CN101203091A - Circuit board renovation method - Google Patents
Circuit board renovation method Download PDFInfo
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- CN101203091A CN101203091A CNA2006101619847A CN200610161984A CN101203091A CN 101203091 A CN101203091 A CN 101203091A CN A2006101619847 A CNA2006101619847 A CN A2006101619847A CN 200610161984 A CN200610161984 A CN 200610161984A CN 101203091 A CN101203091 A CN 101203091A
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- daughter board
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- circuit board
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Abstract
The invention relates to a repairing method of a printing circuit board, comprising a flaw daughter board moving step which judges that a daughter board of a flaw printing circuit board is moved from a mother board of the printing circuit board, and a groove around the periphery of the moving area on the mother board is formed; a normal daughter board recharge step, a normal daughter board is recharged to the former mother board to replace the original flaw daughter board, and flange which is corresponding and combined to the groove is formed around the periphery of the normal daughter board; a surface treatment step, and all the flaw metal connecting points on all the daughter boards of the mother board are treated to lead all the flaw metal connecting points on all the daughter boards to have a uniform exterior surface. When the normal daughter board is recharged to the mother board, the invention can maintain the accurate corresponding position and reduce the sliding phenomena of the daughter boards on the mother board and guarantee the metal connecting points on various daughter boards of the printing circuit board to have the uniform exterior surface.
Description
Technical field
The present invention relates to a kind of circuit board renovation method
Background technology
For electronic installation equipment miscellaneous, no matter the portable equipment that volume is light and handy or large-scale board etc., it is indispensable indispensable member that its inner circuit board is set.Along with reaching its maturity of printed circuit board (PCB) industry, adopt the circuit board of various different technologies manufacturings also to release one after another, although in manufacture process, manufacturer treats the lifting and the equal strictness of keyholed back plate of product yield, cannot say for sure that the finished product yield is maintained hundred-percent perfect state.
Even strict keyholed back plate, in high volume production process still unavoidably flaw product can appear, see also shown in Figure 4, when making printed circuit board (PCB), for undersized circuit board manufacturing, be to go out several zones prior to planning and designing on the motherboard 50, each zone is in order to constitute an independent daughter board 51, its final products promptly are each independently daughter boards 51, and utilizing this mode is to be convenient to comparatively high amts was directly processed and can produce again to board to motherboard 50 circuit board.When a monoblock motherboard 50 if there is a flaw daughter board 52, conventional practice might be abandoned whole motherboard 50, thus, 51 all wastes of all the other normal daughter boards will improve its production cost relatively for manufacturer.
Cooperate and consult Fig. 5, shown in Figure 6, for solving this kind flaw daughter board 52 problems, a kind of restorative procedure is proposed, this flaw daughter board 52 is cut down on motherboard 50, again a normal daughter board 51 is covered to motherboard 50, the section of motherboard cut place such as Fig. 6, daughter board 51 is stair-stepping the combination with 50 of motherboards.
The method of aforementioned fix-up circuit plate has following shortcoming:
1. when normal daughter board 51 covered to motherboard 50, because both present stepped combination, if there is the slit each other, then daughter board 51 can produce the horizontal sliding phenomenon on motherboard 50, so constitutes bit errors for follow-up circuit board operation meeting.
2. each batch circuit board of manufacturing of different time points may be in slightly different in appearance, so this daughter board 51 that covers to the motherboard 50 may be slightly different with the former daughter board on the motherboard 50, especially both metallic contact in appearance, metallic contact on this covering daughter board 51 may be polluted or oxidation and present the outward appearance of relatively poor state already, so the quality of integral product is constituted harmful effect.
As shown in the above description, the restorative procedure of traditional circuit-board is to have to replace with daughter board displacement, the not good problem of metallic contact outward appearance, proposes a good solution so The present invention be directed to these problems.
