TWI674826B - Back drilling method of circuit board - Google Patents
Back drilling method of circuit board Download PDFInfo
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- TWI674826B TWI674826B TW107134640A TW107134640A TWI674826B TW I674826 B TWI674826 B TW I674826B TW 107134640 A TW107134640 A TW 107134640A TW 107134640 A TW107134640 A TW 107134640A TW I674826 B TWI674826 B TW I674826B
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Abstract
一種電路板的背鑽孔方法,包括:提供鑽孔機,其包含工作台、設置於工作台上方的鑽頭、及電性連接鑽頭的控制模組;將第一導電片體設置於工作台上;依據預設背鑽孔區域以鑽頭接觸第一導電片體,以獲得第一高度資訊;移除第一導電片體;將電路板設置於工作台上;將第二導電片體設置於電路板上;依據預設背鑽孔區域以鑽頭接觸第二導電片體,以獲得第二高度資訊;依據第一高度資訊及第二高度資訊計算實際背鑽孔深度值。 A method for back drilling a circuit board includes: providing a drilling machine comprising a workbench, a drill bit disposed above the workbench, and a control module electrically connected to the drill bit; and placing a first conductive sheet body on the workbench ; According to the preset back drilling area, the drill bit contacts the first conductive sheet body to obtain the first height information; the first conductive sheet body is removed; the circuit board is set on the workbench; the second conductive sheet body is set on the circuit On the board; according to the preset back drilling area, the drill bit contacts the second conductive sheet body to obtain the second height information; and the actual back drilling depth value is calculated according to the first height information and the second height information.
Description
本發明涉及一種電路板的背鑽孔方法,尤其涉及一種能提升背鑽孔深度的加工精度的電路板的背鑽孔方法。 The invention relates to a back drilling method of a circuit board, in particular to a back drilling method of a circuit board capable of improving the processing accuracy of the back drilling depth.
現有的電路板的背鑽孔方法在進行背鑽孔作業時,其是以電路板的表面銅面為基準來統一下鑽設定的深度值,其並沒有考量到電路板與電路板之間的板厚差異或板厚均勻性不佳對背鑽孔深度(stub length)的加工精度帶來的影響。因此,當電路板與電路板之間的板厚差異較大或板厚均勻性不佳時,背鑽孔深度的加工精度會隨著背鑽孔的深度越深,其誤差範圍就會越大。舉例來說,當背鑽孔的深度大於90mil時,背鑽孔深度的加工精度的誤差範圍將達到正負5mil。 In the conventional back-drilling method of a circuit board, when performing a back-drilling operation, it uses the surface copper surface of the circuit board as a reference to uniformly drill down the set depth value, which does not take into account the distance between the circuit board and the circuit board. The influence of plate thickness difference or poor plate thickness uniformity on machining accuracy of back stub length. Therefore, when the thickness difference between the circuit board and the circuit board is large or the thickness uniformity is not good, the processing accuracy of the back drilling depth will be larger as the back drilling depth is deeper, and the error range will be larger. . For example, when the depth of the back drilling is greater than 90 mils, the error range of the machining accuracy of the back drilling depth will reach plus or minus 5 mils.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the present inventor believes that the above-mentioned defects can be improved, and with special research and cooperation with the application of scientific principles, he finally proposes an invention with a reasonable design and effective improvement of the above-mentioned defects.
本發明實施例在於提供一種電路板的背鑽孔方法,能有效改善現有的電路板的背鑽孔方法所存在的缺陷。 An embodiment of the present invention is to provide a back drilling method for a circuit board, which can effectively improve the defects existing in the existing back drilling method for a circuit board.
本發明實施例公開一種電路板的背鑽孔方法,包括:提供一鑽孔機;其中,所述鑽孔機包含有一工作台、間隔地設置於所述 工作台上方的一鑽頭、及電性連接所述鑽頭的一控制模組;將一第一導電片體設置於所述鑽孔機的所述工作台上;實施一第一檢測作業,包含:依據一預設背鑽孔區域以所述鑽孔機的所述鑽頭接觸所述第一導電片體的一檢測面,以獲得所述第一導電片體的所述檢測面位於所述預設背鑽孔區域的一第一高度資訊;移除所述第一導電片體;將一電路板設置於所述鑽孔機的所述工作台上;將一第二導電片體設置於所述電路板的相反於所述工作台的一側的表面上;實施一第二檢測作業,包含;依據所述預設背鑽孔區域以所述鑽孔機的所述鑽頭接觸所述第二導電片體的一檢測面,以獲得所述第二導電片體的所述檢測面位於所述預設背鑽孔區域的一第二高度資訊;依據所述第一高度資訊及所述第二高度資訊以所述鑽孔機的所述控制模組計算出一實際背鑽孔深度值;以及實施一背鑽孔作業,包含:依據所述實際背鑽孔深度值在所述預設背鑽孔區域處以所述鑽孔機的所述鑽頭對所述電路板進行鑽孔,以使得所述電路板形成有一背鑽孔。 An embodiment of the present invention discloses a method for back drilling of a circuit board, which includes: providing a drilling machine; wherein the drilling machine includes a workbench and is disposed on the spaced interval; A drill bit above the workbench and a control module electrically connected to the drill bit; setting a first conductive sheet body on the workbench of the drilling machine; performing a first inspection operation, including: According to a preset back drilling area, the drill of the drilling machine contacts a detection surface of the first conductive sheet body to obtain the detection surface of the first conductive sheet body in the preset A first height information of the back drilling area; removing the first conductive sheet body; setting a circuit board on the working table of the drilling machine; setting a second conductive sheet body on the On the surface of the circuit board opposite to the workbench; performing a second inspection operation, including: contacting the drill bit of the drilling machine with the second conductive body according to the preset back drilling area A detection surface of the sheet body to obtain a second height information of the detection surface of the second conductive sheet body located in the preset back drilling area; according to the first height information and the second height The information uses the control module of the drilling machine to calculate an actual back drilling depth. And implementing a back drilling operation, comprising: drilling the circuit board with the drill bit of the drilling machine at the preset back drilling area according to the actual back drilling depth value, so that The circuit board is formed with a back hole.
