JPH10294537A - Printed board - Google Patents

Printed board

Info

Publication number
JPH10294537A
JPH10294537A JP10374797A JP10374797A JPH10294537A JP H10294537 A JPH10294537 A JP H10294537A JP 10374797 A JP10374797 A JP 10374797A JP 10374797 A JP10374797 A JP 10374797A JP H10294537 A JPH10294537 A JP H10294537A
Authority
JP
Japan
Prior art keywords
crack
perforations
substrate
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10374797A
Other languages
Japanese (ja)
Inventor
Hiroshi Uchida
洋 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP10374797A priority Critical patent/JPH10294537A/en
Publication of JPH10294537A publication Critical patent/JPH10294537A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed board provided with a crack preventing and detecting means. SOLUTION: On the board, a crack prevention pattern 3 of copper foil is provided orthogonally among perforations 21, 22, and 23 for division in parallel to the perforations 21, 22, and 23. Checker lands 41, 42, 43, and 44 atop of the crack preventive pattern 3 are fed with electricity to check a crack, and thus a crack which is a defective in the outward appearance of the board is prevented from being caused in the manufacturing process to stabilize the quality of the board 1.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、プリント基板に係
り、特に、クラック防止手段とクラックの検出手段とを
設けたプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly to a printed circuit board provided with crack preventing means and crack detecting means.

【０００２】[0002]

【従来の技術】従来のプリント基板は、図２に示すよう
に、基板１と、この基板１に設けられた分割のためのミ
シン目２１，２２，２３とで構成され、金型プレス加工
時のミシン目２１，２２，２３の間に、微小なクラック
５が発生して目視検査による発見ができなかった。2. Description of the Related Art As shown in FIG. 2, a conventional printed circuit board is composed of a substrate 1 and perforations 21, 22, and 23 provided on the substrate 1 for division. The minute cracks 5 occurred between the perforations 21, 22, and 23 and could not be found by visual inspection.

【０００３】[0003]

【発明が解決しようとする課題】従って、従来のプリン
ト基板は、図２に示すように、基板１に設けられた分割
のためのミシン目２１，２２，２３間に、金型プレス加
工時に微小なクラック５が発生して目視検査による発見
ができないという課題があった。Therefore, as shown in FIG. 2, the conventional printed circuit board is provided with a small space between the perforations 21, 22, and 23 provided on the substrate 1 at the time of die pressing. There is a problem that a crack 5 occurs and cannot be found by visual inspection.

【０００４】そこで、本発明の目的は、クラック防止手
段とクラックの検出手段とを設けたプリント基板を提供
することにある。Accordingly, an object of the present invention is to provide a printed circuit board provided with crack preventing means and crack detecting means.

【０００５】[0005]

【課題を解決するための手段】上述の課題を解決するた
めに、本発明のプリント基板は、基板と、この基板に設
けられた分割のためのミシン目と、このミシン目と平行
に、かつミシン目間に直交して上記基板上に配置した銅
箔のクラック防止パターンとで構成されたことを特徴と
する。In order to solve the above-mentioned problems, a printed circuit board according to the present invention comprises a substrate, a perforation for dividing provided on the substrate, and a parallel with the perforation. And a crack preventing pattern of a copper foil disposed on the substrate at right angles to the perforations.

【０００６】また、上述の課題を解決するために、本発
明のプリント基板は、上記クラック防止パターンの先端
に設けたクラックチェック用のチェッカランドで構成さ
れたことを特徴とする。In order to solve the above-mentioned problems, a printed circuit board according to the present invention is characterized in that it is constituted by a crack check checker land provided at the tip of the crack prevention pattern.

【０００７】[0007]

【発明の実施の形態】次に、本発明の一実施の形態によ
るプリント基板を図面を参照して説明する。Next, a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings.

【０００８】図１は、本発明の一実施の形態によるプリ
ント基板の構成図である。FIG. 1 is a configuration diagram of a printed circuit board according to an embodiment of the present invention.

【０００９】本発明の一実施の形態によるプリント基板
は、図１に示すように、基板１と、この基板１に設けら
れた分割のためのミシン目２１，２２，２３と、このミ
シン目２１，２２，２３と平行に、かつミシン目２１，
２２，２３間に直交して基板１上に配置した銅箔のクラ
ック防止パターン３と、このクラック防止パターン３の
先端に設けたクラックチェック用のチェッカランド４
１，４２，４３，４４とで構成される。As shown in FIG. 1, a printed circuit board according to an embodiment of the present invention includes a substrate 1, perforations 21, 22, 23 for dividing provided on the substrate 1, and a perforation 21. , 22, 23 and perforation 21,
A crack prevention pattern 3 made of copper foil disposed on the substrate 1 at right angles between the 22 and 23, and a checker land 4 for crack checking provided at the tip of the crack prevention pattern 3.
1, 42, 43, and 44.