Summary of the invention
Technical problem underlying to be solved by this invention is, overcome the above-mentioned defective that prior art exists, and provide a kind of printed circuit board (PCB) restorative procedure, can be when the normal daughter board of covering be to motherboard, keep both and have relative position accurately, reduce the sliding phenomenon of daughter board on motherboard, and guarantee that the metallic contact on each printed circuit board (PCB) daughter board has the homogeneous appearance surfaces.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of printed circuit board (PCB) restorative procedure is characterized in that, comprises: a flaw daughter board removes step, will be judged to be a flaw printed circuit board (PCB) daughter board and remove on a mother-board, and the periphery that removes the zone on this motherboard is formed with a groove; One normal daughter board covering step, with a normal daughter board covering extremely aforementioned motherboard be formed with the flange that correspondence is bonded to groove in the periphery of this normal daughter board replacing former flaw daughter board; One surface treatment step is handled the flaw metallic contact on the total daughter board of this motherboard, has the homogeneous appearance surfaces to make the flaw metallic contact on the total daughter board.
Aforesaid printed circuit board (PCB) restorative procedure, wherein the flaw daughter board removes in the step and includes: whether each daughter board that detects on the motherboard is faulty materials, carries out outward appearance and electrical functionality inspection, and with the flaw daughter board in addition annotation also produce figure shelves in view of the above; Determine the cutting coordinate of flaw daughter board according to the target spot on motherboard and the daughter board; According to the cutting coordinate flaw daughter board is excised on motherboard.
Aforesaid printed circuit board (PCB) restorative procedure, include in the wherein normal daughter board covering step: the coating binder is in the engaging zones of daughter board and motherboard; Whether the accuracy of checking daughter board and motherboard relative position meets the requirements, if then fitted.
Aforesaid printed circuit board (PCB) restorative procedure, wherein surface treatment step includes: the metallic contact of removing irregular colour on the daughter board is with as zone to be processed; On motherboard, form a diaphragm, only exposed aforementioned zone to be processed; On zone to be processed, make metallic contact again; Remove diaphragm.
Aforesaid printed circuit board (PCB) restorative procedure, wherein the metallic contact of irregular colour is to remove in modes such as etching, laser processing, miniature abrasive band or emery wheels on the daughter board.
Aforesaid printed circuit board (PCB) restorative procedure, wherein diaphragm is the dry film that a macromolecular material constitutes.
Aforesaid printed circuit board (PCB) restorative procedure, wherein the flaw daughter board is to excise on motherboard with laser, punching press or microsaws machining mode.
Aforesaid printed circuit board (PCB) restorative procedure, wherein the groove of cutting zone is a perpendicular grooves on the motherboard, this perpendicular grooves outer rim is to form an epirelief block edge; The periphery of this covering daughter board is that the perpendicular grooves and the block edge of corresponding motherboard forms complementary structure.
The invention has the beneficial effects as follows, can when the normal daughter board of covering be to motherboard, keep both and have relative position accurately, reduce the sliding phenomenon of daughter board on motherboard, and guarantee that the metallic contact on each printed circuit board (PCB) daughter board has the homogeneous appearance surfaces.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the floor map of the present invention's one mother-board.
Fig. 2 is the cutaway view of one embodiment of the invention.
Fig. 3 is the cutaway view of another embodiment of the present invention.
Fig. 4 is the existing cutting schematic diagram of repairing printed circuit board (PCB).
Fig. 5 is the existing cutting breach schematic perspective view of repairing printed circuit board (PCB).
Fig. 6 is the existing cutaway view of repairing circuit board.
The number in the figure explanation:
10 motherboards, 11 motherboard target spots
12 engagement grooves, 13 block edge
20 daughter board 20a flaw daughter boards
20b covering daughter board 21 daughter board target spots
22 flanges, 23 grooves
50 motherboards
51 daughter boards
52 flaw daughter boards
Embodiment
See also shown in Figure 1, at first a printed circuit board (PCB) (PCB) motherboard 10 is inspected, be to form several independent daughter boards 20 on this motherboard 10, Visual Ispection can utilize visual inspection or judge by equipment, and circuit characteristic detects and can be undertaken by tester table, after inspection finishes, defect areas or daughter board 20 is indicated, and make the figure shelves (CAD) of a correspondence, these figure shelves are the excision and the whole contraposition usefulness of carrying out flaw daughter board 20a for cutting equipment.