本發明實施例另公開一種鑽孔機,包含:一工作台;其中,所述工作台能於一第一檢測作業中提供一第一導電片體設置於其上、且能於一第二檢測作業中提供一電路板及位於所述電路板上的一第二導電片體設置於其上;一鑽頭,間隔地設置於所述工作台的上方;其中,所述鑽頭能於所述第一檢測作業中依據一預設背鑽孔區域朝所述工作台的方向移動,以接觸所述第一導電片體的一檢測面;其中,所述鑽頭能於所述第二檢測作業中依據所述預設背鑽孔區域朝所述工作台的方向移動,以接觸所述第二導電片體的一檢測面;以及一控制模組,電性連接於所述鑽頭;其中,所述控制模組能於所述第一檢測作業中、發送一第一電流訊號至所述鑽頭,並且當所述鑽頭接觸所述第一導電片體的所述檢測面時,所述控制模組能接收由所述鑽頭及所述第一導電片體所共同產生的一第一回饋訊號、且依據所述第一回饋訊號獲得所述第一 高度資訊;其中,所述控制模組能於所述第二檢測作業中、發送一第二電流訊號至所述鑽頭,並且當所述鑽頭接觸所述第二導電片體的所述檢測面時,所述控制模組能接收由所述鑽頭及所述第二導電片體所共同產生的一第二回饋訊號、且依據所述第二回饋訊號獲得所述第二高度資訊;其中,所述控制模組能於一背鑽孔作業中、依據所述第一高度資訊及所述第二高度資訊計算出一實際背鑽孔深度值。 Another embodiment of the present invention discloses a drilling machine, including: a worktable; wherein the worktable can provide a first conductive sheet body disposed thereon in a first inspection operation and can be used in a second inspection During operation, a circuit board and a second conductive sheet body located on the circuit board are provided thereon; a drill bit is disposed above the table at intervals; wherein the drill bit can be placed on the first During the inspection operation, a preset back drilling area is moved toward the table to contact a detection surface of the first conductive sheet body; wherein, the drill can be used according to the second inspection operation. The preset back drilling area is moved in the direction of the table to contact a detection surface of the second conductive sheet body; and a control module electrically connected to the drill bit; wherein the control mold The group can send a first current signal to the drill bit during the first detection operation, and when the drill bit contacts the detection surface of the first conductive sheet body, the control module can receive The drill bit and the first conductive sheet body A first feedback signal generated by the same, and according to the first feedback signal to obtain the first Height information; wherein the control module can send a second current signal to the drill during the second inspection operation, and when the drill contacts the detection surface of the second conductive sheet body , The control module can receive a second feedback signal generated by the drill bit and the second conductive sheet body, and obtain the second height information according to the second feedback signal; wherein, the The control module can calculate an actual back drilling depth value in a back drilling operation according to the first height information and the second height information.
綜上所述,本發明實施例的電路板的背鑽孔方法能通過所述鑽孔機的鑽頭分別於第一及第二檢測作業中對第一及第二導電片體進行檢測、以分別獲得第一及第二高度資訊,並且能依據所述第一及第二高度資訊計算出一實際背鑽孔深度值,從而使得所述背鑽孔深度(stub length)的加工精度被大幅提升。 In summary, the method for back-drilling a circuit board according to an embodiment of the present invention can detect the first and second conductive sheet bodies in the first and second inspection operations by the drill bit of the drilling machine, respectively. The first and second height information is obtained, and an actual back drilling depth value can be calculated according to the first and second height information, so that the processing accuracy of the back drilling depth (stub length) is greatly improved.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, and not to make any limitation to the scope of the present invention limit.
100‧‧‧鑽孔機 100‧‧‧ Drilling Machine
110‧‧‧工作台 110‧‧‧Workbench
111‧‧‧工作台面 111‧‧‧worktop
120‧‧‧鑽頭 120‧‧‧drill
121‧‧‧主軸 121‧‧‧ Spindle
122‧‧‧鑽針 122‧‧‧ Drill Pin
130‧‧‧控制模組 130‧‧‧control module
200‧‧‧第一導電片體 200‧‧‧ the first conductive sheet body
210‧‧‧檢測面 210‧‧‧ detection surface
220‧‧‧檢測點 220‧‧‧testing points
300‧‧‧電路板 300‧‧‧Circuit Board
310‧‧‧通孔 310‧‧‧through hole
320‧‧‧傳導層 320‧‧‧ conductive layer
330‧‧‧背鑽孔 330‧‧‧Back drilling
400‧‧‧第二導電片體 400‧‧‧Second conductive sheet body
410‧‧‧檢測面 410‧‧‧test surface
420‧‧‧檢測點 420‧‧‧testing points
DR‧‧‧預設背鑽孔區域 DR‧‧‧ preset back drilling area
D1、D2‧‧‧厚度 D1, D2‧‧‧thickness
H1‧‧‧第一高度資訊 H1‧‧‧ First Height Information
H2‧‧‧第二高度資訊 H2‧‧‧Second Height Information
SL‧‧‧背鑽孔深度 SL‧‧‧Back drilling depth
P‧‧‧投影平面 P‧‧‧ projection plane
R‧‧‧封閉區域 R‧‧‧ closed area
圖1為本發明實施例鑽孔機的示意圖。 FIG. 1 is a schematic diagram of a drilling machine according to an embodiment of the present invention.
