JPH02237091A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH02237091A JPH02237091A JP1058228A JP5822889A JPH02237091A JP H02237091 A JPH02237091 A JP H02237091A JP 1058228 A JP1058228 A JP 1058228A JP 5822889 A JP5822889 A JP 5822889A JP H02237091 A JPH02237091 A JP H02237091A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- power line
- cut
- chip
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 abstract description 23
- 239000003990 capacitor Substances 0.000 abstract description 15
- 238000012360 testing method Methods 0.000 abstract description 9
- 230000000007 visual effect Effects 0.000 abstract description 4
- 238000011990 functional testing Methods 0.000 abstract description 3
- 230000000295 complement effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
チップ部品を搭載接続する導体パッドを有する印刷配線
板に係り、さらに詳しくは、導体パッドの形状に関し、
電子部品実装後の回路機能試験でチップ部品の搭載有無
が確実にチェックできることを目的とし、チップ部品の
一電極を接続する切れ目を有する分割導体パッドを回路
パターンの途中に設け、該切れ目により前記回路パター
ンを切断するように構成する．
〔産業上の利用分野〕
本発明はチップ部品を搭載接続する導体パッドを有する
印刷配線板に係り、さらに詳しくは、導体パッドの形状
に関する。[Detailed Description of the Invention] [Summary] This relates to a printed wiring board having conductor pads for mounting and connecting chip components, and more specifically, regarding the shape of the conductor pads, it is possible to determine whether or not chip components are mounted in a circuit function test after mounting electronic components. In order to be able to check reliably, a divided conductor pad having a cut for connecting one electrode of a chip component is provided in the middle of the circuit pattern, and the circuit pattern is cut by the cut. [Industrial Application Field] The present invention relates to a printed wiring board having conductor pads for mounting and connecting chip components, and more particularly to the shape of the conductor pads.
電子・通信機器において、電子回路の高密度実装化を図
るため表面実装技術によるチップ部品の実装が行われて
いるが、部品が小さいためその搭載有無の目視検査では
見落とす場合があり、もっと確実に搭載有無の検査がで
きるようにすることが要望されている．
（従来の技術〕
第４図に示す一回路図は、電源線１１ａとアース線１２
ａ間にノイズフィルタとしてのチップコンデンサ１３と
、ＩＣなどの能動素子１４で構成される電子回路である
．
この電子回路を印刷配線板上に構成する場合、従来の印
刷配線板は第５図の平面図に示すように、第４図の電源
線１１ａとアース線１２ａにそれぞれ対応する電源線回
路パターン１１とアース線回路パターン１２を設け、そ
れぞれの回路パターン１１．１２の途中に一点鎖線で示
すチップ部品１３、即ちチップコンデンサの電極１３ａ
を接続する導体パッドｌ５と１６を設けるとともに末端
に２点鎖線で示すＩＣ１４のリード１４ａを接続する導
体パッドｌ７を形成している．
〔発明が解決しようとする課題〕
しかしながら、このような上記印刷配線板によれば、電
子部品実装後の検査において、電子回路上の主要部品で
あるＩＣなどの搭載有無は最終試験である回路機能試験
で容易にチェックすることができるが、ノイズフィルタ
として働くチップコンデンサの実装漏れを小さいが故に
目視試験で見落とすと、チップコンデンサが接続されて
いなくても電源線は接続状態にあるため、回路機能試験
ではチェックが難しいといった問題があった。In electronic and communication equipment, chip components are mounted using surface mount technology in order to achieve high-density mounting of electronic circuits, but since the components are small, they may be overlooked during visual inspection to see if they are mounted. It is requested that it be possible to inspect the presence or absence of equipment. (Prior art) One circuit diagram shown in FIG. 4 shows a power line 11a and a ground line 12.
This is an electronic circuit consisting of a chip capacitor 13 as a noise filter between .a and an active element 14 such as an IC. When configuring this electronic circuit on a printed wiring board, the conventional printed wiring board has a power line circuit pattern 11 corresponding to the power line 11a and the ground line 12a of FIG. 4, respectively, as shown in the plan view of FIG. and ground line circuit patterns 12 are provided, and in the middle of each circuit pattern 11.12 there is a chip component 13 shown by a dashed line, that is, an electrode 13a of a chip capacitor.
Conductor pads l5 and 16 are provided to connect the terminals, and a conductor pad l7 is formed at the end to connect the lead 14a of the IC 14, which is indicated by a two-dot chain line. [Problem to be Solved by the Invention] However, according to the above-mentioned printed wiring board, in the inspection after electronic components are mounted, the presence or absence of mounting of ICs, etc., which are the main components on the electronic circuit, is determined by the circuit function, which is a final test. Although it can be easily checked during a test, if a chip capacitor that acts as a noise filter is overlooked during a visual test because it is small, the circuit function will be affected because the power line is connected even if the chip capacitor is not connected. There were some problems in the exam that it was difficult to check.
