JP2010158820A - Recording head, method for manufacturing the same, base body for taking large number of articles, and recording apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a recording head with high reliability, a method for manufacturing it, a base body for taking a large number of articles, and a recording apparatus. <P>SOLUTION: A thermal head 10 includes: a substrate 30 having one side extending along main scanning directions D1 and D2; a thermal storing layer 40 provided on the whole upper face including an end part on one side of the substrate 30; a plurality of exothermic parts 51 arranged along the main scanning directions D1 and D2 on the thermal storing layer 40 separated from one side of the substrate 10; and a fourth electrically-conductive layer 64 having a base part 64a extending along the main scanning directions D1 and D2 on the thermal storing layer 40 positioned between one side of the substrate 10 and a plurality of the exothermic part 51, and a plurality of extending parts 64b extending to one side of the substrate 30 from the base part 64a along sub-scanning directions D3 and D4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a recording head including a plurality of heat generating portions and a crack reducing layer on a heat storage layer, a method for manufacturing the recording head, a multi-cavity substrate, and a recording apparatus.

  As a printer such as a facsimile or a register, a thermal printer including a thermal head and a platen roller is used. As a thermal head mounted on such a thermal printer, there are a plurality of heat generating parts arranged on a heat storage layer formed on the substrate surface, and a function located on the heat generating part and protecting the heat generating part. Some have a protective layer. The platen roller has a function of pressing a recording medium such as thermal paper against a protective layer positioned on the heat generating portion. In the thermal printer having such a configuration, the heat generating portion generates heat according to a desired image, and the heat generating portion emits by pressing the recording medium substantially uniformly with a platen roller against the protective layer positioned on the heat generating portion. Heat is transferred well to the recording medium. Desired printing on the recording medium is performed by repeating this process.

  In such a thermal printer, when the platen roller is pressed against the thermal head to be mounted, the protective layer may be peeled off due to a crack generated during manufacturing. Therefore, a thermal head provided with a crack reducing layer extending along the arrangement direction of the heat generating parts has been developed in order to reduce cracks during the formation of the protective layer.

  However, the thermal head described in Patent Document 1 may not be able to sufficiently reduce cracks that tear along the arrangement direction of the heat generating portions.

JP-A-10-264427

  The present invention has been conceived under such circumstances, and it is an object of the present invention to provide a highly reliable recording head, a method for manufacturing the recording head, a multi-piece substrate, and a recording apparatus.

  The recording head of the present invention includes a substrate having one side extending along the main scanning direction, a heat storage layer provided on an area including at least the one end of the substrate, and the substrate. A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer spaced apart from the one side of the substrate, and the heat storage located between the one side of the substrate and the plurality of heat generating portions. A crack reducing layer having a base portion extending along the main scanning direction and a plurality of extending portions extending from the base portion to the one side along a direction intersecting the main scanning direction on the layer It is characterized by comprising.

  In the recording head according to the aspect of the invention, it is preferable that the crack reducing layer includes a second crack reducing layer on the heat storage layer positioned between the plurality of extending portions in a plan view.

  The recording head of the present invention includes a protective layer covering the crack reducing layer, and the protective layer preferably has a residual stress larger than that of the heat storage layer.

  The connection base of the recording head of the present invention includes an element substrate that is divided into two or more regions at a boundary extending in the main scanning direction, a heat storage layer provided on the element substrate across the boundary, and A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer positioned on the section, and the heat storage layer positioned between the plurality of heat generating sections and the boundary in one section. A crack having a base portion extending along the main scanning direction and a plurality of extending portions extending from the base portion to the other section adjacent to the one section beyond the boundary. It is characterized by including a reduction layer.

  The connection base of the recording head according to the present invention is arranged on the heat storage layer located between the plurality of heat generating portions and the boundary in the other section so as to be separated from the extending portion along the main scanning direction. It is preferable that a plurality of conductive layers for electrically connecting to the plurality of heat generating portions are included.

