JPH0260185A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH0260185A JPH0260185A JP21276788A JP21276788A JPH0260185A JP H0260185 A JPH0260185 A JP H0260185A JP 21276788 A JP21276788 A JP 21276788A JP 21276788 A JP21276788 A JP 21276788A JP H0260185 A JPH0260185 A JP H0260185A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- manufacturing process
- conductive pattern
- pattern
- warping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000002265 prevention Effects 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241001092070 Eriobotrya Species 0.000 description 1
- 235000009008 Eriobotrya japonica Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣ等の実装部品を実装する回路基板に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board on which mounted components such as ICs are mounted.
本発明は、回路基板に反り防止パターンを設けることに
より、回路基板の製造工程内で発生するストレスによっ
て起こる回路基板の反り−を防止するようにしたもので
ある。The present invention prevents warpage of the circuit board caused by stress generated during the manufacturing process of the circuit board by providing a warpage prevention pattern on the circuit board.
第３回囚及び第３図りに従来例の回路基板の裏面及び平
面を示したように、回路基板ｌは、絶縁基板２上にＩＣ
等の実装部品を電気的に導通をとるための導電パターン
３と、オーバーコート層５によって構成されている。As shown in the third picture and the third drawing of the back side and plane of the circuit board of the conventional example, the circuit board l has an IC on an insulating board 2.
It is composed of a conductive pattern 3 and an overcoat layer 5 for electrically connecting the mounted components such as.
しかし、従来の回路基板は、回路基板の製造工程の乾燥
等によって、絶縁基板と金属パターンの熱膨張率の違い
から回路基板にストレスがかかり、回路基板に反りが発
生し、特に絶縁基板厚の薄いものでは、反りが顕著に現
れ、これが原因による断線等が発生するなど致命的な欠
点となることが多かった。However, with conventional circuit boards, stress is applied to the circuit board due to the difference in thermal expansion coefficient between the insulating board and the metal pattern due to drying during the manufacturing process of the circuit board, causing warping of the circuit board, especially when the thickness of the insulating board increases. Thin wires exhibit noticeable warping, which often causes fatal defects such as wire breakage.
そこで本発明は、従来のこのような欠点を解決するため
、回路基板の製造工程内に回路基板にかかるストレスに
よって発生する回路基板の反りを防止することを目的と
している。SUMMARY OF THE INVENTION In order to solve these conventional drawbacks, it is an object of the present invention to prevent warpage of a circuit board caused by stress applied to the circuit board during the manufacturing process of the circuit board.
上記問題点を解決するために、本発明は回路基板の製造
工程内に回路基板にかかるストレスに耐え得る強度を回
路基板に持たせるため、絶縁基板上にＩＣ等の実装部品
に電気的に接続をもつ導電パターンの他に反り防止パタ
ーンを絶縁基板の両面にそれぞれ互いに直交するように
設け、前記回路基板を形成したことを特徴とする。In order to solve the above problems, the present invention provides electrical connection to mounted components such as ICs on an insulating substrate in order to give the circuit board strength that can withstand the stress applied to the circuit board during the manufacturing process of the circuit board. The circuit board is characterized in that the circuit board is formed by providing anti-warpage patterns on both surfaces of the insulating substrate, in addition to the conductive pattern having a conductive pattern, so as to be perpendicular to each other.
上記のように構成された回路基板は、反り防止パターン
を絶縁基板の両面にそれぞれ直交させるように設けたこ
とにより、回路基板の製造工程内の乾燥等によって回路
基板に加えられる熱で、回路基板を熱膨張によって反ら
せる力を両面それぞれ互いに打ち消し合うように発生さ
せ、その合力により回路基板の反りを防止することがで
きる。The circuit board configured as described above has warpage prevention patterns perpendicular to both sides of the insulating board, so that the heat applied to the circuit board during drying during the manufacturing process of the circuit board can The forces that cause the circuit board to warp due to thermal expansion are generated so as to cancel each other out, and the resultant force can prevent the circuit board from warping.
以下に、本発明の実施例を図面に基づいて説明する。本
発明に係わる回路基板は、第１図（Ａ＋、 ０３の表面
平面図及び裏面平面図に示すように、ガラスエポキシ基
板等の絶縁基板２上にＩＣ等の実装部品に電気的に接続
のある導電パターン３．ＩＣ等の実装部品に電気的に接
続のない反り防止パターン４．及びオーバーコート層５
より形成されており、上記ＩＣ等の実装部品に接続のな
い反り防止パターン４，４は第１図囚、■に示すように
両面互いに直交するように形成されている。以上の構造
により、回路基板ｌが構成されている。なお、第１図０
は回路基板の断面図である。Embodiments of the present invention will be described below based on the drawings. As shown in the front and back plan views of FIG. Conductive pattern 3. Warp prevention pattern 4. and overcoat layer 5, which are not electrically connected to mounted components such as ICs.
The anti-warpage patterns 4, 4, which are not connected to the mounted components such as the IC, are formed so as to be perpendicular to each other on both sides, as shown in FIG. The circuit board 1 is configured by the above structure. In addition, Fig. 1 0
is a cross-sectional view of the circuit board.
そして上記回路基板１を製造する際、製造工程内の乾燥
等によって回路基板１に熱が加えられ、絶８！基板２と
導電パターン３及び反り防止パターン４の熱膨張率の違
いにより上記回路基板ｌに反りが発生する力が働くが、
ＩＣ等の実装部品に電気的に接続のない反り防止パター
ン４がそれぞれ互いに直交しているため、第２図の説明
図に示すように上記回路基板１に反りを発生する力Ｆ。When manufacturing the circuit board 1, heat is applied to the circuit board 1 due to drying during the manufacturing process, causing the circuit board 1 to die! Due to the difference in thermal expansion coefficient between the substrate 2, the conductive pattern 3, and the anti-warp pattern 4, a force that causes the circuit board l to warp is exerted.
