JPH07221414A - Semiconductor circuit board - Google Patents

Abstract

PURPOSE:To simply check defective parts at cutting and splitting step by forming check marks for the precision criterion of cutting and splitting only near the cross points of each scribe line. CONSTITUTION:Semiconductor patterns are formed in each semiconductor circuit pattern forming region on the surface of a glass substrate, 1 and 4 check marks 6 are formed near the cross points 5 of scribe lines 4 and one for each of 4 corners of each circuit substrate and 80mum inside the scribe line 4 with aluminum of wiring material. A L shaped check marks 6 500mum long, 20mum wide is formed, and the substrate is cut along the scribe lines with a general method and split into individual semiconductor circuit substrate. As the check marks 6 are formed at each of 4 corners of the circuit substrate, the checking is easier and more efficient and a substrate is utilized more efficiently compared with the conventional product.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor circuit board which is cut and divided from an insulating board having a plurality of semiconductor circuit patterns and used.

[0002]

2. Description of the Related Art In cutting and dividing a semiconductor circuit board of this type, an alignment mark for recognizing a cutting position of a cutting device is formed on an insulating substrate having a semiconductor circuit pattern, and cutting is performed based on the mark. The method of doing is adopted. However, since this alignment mark is often formed at a position apart from the actual cutting position, it is not necessarily suitable for judging the quality of the cutting division in each of the divided semiconductor circuit boards. It was difficult to use as a standard. Therefore,
When judging the quality of cutting division with this method,
It is necessary to separately form a dedicated mark for making the determination and inspect for a defective cut division, which is troublesome.

On the other hand, as a method for easily inspecting a defective cut / divided product generated in such a cut / division process of a semiconductor circuit board, conventionally, a line shape surrounding the outer peripheral edge of each semiconductor circuit pattern forming region is used. Japanese Patent Laid-Open No. 56-1522 has been proposed.
48, JP-A-4-330758).

In this technique, as shown in FIG. 3, a scribe for cutting each circuit pattern outside the periphery of a plurality of semiconductor circuit board pattern forming regions b formed on an insulating substrate a is provided. In the region inside the (cutting) line c, continuous inspection marks d are formed so as to surround the circuit pattern formation region. In the figure, e indicates a bonding pad for attaching a bonding wire or the like for connecting the semiconductor circuit to the outside. The inspection mark d is formed of a wiring material of a semiconductor circuit pattern or the like. In the semiconductor circuit substrate on which such inspection marks d are formed, are cracks or chips generated when the substrate a is cut and divided according to the scribe line c by dividing means such as cutting have reached the line of the inspection marks d. By checking whether or not the defective product is inspected.

[0005]

However, in the semiconductor circuit board as described above, the inspection mark d having a recognizable constant width is provided outside the peripheral edge of the semiconductor circuit board pattern forming area b. However, since the space P for forming the inspection mark d must be secured at all times, there is a problem that the use efficiency of the substrate is reduced by the area occupied by the mark. Moreover, in wire bonding, etc., as shown in FIG.
There is also a problem that a part of the bonding wire f on the side of the bonding pad e bends downward as shown in FIG.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor circuit board which can solve the above-mentioned problems of the prior art and can easily inspect defective products in the cutting and dividing step. .

[0007]

A semiconductor circuit board according to the present invention is formed by individually forming a plurality of semiconductor circuit patterns on an insulating substrate and then along scribe lines formed on the periphery of each semiconductor circuit pattern forming region. In the semiconductor circuit board to be used by cutting and dividing, it is formed on the insulating substrate in a region where wiring and bonding pad are not formed in the semiconductor circuit pattern forming area and along the outermost peripheral edge of the circuit pattern forming area. It is characterized in that an inspection mark serving as a criterion for determining the cutting division accuracy is formed only in a portion near the intersection of each scribe line.

Here, as shown in FIG. 1, the inspection mark 6 in the present invention is formed on the insulating substrate 1 in the semiconductor circuit pattern forming region 2 where the wiring and the bonding pad 3 are not formed. At the same time, it may be a location (area) corresponding to a location near the intersection 5 of the scribe line 4. More specifically, it is the four corners (corner portions) of the rectangular circuit board, and is preferably an area where the distance y from the scribe line 4 to the inside is 100 μm or less, as shown in FIG. In particular, the distance y from the scribe line 4 is selected based on the scribe accuracy and the allowable amount of cracks and chips at the time of cutting.

The scribe lines 4 are formed close to each other along the outermost peripheral edge of the semiconductor circuit pattern forming region 2. In this way, the scribe line can be formed along the outermost peripheral edge of the circuit pattern forming region because the space for forming the inspection mark, which has been secured between the conventional scribe line and the circuit pattern forming region, is unnecessary. Is.

The inspection mark 6 is appropriately selected with respect to its shape, size, etc. and is not particularly limited, but it is preferable that the inspection mark 6 has a shape parallel to each of the two intersecting scribe lines 4. In this preferable mode, for example, each piece has an L-shape that is parallel to two intersecting scribe lines 4, and the length s of each piece is s.
Is 500 μm or more (about 2000 μm or less) and its width w is 50 μm or less (about 10 μm or more).