  The manufacturing method of the recording head according to the embodiment of the present invention includes a first step of preparing an element substrate that is partitioned into two or more regions by a boundary extending in the main scanning direction, and straddling the boundary on the element substrate. A second step of providing a heat storage layer; a plurality of heat generating portions arranged along the main scanning direction on the heat storage layer in the partition; and the plurality of heat generating portions in the one partition and the boundary. And a crack reducing layer having a base extending in the main scanning direction and a plurality of extending portions extending from the base to the other section adjacent to the one section beyond the boundary. And a fourth step of dividing the raw substrate along the boundary.

  In the recording head manufacturing method according to the embodiment of the present invention, in the third step, the recording head is formed in the main scanning direction on the heat storage layer positioned between the plurality of heat generating portions and the boundary in the other section. 14. The method of manufacturing a recording head according to claim 13, further comprising: forming a plurality of conductive layers arranged to be electrically connected to the plurality of heat generating portions, which are arranged along the extending portion along the same. .

  A recording apparatus of the present invention includes the above-described recording head and a transport unit that transports a recording medium.

  The recording head of the present invention includes a substrate having one side extending in the main scanning direction, a heat storage layer provided on an area including an end portion on at least one side of the substrate, and one side of the substrate A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer spaced apart from the substrate, and a heat storage layer positioned between one side of the substrate and the plurality of heat generating portions along the main scanning direction. And a crack reducing layer having a plurality of extending portions extending from the base portion to one side of the substrate along a direction intersecting the main scanning direction. For this reason, in the recording head of the present invention, even if a crack has occurred in the heat storage layer, it is possible to reduce the occurrence of the crack in a direction crossing the main scanning direction by the base extending along the main scanning direction. In addition, it is possible to reduce the occurrence of cracks in the main scanning direction by the extending portions extending in the intersecting direction. Therefore, the recording head of the present invention can improve reliability.

  In the recording head of the present invention, when the crack reducing layer is configured to include the second crack reducing layer on the heat storage layer located between the plurality of extending portions in plan view, the heat storage layer is cracked. Even in the case of cracking, the progress of cracks can be further reduced. Therefore, this recording head can further improve the reliability.

  The recording head of the present invention includes a protective layer covering the crack reducing layer, and even when the residual stress is larger than the residual stress of the heat storage layer, the heat storage layer cracks. Can be reduced. Therefore, this recording head can further improve the reliability.

  The connection base of the recording head of the present invention includes an element substrate that is partitioned into two or more regions at a boundary extending in the main scanning direction, a heat storage layer provided across the boundary on the element substrate, A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer located in the region, and along the main scanning direction on the heat storage layer located between the plurality of heat generating portions and the boundary in one section And a crack reducing layer having a plurality of extending portions extending from the base to the other section adjacent to the one section beyond the boundary. For this reason, in the connection base of the recording head of the present invention, even if a crack occurs in the heat storage layer when the connection base is divided along the boundary, the extension in the crossing direction causes a crack in the main scanning direction. Can be reduced. Therefore, the connection base of the recording head of the present invention can improve reliability.

  The connection base of the recording head of the present invention is arranged on the heat storage layer located between the plurality of heat generating portions and the boundary in other sections, and is separated from the extending portion along the main scanning direction. In the case where a plurality of conductive layers for electrical connection to the heat generating portion are included, the conductive layer provided on the other of the substrate regions is provided even when the crack reducing layer has conductivity. Short circuit through the crack reducing layer can be reduced.

  According to the recording head manufacturing method of the present invention, a first step of preparing an element substrate partitioned into two or more regions at a boundary extending in the main scanning direction, and providing a heat storage layer across the boundary on the element substrate A second step, a plurality of heat generating portions arranged along the main scanning direction on the heat storage layer in the section, and a base extending along the main scanning direction between the plurality of heat generating sections and the boundary in the one section And a third step of forming a crack reducing layer having a plurality of extending portions extending from the base to the other section adjacent to the one section beyond the boundary, and a step of dividing the base substrate along the boundary 4 processes. Therefore, according to the recording head manufacturing method of the present invention, even when a crack is generated in the heat storage layer when the base substrate is divided in the fourth step, the crack is generated in the main scanning direction by the extending portion extending in the intersecting direction. Can be reduced. Therefore, the recording head manufacturing method of the present invention can improve the reliability.

