KR101938379B1 - Processing device for groove of HI-FIX board with improved machining accuracy and Processing method for groove using the same - Google Patents

Abstract

The present invention relates to an apparatus for processing a groove on a Hi-Fix board with improved machining accuracy, comprising: a bush member installed at one side of a main body to be able to move up and down and forming a through hole at the center; a drill unit installed within the bush member to be able to move up and down to go in and out through the through hole in the inner and outer direction of the bush member; a reference block securely installed at one side of the bush member; an actuating block connected to one side of the drill unit to move accompanied with the drill unit if the drill unit moves up and down; a detection unit detecting a relative position of the actuating block from the reference block in the case that an end of the drill unit is arranged at a preset position; and a control unit setting a processing reference value based on a separation distance of an initial position and the relative position of the actuating block and controlling operation of the drill unit according to the set processing reference value. The present invention detects the relative position of the actuating block from the reference block to automatically set the depth of the groove processed by a drill tool, thereby remarkably enhancing processing quality and also reducing work time.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a groove machining apparatus for a high-fix substrate having improved machining accuracy and a groove machining method for a high-

The present invention relates to a groove machining apparatus for a high-precision (HI-FIX) substrate having improved machining accuracy, and more particularly to a groove machining apparatus for detecting a relative position of a movable block on the basis of a reference block, (HI-FIX) substrate having improved machining accuracy and capable of shortening the working time as well as greatly improving the machining quality, and a groove processing method of a high-fix (HI-FIX) substrate using the same .

Semiconductor integrated circuits (ICs) and various electronic components can not operate by itself. They must be mounted and electrically connected to each other, power must be supplied, and the functional parts responsible for this are mounted on a printed circuit board ; A printed circuit board).

PCBs are divided into Rigid PCBs and Flexible PCBs depending on the material. In general, PCBs are divided into single-sided PCBs, double-sided PCBs and multi-layered PCBs depending on the number of layers. A single-sided PCB (PCB) is a PCB on which wiring is formed on only one side of the substrate. A double side PCB (PCB) is a PCB formed with wiring on both sides of a PCB.

A multilayer PCB (MLB) is a PCB in which wires are formed in multiple layers. Single-sided PCBs are mainly used for products with simple functions, and electronic equipment having complex functions increases the number of PCBs in order to place a lot of wiring in a limited space. This is why manufacturing of double-sided PCBs and multi-layered PCBs is more recent than single-sided PCBs.

When manufacturing double-sided PCBs, unlike single-sided PCBs, via holes must be machined and plated to connect the wires on both sides. Generally, via hole machining is performed using CNC (computerized numerical control) type grooving machine (usually more than 6 axes). The CNC drill turns the drill bit at high speed while processing the via hole in the substrate.

Meanwhile, an electrical die sorting (EDS) process is performed to check the electrical characteristics of each device to identify defective devices among the electrical devices formed on the PCB.

In this case, the EDS process is performed by applying an electrical signal to the semiconductor devices formed on the wafer and judging the failure by a signal checked from the applied electrical signal. At this time, the probe card is in contact with a pad formed on each of the semiconductor elements and is connected to external inspection equipment.

Recently, as the size of electronic products has been miniaturized, the size of the PCB to be applied is also miniaturized, and the gap between the devices has been integrated, a very precise processing force in the order of nm is required for manufacturing a high- have.

1 is a view showing a conventional machining apparatus for a high-fix substrate.

A machining apparatus for a high-fix substrate is usually used to form a groove or a hole in the above-described high-fix substrate. An example of such a machining apparatus is shown in FIG.

As shown in FIG. 1, a conventional high-fix substrate processing apparatus 100 includes a main body 110 on which a high-fix substrate, which is an object to be processed, is seated on an upper surface of the main body 110, And a drill part 120 provided with a drill tool 121 at a lower end thereof.

The conventional high-fix substrate processing apparatus 100 fixes a high-fix substrate to be processed on one side of the upper surface of the main body 110, and when the drill unit 120 moves downward according to a predetermined moving distance, And the drill 120 forms a groove by processing one side of the high-fix substrate.