上記問題点に鑑み、本発明は電子部品実装後の回路機能
試験でチップ部品の搭載有無が確実にチェックできる印
刷配線板を提供することを目的とする．
〔課題を解決するための手段〕
上記目的を達成するために、本発明の印刷配線板におい
ては、 チップ部品ｐ一電極を接続する切れ目を有する
分割導体パッドを回路パターンの途中に設け、該切れ目
により前記回路パターンを切断するように構成する。In view of the above problems, an object of the present invention is to provide a printed wiring board that can reliably check the presence or absence of chip components in a circuit function test after mounting electronic components. [Means for Solving the Problems] In order to achieve the above object, in the printed wiring board of the present invention, a divided conductor pad having a cut for connecting the chip component p and the electrode is provided in the middle of the circuit pattern, and the cut The circuit pattern is cut by cutting the circuit pattern.
回路パターンの途中に切れ目を存する分割導体パッドを
設けることにより、分割導体パッド上にチップ部品が接
続されていなければ、回路パターンは切れ目により切断
状態のままになっており、電子部品実装後の回路機能試
験において電子回路は正常に動作せず、チップ部品の接
続有無を確実にチェックすることができる。By providing a divided conductor pad with a cut in the middle of the circuit pattern, if no chip components are connected to the divided conductor pad, the circuit pattern remains disconnected due to the cut, and the circuit after electronic components are mounted. During a functional test, electronic circuits do not operate normally, and it is possible to reliably check whether chip components are connected or not.
以下図面に示す一実施例により本発明の要旨を具体的に
説明する．
第１図の平面図に示す印刷配線板は、第４図に示した回
路図に基づく電子回路を構成する．即ち、従来同様に電
源線回路パターンｌとアース線回路パターン２を設け、
それぞれの回路パターン１．２の途中に１点鎖線で示す
チップ部品３、即ちチップコンデンサの電極３ａを接続
する分割導体パッド５と導体バソド６を設けるとともに
、末端に２点鎖線で示すＩＣ４のリ一ド４ａを接続する
導体パッド７を設けているが、この電源線回路パターン
１の途中に設けた分割導体パソド５は輻０．２〜０．３
鶴程度の切れ目５ａにより５−１．５−２に２分されて
おり、電源線回路パターン１を切断している点が異なる
．
このように電源線回路パターン１の途中に電源線回路パ
ターンｌを切断するような切れ目５ａを有する分割導体
パッド５ （５−１．５−２）を設けることにより、い
ま、第２図の要部実装平面図に示すように分割導体パッ
ド５上にチップコンデンサ３の一方の電極３ａが接続さ
れていれば、電源線回路パターンｌは接続されたチップ
コンデンサ３の電極３ａを介し分割導体パッド５、即ち
５−１ と５−２とをブリッジ接続するため導通状態に
あって電子部品実装後の回路機能試験において正常に回
路動作する。The gist of the present invention will be specifically explained below with reference to an embodiment shown in the drawings. The printed wiring board shown in the plan view of FIG. 1 constitutes an electronic circuit based on the circuit diagram shown in FIG. That is, as in the conventional case, a power line circuit pattern 1 and a ground line circuit pattern 2 are provided,
In the middle of each circuit pattern 1.2, a divided conductor pad 5 and a conductor bathode 6 are provided to connect the chip component 3 shown by the dashed-dotted line, that is, the electrode 3a of the chip capacitor, and a lead for the IC 4 shown by the dashed-dotted line is provided at the end. A conductor pad 7 is provided to connect the power line circuit pattern 1, and the divided conductor pad 5 provided in the middle of the power line circuit pattern 1 has a radius of 0.2 to 0.3.
The difference is that it is divided into 5-1 and 5-2 by a crane-sized cut 5a, and the power line circuit pattern 1 is cut. By providing the divided conductor pad 5 (5-1.5-2) having the cut 5a that cuts the power line circuit pattern l in the middle of the power line circuit pattern 1 in this way, the main points shown in FIG. If one electrode 3a of the chip capacitor 3 is connected to the divided conductor pad 5 as shown in the partial mounting plan view, the power line circuit pattern l is connected to the divided conductor pad 5 through the electrode 3a of the connected chip capacitor 3. That is, since 5-1 and 5-2 are bridge-connected, they are in a conductive state and the circuit operates normally in a circuit function test after electronic components are mounted.
もし、第３図の要部実装平面図に示すようにチップコン
デンサ３が接続漏れ（接続不完全を含む）していれば、
分割導体パッド５−１．５−２間は開放のままとなり、
電源線回路パターンｌは切断状態と１なり電子部品実装
後の回路機能試験において正常に回路動作しないことか
ら、例え目視検査でチップコンデンサ３が接続漏れを見
落としてもチップコンデンサ３の搭載有無を確実にチェ
ックすることができる．
なお、上記説明の分割導体パッドは電源線に限らず信号
線に設けてもよく、この場合もチップ部品が接続されな
い限り電子回路は正常に回路動作・・できないことから
同様にチップ部品の接続漏れをチェックすることができ
る．
また、上記説明はチップコンデンサで説明したが、チッ
プ抵抗などの他のチップ部品を接続する場合にも適用で
きることは言うまでもない。If the chip capacitor 3 has a connection leak (including an incomplete connection) as shown in the main part mounting plan view of FIG.