  According to the recording head manufacturing method of the present invention, the plurality of heat generating portions in other sections are arranged on the heat storage layer positioned between the boundaries and spaced apart from the extending portions along the main scanning direction. In the case of forming a plurality of conductive layers for electrical connection to the heat generating portion, even if the crack reducing layer has conductivity, the conductive layer provided on the other of the substrate regions is replaced with the crack reducing layer. Therefore, it is possible to reduce the short circuit.

  The recording apparatus of the present invention includes the above-described recording head. Therefore, the recording apparatus of the present invention can enjoy the effects of the above-described recording head. Therefore, the recording apparatus of the present invention can improve reliability.

1 is a plan view showing a schematic configuration of a thermal head that is an example of an embodiment of a recording head of the invention. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. It is sectional drawing along the III-III line | wire shown in FIG. FIG. 3 is a plan view illustrating a schematic configuration of a connection base of a thermal head that is an example of an embodiment of a recording head of the present invention. It is the top view to which the principal part of the connection base | substrate of the thermal head shown in FIG. 4 was expanded. FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5. FIG. 2 is a cross-sectional view showing a manufacturing process of the thermal head shown in FIG. 1. FIG. 2 is a cross-sectional view showing a manufacturing process of the thermal head shown in FIG. 1. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. FIG. 6 is a plan view showing a modification of the thermal head shown in FIG. 1. FIG. 5 is a plan view showing a modification of the connecting base of the thermal head shown in FIG. 4.

<Recording head>
FIG. 1 is a plan view showing a schematic configuration of a thermal head 10 which is an example of an embodiment of a recording head of the present invention.

  FIG. 2 is an enlarged plan view of a main part of the thermal head 10 shown in FIG.

  3 is a cross-sectional view taken along the line III-III shown in FIG.

  The thermal head 10 includes a base 20, a drive IC 21, and an external connection member 22.

  The base body 20 includes a substrate 30, a heat storage layer 40, an electrical resistance layer 50, a conductive layer 60, and a protective layer 70.

  The substrate 30 has a function of supporting the heat storage layer 40, the electric resistance layer 50, the conductive layer 60, the protective layer 70, and the driving IC 21. The substrate 30 is formed in a rectangular shape extending in the main scanning directions D1 and D2 in a plan view, and one side 30a extends along the main scanning directions D1 and D2. A heat storage layer 40 is provided over the entire upper surface of the substrate 30 in the thickness direction D5, D6 on the D5 direction side.

  The heat storage layer 40 has a function of temporarily storing a part of heat generated in a heat generating portion 51 described later of the electric resistance layer 50. That is, the heat storage layer 40 plays a role of improving the thermal response characteristics of the thermal head 10 by shortening the time required to raise the temperature of the heat generating portion 51. An example of a material for forming the heat storage layer 41 is quartz glass. The heat storage layer 40 of the present embodiment has a protruding portion 41 that partially protrudes in the D5 direction among the thickness directions D5 and D6.

  The protruding portion 41 is a portion that contributes to pressing the recording medium against the protective layer 70 located on the heat generating portion 51 satisfactorily. The protrusion 41 is configured in a strip shape extending in the main scanning directions D1 and D2. The protrusion 41 has a substantially semi-elliptical cross section in the sub-scanning directions D3 and D4 orthogonal to the main scanning directions D1 and D2.