Here, the conventional machining apparatus 100 for a high-fix substrate is configured to manually set the moving distance of the drill 120, that is, to set the machining depth before performing the groove machining of the high-fix substrate, Thus, there is a difference in the setting of the depth of processing.

In addition, in the conventional machining apparatus 100 for a high-fix substrate, when the thickness of a high-fix substrate as an object to be machined varies, the machining depth must be set each time the work setting is reset.

In addition, the conventional machining apparatus 100 for a high-fix substrate can not accurately determine the machining depth even if the machining depth is set accurately, There is a problem that the machining quality is lowered.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and apparatus for detecting a relative position of a movable block on the basis of a reference block, (HI-FIX) substrate having improved machining accuracy and capable of shortening the working time, and a groove processing method for a high-fix (HI-FIX) substrate using the same.

It is another object of the present invention to provide a drill bit guide apparatus which is supported on one side of an intermittent plate when a drill unit reaches a predetermined position so that downward movement of a drill unit is interrupted, (HI-FIX) substrate and a high-fix (HI-FIX) substrate using the same to minimize the friction between the plate and the drill portion and prevent the tool life from decreasing. Grooving method.

It is still another object of the present invention to provide a method of manufacturing a high-quality substrate by analyzing the thickness of a high-fix substrate, which is an object to be processed, (HI-FIX) substrate having improved machining accuracy which can remarkably improve the productivity as well as greatly shortening the time required for the work, and a groove forming apparatus for a high- And to provide a processing method.

According to an aspect of the present invention, there is provided a bushing comprising: a bushing member vertically movably installed at one side of a main body and formed with a through hole at a center thereof; A drill portion which is drawn in and out of the bush member through a through hole; a reference block fixedly installed on one side of the bush member; and a case in which one side is connected to one side of the drill portion, A detection unit for detecting a relative position of the movable block with reference to the reference block when the end of the drill is disposed at a preset setting position, and a detection unit for detecting a relative position between the initial position of the movable block and the relative position A control section for setting the machining reference value based on the spacing distance and controlling the operation of the drill section according to the set machining reference value Wherein the bush member includes a housing which is installed on one side of the main body so as to be movable up and down, a housing space in which the housing space is formed, and a hollow is formed in the bottom thereof; And a bearing member interposed between the intermittent plate and the intermittent plate, the intermittent plate having a hole formed therein and supporting the one side of the outer surface of the drill at a predetermined position when the drill is moved downward, (HI-FIX) substrate having improved machining accuracy.

delete

In addition, the drill part may be formed with an inclined part inclined downwardly inwardly on one side of the outer surface, and the inclined part may be formed on one side of the inner surface of the drill part so as to be inclined downward in a direction in which the hole is formed.

On the other hand, in a groove machining method of a high-fix (HI-FIX) substrate having improved machining accuracy for machining a groove on a high-fix substrate by using a groove machining apparatus of the HI-FIX substrate according to claim 1, An end detecting step of stopping the movement of the drill when detecting the end of the drill part which is moved downward in the end detecting unit provided in the hole of the setting block, Wherein the first relative position of the movable block moved together with the drill is detected based on the reference block when the movement of the drill is stopped and the first relative position of the movable block detected and the first relative position A machining depth setting step of setting a machining reference value on the basis of the distance; It provides for an improved processing accuracy high-fix (HI-FIX) the substrate comprising the processing steps of the grooving method.

The machining step may include detecting the relative position of the reference block with reference to the movable block in a state where the bush member is disposed on the upper surface of the set block having a predetermined thickness, A thickness reference value setting step of setting a thickness reference value on the basis of a distance between the relative positions of the reference blocks; and a thickness reference value setting step of setting a thickness reference value based on the distance between the relative positions of the reference blocks, A thickness detection step of detecting a relative position of the reference block and a thickness of the high fix substrate based on a distance between an initial position of the reference block and a relative position of the detected reference block; The groove is formed on one side of the high-fix substrate when the thickness of the high-speed substrate falls within the effective range of the thickness reference value, For the outside of the effective range preferably it includes a step carried out for the high-fix the substrate to the outside.