圖2為本發明實施例電路板的背鑽孔方法的步驟S101的示意圖。 FIG. 2 is a schematic diagram of step S101 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖3為本發明實施例電路板的背鑽孔方法的步驟S102的示意圖。 FIG. 3 is a schematic diagram of step S102 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖4為本發明實施例電路板的背鑽孔方法的步驟S103的示意圖。 FIG. 4 is a schematic diagram of step S103 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖5為本發明實施例電路板的背鑽孔方法的步驟S1O4的示意圖。 FIG. 5 is a schematic diagram of step S1O4 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖6為本發明實施例電路板的背鑽孔方法的步驟S105的示意圖。 FIG. 6 is a schematic diagram of step S105 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖7為本發明實施例電路板的背鑽孔方法的步驟S107的示意圖。 FIG. 7 is a schematic diagram of step S107 of a back drilling method for a circuit board according to an embodiment of the present invention.
圖8為本發明實施例第二導電片體的一個檢測點落在第一導電片體的三個檢測點共同構成的封閉區域的範圍內的示意圖。 FIG. 8 is a schematic diagram of a detection point of the second conductive sheet body falling within a closed area formed by the three detection points of the first conductive sheet body according to the embodiment of the present invention.
圖9為本發明實施例第二導電片體的一個檢測點落在第一導電片體的四個檢測點共同構成的封閉區域的範圍內的示意圖。 FIG. 9 is a schematic diagram of one detection point of the second conductive sheet body falling within a closed area formed by the four detection points of the first conductive sheet body according to the embodiment of the present invention.
請參閱圖1至圖9,為本發明的實施例,需先說明的是,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。 Please refer to FIGS. 1 to 9, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the related quantities and appearances mentioned in the drawings, and is only used to specifically describe the embodiments of the present invention, so that In order to understand the content of the present invention, it is not intended to limit the protection scope of the present invention.
[電路板的背鑽孔方法] [Back drilling method of circuit board]
本實施例公開一種電路板的背鑽孔方法。所述電路板的背鑽孔方法包含步驟S101、步驟S102、步驟S103、步驟S104、步驟S105、步驟S106、及步驟S107。必須說明的是,本實施例所載之各步驟的順序與實際的操作方式可視需求而調整,並不限於本實施例所載。 This embodiment discloses a back drilling method for a circuit board. The back drilling method of a circuit board includes steps S101, S102, S103, S104, S105, S106, and S107. It must be noted that the order of the steps and the actual operation mode in this embodiment can be adjusted according to requirements, and are not limited to those in this embodiment.
如圖1及圖2,步驟S101為提供一鑽孔機100。所述鑽孔機100包含一工作台110、一鑽頭120、及一控制模組130。其中,所述工作台110具有一工作台面111。所述鑽頭120包含一主軸121及設置於所述主軸121上的一鑽針122。較佳地,所述主軸121是夾置所述鑽針122。進一步地說,所述鑽頭120是間隔地設置於所述工作台110的工作台面111的上方、且能朝所述工作台面111的方向移動、以執行一檢測作業(如下文所述的第一檢測作業及第二檢測作業)或一鑽孔作業(如下文所述的背鑽孔作業)。所述控制模組130包含一電容式感應單元(圖未繪示)、一訊號處理單元(圖未繪示)、及一算術邏輯單元(圖未繪示),並且所述控制模組130是電性連接於所述鑽頭120。關於上述鑽頭120及控制模組130的操作方式及能執行的功能將於下述步驟中適時地做說明。 As shown in FIGS. 1 and 2, step S101 is to provide a drilling machine 100. The drilling machine 100 includes a work table 110, a drill bit 120, and a control module 130. The workbench 110 has a worktable surface 111. The drill bit 120 includes a main shaft 121 and a drill pin 122 disposed on the main shaft 121. Preferably, the main shaft 121 is sandwiched between the drill pins 122. Further, the drill bit 120 is disposed above the work surface 111 of the work table 110 at intervals, and can be moved in the direction of the work surface 111 to perform a detection operation (as described in Inspection operation and second inspection operation) or a drilling operation (back drilling operation as described below). The control module 130 includes a capacitive sensing unit (not shown), a signal processing unit (not shown), and an arithmetic logic unit (not shown). The control module 130 is Electrically connected to the drill bit 120. The operation modes and functions that can be performed of the drill bit 120 and the control module 130 will be described in due course in the following steps.
如圖3,步驟S102為將一第一導電片體200設置於工作台110的工作台面111上。在本實施例中,所述第一導電片體200較佳 地為呈薄片狀且厚度均一的金屬導電片體,並且所述第一導電片體200更佳地為一鋁片蓋板,但本發明不受限於此。更詳細地說,所述第一導電片體200的相反於工作台面111的一側的表面定義為一檢測面210,並且所述檢測面210能用以提供上述鑽頭120的鑽針122接觸,以執行如下所述的第一檢測作業。 As shown in FIG. 3, step S102 is to set a first conductive sheet body 200 on the work surface 111 of the work platform 110. In this embodiment, the first conductive sheet body 200 is preferably The ground is a metal conductive sheet body having a sheet shape and a uniform thickness, and the first conductive sheet body 200 is more preferably an aluminum sheet cover, but the present invention is not limited thereto. In more detail, a surface of the first conductive sheet body 200 opposite to the work surface 111 is defined as a detection surface 210, and the detection surface 210 can be used to provide contact with the drill pin 122 of the drill bit 120. To perform a first detection job as described below.
