JPH02278787A - Pattern structure of printed wiring board - Google Patents

Abstract

PURPOSE:To reduce the number of inspection processes of a dislocation of a solder resist by a method wherein a wiring pattern which detects the dislocation of the solder resist is arranged on a printed wiring board. CONSTITUTION:It can be detected whether a dislocation of a solder resist 2 causes a trouble or not by inspecting only parts of patterns 6a, 6b, for solder- resist dislocation detection use, which have been arranged on a printed wiring board 1. That is to say, when the pattern 6a for solder-resist dislocation detection use is not covered with the solder resist 2 and the pattern 6b for solder- resist dislocation detection use is covered with the solder resist 2, this indicates a state of a good product. Thereby, the number of inspection processes of a dislocation of the solder resist can be reduced, and the yield of products can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a wiring pattern structure of a printed wiring board.

[Prior Art] The solder resist 2 printed on the printed wiring board 1 may deviate from its normal position to some extent depending on its manufacturing process capability. (for example, the land 5 or the through hole 7) also causes the same shift as described above.

The conventional printed wiring board 1 did not have a wiring pattern for detecting a positional shift of the solder resist 2.

[Problem to be solved by the invention]

However, as the wiring density on the printed wiring board 1 increases, various problems will occur in the openings of the solder resist 2 due to misalignment of the solder resist 2.

For example, as shown in Fig. 2, the solder resist 2 adheres to a part of the soldering land 4, which reduces the effective area of the soldering land 4, and the soldering of the electronic components to be soldered becomes difficult. inferior in sex.

(If the condition is severe, it will be impossible to solder.) Also, as shown in Figure 3, the bonding land 5
A bonding land 5.A solder resist 2 is attached to a part of the bonding land 5, where the bonding connection is actually performed. If the solder resist 2 adheres to the tip of the solder resist 2, bonding connection becomes impossible. As shown in FIG. 4, when the wiring conductor pattern 3 is located close to the land 4 for the hang type, a part of the wiring conductor pattern 3 is exposed due to the positional shift of the solder resist 2. There is a possibility that a short circuit may occur due to the solder when soldering electronic components to the printed wiring board 4.6 In the prior art described above, in each of the above cases, it is necessary to inspect the printed wiring board l and remove defects before using it. However, since each location must be checked one by one, there is a problem in that as the number of openings in the solder resist 2 increases, the number of inspection steps described above increases. Furthermore, if the above-mentioned printed wiring board 1 is found to be defective during the manufacturing process, such as during the bonding connection process or hanging process, the printed wiring board 1 must be determined to be defective, resulting in a decrease in product yield. There was a problem.

Therefore, the present invention has been made to solve these problems, and its purpose is to reduce the number of man-hours for inspecting the positional deviation of solder resist as described above, and to improve the yield of products. The purpose is to provide a pattern structure for a wiring board.

[Means for Solving the Problems 1] In order to achieve the above-mentioned object, the pattern structure of the printed wiring board of the present invention is such that a wiring pattern for detecting a positional shift of the solder resist is arranged on the printed wiring board. It is characterized by

[Example 1 FIG. 1(a) is a plan view showing an example of the present invention, FIG.
b) is an enlarged plan view of section A in FIG. 2(a).

According to the embodiment of FIG. 1(a), the printed wiring board tel
Solder resist misalignment detection pattern 6 placed above
By inspecting only the portions a and 6b, it is possible to detect whether the positional deviation of the solder resist 2 is a problem or not. That is, as shown in FIG. 1(b), the solder resist positional deviation detection pattern 6a is not covered with the solder resist 2, and the solder resist positional deviation detection pattern 6b is not covered with the solder resist 2. It is in good condition. In FIG. 1(C), the solder resist 2 is displaced in the X direction, resulting in a defective product. In FIG. 1(d), the solder resist 2 is displaced in the Y direction, resulting in a defective product.

As mentioned above, all the openings of the solder resist 2 are inspected (and the solder resist positional deviation detection pattern 6a is not inspected).
- By inspecting only the portion 6b, it is possible to detect whether the positional deviation of the solder resist 2 is a problem or not, and therefore the number of man-hours for inspecting the positional deviation of the solder resist 2 can be reduced.

FIG. 5 is a plan view showing another embodiment of the present invention, in which the solder resist positional deviation detection pattern 6a is not covered with the solder resist 2, and the solder resist positional deviation detection pattern 6b is covered with the solder resist 2. If it is covered with , it is in good condition.

FIG. 6 is a plan view showing yet another embodiment of the present invention, in which a conductor portion is removed in a circular pattern on a continuous and wide-area pattern (such as a solid earth pattern) on the printed wiring board 1. A solder resist misalignment detection pattern 6 is arranged. At this time, the solder resist 2 is arranged inside the solder resist positional deviation detection pattern 6 at a certain distance.

According to the embodiment shown in FIG. 6, if the solder resist misalignment detection pattern 6 is covered with the solder resist 2, it is a good product, and if it is exposed, it is a defective product.

FIG. 7 shows yet another embodiment of the present invention, in which solder resist misalignment detection patterns 6 are arranged at the four corners of the printed wiring board l.

According to the embodiment shown in FIG. 7, if the solder resist misalignment detection pattern 6 is covered with the solder resist 2, it is a good product, and if it is exposed, it is a defective product.

[Effects of the Invention] As described above, according to the present invention, by arranging the wiring pattern for detecting the positional deviation of the solder resist on the printed wiring board, the number of man-hours for inspecting the positional deviation of the solder resist can be reduced. have an effect.

In addition, it is possible to detect faulty solder resist misalignment in a shorter time than before before using the printed wiring board, which reduces defects discovered during manufacturing and improves product yield. This has the effect of reducing overall manufacturing man-hours.

[Brief explanation of drawings]

FIG. 1(a) is a plan view showing one embodiment of the present invention. FIG. 1(b) is an enlarged view of section A in FIG. 1(a), showing that the solder resist is in a non-defective state with no misalignment. FIG. 1(C) and FIG. 1(d) are plan views showing that the positional shift of the solder resist is a defective product. FIG. 2 is a diagram showing that the solder resist has adhered to the soldering land due to the positional shift of the solder resist. FIG. 3 is a diagram showing that solder resist has adhered to the bonding land due to misalignment of the solder resist. FIG. 4 is a diagram showing that the wiring conductor pattern is exposed from the solder resist due to the positional shift of the solder resist. FIG. 5 is a plan view showing another embodiment of the invention. FIG. 6 is a plan view showing another embodiment of the present invention. FIG. 7 is a plan view showing still another embodiment of the present invention. 1... Printed wiring board 2... Solder resist 3... Wiring conductor pattern 4... Land for soldering 5... Land for bonding 6... Pattern for detecting displacement of solder resist 7...・Applicant for through holes and above Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki (and 1 other person) Figure 1 (d) Fuezu Tomizu Δ

Claims (1)

[Claims] In printed wiring boards with solder resist,
A pattern structure of a printed wiring board, characterized in that a wiring pattern for detecting a positional shift of a solder resist is arranged on the printed wiring board.