According to the present invention, the relative position of the movable block is detected on the basis of the reference block, and the depth of grooving by the drill is automatically set to improve the machining quality, and the work time can be shortened .

When the drill unit reaches a predetermined position, the drill unit is supported on one side of the intermittent plate so that the downward movement of the drill unit is interrupted. The intermittent plate rotates in conjunction with the drill unit, It is possible to minimize the friction between the drill section and the drill section, thereby preventing the life of the tool from being deteriorated.

In the present invention, the thickness of the high-fix substrate as the object to be processed is analyzed before the groove machining, and only the high-fix substrate having a predetermined thickness is subjected to the groove machining at a time, The time required can be greatly shortened and the productivity can be remarkably improved.

1 is a view showing a conventional machining apparatus for a high-fix substrate,
FIG. 2 is a view schematically showing a groove processing apparatus for a high-precision (HI-FIX) substrate with improved machining accuracy according to an embodiment of the present invention,
FIG. 3 is a flowchart showing, in order, a groove processing method using a groove processing apparatus for a high-fix (HI-FIX) substrate according to an embodiment of the present invention,
4 is a view showing a state of setting a machining reference value according to an embodiment of the present invention,
5 is a view showing a state of setting a thickness reference value according to an embodiment of the present invention,
6 is a view showing a state in which a drilling section according to an embodiment of the present invention grooves one side of a high fixa substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a view schematically showing a groove machining apparatus for a high-precision (HI-FIX) substrate with improved machining accuracy according to an embodiment of the present invention.

2, a groove machining apparatus for a high-fix (HI-FIX) substrate having improved machining accuracy according to an embodiment of the present invention includes a main body 10, a bush member 20, a drill 30, A reference block 40, a movable block 50, a detection unit 60, and a control unit 70. [0050]

The main body 10 is formed in a box shape of a substantially rectangular parallelepiped, and a seating area 11 on which a high-fix substrate is seated is formed on the top surface. In the processing of the seated high-fix substrate, And the other side of the upper surface is provided with a clamp for fixing the high-fix substrate.

The main body 10 supports the high-fix substrate, which is an object to be processed, and also provides an installation area having various configurations described later.

The bush member 20 includes a housing 21 having a hollow space 21a formed therein and an intermittent plate 22 rotatably mounted on one side of the housing 21 having the hollow 21a formed therein, And a bearing 23 interposed between the housing 21 and the intermittent plate 22 to provide an installation area of the reference block 40, the movable block 50 and the detection unit 60, which will be described later, It also plays a supporting role.

More specifically, the housing 21 is formed in a substantially cylindrical shape. The housing 21 is installed on an upper portion of a high fix substrate mounted on the seating area 11 on one side of the main body 10 so as to be movable up and down, And serves to support the reference block 40.

The intermittent plate 22 is formed in a substantially plate shape. As described above, the intermittent plate 22 is freely rotatable on one side of the housing 21, supports one side of the outer surface of the drill 30, The load generated during the process of contacting the drill 30 is minimized by controlling the movement of the drill 30 and the rotation of the drill 30 by the rotational force of the drill 30, And serves to prevent breakage due to contact or damage of the drill 30.

A hole 22a through which the end of the drill 30 passes is formed at the center of the intermittent plate 22 and an inclined surface 22b inclined downward in a direction in which the hole 22a is formed at one side of the inner surface, This is because when the drill 30 is contacted, the inclined portion 32a formed on the outer surface of the drill 30 is brought into contact with the inclined surface 22b so that the movement of the drill 30 can be more stably performed .

The bearing 23 is interposed between the intermittent plate 22 and the housing 21 so that the intermittent plate 22 can rotate more smoothly when the intermittent plate 22 rotates. ) Are well known to those of ordinary skill in the art so that they can be purchased and used commercially. Therefore, the detailed description thereof will be omitted.

The drill unit 30 includes a main shaft 31 which is vertically movably installed on a seating area 11 on one side of the main body 10 and a tool body 32 which is rotatably installed below the main shaft 31 And a drill tool 33 coupled to a lower portion of the tool body 32. A groove or hole 22a is formed in one side of the high fix substrate by rotating in contact with one side of the high fix substrate .

