JPH0541567A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0541567A JPH0541567A JP19650091A JP19650091A JPH0541567A JP H0541567 A JPH0541567 A JP H0541567A JP 19650091 A JP19650091 A JP 19650091A JP 19650091 A JP19650091 A JP 19650091A JP H0541567 A JPH0541567 A JP H0541567A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- circuit pattern
- forming substrate
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線板に係り、
特に該プリント配線板を試験するための試験回路パター
ンを備えたプリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board,
Particularly, it relates to a printed wiring board having a test circuit pattern for testing the printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は、所定の縦×横の規格
寸法があるのが通例であり、そのため、このようなプリ
ント配線板を形成するには、図2(a)に示すように、この
規格寸法にできるだけ接近した規格寸法のプリント配線
板形成用基板３を選択し、このプリント配線板形成用基
板３にメッキ工程、スルーホールの孔開け工程、積層工
程等のプリント配線板形成のための処理工程を施して、
このプリント配線板形成用基板３内にプリント配線板１
を形成している。2. Description of the Related Art Printed wiring boards usually have predetermined vertical and horizontal standard dimensions. Therefore, in order to form such a printed wiring board, as shown in FIG. For selecting a printed wiring board forming substrate 3 having a standard dimension as close as possible to this standard dimension, for forming a printed wiring board on the printed wiring board forming substrate 3 such as a plating step, a through hole punching step, and a laminating step. The treatment process of
The printed wiring board 1 is placed in the printed wiring board forming substrate 3.
Is formed.
【０００３】そしてこの完成したプリント配線板１をプ
リント配線板形成用基板３より切り出している。ところ
で、このように形成されたプリント配線板１の特性イン
ピーダンス等の検査項目を試験し、形成されたプリント
配線板１が良品であるか、不良であるかを検査するため
の試験回路パターン２を、このプリント配線板１の内部
に設けるか、或いは図示するように該プリント配線板１
の形成領域の近傍に別個に設けることが実施されてい
る。The completed printed wiring board 1 is cut out from the printed wiring board forming substrate 3. By the way, a test circuit pattern 2 for inspecting the inspection items such as the characteristic impedance of the printed wiring board 1 formed in this way and inspecting whether the formed printed wiring board 1 is a good product or a defective product is provided. Provided inside the printed wiring board 1 or as shown in FIG.
It is implemented separately in the vicinity of the formation region.
【０００４】特にこのプリント配線板の特性インピーダ
ンスの検査を行うための試験回路パターンは、プリント
配線板と同様な製造工程を用いて形成した方が、よりプ
リント配線板の特性に合致した検査ができるとされてい
る。In particular, if the test circuit pattern for inspecting the characteristic impedance of the printed wiring board is formed by using a manufacturing process similar to that of the printed wiring board, it is possible to more closely match the characteristics of the printed wiring board. It is said that.
【０００５】図2(b)に示すように、このような完成され
たプリント配線板１の特性インピーダンス等の検査項目
を検査するための試験回路パターン２を、形成すべきプ
リント配線板１の形成領域の近傍に設ける場合、この試
験回路パターン１を形成する領域の面積分だけ、定尺寸
法の大きいプリント配線板形成用基板３を用いる必要が
ある。As shown in FIG. 2B, a test circuit pattern 2 for inspecting inspection items such as characteristic impedance of the completed printed wiring board 1 is formed. When it is provided in the vicinity of the area, it is necessary to use the printed wiring board forming substrate 3 having a large standard size by the area of the area where the test circuit pattern 1 is formed.