Further, the material and method of forming the inspection mark 6 are appropriately selected and are not particularly limited. For example, when a metal material such as a wiring layer forming a semiconductor circuit is used, This has the advantage that it can be formed simultaneously with the circuit pattern, and the complexity of mark formation is almost eliminated. The inspection mark 6 is usually formed directly on the insulating substrate, but it is not particularly limited to this as long as it can be identified at the time of inspection. In addition, for example, an insulating film is laminated and formed on the insulating substrate. It can be formed later on the insulating film. Further, the inspection mark may be formed by an insulating film formed on the insulating substrate. That is,
The insulating film material is not deposited on the portion of the insulating film corresponding to the original inspection mark forming position, and the insulating layer is patterned so that the surface of the insulating substrate is exposed in the mark shape. In this case, the insulating film needs to be formed of a material or the like that can distinguish the insulating film portion and the mark portion (the surface of the insulating substrate) formed by the insulating film.

Further, the insulating substrate in the semiconductor circuit substrate may be any one that can be used in this type of circuit substrate. When the insulating substrate is a glass substrate, cracks and chips are likely to occur at the corners of the circuit board where the scribe lines intersect during the cutting division (cutting), so that the inspection mark 6 as described above is used.
According to this, it is possible to more efficiently and efficiently inspect the cutting division accuracy of such a glass insulating substrate.

[0013]

According to the semiconductor circuit board of the present invention, after the cutting and dividing is performed along the scribe line, the inspection mark formed only in the specific region is visually or visually observed by an automatic inspection device such as a TV camera. The accuracy of cutting division can be inspected by checking whether the inspection mark has cracks or chips. This inspection eliminates defective products.

[0014]

EXAMPLES The present invention will be described in more detail with reference to examples.

As shown in FIG. 1, a plurality of semiconductor circuit patterns are formed in each semiconductor circuit pattern forming region on the surface of a glass substrate 1 having a thickness of 1.1 mm by a conventional method such as thin film forming means. Simultaneously with this pattern formation, four inspection marks 6 were formed using aluminum, which is a wiring material of the semiconductor circuit.

Then, the scribe line 4 is formed on the outer peripheral edge of each semiconductor circuit pattern forming region by a conventional method.

In this embodiment, the inspection marks 6 are formed in the four corners of each circuit board at a position near the intersection 5 of the scribe lines 4 and 80 μm inside the scribe lines 4. As the inspection mark 6, a piece having a length s of 500 μm and a width w of 20 μm was formed into an L shape as a whole. Therefore, in this inspection mark 6, the distance y (= x + w) from the scribe line 4 to the inside is 100.
It is formed in a region having a width of μm.

Next, the substrate on which the plurality of semiconductor circuit patterns, the inspection marks and the like were formed was cut along a scribe line by a conventional means, and divided into individual semiconductor circuit substrates.

Each of the obtained semiconductor circuit boards was inspected for inspection marks 6 and inspected for cracks or chips during cutting and division. In this embodiment, since the glass substrate is used as the insulating substrate 1, cracks and chips are often generated at the corners of the circuit board, but the inspection marks 6 are formed at the four corners of the circuit board. By doing so, the above-mentioned inspection could be performed easily and efficiently. Further, since the inspection mark 6 is formed in the circuit pattern forming region as described above, the substrate can be effectively used as compared with the conventional product in which the mark is formed outside the forming region.

[0020]

As described above, in the semiconductor circuit board of the present invention, the inspection mark serving as the judgment standard of the cutting and dividing accuracy, the wiring and the bonding pad in the semiconductor circuit pattern forming region on the insulating substrate are formed. Since it is formed only on the unexposed portion and in the vicinity of the intersection of each scribe line, the inspection mark is placed on the portion outside the semiconductor circuit pattern forming area and on the inside of the scribe line as in the conventional product. It is not necessary to secure an extra space for formation, and the insulating substrate can be effectively used accordingly. Further, since the inspection mark does not exist between the bonding pad and the edge portion of the circuit board, it is possible to prevent a problem in the conventional product such that a part of the bonding wire bends downward and comes into contact with the inspection mark to cause a short circuit. it can.

As described above, according to the present invention, by only forming the inspection mark only in the specific area as described above, it is possible to easily inspect the defective product in the cutting and dividing step using the inspection mark as a criterion. .

[Brief description of drawings]

FIG. 1 is a conceptual plan view showing a semiconductor circuit board according to an embodiment of the present invention.

2A and 2B are views for explaining an inspection mark on a semiconductor circuit board, in which a is a plan view thereof and b is its bb.
It is a line sectional view.

FIG. 3 is a conceptual plan view showing a conventional semiconductor circuit board on which inspection marks are formed.

FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3 and is a view for explaining a state where a defective product is generated by a conventional inspection mark and a bonding wire.

[Explanation of symbols]

1 ... Insulating substrate, 2 ... Semiconductor circuit pattern formation region, 3
… Wiring and bonding pads, 4… Scribing lines, 5
… Intersection, 6… inspection mark.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location H01L 21/301 H05K 3/00 XP (72) Inventor Ryo Yamazawa 2274 Hongo, Ebina City, Kanagawa Prefecture, Fuji Xerox Co., Ltd.

Claims (1)

[Claims] 1. A semiconductor circuit board which is formed by forming a plurality of semiconductor circuit patterns on an insulating substrate and then individually cutting and dividing the semiconductor circuit pattern along a scribe line formed at the periphery of each semiconductor circuit pattern forming region. Only the portion in the semiconductor circuit pattern forming region on the insulating substrate where the wiring and bonding pad are not formed and near the intersection of the scribe lines formed along the outermost peripheral edge of the circuit pattern forming region A semiconductor circuit board, wherein an inspection mark serving as a judgment standard for cutting and dividing accuracy is formed on.