)由絕緣材質所 製成，該絕緣材質可為樹脂，基板（丨丨）並於至少一側板面 上覆蓋有銅箔（12)，該銅箔（12)之厚度可介於12至18^m 之間，而後將該基板（11)置於一酸、鹼溶液中以去除銅箔 (12)表面之氧化物以及油脂，再以一清洗液進行中和及洗 淨，於洗淨完畢後，使用一蝕刻液對銅箔（丨2)進行化學蝕 刻，該蝕刻液為含有機物（13)、硫酸（H2S〇4)、雙氧水（H) 以及銅離子之水溶液，其中硫酸與雙氧水可與銅镇產生丄 ❹蝕反應其重量百刀比可分別為7以及，而該有機物（13) 可均句分散並吸附於銅笛（12)表面，使銅络（12)表面一部 份為其所覆蓋，並阻擋硫酸（Μ〇4)以及雙氧水（HA)對其 所覆蓋之銅箱（12)表面進純刻，而該銅離子可增加飯刻 液對銅箱之腐蝕效果，其添加於蝕刻液内之方法，係以僅 含有有機物（13)、硫酸（HzS〇4)以及雙氧水（n)之溶液對 一廢棄之印刷電路板的銅_進行化學㈣，使銅受腐餘後 產生銅離子並進入於溶液内，而成為所述之㈣液，銅離 子於蝕刻液内之濃度並控制於h 5至25g/i之間； 8 201016092 配合參見第二圖所示，該蝕刻液僅腐蝕銅箔（12)表面 上未為所述有機物（13)所覆蓋之部位，因而形成有許多微 孔（121)，腐蝕反應之反應式係如下所述：The etching amount of Cu + H202—Cu0 + H20 Cu+H2S04— Cu2++S042_+h2〇 copper is controlled to be between 2.5 and 4.5 " m (calculated by weight change) 'copper flute treated by chemical surname The surface of the surface is porous and the color is darker than that before the treatment; after the completion of the chemical (4), it is drilled by a __ laser drilling machine to irradiate the surface of the copper box with a laser. For the part to be drilled, the copper foil and the substrate are broken down to achieve the purpose of drilling. The invention has the advantages that the laser beam irradiated on the surface of the steel foil is not directly reflected and dissipated, but the county has eight soils to remove the first beam, and the first beam can enter the micropores and reflect in the micropores. The energy of the refraction ' & laser can be absorbed by the copper lining, so even if a weaker laser such as a carbon dioxide laser is used, the 7 201016092 copper foil and the substrate can be broken down to achieve the purpose of drilling. It is applied to a substrate covered with a copper foil having a thickness of 12 to i8 #m, so that the substrate can be drilled by a carbon dioxide laser processing machine with a faster processing speed, and the substrate can be used with a thick copper foil. And achieve cost savings. [Embodiment] Referring to the first figure, the present invention first provides a substrate (11) covered with a copper foil (12) on one side of a board surface, the substrate (11) being made of an insulating material, the insulation The material may be a resin, a substrate (丨丨) and at least one side of the board surface covered with a copper foil (12), the copper foil (12) may have a thickness of between 12 and 18 cm, and then the substrate (11) ) is placed in an acid or alkali solution to remove oxides and grease on the surface of the copper foil (12), and then neutralized and washed with a cleaning solution. After the cleaning, an etching solution is used to treat the copper foil (丨) 2) performing chemical etching, the etching solution is an aqueous solution containing organic matter (13), sulfuric acid (H2S〇4), hydrogen peroxide (H) and copper ions, wherein sulfuric acid and hydrogen peroxide can react with copper to produce a corrosion reaction. The ratio can be 7 and respectively, and the organic matter (13) can be uniformly dispersed and adsorbed on the surface of the copper flute (12), so that a part of the surface of the copper (12) is covered and blocks sulfuric acid (Μ〇4). And the hydrogen peroxide (HA) fills the surface of the copper box (12) covered by it, and the copper ion can increase the rice engraving liquid. The corrosion effect of the copper box, which is added to the etching liquid, is to chemically treat the copper of a discarded printed circuit board with a solution containing only organic matter (13), sulfuric acid (HzS〇4), and hydrogen peroxide (n). After the copper is corroded, copper ions are generated and enter into the solution to become the liquid (4), and the concentration of copper ions in the etching liquid is controlled between h 5 and 25 g/i; 8 201016092 As shown in the figure, the etching solution only corrodes a portion of the surface of the copper foil (12) which is not covered by the organic substance (13), and thus a plurality of micropores (121) are formed, and the reaction formula of the corrosion reaction is as follows:
Cu+H202->Cu0+H20 Cu+H2S04-> Cu2++S042-+H20 配合參見第三圖所示’於腐银過程中，該銅離子可參 與反應’使微孔（121 )不僅只有孔深增加，其孔壁亦受腐 钱而使孔徑擴張，而銅箔（12)之蝕刻量係控制為2. 5至4. 5 # m之間（以重量變化計算），參見第四圖所示，經化學餘 刻處理後’銅箔（12)表面係呈凹凸起伏的多孔狀且顏色較 化學餘刻處理之前為深而呈現為深棕色狀，而該蝕刻液並 可予以收集，供其餘化學蝕刻製程使用； 進一步參見第五及第六圖所示，於化學蝕刻完成後， 係以一二氧化碳雷射鑽孔機（2 0)進行鑽孔加工，由於光束 可進入於微孔（121)内’並於微孔（12ι)内反射、折射而不 至於立刻逸散，並且銅箔係呈現較深色的棕色狀，因此可 增加銅箱（12)對二氧化碳雷射的能量的吸收，使二氧化碳 雷射可擊穿銅箔以及基板以達到鑽孔之目的。 【圖式簡單說明】 第一圖為本發明中有機體散佈於銅箔表面之示意圖。 第一及第三圖為本發明中銅箔為蝕刻液所腐蝕之示意 圖。 第四圖為本發明中銅箔經蝕刻後以掃描式電子顯微鏡 所觀察之表面金相圖。 9 201016092 第五圖及第六圖為本發明中以雷射於印刷電路板上鑽 孔之示意圖》 【主要元件符號說明】 (11)基板 (121)微孔 (12) 銅箔 (13) 有機艎 (20)二氧化碳雷射鑽孔機 十、申請專利範圍： ® 1·一種印刷電路板之雷射鑽孔方法，包括： 提供一至少一側板面上覆蓋有銅箔的基板，該銅箔之 厚度為12至18/im; 銅箔表面先進行一酸、鹼清洗並中和及洗淨，隨後以 一含有機物、硫酸（ISO〗）、雙氧水（H202)以及銅離子之蝕 刻液對銅箔進行化學蝕刻，其中該有機物可均勻分散並吸 附於銅箔表面，而硫酸（Η4〇4)以及雙氧水（H2〇2)係蝕刻銅 猪表面未為有機物吸附的位置，使銅箔表面形成有許多微 〇孔； 以一雷射照射於該銅箔表面上欲進行鑽孔之部位，將 銅箔及基板擊穿。 2 .如申請專利範圍第1項所述之印刷電路板之雷射 鑽孔方法’其中於腐蝕過程中，銅離子於蝕刻液中的濃度 係介於1. 5至25g/l之間。 3 ·如申請專利範圍第1或2項所述之印刷電路板之 雷射鑽孔方法，其中其中雷射係使用二氧化碳雷射。Cu+H202->Cu0+H20 Cu+H2S04-> Cu2++S042-+H20 Coordination See the third figure, 'In the process of sulphur, the copper ions can participate in the reaction' to make the micropores (121) not only Only the depth of the hole is increased, the wall of the hole is also subjected to the depletion of money, and the aperture is expanded, and the etching amount of the copper foil (12) is controlled to be between 2.5 and 4. 5 # m (calculated by weight change), see the fourth As shown in the figure, after the chemical etching treatment, the surface of the copper foil (12) is undulating and porous, and the color is deep brown before the chemical treatment, and the etching liquid can be collected. For the rest of the chemical etching process; further see the fifth and sixth figures, after the chemical etching is completed, a carbon dioxide laser drilling machine (20) for drilling, because the beam can enter the micro-hole ( 121) Inside 'and reflected and refracted in the micropores (12 ι) without immediately dissipating, and the copper foil is darker brown, thus increasing the absorption of carbon dioxide by the copper box (12) So that the carbon dioxide laser can penetrate the copper foil and the substrate to achieve the purpose of drilling. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of the organic body dispersed on the surface of a copper foil in the present invention. The first and third figures are schematic views of the copper foil being etched by an etching solution in the present invention. The fourth figure is a metallographic diagram of the surface observed by a scanning electron microscope after etching the copper foil in the present invention. 9 201016092 The fifth and sixth figures are schematic diagrams of drilling holes on a printed circuit board in the present invention. [Description of main components] (11) Substrate (121) Micropores (12) Copper foil (13) Organic艎(20)CO2 laser drilling machine X. Patent application scope: ® 1. A laser drilling method for a printed circuit board, comprising: providing a substrate covered with copper foil on at least one side of the board surface, the copper foil The thickness of the copper foil is first subjected to an acid and alkali cleaning and neutralized and washed, followed by an etching solution containing organic matter, sulfuric acid (ISO), hydrogen peroxide (H202) and copper ions. Chemical etching is performed, wherein the organic substance is uniformly dispersed and adsorbed on the surface of the copper foil, and the surface of the copper pig is not adsorbed by the sulfuric acid (Η4〇4) and the hydrogen peroxide (H2〇2), and the surface of the copper foil is formed. Micro-boring; the copper foil and the substrate are broken down by a laser irradiation on the surface of the copper foil to be drilled. 2之间之间之间。 The concentration of copper ions in the etching solution is between 1. 5 to 25g / l. 3. A laser drilling method for a printed circuit board according to claim 1 or 2, wherein the laser system uses a carbon dioxide laser.