  The electrical resistance layer 50 has a heat generating portion 51 that functions as a heat generating portion that generates heat when power is supplied. The electrical resistance layer 50 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 60. Examples of the material for forming the electric resistance layer 50 include TaN-based materials, TaSiO-based materials, TaSiNO-based materials, TiSiO-based materials, TiSiCO-based materials, and NbSiO-based materials. The electrical resistance layer 50 is provided on the heat storage layer 40, and a part thereof is provided on the protruding portion 41. In the present embodiment, a portion of the electrical resistance layer 50 to which a voltage is applied from the conductive layer 60 where the conductive layer 60 is not formed functions as the heat generating portion 51.

  The heat generating part 51 is a part that functions as a heat generating part that generates heat by supplying power. The heat generating portion 51 is configured such that the heat generation temperature due to power supply from the conductive layer 60 is in a range of, for example, 200 [° C.] or more and 550 [° C.] or less. The heat generating portion 51 is located on the protruding portion 41 of the heat storage layer 40 and is arranged along the main scanning directions D1 and D2. In the present embodiment, the arrangement direction of the heat generating portions 51 is the main scanning direction of the thermal head 10.

  The conductive layer 60 is provided on the electric resistance layer 50. As a material for mainly forming the conductive layer 60, for example, any one kind of metal such as aluminum, gold, silver, copper, or an alloy thereof can be used. The conductive layer 60 includes a first conductive layer 61, a second conductive layer 62, a third conductive layer 63, and a fourth conductive layer 64. The conductive layer 64 of this embodiment employs aluminum.

  The first conductive layer 61 contributes to power supply to the heat generating part 51. In the first conductive layer 61, one end portion on the D3 direction side of each of the sub-scanning directions D3 and D4 is located on one end side of the heat generating portion 51. The first conductive layer 61 includes an IC connection layer 611 and a power supply connection layer 612. This IC connection layer 611 is electrically connected to the drive IC 21 at the other end of the sub-scanning directions D3 and D4 on the D4 direction side. The power supply connection layer 612 is electrically connected to the power supply via the drive IC 21 at the other end of the D4 direction in the sub-scanning directions D3 and D4.

  The second conductive layer 62 is for electrically connecting the two heat generating portions 51. The second conductive layer 62 has an end portion on the D4 direction side in the sub-scanning directions D3 and D4 located on the other end side of the heat generating portion 51 adjacent in the main scanning directions D1 and D2.

  The third conductive layer 63 is for electrically connecting the drive IC 21 and the external connection member 22. The third conductive layer 63 has one end portion on the D3 direction side in the sub-scanning directions D3 and D4 connected to the drive IC 21, and the other end portion on the D4 direction side in the sub-scanning directions D3 and D4 is for external connection. It is connected to the member 22.

The 4th conductive layer 64 functions as a crack reduction layer which reduces that the crack produced in the edge part by the side of D3 direction among subscanning directions D3 and D4 of heat storage layer 40 progresses in the D4 direction. As the fourth conductive layer 64 of the present embodiment, a metal material that is more malleable than the heat storage layer 40 is employed and functions as a crack reduction layer. The fourth conductive layer 64 is provided on the D3 direction side in the sub-scanning directions D3 and D4 of the second conductive layer 62. The fourth conductive layer 64 has a base portion 64a and an extension portion 64b. The base 64a extends in the main scanning directions D1 and D2, and both ends extend to the end of the substrate 30 in the main scanning directions D1 and D2. Further, the extending portion 64 b extends from the base portion 64 a along the sub-scanning directions D 3 and D 4, and its end extends to the end on the D 3 direction side in the sub-scanning directions D 3 and D 4 of the substrate 30. In other words, the fourth conductive layer 64 extends from one end of the substrate 30 to the other end in the main scanning directions D1 and D2, and the D3 direction of the sub-scanning directions D3 and D4 of the substrate 30 in the sub-scanning directions D3 and D4. It extends to the side edge. The fourth conductive layer 64 extends from the end on the D3 direction side in the sub-scanning directions D3 and D4 toward the D4 direction in the sub-scanning directions D3 and D4, and D4 in the sub-scanning directions D3 and D4. It has a groove 64b ₁ whose end on the direction side is closed. The groove 64b ₁ is a gap between the extending portion 64b adjacent in the main scanning direction D1, D2. The fourth conductive layer 64 of the present embodiment, the side surfaces of the base portion 64a and the extending portion 64b are continuous with the curved, D4 directions of the sub-scanning direction D3, D4 of the groove 64b ₁ in plan view The end on the side forms a smooth surface. Here, when aluminum is employ | adopted as the 4th conductive layer 64, a dimension preferable as a crack reduction layer is illustrated. As the length _{L a} in the sub-scanning direction D3, D4 of the base 64a, for example, include a range of 100 [[mu] m] or 250 [[mu] m] or less. As the length _{L b} in the sub-scanning direction D3, D4 of the extending portion 64b, for example, include a range of 100 [[mu] m] or 300 [[mu] m] or less. As the width _{W b} in the main scanning direction D1, D2 of the extending portion 64b, for example, it includes 100 [[mu] m] or 250 [mm] or less. Furthermore, as this distance _{d b} in the main scanning direction D1, D2 of the extending portion 64b adjacent in the main scanning direction D1, D2, for example, include a range of 50 [[mu] m] or 2.0 [mm] or less.