【０００６】[0006]
【発明が解決しようとする課題】そしてこの定尺寸法の
大きいプリント配線形成用基板３を用いて、プリント配
線板１、並びに試験回路パターン２を形成した後、該試
験回路パターン２を用いて、前記形成されたプリント配
線板１の特性インピーダンス等の諸特性を測定した後、
このプリント配線板１を定尺のプリント配線板形成用基
板３から切断している。そのため、定尺のプリント配線
板形成用基板３の可なりの面積が不要となって切断され
て放棄され、形成されるプリント配線板の製造コストが
大となる問題点を生じている。The printed wiring board 1 and the test circuit pattern 2 are formed by using the printed wiring board 3 having a large standard size, and then the test circuit pattern 2 is used. After measuring various characteristics such as characteristic impedance of the formed printed wiring board 1,
This printed wiring board 1 is cut from a printed wiring board forming substrate 3 of a fixed length. Therefore, a considerable area of the printed wiring board forming substrate 3 of a fixed length becomes unnecessary and is cut and abandoned, which causes a problem that the manufacturing cost of the formed printed wiring board becomes large.
【０００７】本発明は上記した定尺のプリント配線板形
成用基板３が無駄に成らないようにして製造コストを低
下させたプリント配線板を目的とする。It is an object of the present invention to provide a printed wiring board in which the above-mentioned regular-sized printed wiring board forming substrate 3 is not wasted and the manufacturing cost is reduced.
【０００８】[0008]
【課題を解決するための手段】本発明のプリント配線板
は、所定の定尺寸法のプリント配線板形成用基板内にプ
リント配線板形成工程の処理を施し、該定尺寸法のプリ
ント配線板形成用基板より完成されたプリント配線板を
切り出す工程を有するプリント配線板に於いて、前記定
尺寸法のプリント配線板形成用基板より、完成されたプ
リント配線板を切り出す切断領域に、該プリント配線板
を試験するための試験回路パターンを設けたことを特徴
とする。In the printed wiring board of the present invention, a printed wiring board forming step having a predetermined size is performed in a printed wiring board forming step to form a printed wiring board having the fixed size. In a printed wiring board having a step of cutting out the completed printed wiring board from the printed wiring board, the printed wiring board is formed in a cutting region where the completed printed wiring board is cut out from the printed wiring board forming board of the standard size. Is provided with a test circuit pattern for testing.
【０００９】[0009]
【作用】本発明のプリント配線板は、定尺寸法のプリン
ト配線板形成用基板より形成されたプリント配線板を切
り出すための切断領域に、プリント配線板の試験用の回
路パターンを形成する。そしてこの試験用回路パターン
で完成されたプリント配線板を検査した後、この完成さ
れたプリント配線板の周囲の切断領域を切断すること
で、従来より切断されて廃棄される領域に試験用回路パ
ターンを設けているので、定尺のプリント配線板形成用
基板の材料が切断されて無駄になる領域が減少し、その
ため、形成されるプリント配線板の製造コストが低下す
る。In the printed wiring board of the present invention, a circuit pattern for testing the printed wiring board is formed in a cutting area for cutting out the printed wiring board formed from the printed wiring board forming substrate of a fixed size. Then, after inspecting the printed wiring board completed with this test circuit pattern, by cutting the cutting area around the completed printed wiring board, the test circuit pattern is cut into an area which is cut and discarded as compared with the conventional one. Since the area is provided, the area where the material of the printed wiring board forming substrate of a fixed length is cut and wasted is reduced, and therefore the manufacturing cost of the printed wiring board to be formed is reduced.
【００１０】[0010]
【実施例】以下、図面を用いて本発明の実施例につき詳
細に説明する。図１は本発明のプリント配線板の実施例
を説明するための平面図である。Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view for explaining an embodiment of the printed wiring board of the present invention.
【００１１】図示するように、本発明のプリント配線板
は、所定の定尺寸法のプリント配線板形成用基板３の内
部に、メッキ工程、スルーホールの孔開け工程、積層工
程等のプリント配線板の製造工程を施してプリント配線
板１を形成する。As shown in the figure, the printed wiring board of the present invention is provided in a printed wiring board forming substrate 3 having a predetermined standard size, such as a plating step, a through hole punching step and a laminating step. Then, the printed wiring board 1 is formed.