Particularly, at first on motherboard 10, be formed with several, the same daughter board target spot 21 that on each daughter board 20, forms for thin contraposition as the motherboard target spot 11 that thick contraposition is used.Then motherboard 10 is transported on the laser cutting device, distinguish the harmomegathus ratio of view apparatus CCD with the image on the laser cutting device, with the laser cutting light beam coordinate position that is judged to be flaw daughter board 20a is excised then according to the whole motherboard 10 of motherboard target spot 21 calculating.As shown in Figure 2, the periphery of cutting zone is to be manufactured with engagement grooves 12 on motherboard 10.During when the thickness of circuit board if greater than 0.8mm, can adopt microsaws machine cut, punching press to mix use with laser mode, with the raising process velocity.
Be the engagement grooves 12 on the corresponding motherboard 10, the periphery of the covering daughter board 20b of flaw daughter board 20a also is to be processed to form flange 22 as an alternative, and the composition surface of aforementioned engagement grooves 12 and flange 22 is that the coating binder is to fit.
When fitting operation, be to distinguish that by image view apparatus CCD confirms whether whole position precision meets the requirements once more according to motherboard target spot 11 and daughter board target spot 21, if meet the requirements, then carry out the applying operation, otherwise, then by the in addition revisal automatically of operating personnel or board, after finishing, revisal distinguishes that by image view apparatus CCD confirms just to fit after errorless.Because covering daughter board 20b and the combination of 10 of motherboards are to place groove 12 places so that flange 22 is corresponding, so sliding phenomenon between the two can be reduced, the position precision of integral body are effectively improved.
See also shown in Figure 3, another embodiment of the present invention is that the peripheral region of cutting zone on motherboard 10 forms perpendicular grooves 12, extend the block edge 13 of a vertical epirelief in groove 12 outer rims, so the periphery of covering daughter board 20b is to be formed with corresponding complementary structure, the groove 23 and that this complementary structure comprises a vertical configuration equally extends in the flange 22 of these groove 23 outer rims.
After finishing the covering operation, carry out the surface treatment program again one.If the metallic contact place on each daughter board 20, the 20b has the phenomenon that color and luster differs, be to utilize modes such as etching, laser processing, miniature abrasive band, emery wheel that the place of this metallic contact irregular colour is removed.After removing finishes, be the diaphragm that coating one deck constitutes with macromolecule materials such as dry films to the part of nonmetal contact areas, only exposed metallic contact district to be repaired.Then make metallic contact again, after the metallic contact making finishes, then divest diaphragm, so promptly finish the finished product of color homogeneous in the zone that removing finishes.
In sum, the present invention not only can repair the flaw district on the mother-board, and also can keep good contraposition effect in the mending course and obtain preferable position precision, and can guarantee that by a surface treatment program end product has the appearance of color and luster homogeneous.
Claims (8)
1. a printed circuit board (PCB) restorative procedure is characterized in that, comprises:
One flaw daughter board removes step, will be judged to be a flaw printed circuit board (PCB) daughter board and remove on a mother-board, and the periphery that removes the zone on this motherboard is formed with a groove;
One normal daughter board covering step, with a normal daughter board covering extremely aforementioned motherboard be formed with the flange that correspondence is bonded to groove in the periphery of this normal daughter board replacing former flaw daughter board;
One surface treatment step is handled the flaw metallic contact on the total daughter board of this motherboard, has the homogeneous appearance surfaces to make the flaw metallic contact on the total daughter board.