如圖4,步驟S103為實施一第一檢測作業。所述第一檢測作業包含:依據一預設背鑽孔區域DR以所述鑽頭120的鑽針122接觸第一導電片體200的檢測面210,以獲得所述第一導電片體200的檢測面210位於預設背鑽孔區域DR的一第一高度資訊H1。 As shown in FIG. 4, step S103 is to perform a first detection operation. The first detection operation includes: contacting the drill pin 122 of the drill 120 with the detection surface 210 of the first conductive sheet body 200 according to a preset back drilling area DR to obtain the detection of the first conductive sheet body 200 The surface 210 is located at a first height information H1 of the preset back drilling area DR.
更具體地說,在實施所述第一檢測作業時,上述鑽孔機100的控制模組130的電容式感應單元(如:CBD電容式感應器)能發送一第一電流訊號至鑽頭120的鑽針122,並且當所述鑽頭120的鑽針122接觸第一導電片體200的檢測面210、且與該檢測面210電流導通時,上述鑽孔機100的控制模組130的訊號處理單元能接收由鑽頭120的鑽針122及第一導電片體200所共同產生的第一回饋訊號、且依據所述第一回饋訊號進行訊號處理、以獲得所述第一高度資訊H1。 More specifically, during the first detection operation, the capacitive sensing unit (such as a CBD capacitive sensor) of the control module 130 of the drilling machine 100 can send a first current signal to the drill 120. A drill pin 122, and when the drill pin 122 of the drill bit 120 contacts the detection surface 210 of the first conductive sheet body 200 and is electrically connected to the detection surface 210, the signal processing unit of the control module 130 of the above-mentioned drilling machine 100 The first feedback signal generated by the drill pin 122 of the drill bit 120 and the first conductive sheet body 200 can be received, and signal processing is performed according to the first feedback signal to obtain the first height information H1.
值得一提的是,在本發明的一實施例中,所述第一導電片體200的檢測面210的面積必須足夠大,以使得當所述鑽頭120的鑽針122接觸所述第一導電片體200的檢測面210時,能順利地啟動檢測作業(如:檢測面210的面積必須大於鑽頭120的主軸121的表面積,以利於形成足夠的電容、且能使得電容值大於標準值)。 It is worth mentioning that, in an embodiment of the present invention, the area of the detection surface 210 of the first conductive sheet body 200 must be sufficiently large so that when the drill pin 122 of the drill bit 120 contacts the first conductive When the detection surface 210 of the sheet 200 is used, the detection operation can be started smoothly (for example, the area of the detection surface 210 must be larger than the surface area of the main shaft 121 of the drill 120 to facilitate the formation of sufficient capacitance and the capacitance value to be greater than a standard value).
接著,在實施所述第一檢測作業且獲得所述第一高度資訊H1後,所述鑽頭120的鑽針122將朝遠離工作台面111的方向移動,並且所述第一導電片體200將被移除(如:利用機械手臂或利用人工搬運等方式移除),以利於進行後續的製造步驟。 Next, after the first detection operation is performed and the first height information H1 is obtained, the drill pin 122 of the drill 120 will move away from the work surface 111, and the first conductive sheet body 200 will be Removal (such as: using a robotic arm or manual handling) to facilitate subsequent manufacturing steps.
如圖5,步驟S104為將一電路板300設置於工作台110的工作台面111上,並且將一第二導電片體400設置於電路板300的相反於工作台110的工作台面111的一側的表面上。 As shown in FIG. 5, step S104 is to set a circuit board 300 on the work surface 111 of the work table 110, and set a second conductive sheet body 400 on a side of the circuit board 300 opposite to the work surface 111 of the work table 110. on the surface.
更詳細地說,所述電路板300具有位於相反側的兩個表面(圖未標號)、且包含有設置於兩個所述表面之間的多個板結構(圖未標號)。另,所述電路板300進一步具有貫穿兩個所述表面的一通孔310、且包含有鍍設於所述通孔310的孔壁上的一傳導層320。其中,當所述電路板300設置於工作台110的工作台面111上時,所述電路板300的通孔310及傳導層320皆是位於預設背鑽孔區域DR的範圍內。其中,在本發明的一實施例中,所述電路板300具有不大於4毫米(mm)的板厚、不大於480毫米的板長、及不大於400毫米的板寬,但本發明不受限於此。 In more detail, the circuit board 300 has two surfaces (not shown in the figure) located on opposite sides, and includes a plurality of board structures (not shown in the figure) disposed between the two surfaces. In addition, the circuit board 300 further has a through hole 310 penetrating the two surfaces and includes a conductive layer 320 plated on the hole wall of the through hole 310. Wherein, when the circuit board 300 is disposed on the work surface 111 of the workbench 110, the through holes 310 and the conductive layer 320 of the circuit board 300 are both located within the range of the preset back drilling region DR. Wherein, in an embodiment of the present invention, the circuit board 300 has a board thickness of not more than 4 millimeters (mm), a board length of not more than 480 millimeters, and a board width of not more than 400 millimeters. Limited to this.