The protective layer 70 has a function of protecting the heat generating portion 51 and the conductive layer 60. The protective layer 70 is provided so as to cover the heat generating portion 51 and a part of the conductive layer 60. As a material for mainly forming the protective layer 70, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, and SiO ₂ Material, Ta ₂ O ₅ material, TaSiO material, TiC material, TiN material, TiO ₂ material, TiB ₂ material, AlC material, AlN material, Al Examples thereof include ₂ O ₃ -based materials, ZnO-based materials, B ₄ C-based materials, and BN-based materials. Here, the “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. In addition, here, “˜-based material” is a material composed of Si atoms and C atoms, taking a SiC-based material as an example, and not only a material having a stoichiometric composition, but also a stoichiometric amount. A material having a composition ratio deviating from the theoretical composition may be used. In addition, “a material mainly including a system material” refers to a material whose main material is 50 wt% or more with respect to the whole, and may include, for example, an additive. The protective layer 70 of the present embodiment has a larger residual stress than the heat storage layer 40.

  The drive IC 21 has a function of controlling the heat generation of the plurality of heat generating parts 51. The drive IC 21 is electrically connected to the heat generating part 51 through the first conductive layer 61. With such a configuration, it is possible to selectively control the power supplied to the heat generating unit 51 and control heat generation.

  The external connection member 22 has a function of supplying an electrical signal for selectively causing the heat generating portion 51 to generate heat. Examples of the external connection member 22 include a combination of a flexible cable and a connector.

  The thermal head 10 includes a substrate 30 having one side extending along the main scanning directions D1 and D2, a heat storage layer 40 provided on the entire upper surface including an end portion on one side of the substrate 30, and a substrate. 10 on the heat storage layer 40 spaced from one side, and is located between the plurality of heat generating parts 51 arranged along the main scanning directions D1 and D2 and between one side of the substrate 10 and the plurality of heat generating parts 51. On the heat storage layer 40, a base portion 64a extending along the main scanning directions D1 and D2 and a plurality of extending portions 64b extending from the base portion 64a to the one side along the sub-scanning directions D3 and D4 are provided. The fourth conductive layer 64 is included. Therefore, in the thermal head 10, even if the heat storage layer 40 located between the extending portions 64b is cracked, the base portion 64a extending along the main scanning directions D1 and D2 causes the sub scanning direction D3. The extension of the cracks in the main scanning directions D1 and D2 can be reduced by the extension part 64b extending along the sub-scanning directions D3 and D4 as well as the progress of the cracks along the D4. be able to. Therefore, the thermal head 10 can improve reliability.