2. printed circuit board (PCB) restorative procedure according to claim 1 is characterized in that described flaw daughter board removes in the step to include:
Whether each daughter board that detects on the motherboard is faulty materials, carries out outward appearance and electrical functionality inspection, and with the flaw daughter board in addition annotation also produce figure shelves in view of the above;
Determine the cutting coordinate of flaw daughter board according to the target spot on motherboard and the daughter board;
According to the cutting coordinate flaw daughter board is excised on motherboard.
3. printed circuit board (PCB) restorative procedure according to claim 1 and 2 is characterized in that including in the described normal daughter board covering step:
The coating binder is in the engaging zones of daughter board and motherboard;
Whether the accuracy of checking daughter board and motherboard relative position meets the requirements, if then fitted.
4. printed circuit board (PCB) restorative procedure according to claim 3 is characterized in that described surface treatment step includes:
The metallic contact of removing irregular colour on the daughter board is with as zone to be processed;
On motherboard, form a diaphragm, only exposed aforementioned zone to be processed;
On zone to be processed, make metallic contact again;
Remove diaphragm.
5. printed circuit board (PCB) restorative procedure according to claim 4, the metallic contact that it is characterized in that irregular colour on the described daughter board are to remove in modes such as etching, laser processing, miniature abrasive band or emery wheels.
6. printed circuit board (PCB) restorative procedure according to claim 4 is characterized in that described diaphragm is the dry film that a macromolecular material constitutes.
7. printed circuit board (PCB) restorative procedure according to claim 4 is characterized in that described flaw daughter board is to excise on motherboard with laser, punching press or microsaws machining mode.
8. printed circuit board (PCB) restorative procedure according to claim 4, the groove that it is characterized in that cutting zone on the described motherboard is a perpendicular grooves, this perpendicular grooves outer rim is to form an epirelief block edge; The periphery of this covering daughter board is that the perpendicular grooves and the block edge of corresponding motherboard forms complementary structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101619847A CN101203091A (en) | 2006-12-12 | 2006-12-12 | Circuit board renovation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101619847A CN101203091A (en) | 2006-12-12 | 2006-12-12 | Circuit board renovation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101203091A true CN101203091A (en) | 2008-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101619847A Pending CN101203091A (en) | 2006-12-12 | 2006-12-12 | Circuit board renovation method |
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| CN (1) | CN101203091A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281983A (en) * | 2009-03-02 | 2011-12-14 | 奥博泰克有限公司 | A method and system for electrical circuit repair |
| CN101877944B (en) * | 2009-04-29 | 2012-06-27 | 鸿骐新技股份有限公司 | Full implanting board of printed circuit board and connecting method thereof |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| WO2015154241A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| CN106714465A (en) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | Visual inspection-based PCB board automatic splicing method |
| CN112399724A (en) * | 2020-11-04 | 2021-02-23 | 广东佛智芯微电子技术研究有限公司 | Bonding wire-based fine line repairing method |
-
2006
- 2006-12-12 CN CNA2006101619847A patent/CN101203091A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281983A (en) * | 2009-03-02 | 2011-12-14 | 奥博泰克有限公司 | A method and system for electrical circuit repair |
| CN101877944B (en) * | 2009-04-29 | 2012-06-27 | 鸿骐新技股份有限公司 | Full implanting board of printed circuit board and connecting method thereof |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| CN102573303B (en) * | 2010-12-31 | 2015-10-07 | 北大方正集团有限公司 | Circuit board molding method and circuit board |
| WO2015154241A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| CN105307397B (en) * | 2015-09-16 | 2018-12-07 | 广州美维电子有限公司 | A kind of circuit board exposure method and device |
| CN106714465A (en) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | Visual inspection-based PCB board automatic splicing method |
| CN112399724A (en) * | 2020-11-04 | 2021-02-23 | 广东佛智芯微电子技术研究有限公司 | Bonding wire-based fine line repairing method |
| CN112399724B (en) * | 2020-11-04 | 2022-03-22 | 广东佛智芯微电子技术研究有限公司 | Bonding wire-based fine line repairing method |
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Open date: 20080618 |