Since the warpage prevention patterns 4 that are not electrically connected to mounted components such as ICs are perpendicular to each other, a force F that causes the circuit board 1 to warp as shown in the explanatory diagram of FIG.
Ｆ゛がそれぞれ打ち消し合うように働き、上記回路基板
１の反りを防止する。F' acts to cancel each other out and prevents the circuit board 1 from warping.
本発明の回路基板は以上のように、絶縁基板上に、反り
防止パターンを両面にそれぞれ互いに直交させるように
形成することにより、回路基板の製造工程内で、回路基
板にかかるストレスによって発生する回路基板の反りを
防止する効果がある。As described above, the circuit board of the present invention is provided by forming warp prevention patterns on both sides of an insulating board so as to be perpendicular to each other, thereby preventing warpage that occurs due to stress applied to the circuit board during the manufacturing process of the circuit board. This has the effect of preventing the board from warping.
第１囲繞は本発明の一実施例を示す回路基板の表面平面
図、第１図りは本発明の一実施例を示す回路基板の裏面
平面図、第１図（Ｑは本発明の一実施例を示す回路基板
の断面図、第２図は本発明の一実施例の効果を示す説明
図、第３図囚、０は従来例の回路基板の表面図及び裏面
図である。
１・・・回路基板
２・・・絶縁基板
３・・・導電パターン
４・・・反り防止パターン
５・・・オーバーコート層
以上
出願人 セイコー京葉工業株式会社
代理人 弁理士 林 敬 之 助
本発明の実施例て−める回路基板の西面＋面図第１ 図
（Ａ）
絨明の大杷刺である日記１４淀の裏面千面図第１図（Ｂ
）
本発明の実施例の回１６基板の飢面図
第１ 図（Ｃ）The first box is a front surface plan view of a circuit board showing an embodiment of the present invention, the first drawing is a back plan view of a circuit board showing an embodiment of the present invention, and FIG. FIG. 2 is an explanatory diagram showing the effects of an embodiment of the present invention, and FIG. 3, 0, is a front and back view of a conventional circuit board. Circuit board 2...Insulating substrate 3...Conductive pattern 4...Warp prevention pattern 5...Overcoat layer and above Applicant: Seiko Keiyo Kogyo Co., Ltd. Agent Patent attorney: Takayuki Hayashi Embodiments of the present invention - West side + side view of the printed circuit board Figure 1 (A) Thousand-sided view of the back side of the diary 14 Yodo, which is a large loquat of Keimei Figure 1 (B
) Figure 1(C)
Claims (1)
た両面回路基板において、上記導電パターンは、ＩＣ等
の実装部品に電気的に導通をとるための導電パターンと
、製造工程中に回路基板にかかるストレスによる反りを
防止するための反り防止パターンによって構成している
ことを特徴とした回路基板。In a double-sided circuit board in which a conductive pattern is formed on an insulating substrate by chemical treatment, etc., the conductive pattern is a conductive pattern for establishing electrical continuity with mounted components such as ICs, and a stress applied to the circuit board during the manufacturing process. A circuit board characterized in that it is constructed with a warpage prevention pattern for preventing warpage due to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21276788A JPH0260185A (en) | 1988-08-26 | 1988-08-26 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21276788A JPH0260185A (en) | 1988-08-26 | 1988-08-26 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260185A true JPH0260185A (en) | 1990-02-28 |
Family
ID=16628060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21276788A Pending JPH0260185A (en) | 1988-08-26 | 1988-08-26 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260185A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5912654A (en) * | 1995-03-27 | 1999-06-15 | Canon Kabushiki Kaisha | Electric-circuit board for a display apparatus |
| WO2009072182A1 (en) * | 2007-12-04 | 2009-06-11 | Fujitsu Limited | Circuit board and electronic device |
| JP2010129874A (en) * | 2008-11-28 | 2010-06-10 | Toshiba Corp | Printed wiring board |
| JP2014049648A (en) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | Printed wiring board |
| US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
| CN115066986A (en) * | 2020-02-11 | 2022-09-16 | 三星电子株式会社 | Printed circuit board assembly and electronic device including the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124295A (en) * | 1984-07-13 | 1986-02-01 | 日本電気株式会社 | Circuit board |
-
1988
- 1988-08-26 JP JP21276788A patent/JPH0260185A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124295A (en) * | 1984-07-13 | 1986-02-01 | 日本電気株式会社 | Circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5912654A (en) * | 1995-03-27 | 1999-06-15 | Canon Kabushiki Kaisha | Electric-circuit board for a display apparatus |
| WO2009072182A1 (en) * | 2007-12-04 | 2009-06-11 | Fujitsu Limited | Circuit board and electronic device |
| JP2010129874A (en) * | 2008-11-28 | 2010-06-10 | Toshiba Corp | Printed wiring board |
| US7919716B2 (en) | 2008-11-28 | 2011-04-05 | Kabushiki Kaisha Toshiba | Printed wiring board and electronic apparatus |
| JP2014049648A (en) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | Printed wiring board |
| US9818682B2 (en) * | 2014-12-03 | 2017-11-14 | International Business Machines Corporation | Laminate substrates having radial cut metallic planes |
| CN115066986A (en) * | 2020-02-11 | 2022-09-16 | 三星电子株式会社 | Printed circuit board assembly and electronic device including the same |
| EP4102941A4 (en) * | 2020-02-11 | 2023-10-04 | Samsung Electronics Co., Ltd. | Printed circuit board assembly and electronic device comprising same |
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