JPS63241989A - Circuit wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a circuit wiring board used for mounting electronic components made of mini-molded components such as Zener diodes or transistors. be.

(Prior Art) Conventionally, in this type of circuit wiring board, especially in a printed circuit board on which mini-mold parts are mounted, the pattern wiring of the mini-mold parts has a rectangular part that contacts the lead pins. Are known.

(Problems to be Solved by the Invention) However, in a printed circuit board having such a conventional structure, for example, the pattern land 2 of the mini-mold component printed on the board body 1 as illustrated in FIG. In this case, a mini mold transistor T as shown in FIG.
When three ff1Ks consisting of emitter E, collector C, and base B of r are brought into contact with each other, flow soldering as shown in FIG.
As shown in B), the area of each pattern with the pattern land 22 used for flow soldering changes depending on the soldering conditions, and moreover, at present, each pattern is rectangular and the same. , it is not only impossible to determine the polarity of the transistor Tr, but also the shape of the pattern land itself is inappropriate even when automatically inspected using an in-circuit tester.6 The present invention solves the above-mentioned circumstances. The purpose was to solder mini-molded parts without deteriorating their properties, to allow probe pins for in-circuit testers, etc. to be placed, and to be able to determine polarity. An object of the present invention is to provide a circuit wiring board that allows easy installation.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a circuit wiring board on which mini-molded parts are mounted on the board main body. a first pattern land electrically connected to a first test land centered on a first grid point of 1710 inches above and to which a first electrode of the mini-mold component is soldered; a second pattern land electrically connected to a second test land centered on a second grid point of 1/10 inch and to which a second electrode of the mini-mold component is soldered; and a third pattern land electrically connected to the third test land centered on the lattice point No. 3 and to which the third electrode of the mini-mold component is soldered. be.

(Function) That is, by having the above configuration, the present invention has the following features:
The pattern land shapes for the three electrodes of the mini-mold part are all different, and a portion of the pattern land is arranged at a grid point of 1/10 inch (2.54 mm) scale. It is possible to identify the electrodes of mini-mold parts just by looking at them, and it is also possible to easily perform inspections using an in-circuit tester, etc.

(Example) Hereinafter, the present invention will be described in detail with reference to an example shown in FIG.

FIG. 1 shows a circuit wiring board according to the present invention, for example, a printed circuit board on which a mini-mold transistor Tr as shown in FIG. 3, which is a mini-mold component, is mounted. a first test land centered on the first lattice point p1 of 1/10 inch (2,54 mm), and a first pattern land Q electrically connected to second grid point p
2, a second pattern land Q2 electrically connected to a second test land t2 centered at 2, and a third test land t3 centered at a third lattice point p of 1/10 inch.
A mini-mold transistor T is formed on each of these pattern lands Q, Q2, Q, as shown by dotted lines in FIG.
Emitter E of r.

Three electrodes consisting of collector C and base B can be soldered to each other.

In other words, an in-circuit tester tests the transistor Tr.
Probe pins are used to automatically inspect the mounting status of
In principle, they are arranged on grid points of 1/10 inch, and when designing wiring patterns for printed circuit boards, patterns are changed using paper with a 1/10 inch scale. is normal. In this case, the component center of the transistor Tr, which is a mini-molded component, is placed on a grid point of 1/10 inch scale to determine the local coordinate system of the component. In this way, when the component center of the transistor Tr is determined,
Since the minimum area required for soldering is determined, the positions of each pattern land Q1, Q2, and Q3 are determined, and the test lands t, t2, and t3 are placed in the condition shown in Figure 1. By arranging , space can be omitted.

On the other hand, the test lands t1 and t2 of the emitter E and base B of the mini-mold transistor Tr are closer to the center from one dimension above, and the 1/10 inch lattice points p and p2 are
are separated from each pattern land aiQ2, but also the test land of connector C.

is included in pattern land λ4 from the position of lattice point p3, and this pattern land a is a test land.
The area is wider than 2, and in this way, the test land t
By providing 1, t2, and t3, the area of each pattern land a1, Q2, and Q3 can be increased, so as shown in Figure 1, two corner cuts are made on the pattern land ℃3. If one corner cut is formed in B, the polarity of the transistor can be easily determined from the different shapes.

It should be noted that the present invention is not limited to the above embodiments in any way, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[Effects of the Invention] As is clear from the above description, according to the present invention, a first test land centered on a first grid point of 1/10 inch is formed on a board body on which a mini-mold component is mounted. a second pattern land electrically connected to a second test land centered on a second grid point of 1/10 inch; forming a third pattern land electrically connected to a third test land centered on a third grid point of inches;
A third mini-mold part is placed on each of these pattern lands.
In addition to soldering the electrodes, the shape of each pattern land was made different for the three electrodes of the mini-mold part, and a part of the pattern land was
/10 inch (2.54 mm) scale grid points, it is possible to identify the electrodes of mini-mold parts just by looking at the pattern land, and it is easy to inspect using an in-circuit tester, etc. Therefore, it is possible to provide a circuit wiring board having excellent effects such as:

[Brief explanation of the drawing]

FIG. 1 is a plan view of essential parts showing an embodiment of a circuit wiring board according to the present invention, FIG. 2 is an explanatory diagram showing an example of a pattern land printed on a conventional board body, and FIG. 3 is a conventional 4(A) and 4(B) are explanatory views showing pattern lands for flow soldering and pattern lands for reflow soldering, respectively. 10... Board body, Q□, Q2, Q3... Pattern land. Pl, P2-P3...lattice point, t-work, 12.1. ...Test land, Tr...Mini mold component (transistor), E...Emitter
(electrode). B...Base (electrode), C...Connector (electrode). Applicant's agent Patent attorney Takehiko Suzue Figure 2C

Claims (1)

[Claims] A circuit wiring board on which mini-molded parts are mounted on the board main body, and a 1/10 inch first
a first pattern land electrically connected to a first test land centered on a grid point of and to which a first electrode of the mini-mold component is soldered; and a second grid point of 1/10 inch. a second pattern land electrically connected to a second test land centered at and to which a second electrode of said mini-mold component is soldered; and a second pattern land centered at a third grid point of 1/10 inch. and a third pattern land electrically connected to the third test land to which the third electrode of the mini-mold component is soldered.