The tool body 32 is formed in a substantially cylindrical shape and supports the drill tool 33 in a stable manner and transmits a rotational force applied to the drill tool 33 when rotational force is applied from the main shaft 31 .

The tool body 32 has an inclined surface 22b inclined downwardly inwardly on the lower side of the outer surface of the tool body 32. When the inclined portion 32a is inclined at an inclined surface 22b .

The drill tool 33 is formed in a substantially rod-like shape and serves to process the groove on one side of the high-fix substrate while rotating by the rotational force transmitted from the tool body 32.

The reference block 40 is formed in a substantially block shape and is fixed to one side of the housing 21 to provide a reference position for detecting the position of the movable block 50, So that it can detect the relative position.

The movable block 50 is formed in a substantially block shape like the reference block 40 and is arranged to be movable up and down in the vicinity of the reference block 40. One side of the movable block 50 is connected to one side of the drill 30, 30 are moved downward together with the drill 30 to move downward to detect the moving position of the drill 30.

The detection unit 60 is provided at one side of the housing 21 and serves to detect the relative position of the movable block 50 with reference to the reference block 40 and apply the detected relative position to the control unit 70, A commercially available distance sensor may be used.

The control unit 70 controls the machining depth of the drill unit 30 in the actual grooving based on the machining reference value set through the setting block before the high-fix substrate processing based on the detection value detected from the detection unit 60 The operation of the controller 70 will be described in more detail with reference to FIGS. 3 and 4, which will be described later.

FIG. 3 is a flowchart showing a groove machining method using a groove machining apparatus of a high-fix (HI-FIX) substrate in order according to an embodiment of the present invention, and FIG. 4 is a view showing a machining reference value according to an embodiment of the present invention FIG. 5 is a diagram illustrating a state in which a thickness reference value is set according to an embodiment of the present invention. FIG. 6 is a view illustrating a state in which the drill unit 30 according to the embodiment of the present invention is in a high And the groove is machined on one side of the fix substrate.

A groove machining method using a groove machining apparatus for a HI-FIX substrate according to an embodiment of the present invention will now be described with reference to FIGS. 3 to 6.

First, a setting block G having a setting hole G1 formed on one side thereof is seated and fixed in a seating area 11 of the main body 10, and a bush member 20 is disposed on the upper surface thereof.

The end detecting unit D provided on one side of the inner surface of the setting block G in which the setting hole G1 is formed when the drill 30 moves downward and the lower end of the drill 30 is inserted into the setting block G, The control unit 70 stops the drill unit 30 from moving.

At this time, when the drill unit 30 moves downward, the movable block 50 connected to the drill unit 30 moves along with the movement of the drill unit 30. As the drill unit 30 stops moving, the movement of the movable block 50 also stops.

The detection unit 60 detects the relative position of the movable block 50 moved together with the drill 30 with respect to the reference block 40 and detects the relative position between the initial position of the movable block 50 and the detection position The machining depth to be machined, that is, the machining reference value is set based on the distance between the relative positions.

Next, the setting block G is taken out, and the setting block J having a predetermined thickness is placed in the seating area 11 of the main body 10, and then the bushing 20 is placed on the upper surface of the setting block.

The relative position of the reference block 40 is detected based on the initial position of the movable block 50 while the bush member 20 is in contact with the upper surface of the setting block J, The thickness reference value is set based on the distance between the relative positions of the reference block 40.

Thereafter, a high-fix substrate H as an object to be processed is placed on the seating area 11 of the main body 10, and the bushing 20 is placed on the top surface of the high- 50, the thickness of the high-fix substrate H to be processed is analyzed on the basis of the initial position of the reference block and the separation distance between the reference block and the relative position.

When the thickness of the analyzed high-fix substrate (H) falls within the effective range of the thickness reference value set above, grooving is performed on one side of the high-fix substrate (H). If the thickness of the high- Out.

This is to improve the machining quality by collectively processing the high fix substrates having similar thicknesses in a state where the machining reference value is set, and to shorten the work time by shortening the time for resetting the machining reference.