In the thermal head 10, a groove 64b ₁ is, in the direction D6 view of the thickness direction D5, D6, since the end portion of the D4 side of the sub-scanning direction D3, D4 form a smooth surface, heat storage layer 40 Even when a crack occurs in the film, it is possible to further reduce the progress of the crack. Therefore, the thermal head 10 can further improve reliability.

The thermal head 10 includes a protective layer 70 covering the fourth conductive layer 64, and the protective layer 70 has a heat storage layer 40 even when the residual stress is larger than the residual stress of the heat storage layer 40. It is possible to reduce the occurrence of cracks. Therefore, the thermal head 10 can further improve reliability.
<Multiple print head substrate>
FIG. 4 is a plan view showing a schematic configuration of a multi-cavity substrate 20X which is an example of an embodiment of a connecting substrate of the recording head of the present invention.

  FIG. 5 is an enlarged plan view of a main part of the multi-cavity base 20X shown in FIG.

  FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG.

  The multi-cavity base 20X is configured by connecting a part of the base 20 to each other. The multi-cavity base 20X includes a base substrate 30X, a connected heat storage layer 40X, an electric resistance layer 50, and a connected conductive layer 60X.

The base substrate 30 </ b> X has a plurality of substrate regions 30 </ b> Xa that function as the substrate 30. The base substrate 30X has a split 30Xb in addition to the substrate region 30Xa. In the base substrate 30X, a rectangular substrate region 30Xa extending in the main scanning directions D1 and D2 is connected to the sub-scanning directions D3 and D4, and a split 30Xb is provided at both ends of each substrate region 30Xa in the main scanning directions D1 and D2. have. Further, the base substrate 30X is arranged along the boundary between the substrate region 30Xa and the split margin 30Xb, and is formed in a substantially conical division formed from the D6 direction side to the D5 direction side in the thickness directions D5 and D6. It has a groove 30X _1. Further, the base substrate 30X is provided with a connected heat storage layer 40X over the entire upper surface on the D5 direction side of the thickness directions D5 and D6.

  The connected heat storage layer 40X has a plurality of heat storage regions 40Xa that function as the heat storage layer 40 on each substrate region 30Xa.

  The electrical resistance layer 50 in the multi-cavity substrate 20X is provided in each of the substrate regions 30Xa.

  The connection conductive layer 60 </ b> X includes a first connection layer 61, a second connection layer 62, a third connection layer 63, and a fourth connection layer 64 </ b> X having a portion functioning as the fourth connection layer 64. ing. The first conductive layer 61, the second conductive layer 62, and the third conductive layer 63 are provided in each of the substrate regions 30Xa.

The fourth linking conductive layer 64 </ b> X has a region that functions as the fourth conductive layer 64. The fourth connection conductive layer 64X is provided from one side to the other beyond the boundary between the adjacent substrate regions 30Xa, and straddles the boundary between the substrate regions 30Xa. Of the fourth linking conductive layer 64 </ b> X, a region provided in one substrate region 30 </ b> Xa functions as the fourth conductive layer 64. The extension region 64Xb functioning as the extension part 64b of the fourth conductive layer 64 extends to the other substrate region 30Xa, and the end on the D3 direction side of the sub-scanning directions D3 and D4 is the other substrate region 30Xa. It faces the third conductive layer 63 provided on the surface. Further, the fourth linking conductive layer 64X extends over the adjacent margin 30Xb in the main scanning directions D1 and D2. The region functioning as the base portion 64a of the fourth conductive layer 64 extends to both ends of the base substrate 30X in the main scanning directions D1 and D2. Here, the length L _Xb in the sub-scanning directions D3 and D4 of the extended region 64Xb when aluminum is adopted as the fourth connection conductive layer 64X includes, for example, a range of 150 [μm] or more and 500 [μm] or less. .