在本實施例中,所述第二導電片體400類似於第一導電片體200、為呈薄片狀且厚度均一的金屬導電片體,並且所述第二導電片體400更佳地為一鋁片蓋板,但本發明不受限於此。更詳細地說,所述第二導電片體400的相反於電路板300的一側的表面定義為一檢測面410,並且所述檢測面410能用以提供上述鑽頭120的鑽針122接觸,以執行如下所述的第二檢測作業。 In this embodiment, the second conductive sheet body 400 is similar to the first conductive sheet body 200 and is a thin metal sheet with a uniform thickness, and the second conductive sheet body 400 is more preferably a Aluminum sheet cover, but the present invention is not limited to this. In more detail, a surface of the second conductive sheet body 400 opposite to the circuit board 300 is defined as a detection surface 410, and the detection surface 410 can be used to provide contact with the drill pin 122 of the drill bit 120, To perform a second detection job as described below.
如圖6,步驟S105為實施一第二檢測作業。所述第二檢測作業包含;依據所述預設背鑽孔區域DR以所述鑽頭120的鑽針122接觸第二導電片體400的檢測面410,以獲得所述第二導電片體400的檢測面410位於預設背鑽孔區域DR的一第二高度資訊H2。 As shown in FIG. 6, step S105 is to perform a second detection operation. The second detection operation includes: contacting the detection surface 410 of the second conductive sheet body 400 with the drill pin 122 of the drill bit 120 according to the preset back drilling area DR to obtain the second conductive sheet body 400. The detection surface 410 is located at a second height information H2 of the preset back drilling area DR.
更具體地說,在實施所述第二檢測作業時,上述鑽孔機100的控制模組130的電容式感應單元(如:CBD電容式感應器)能發送一第二電流訊號至鑽頭120的鑽針122,並且當所述鑽頭120的鑽針122接觸第二導電片體400的檢測面410、且與該檢測面410電流導通時,上述鑽孔機100的控制模組130的訊號處理單元能接收由鑽頭120的鑽針122及第二導電片體400所共同產生的 第二回饋訊號、且依據所述第二回饋訊號進行訊號處理、以獲得所述第二高度資訊H2。 More specifically, when the second detection operation is performed, the capacitive sensing unit (such as a CBD capacitive sensor) of the control module 130 of the drilling machine 100 can send a second current signal to the drill 120. A drill pin 122, and when the drill pin 122 of the drill bit 120 contacts the detection surface 410 of the second conductive sheet body 400 and is electrically connected to the detection surface 410, the signal processing unit of the control module 130 of the drilling machine 100 described above Capable of receiving both the drill pin 122 of the drill bit 120 and the second conductive sheet body 400 The second feedback signal is processed according to the second feedback signal to obtain the second height information H2.
值得一提的是,在本發明的一實施例中,所述第二導電片體400的檢測面410的面積較佳地是大於所述電路板300的表面(如:上表面)的面積。藉此,所述電路板300的表面的導電面積能被提升(電容值能被提升),並且當所述鑽頭120的鑽針122接觸所述第二導電片體400的檢測面410時,能順利地啟動檢測作業。 It is worth mentioning that, in an embodiment of the present invention, an area of the detection surface 410 of the second conductive sheet body 400 is preferably larger than an area of a surface (such as an upper surface) of the circuit board 300. Thereby, the conductive area on the surface of the circuit board 300 can be improved (capacitance can be improved), and when the drill pin 122 of the drill bit 120 contacts the detection surface 410 of the second conductive sheet body 400, Start the inspection job smoothly.
另外值得一提的是,在本發明的一實施例中,所述第一導電片體200在預設背鑽孔區域DR處的厚度D1(如圖4)較佳地是大致等於所述第二導電片體400在預設背鑽孔區域DR處的厚度D2(如圖6)。藉此,在後續計算實際板厚值的步驟中,上述的結構特徵能提升實際板厚值的計算精準度(避免因厚度差異造成的計算誤差)。 It is also worth mentioning that, in an embodiment of the present invention, the thickness D1 (as shown in FIG. 4) of the first conductive sheet body 200 at the preset back drilling region DR is preferably substantially equal to the first The thickness D2 of the two conductive sheet bodies 400 at the preset back drilling region DR (see FIG. 6). Therefore, in the subsequent step of calculating the actual plate thickness value, the above-mentioned structural features can improve the calculation accuracy of the actual plate thickness value (to avoid calculation errors caused by thickness differences).
進一步地說,當所述第一導電片體200的檢測面210在第一檢測作業中被鑽頭120的鑽針122接觸後,會產生微凹陷針痕。因此,若以相同的導電片體進行第二檢測作業,可能會導致實際板厚值的計算精準度被降低(因相同的檢測點已產生微凹陷針痕,會影響高度資訊的量測)。為了避免上述缺陷,在本發明的一實施例中,所述第一導電片體200在實施第一檢測作業之後即被丟棄,並且在實施第二檢測作業時,所述第二導電片體400是採用與第一導電片體200規格相同(如:尺寸、厚度、材質皆相同)的導電片體,但所述第二導電片體400是未被使用過的導電片體。需說明的是,本發明並不受限於上述實施例所載,舉例來說,在本發明的另一實施例中,所述第二導電片體400也可以是與所述第一導電片體200採用相同一張導電片體,也就是說,所述第一導電片體200在使用完畢後可以被重複使用,並且被當作所述第二導電片體400使用。 Further, when the detection surface 210 of the first conductive sheet body 200 is contacted by the drill pin 122 of the drill bit 120 during the first detection operation, micro-dent marks are generated. Therefore, if the second detection operation is performed with the same conductive sheet body, the calculation accuracy of the actual plate thickness value may be reduced (because micro-dent marks have been generated at the same detection point, which will affect the measurement of height information). In order to avoid the above defects, in an embodiment of the present invention, the first conductive sheet body 200 is discarded after the first inspection operation is performed, and when the second inspection operation is performed, the second conductive sheet body 400 The conductive sheet is the same as the first conductive sheet 200 (eg, the same size, thickness, and material), but the second conductive sheet 400 is an unused conductive sheet. It should be noted that the present invention is not limited to the above embodiments. For example, in another embodiment of the present invention, the second conductive sheet body 400 may be the same as the first conductive sheet. The body 200 uses the same conductive sheet body, that is, the first conductive sheet body 200 can be reused after being used, and is used as the second conductive sheet body 400.