【００１２】また同時に該プリント配線板１の周囲の切
断領域11に、上記したプリント配線板の製造工程と同様
な工程で特性インピーダンスの測定用の試験回路パター
ン２を設ける。そしてこのプリント配線板１を形成した
後には、この試験回路パターン２で完成したプリント配
線板の特性インピーダンスを測定した後、この試験回路
パターン２の形成領域を切断領域11として、ＮＣルータ
ー、若しくはプレス切断機を用いて、完成されたプリン
ト配線板１をプリント配線板形成用基板３から切断す
る。At the same time, a test circuit pattern 2 for measuring the characteristic impedance is provided in the cutting area 11 around the printed wiring board 1 in the same process as the above-mentioned printed wiring board manufacturing process. After the printed wiring board 1 is formed, the characteristic impedance of the printed wiring board completed by the test circuit pattern 2 is measured, and then the formation area of the test circuit pattern 2 is used as the cutting area 11 for the NC router or the press. The completed printed wiring board 1 is cut from the printed wiring board forming substrate 3 using a cutting machine.
【００１３】このプリント配線板１の周囲に設けた切断
領域11は幅が0.5mm 程度で、従来はこの領域は切断領域
として当然放棄していた領域であるので、定尺寸法のプ
リント配線板形成用基板３の無駄には成らない。The cut area 11 provided around the printed wiring board 1 has a width of about 0.5 mm, and since this area is naturally abandoned as a cut area in the past, a printed wiring board having a standard size is formed. The circuit board 3 is not wasted.
【００１４】このようにすると、定尺寸法のプリント配
線板形成用基板３の材料の無駄となる部分の領域が減少
するので、形成されるプリント配線板１の製造コストが
低下し、低コストのプリント配線板が得られる。In this way, the area of the wasted portion of the material for the printed wiring board forming substrate 3 of a fixed size is reduced, so that the manufacturing cost of the printed wiring board 1 to be formed is reduced and the cost is low. A printed wiring board is obtained.
【００１５】[0015]
【発明の効果】以上述べたように、本発明のプリント配
線板によれば、定尺寸法のプリント配線板形成用基板の
切断されて無駄となる領域が減少するため、材料の無駄
が少なくなり、低コストのプリント配線板が得られる効
果がある。As described above, according to the printed wiring board of the present invention, the area of the printed wiring board forming substrate having a fixed size that is wasted due to cutting is reduced, so that the waste of material is reduced. There is an effect that a low-cost printed wiring board can be obtained.
【図１】 本発明のプリント配線板の平面図である。FIG. 1 is a plan view of a printed wiring board according to the present invention.
【図２】 従来のプリント配線板の平面図である。FIG. 2 is a plan view of a conventional printed wiring board.
1 プリント配線板 2 試験回路パターン 3 プリント配線板形成用基板 11 切断領域 1 Printed wiring board 2 Test circuit pattern 3 Printed wiring board forming board 11 Cutting area
Claims (1)
基板(3) 内にプリント配線板(1) の製造工程の処理を施
し、該定尺寸法のプリント配線板形成用基板(3) より形
成されたプリント配線板(1) を切り出す工程を有するプ
リント配線板に於いて、 前記定尺寸法のプリント配線板形成用基板(3) より、形
成されたプリント配線板(1) を切り出す切断領域(11)
に、該形成されたプリント配線板(1) を試験するための
試験回路パターン(2) を設けたことを特徴とするプリン
ト配線板。1. A printed wiring board forming substrate (3) having a predetermined size is obtained by subjecting a printed wiring board forming substrate (3) having a predetermined size to a manufacturing process of the printed wiring board (1). A printed wiring board having a step of cutting out the printed wiring board (1) formed by cutting the formed printed wiring board (1) from the printed wiring board forming substrate (3) of the standard size. Area (11)
The printed wiring board is characterized by further comprising a test circuit pattern (2) for testing the formed printed wiring board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19650091A JPH0541567A (en) | 1991-08-06 | 1991-08-06 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19650091A JPH0541567A (en) | 1991-08-06 | 1991-08-06 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0541567A true JPH0541567A (en) | 1993-02-19 |
Family