On the other hand, when the groove machining is performed, the drill portion 30 is moved downward and the inclined portion 32a contacts the inclined surface 22b of the intermittent plate 22 at a position corresponding to the machining reference value, As shown in Fig.

At the same time, the intermittent plate 22, which is in contact with the outer surface of the drill 30, rotates together with the rotation of the drill 30, thereby minimizing the friction load due to the contact.

The detection unit 60 detects the relative position of the movable block 50 with reference to the reference block 40 and detects the movement distance between the detected initial position of the movable block 50 and the relative position with the movable reference value The control unit 70 stops the drilling operation of the drill unit 30 based on the generated signal and returns to the initial position.

Thus, this embodiment can form a groove precisely at a predetermined processing depth on one side of the high-fix substrate (H).

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications and variations without departing from the spirit and scope of the invention. Accordingly, the appended claims are intended to cover such modifications or changes as fall within the scope of the invention.

10: main body 11: seating area
20: Bush member 21: Housing
21a: hollow space 21b: accommodation space
22: intermittent plate 22a: hole
22b: slope 23: bearing
30: drill 31: spindle
32: Tool body 32a:
33: drill section 40: reference block
50: movable block 60: detection unit
70:

Claims (5)

A bush member mounted on one side of the main body so as to be movable in the up and down direction and having a through hole at the center thereof;
A drill unit vertically movably installed in the bush member and drawn in and out of the bush member through the through hole;
A reference block fixedly installed on one side of the bush member;
A movable block having one side connected to one side of the drill part and moving up and down when the drill part moves up and down; And
A detecting unit that detects a relative position of the movable block based on the reference block when the end of the drill is disposed at a predetermined setting position; And
And a controller for setting a machining reference value based on a distance between the initial position of the movable block and the relative position and controlling the operation of the drill according to a set machining reference value,
The bush member
A housing which is installed on one side of the main body so as to be movable in the up and down direction and in which a housing space is formed and a hollow is formed on the bottom;
An intermittent plate that is freely rotatable in the hollow of the housing and has a hole formed at the center thereof and supports one side of the outer surface of the drill at a predetermined position when the drill is moved downward to control the movement of the drill tool; And
And a bearing member interposed between the housing and the intermittent plate, wherein the bearing member is disposed between the housing and the intermittent plate.
delete The method according to claim 1,
Wherein the drill portion has an inclined portion inclined downwardly inwardly on one side of the outer surface,
Wherein the intermittent plate has an inclined surface inclined downward in a direction in which the hole is formed on one side of the inner surface so that the inclined portion contacts the inclined surface.
A groove processing method of a high-fix (HI-FIX) substrate having improved machining accuracy of processing a groove on a high-fix substrate by using a groove machining apparatus of the HI-FIX substrate according to claim 1,
An end detecting step of stopping the movement of the drill when detecting the end of the drill part which is moved downward in the end detecting unit provided in the hole of the setting block;
Wherein when the drill unit stops moving, the relative position of the movable block moved with the drill unit is detected based on the reference block, and based on the detected initial position of the movable block and the distance between the relative positions A machining depth setting step of setting a machining reference value; And
And a machining step of machining the high-speed substrate by moving the drill unit downward by a distance corresponding to the machining reference value.
5. The method of claim 4,
The processing step
The relative position of the reference block is detected on the basis of the movable block in a state where the bushing member is disposed on the upper surface of the set block having a predetermined thickness and the relative position between the initial position of the reference block and the relative position of the detected reference block A thickness reference value setting step of setting a thickness reference value based on the spacing distance;
Wherein the relative position of the reference block is detected on the basis of the movable block in a state where the bush member is disposed on the upper surface of the high fix substrate mounted on the main body and the initial position of the reference block, A thickness detecting step of detecting a thickness of the high-fix substrate based on a distance between the relative positions;
Performing grooving on one side of the high-fix substrate when the analyzed thickness of the high-fix substrate falls within an effective range of the thickness reference value, and taking out the high-quality substrate to the outside when the thickness exceeds the effective range of the thickness reference value (HI-FIX) substrate having improved machining accuracy.

Images