步驟S106為依據所述第一高度資訊H1及第二高度資訊H2以上述鑽孔機100的控制模組130的算術邏輯單元計算出一實際背鑽孔深度值,以利於實施後續被鑽孔作業(步驟S107)。 Step S106 is to calculate an actual back drilling depth value based on the first height information H1 and the second height information H2 by using the arithmetic logic unit of the control module 130 of the drilling machine 100, to facilitate the subsequent drilling operation. (Step S107).
更詳細地說,在本發明的一實施例中,所述實際背鑽孔深度值的計算方式包含:將所述第二高度資訊H2與第一高度資訊H1相減、且取絕對值,以獲得一實際板厚值;將所述實際板厚值與儲存於所述控制模組(的儲存單元)的一理論板厚值相除,以獲得一校正比例值;及將所述校正比例值與儲存於所述控制模組130(的儲存單元)的一背鑽孔深度設定值相乘,以獲得所述實際背鑽孔深度值,但本發明不受限於此。 In more detail, in an embodiment of the present invention, the calculation method of the actual back drilling depth value includes: subtracting the second height information H2 from the first height information H1 and taking an absolute value to Obtaining an actual plate thickness value; dividing the actual plate thickness value with a theoretical plate thickness value stored in the control module (storage unit) to obtain a correction ratio value; and dividing the correction ratio value Multiplying with a back drilling depth setting value stored in the control module 130 (storage unit) to obtain the actual back drilling depth value, but the present invention is not limited thereto.
如圖7,步驟S107為實施一背鑽孔作業。所述背鑽孔作業包含:依據所述實際背鑽孔深度值在預設背鑽孔區域DR處以所述鑽頭120的鑽針122對電路板300進行鑽孔,以使得所述電路板300形成有一背鑽孔330。其中,所述鑽頭120的鑽針122對電路板300進行鑽孔的一下鑽深度即為所述背鑽孔深度值。 As shown in FIG. 7, step S107 is to perform a back drilling operation. The back drilling operation includes: drilling the circuit board 300 with the drill pin 122 of the drill bit 120 at a preset back drilling area DR according to the actual back drilling depth value, so that the circuit board 300 is formed. There is a back hole 330. Wherein, the drilling depth of the drill pin 122 of the drill bit 120 for drilling the circuit board 300 is the back drilling depth value.
更詳細地說,在本實施例中,由於所述鑽頭120的鑽針122是朝位於預設背鑽孔區域DR處的通孔310及傳導層320進行鑽孔,因此在實施所述背鑽孔作業之後,所述電路板300的背鑽孔330是重疊於所述通孔310的至少局部,以使得所述傳導層320的至少局部被移除、且使得所述背鑽孔330的孔壁不具有任何的傳導層320。其中,所述背鑽孔330的孔徑是大於通孔310的孔徑,但本發明不受限於此。 In more detail, in the present embodiment, since the drill pin 122 of the drill bit 120 is drilled toward the through hole 310 and the conductive layer 320 at the preset back drilling area DR, the back drilling is implemented. After the hole operation, the back-drilled hole 330 of the circuit board 300 overlaps at least a part of the through-hole 310 so that at least a part of the conductive layer 320 is removed, and the back-drilled hole 330 is a hole The wall does not have any conductive layer 320. The diameter of the back-drilled hole 330 is larger than the diameter of the through-hole 310, but the present invention is not limited thereto.
綜上所述,本發明實施例的電路板的背鑽孔方法能通過所述鑽孔機100的鑽頭120分別於第一及第二檢測作業中對第一及第二導電片體200、400進行檢測、以分別獲得第一及第二高度資訊H1、H2,並且能依據所述第一及第二高度資訊H1、H2計算出一實際背鑽孔深度值,從而使得所述背鑽孔深度SL(stub length) 的加工精度被大幅提升。 In summary, the method for back drilling of a circuit board according to the embodiment of the present invention can pass through the drill bit 120 of the drilling machine 100 to the first and second conductive sheet bodies 200 and 400 in the first and second inspection operations, respectively. Perform detection to obtain first and second height information H1, H2, respectively, and calculate an actual back drilling depth value according to the first and second height information H1, H2, so that the back drilling depth SL (stub length) The machining accuracy has been greatly improved.
更詳細地說,現有的電路板的背鑽孔方法在進行背鑽孔作業時,其是以電路板的表面銅面為基準來統一下鑽設定的深度值,其並沒有考量到電路板與電路板之間的板厚差異或板厚均勻性不佳對背鑽孔深度(stub length)的加工精度帶來的影響。因此,當電路板與電路板之間的板厚差異較大或板厚均勻性不佳時,背鑽孔深度的加工精度會隨著背鑽孔的深度越深,其誤差範圍就會越大。舉例來說,當背鑽孔的深度大於90mil時,背鑽孔深度的加工精度的誤差範圍將達到正負5mil。 In more detail, when the conventional back-drilling method of a circuit board performs a back-drilling operation, it uses the surface copper surface of the circuit board as a reference to uniformly drill down the set depth value, which does not take into account the The influence of the difference in board thickness or the poor uniformity of the board thickness on the processing accuracy of the back stub length. Therefore, when the thickness difference between the circuit board and the circuit board is large or the thickness uniformity is not good, the processing accuracy of the back drilling depth will increase with the depth of the back drilling, and the error range will increase . For example, when the depth of the back drilling is greater than 90 mils, the error range of the machining accuracy of the back drilling depth will reach plus or minus 5 mils.