【００１０】次に、本発明の一実施の形態によるプリン
ト基板の構造を図面を参照して説明する。Next, the structure of a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings.

【００１１】本発明の一実施の形態によるプリント基板
の構造は、図１に示すように、基板１上に、分割のため
のミシン目２１，２２，２３と平行に、かつミシン目２
１，２２，２３間に直交して銅箔のクラック防止パター
ン３を設け、このクラック防止パターン３の先端のチェ
ッカランド４１，４２，４３，４４に通電を行なってク
ラックのチェックを行い、製造工程時、基板１の外観不
良となるクラックの発生を防止して基板１の品質を安定
することができる。As shown in FIG. 1, the structure of a printed circuit board according to an embodiment of the present invention is formed on a substrate 1 in parallel with perforations 21, 22, and 23 for division and on perforations 2.
A crack preventing pattern 3 made of copper foil is provided orthogonally between 1, 2, 23, and the checker lands 41, 42, 43, and 44 at the tip of the crack preventing pattern 3 are energized to check for cracks. At this time, the quality of the substrate 1 can be stabilized by preventing the occurrence of cracks that cause the appearance of the substrate 1 to be poor.

【０００１２】[00012]

【発明の効果】以上説明したように、本発明のプリント
基板によれば、分割のためのミシン目と平行に、かつミ
シン目間に直交して銅箔のクラック防止パターンを基板
上に設け、このクラック防止パターンの先端のチェッカ
ランドにより、物理的強度をミシン目間に持たせたこと
でクラック発生率が低くなリ、かつ目視検査に頼ってい
たクラックの検出を電気的に判断できるため、基板の品
質を安定させる効果がある。As described above, according to the printed board of the present invention, a crack preventing pattern of copper foil is provided on the board in parallel with the perforations for division and perpendicular to the perforations. The checker land at the tip of this crack prevention pattern allows the physical strength to be maintained between the perforations to reduce the crack occurrence rate, and to electrically determine the crack detection that relied on visual inspection. This has the effect of stabilizing the quality of the substrate.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態によるプリント基板の構
成図である。FIG. 1 is a configuration diagram of a printed circuit board according to an embodiment of the present invention.

【図２】従来のプリント基板の構成図である。FIG. 2 is a configuration diagram of a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

１ 基板 ２１，２２，２３ ミシン目 ３ クラック防止パターン ４１，４２，４３，４４ チェッカランド ５ クラック DESCRIPTION OF SYMBOLS 1 Substrate 21, 22, 23 Perforation 3 Crack prevention pattern 41, 42, 43, 44 Checker land 5 Crack

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 基板と、この基板に設けられた分割のた
めのミシン目と、このミシン目と平行に、かつミシン目
間に直交して上記基板上に配置した銅箔のクラック防止
パターンとで構成されたことを特徴とするプリント基
板。1. A substrate, a perforation for dividing provided on the substrate, and a crack preventing pattern of a copper foil disposed on the substrate in parallel with the perforations and orthogonal to the perforations. A printed circuit board characterized by comprising: 【請求項２】 上記クラック防止パターンの先端に設け
たクラックチェック用のチェッカランドで構成されたこ
とを特徴とする請求項１記載のプリント基板。2. The printed circuit board according to claim 1, comprising a checker land for crack checking provided at a tip of the crack prevention pattern.
JP10374797A 1997-04-22 1997-04-22 Printed board Pending JPH10294537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10374797A JPH10294537A (en) 1997-04-22 1997-04-22 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10374797A JPH10294537A (en) 1997-04-22 1997-04-22 Printed board

Publications (1)

Publication Number Publication Date
JPH10294537A true JPH10294537A (en) 1998-11-04

Family

ID=14362187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10374797A Pending JPH10294537A (en) 1997-04-22 1997-04-22 Printed board

Country Status (1)

Country Link
JP (1) JPH10294537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010158820A (en) * 2009-01-08 2010-07-22 Kyocera Corp Recording head, method for manufacturing the same, base body for taking large number of articles, and recording apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010158820A (en) * 2009-01-08 2010-07-22 Kyocera Corp Recording head, method for manufacturing the same, base body for taking large number of articles, and recording apparatus

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