  The multi-chip base 20X of the thermal head 10 includes a connecting substrate 20X having two substrate regions 30Xa separated by a boundary extending in the main scanning directions D1 and D2, and two substrate regions 30Xa of the connecting substrate 20X. A heat storage layer 40 extending from one to the other, a plurality of heat generating portions 51 arranged on the heat storage layer 40 along the main scanning directions D1 and D2, and one substrate A base portion 64a extending along the main scanning directions D1 and D2 provided on the heat storage layer 40 located between the plurality of heat generating portions 51 and the boundaries in the region 30Xa, and one substrate region from the base portion 64a And a fourth conductive layer 64 having a plurality of extending portions 64b extending over another substrate region 30Xa adjacent to 30Xa. Therefore, in the multi-cavity substrate 20X of the thermal head 10, even when a crack occurs in the heat storage layer 40 when the multi-cavity substrate 20X is divided along the boundary, it extends along the main scanning directions D1 and D2. Of course, the base 64a can reduce the development of cracks along the sub-scanning directions D3 and D4, and the extension 64b extending in the sub-scanning directions D3 and D4 can be used in the main scanning directions D1 and D2. The progress of cracks can also be reduced. Therefore, the multi-cavity base 20X of the thermal head 10 can improve the reliability.

  The multi-cavity base 20X of the thermal head 10 becomes an extended portion 64b along the main scanning directions D1 and D2 on the heat storage layer 40 located between the plurality of heat generating portions 51 and the boundary in the other substrate region 30Xa. Since the third conductive layer 63 includes a plurality of third conductive layers 63 arranged apart from the region, the fourth conductive layer 64 provided on the other side of the substrate region 30Xa is a conductive material. Even when it is connected to the external connection member 70 via, it is possible to reduce a short circuit via the fourth conductive layer 64.

Hereinafter, a method for manufacturing the thermal head 10 and the multi-cavity substrate 20X according to the present embodiment will be described with reference to FIGS.
<Heat storage layer formation process>
As shown in FIG. 7 (a), to prepare the element substrate 30X which first has a split groove 30X _1, to form a consolidated heat storage layer 40X thereon. Specifically, a substantially flat connected heat storage film is formed on the entire upper surface on the D5 direction side in the thickness direction D5, D6 of the base substrate 30X by a film forming technique such as sputtering. Next, the continuous heat storage film is etched by a film forming technique such as sputtering to form a connected heat storage layer 40 </ b> X having a region that becomes the protruding portion 41.
<Connected resistance film forming process>
As shown in FIG. 7B, the connection resistance film 50Y is formed on the entire upper surface on the D5 direction side in the thickness directions D5 and D6 of the connection heat storage layer 40X. Specifically, the connection resistance film 50Y is formed on the connection heat storage film 40X by a film formation technique such as sputtering and vapor deposition.
<Connected conductive film forming step>
As shown in FIG. 7C, the connection conductive film 60Y is formed on the entire upper surface on the D5 direction side in the thickness directions D5 and D6 of the connection resistance film 50Y. Specifically, the connection conductive film 60Y is formed by forming a substantially flat film on the connection resistance film 50Y by a film formation technique such as sputtering and vapor deposition.
<Patterning process>
As shown in FIG. 8A, the electric resistor layer 50 and the connecting conductive layer 60X are formed. Specifically, first, a mask is formed on the connection conductive layer 60X by a fine processing technique such as photolithography. Next, the mask is peeled off by leaving a region to be the electrical resistor layer 50 and the connecting conductive layer 60X by a fine processing technique such as photolithography. Next, the connection resistance film 50Y and a part of the connection conductive film 60Y exposed from the mask are etched. As a result, the other portions of the coupling resistance film 50Y and the coupling conductive film 60Y that remain without being etched can be used as the electrical resistor layer 50 and the coupling conductive layer 60X.

In this manner, the multi-cavity base 20X of the thermal head 10 of this embodiment can be manufactured.
<Substrate dividing step>
As shown in FIG. 8 (b), by dividing the multi-cavity substrate 20X along the dividing groove 30X _1, to obtain a substrate 30.
<Protective layer forming step>
As shown in FIG. 8C, a protective layer 70 that covers the electrical resistor layer 50 and the conductive layer 60 is formed. Specifically, first, a mask is formed so as to expose a portion to be protected by the protective layer 70 by a fine processing technique such as photolithography. Next, the protective layer 70 is formed by a film forming technique such as sputtering or vapor deposition.