相對於上述缺失,本發明實施例的電路板的背鑽孔方法能使得被製造出來的電路板300的背鑽孔深度SL(如圖7)的加工精度被大幅地提升。舉例來說,當所述背鑽孔深度SL小於90mil時,所述背鑽孔深度SL的加工精度為正負2mil以內,並且當所述背鑽孔深度SL小於90mil時,所述背鑽孔深度SL的加工精度為正負3mil以內。 Compared with the above-mentioned deficiency, the method for back drilling of the circuit board according to the embodiment of the present invention can greatly improve the processing accuracy of the back drilling depth SL (see FIG. 7) of the manufactured circuit board 300. For example, when the back drilling depth SL is less than 90mil, the processing accuracy of the back drilling depth SL is within plus or minus 2mil, and when the back drilling depth SL is less than 90mil, the back drilling depth SL The processing accuracy of SL is within 3mil.
另外值得一提的是,由於本發明實施例的測試第一及第二高度資訊H1、H2的區域與實施背鑽孔的區域相同(皆是預設背鑽孔區域DR),因此本發明實施例的電路板的背鑽孔方法能藉由評估電路板300位於預設背鑽孔區域DR的實際板厚值來進一步計算出較合理的實際背鑽孔深度值,從而大幅提升背鑽孔深度SL的加工精度。 It is also worth mentioning that, since the area for testing the first and second height information H1, H2 in the embodiment of the present invention is the same as the area where the back drilling is performed (both are the preset back drilling area DR), the present invention is implemented The back drilling method of the example circuit board can further calculate a more reasonable actual back drilling depth by evaluating the actual board thickness value of the circuit board 300 located in the preset back drilling area DR, thereby greatly increasing the back drilling depth. Machining accuracy of SL.
如圖8及圖9,進一步地說,在本發明的另一實施例中,為了提升實際板厚值的精準度,在實施所述第一檢測作業時,所述第一導電片體200的檢測面210在預設背鑽孔區域DR處定義有至少三個檢測點220(如:圖8的三個檢測點220或圖9的四個檢測點220),所述鑽頭120的鑽針122能分別接觸第一導電片體200的至少三個所述檢測點220,以分別獲得所述第一導電片體200的至 少三個所述檢測點220的高度資訊,並且所述第一檢測作業進一步包含:依據所述第一導電片體200的至少三個所述檢測點220的高度資訊以所述控制模組130(的算術邏輯單元)計算出所述第一高度資訊H1。更具體地說,上述第一高度資訊H1的計算方式是將至少三個所述檢測點220的高度資訊以最小平方法的方式進行計算,以獲得一台面高度函數(profile),接著再根據該台面高度函數計算出面補償的第一高度資訊H1,但本發明不受限於此。舉例來說,上述第一高度資訊H1的計算方式也可以例如是利用算數平均數或幾何平均數的方式進行計算。 As shown in FIG. 8 and FIG. 9, further, in another embodiment of the present invention, in order to improve the accuracy of the actual plate thickness value, the first conductive sheet 200 The detection surface 210 defines at least three detection points 220 (eg, the three detection points 220 in FIG. 8 or the four detection points 220 in FIG. 9) at a preset back drilling area DR. The drill bit 122 of the drill bit 120 Can respectively contact at least three of the detection points 220 of the first conductive sheet body 200 to obtain the The height information of the three detection points 220 is less, and the first detection operation further includes: using the control module 130 according to the height information of the at least three detection points 220 of the first conductive sheet body 200. (Arithmetic logic unit) calculates the first height information H1. More specifically, the calculation method of the first height information H1 is to calculate the height information of at least three of the detection points 220 in a least square method to obtain a table height function, and then according to the The table height function calculates the first height information H1 of the surface compensation, but the present invention is not limited to this. For example, the calculation method of the first height information H1 may also be performed by using an arithmetic mean or a geometric mean, for example.
另,在實施所述第二檢測作業時,所述第二導電片體400的檢測面410在預設背鑽孔區域DR處定義有一個檢測點420,並且所述鑽頭120的鑽針122能接觸第二導電片體400的一個所述檢測點420,以獲得所述第二高度資訊H2。 In addition, when the second inspection operation is performed, the detection surface 410 of the second conductive sheet body 400 defines a detection point 420 at a preset back drilling area DR, and the drill pin 122 of the drill 120 can One of the detection points 420 of the second conductive sheet body 400 is contacted to obtain the second height information H2.
請繼續圖8及圖9,所述第一導電片體200的至少三個所述檢測點220彼此不共線;其中,當所述第一導電片體200及第二導電片體400各沿其法線方向投影至一投影平面P上時,所述第二導電片體400的一個所述檢測點420是落在第一導電片體200的至少三個所述檢測點220所共同構成的一封閉區域R的範圍內(如:圖8的三角形封閉區域R或圖9的方形封閉區域R)。 Please continue with FIGS. 8 and 9, at least three of the detection points 220 of the first conductive sheet body 200 are not in line with each other; wherein, when the first conductive sheet body 200 and the second conductive sheet body 400 are along When its normal direction is projected onto a projection plane P, one of the detection points 420 of the second conductive sheet body 400 is formed by at least three of the detection points 220 of the first conductive sheet body 200. Within a range of a closed area R (such as the triangular closed area R in FIG. 8 or the square closed area R in FIG. 9).