The divided conductor pads 5-1 and 5-2 remain open,
Since the power line circuit pattern 1 is in a disconnected state and the circuit does not operate normally in the circuit function test after mounting the electronic components, it is possible to ensure that the chip capacitor 3 is mounted even if the chip capacitor 3 misses a connection during a visual inspection. You can check. Note that the split conductor pads described above may be provided not only for power lines but also for signal lines, and in this case as well, the electronic circuit cannot operate normally unless the chip components are connected, so there is a possibility that the chip components may not be connected properly. You can check. Further, although the above explanation has been made with respect to a chip capacitor, it goes without saying that it can also be applied to the case where other chip components such as a chip resistor are connected.
以上、詳述したように本発明によれば、回路パターンの
途中に切れ目を有する分割導体パッドを設けることによ
り、チップ部品の搭載有無（あるいは接続不完全）を回
路機能試験において確実にチェックすることができ、目
視試験による見落としを補完することができるといった
産業上極めて有用な効果を発揮する。As described in detail above, according to the present invention, by providing a divided conductor pad having a break in the middle of a circuit pattern, it is possible to reliably check whether a chip component is mounted (or whether the connection is incomplete) in a circuit function test. It has extremely useful effects in industry, such as being able to compensate for oversights caused by visual testing.
第４図は従来技術による一回路図、 第５図は第４図の印刷配線板の平面図である。Figure 4 is a circuit diagram according to the prior art. FIG. 5 is a plan view of the printed wiring board of FIG. 4.
図において、
ｌは回路パターン（電源線回路パターン）、３はチップ
部品（チップコンデンサ）、３ａは電極、
５．５−１．５−２は分割導体バッド、５ａは切れ目を
示す。In the figure, l indicates a circuit pattern (power line circuit pattern), 3 indicates a chip component (chip capacitor), 3a indicates an electrode, 5.5-1.5-2 indicates a divided conductor pad, and 5a indicates a cut.
第１図は本発明による印刷配線板の一実施例の平面図、
第２図は第１図のチップ部品の接続状態を示す要部平面
図、
第３図は第１図のチップ部品の接続漏れの状態を示す要
部平面図、FIG. 1 is a plan view of an embodiment of a printed wiring board according to the present invention, FIG. 2 is a plan view of essential parts showing the state of connection of the chip components shown in FIG. 1, and FIG. 3 is a plan view of the connection of the chip components shown in FIG. 1. A plan view of the main part showing the state of leakage,
Claims (1)
５ａ）を有する分割導体パッド（５）を回路パターン（
１）の途中に設け、該切れ目（５ａ）により前記回路パ
ターン（１）を切断したことを特徴とする印刷配線板。The cut connecting one electrode (3a) of the chip component (3) (
5a) with a circuit pattern (
A printed wiring board characterized in that the circuit pattern (1) is cut by the cut (5a) provided in the middle of the cut (5a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1058228A JPH02237091A (en) | 1989-03-09 | 1989-03-09 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1058228A JPH02237091A (en) | 1989-03-09 | 1989-03-09 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02237091A true JPH02237091A (en) | 1990-09-19 |
Family
ID=13078224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1058228A Pending JPH02237091A (en) | 1989-03-09 | 1989-03-09 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02237091A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5425647A (en) * | 1992-04-29 | 1995-06-20 | Alliedsignal Inc. | Split conductive pad for mounting components to a circuit board |
| WO1998016092A1 (en) * | 1996-10-07 | 1998-04-16 | Fuji Xerox Co., Ltd. | Printed wiring board device |
| JPWO2011162005A1 (en) * | 2010-06-24 | 2013-08-19 | ボッシュ株式会社 | Printed circuit board |
| JP2017083267A (en) * | 2015-10-27 | 2017-05-18 | Tdk株式会社 | Electronic circuit and electronic apparatus |
-
1989
- 1989-03-09 JP JP1058228A patent/JPH02237091A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5425647A (en) * | 1992-04-29 | 1995-06-20 | Alliedsignal Inc. | Split conductive pad for mounting components to a circuit board |
| WO1998016092A1 (en) * | 1996-10-07 | 1998-04-16 | Fuji Xerox Co., Ltd. | Printed wiring board device |
| US6166457A (en) * | 1996-10-07 | 2000-12-26 | Fuji Xerox Co., Ltd. | Printed-circuit assembly |
| JPWO2011162005A1 (en) * | 2010-06-24 | 2013-08-19 | ボッシュ株式会社 | Printed circuit board |
| JP2017083267A (en) * | 2015-10-27 | 2017-05-18 | Tdk株式会社 | Electronic circuit and electronic apparatus |
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