ID=16358791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19650091A Withdrawn JPH0541567A (en) | 1991-08-06 | 1991-08-06 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541567A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206608A (en) * | 1992-01-30 | 1993-08-13 | Nec Toyama Ltd | Manufacture of printed wiring board |
| JP2002359451A (en) * | 2001-05-30 | 2002-12-13 | Ibiden Co Ltd | Printed wiring board |
| JP2008112885A (en) * | 2006-10-31 | 2008-05-15 | Hitachi Cable Ltd | Printed wiring board |
| JP2011181785A (en) * | 2010-03-03 | 2011-09-15 | Nec Corp | Test coupon for measuring characteristic impedance, and printed board including the same |
| JP2014093340A (en) * | 2012-11-01 | 2014-05-19 | Nec Corp | Test coupon for managing characteristic impedance and print circuit board with the same |
| JP2014165478A (en) * | 2013-02-28 | 2014-09-08 | Denso Corp | Printed board, electronic control device, and inspection method for printed board |
-
1991
- 1991-08-06 JP JP19650091A patent/JPH0541567A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206608A (en) * | 1992-01-30 | 1993-08-13 | Nec Toyama Ltd | Manufacture of printed wiring board |
| JP2002359451A (en) * | 2001-05-30 | 2002-12-13 | Ibiden Co Ltd | Printed wiring board |
| JP2008112885A (en) * | 2006-10-31 | 2008-05-15 | Hitachi Cable Ltd | Printed wiring board |
| JP4544236B2 (en) * | 2006-10-31 | 2010-09-15 | 日立電線株式会社 | TAB tape |
| JP2011181785A (en) * | 2010-03-03 | 2011-09-15 | Nec Corp | Test coupon for measuring characteristic impedance, and printed board including the same |
| JP2014093340A (en) * | 2012-11-01 | 2014-05-19 | Nec Corp | Test coupon for managing characteristic impedance and print circuit board with the same |
| JP2014165478A (en) * | 2013-02-28 | 2014-09-08 | Denso Corp | Printed board, electronic control device, and inspection method for printed board |
| US9470741B2 (en) | 2013-02-28 | 2016-10-18 | Denso Corporation | Printed board, electronic control apparatus and inspection method of printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0541567A (en) | Printed wiring board | |
| JP3027256B2 (en) | Printed wiring board | |
| JPS59215786A (en) | Blank board for punching printed circuit board | |
| JPH07221414A (en) | Semiconductor circuit board | |
| JPH03119783A (en) | Hybrid integrated circuit device, manufacture thereof and discrimination thereof | |
| DE19947092A1 (en) | Printed circuit board has electronic component(s) mounted in positioning area for separation from circuit board for another application | |
| JPH0423158U (en) | ||
| JPH02262390A (en) | Printed-wiring board | |
| JPS63105087U (en) | ||
| JPH06196836A (en) | Memory module | |
| JPH056677Y2 (en) | ||
| JP2002043742A (en) | Manufacturing method of circuit board | |
| JPH10294537A (en) | Printed board | |
| JPH0426795B2 (en) | ||
| JPH04123492A (en) | Method of mounting part onto multiple sheet printing board | |
| JPH09214080A (en) | Printed wiring board | |
| JPH066100A (en) | Checking method of electronic part on board | |
| JPH05110230A (en) | Manufacture of printed wiring board | |
| JPH10135626A (en) | Printed board | |
| CN2583930Y (en) | Printed circuit board with detecting block | |
| JPS6285485A (en) | Checking of printed circuit board | |
| JPH0521923A (en) | Printed wiring board | |
| KR980007881A (en) | Inspection method of printed circuit board | |
| JPH06342963A (en) | Printed circuit board and dividing method therefor | |
| CA1303240C (en) | Printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981112 |