[鑽孔機] [driller]
以上為本發明實施例的電路板的背鑽孔方法的說明,而以下接著說明能用於上述電路板的背鑽孔方法的鑽孔機100。必須說明的是,雖然本實施例的鑽孔機100能用於上述電路板的背鑽孔方法,但本發明不受限於此。也就是說,本實施例的鑽孔機100也可以用於其它種類的電路板的背鑽孔方法。 The above is the description of the back drilling method of the circuit board according to the embodiment of the present invention, and the following describes the drilling machine 100 that can be used for the back drilling method of the circuit board. It must be noted that although the drilling machine 100 of this embodiment can be used for the above-mentioned method of back drilling a circuit board, the present invention is not limited thereto. That is, the drilling machine 100 of this embodiment can also be used for other kinds of circuit board drilling methods.
如圖1及圖2,本實施例另公開一種鑽孔機100。所述鑽孔機100包含工作台110、間隔地設置於所述工作台110上方的一鑽頭 120、及電性連接於所述鑽頭120的一控制模組130。 As shown in FIG. 1 and FIG. 2, this embodiment further discloses a drilling machine 100. The drilling machine 100 includes a worktable 110 and a drill bit spaced above the worktable 110. 120, and a control module 130 electrically connected to the drill bit 120.
如圖3及圖5,所述工作台110能於一第一檢測作業中提供一第一導電片體200設置於其上(如圖3)、且能於一第二檢測作業中提供一電路板300及位於所述電路板300上的一第二導電片體400設置於其上(如圖5)。 As shown in FIG. 3 and FIG. 5, the table 110 can provide a first conductive sheet body 200 on a first inspection operation (see FIG. 3), and can provide a circuit during a second inspection operation. The board 300 and a second conductive sheet body 400 on the circuit board 300 are disposed thereon (see FIG. 5).
如圖4及圖6,所述鑽頭120能於第一檢測作業中依據一預設背鑽孔區域DR朝工作台110的方向移動,以接觸所述第一導電片體200的一檢測面210(如圖4),並且所述鑽頭120能於第二檢測作業中依據所述預設背鑽孔區域DR朝工作台110的方向移動,以接觸所述第二導電片體400的一檢測面410(如圖6)。 As shown in FIG. 4 and FIG. 6, the drill bit 120 can be moved in the direction of the worktable 110 according to a preset back drilling area DR during the first inspection operation to contact a detection surface 210 of the first conductive sheet body 200. (As shown in FIG. 4), and the drill bit 120 can be moved in the direction of the worktable 110 according to the preset back drilling area DR in a second inspection operation to contact a detection surface of the second conductive sheet body 400. 410 (see Figure 6).
所述控制模組130能於第一檢測作業中、發送一第一電流訊號至所述鑽頭120,並且當所述鑽頭120接觸第一導電片體200的檢測面210時,所述控制模組130能接收由鑽頭120及第一導電片體200所共同產生的一第一回饋訊號、且依據所述第一回饋訊號獲得所述第一高度資訊H1。再者,所述控制模組130能於第二檢測作業中、發送一第二電流訊號至所述鑽頭120,並且當所述鑽頭120接觸第二導電片體400的檢測面410時,所述控制模組130能接收由鑽頭120及第二導電片體400所共同產生的一第二回饋訊號、且依據所述第二回饋訊號獲得所述第二高度資訊H2。其中,所述控制模組130能於一背鑽孔作業中、依據所述第一高度資訊H1及所述第二高度資訊H2計算出一實際背鑽孔深度值。 The control module 130 can send a first current signal to the drill bit 120 during a first inspection operation, and when the drill bit 120 contacts the detection surface 210 of the first conductive sheet body 200, the control module 130 130 can receive a first feedback signal generated by the drill 120 and the first conductive sheet body 200, and obtain the first height information H1 according to the first feedback signal. Furthermore, the control module 130 can send a second current signal to the drill bit 120 during the second detection operation, and when the drill bit 120 contacts the detection surface 410 of the second conductive sheet body 400, the control module 130 The control module 130 can receive a second feedback signal generated by the drill 120 and the second conductive sheet body 400 and obtain the second height information H2 according to the second feedback signal. The control module 130 can calculate an actual back drilling depth value in a back drilling operation according to the first height information H1 and the second height information H2.
[本發明實施例的技術功效] [Technical effect of the embodiment of the present invention]
綜上所述,本發明實施例的電路板的背鑽孔方法及鑽孔機能通過所述鑽孔機100的鑽頭120分別於第一及第二檢測作業中對第一及第二導電片體200、400進行檢測、以分別獲得第一及第二高度資訊H1、H2,並且能依據所述第一及第二高度資訊H1、H2計算出一實際背鑽孔深度值,從而使得所述背鑽孔深度(stub length)的加工精度被大幅提升。 In summary, the method for back drilling and the drilling machine of the circuit board according to the embodiment of the present invention can pass through the drill bit 120 of the drilling machine 100 to the first and second conductive sheet bodies in the first and second inspection operations, respectively. 200 and 400 are performed to obtain the first and second height information H1 and H2 respectively, and an actual back drilling depth value can be calculated according to the first and second height information H1 and H2, so that the back Drilling depth length) processing accuracy has been greatly improved.
以上所述僅為本發明的優選可行實施例,並非用來侷限本發明的保護範圍,凡依本發明申請專利範圍所做的均等變化與修飾,皆應屬本發明的權利要求書的保護範圍。 The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Any equal changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the protection scope of the claims of the present invention .
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