The base body 20 is manufactured as described above.
<Drive IC placement process>
A drive IC 21 is disposed in a predetermined region of the base 20. Specifically, the base body 20 and the driving IC 21 are connected via a conductive member such as a conductive bump and an anisotropic conductive material.
<External connection member placement process>
The external connection member 22 is disposed in a predetermined region of the base body 20. Specifically, the base body 20 and the external connection member 22 are connected via a conductive member such as a conductive bump and an anisotropic conductive material.

  As described above, the thermal head 10 of this embodiment can be manufactured.

  The manufacturing method of the thermal head 10 includes a step of preparing a base substrate 30X that is partitioned into two or more substrate regions 30Xa by boundaries extending in the main scanning directions D1 and D2, and a heat storage layer across the boundaries on the base substrate 30X. 40, a plurality of heat generating portions 51 arranged on the heat storage layer 40 along the main scanning directions D1 and D2, and a plurality of heat generating portions 51 in one substrate region 30Xa and a main scan. A fourth conductive layer 64 having a base portion 64a extending along the directions D1 and D2 and a plurality of extending portions 64b extending from the base portion 64a to a section of another substrate region 30Xa adjacent to the one substrate region 30Xa beyond the boundary. And a step of dividing the base substrate 30X along the boundary. Therefore, in the manufacturing method of the thermal head 10, even when the heat storage layer 40 is cracked when the connection substrate 20 </ b> X is divided in the fourth step, the base 64 a extending along the main scanning directions D <b> 1 and D <b> 2 is used. Of course, it is possible to reduce the progress of cracks along the sub-scanning directions D3 and D4, and the extension 64b extending in the sub-scanning directions D3 and D4 causes the cracks to propagate in the main scanning directions D1 and D2. Can also be reduced. Therefore, the manufacturing method of the thermal head 10 can improve reliability.

The manufacturing method of the thermal head 10 includes a plurality of second heads arranged in the main scanning directions D1 and D2 and spaced apart from the extending portions 64b between the plurality of heat generating portions 51 and the boundaries in the section of the other substrate region 30Xa. Since the third conductive layer 63 is formed, the fourth conductive layer 64 is provided on the other side of the substrate region 30Xa even when the third conductive layer 63 is connected to the external connection member 70 through the conductive material. Short circuit through the four conductive layers 64 can be reduced.
<Recording device>
FIG. 9 is a diagram showing a schematic configuration of a thermal printer 1 which is an example of an embodiment of a recording apparatus of the present invention.

  The thermal printer 1 includes a thermal head 10, a transport mechanism 11, and a control device 12.

  The transport mechanism 11 has a function of bringing the recording medium P into contact with the protective layer 70 located on the heat generating portion 51 of the thermal head 10 while transporting the recording medium P in the D3 direction of the sub-scanning directions D3 and D4. is there. The transport mechanism 11 includes a platen roller 111 and transport rollers 112, 113, 114, and 115.

  The platen roller 111 has a function of pressing the recording medium P against the protective layer 70 on the heat generating portion 51. The platen roller 111 is rotatably supported in contact with the protective layer 70 located on the heat generating portion 51. The platen roller 111 is configured by covering the outer surface of a cylindrical raw tube with an elastic member. This elementary tube is made of a metal such as stainless steel. This elastic member is made of, for example, butadiene rubber, and has a thickness dimension set in a range of 3 [mm] to 15 [mm].

  The conveyance rollers 112, 113, 114, and 115 have a function of conveying the recording medium P in the D3 direction among the sub-scanning directions D3 and D4. That is, the transport rollers 112, 113, 114, and 115 supply the recording medium P between the heat generating portion 51 of the thermal head 10 and the platen roller 111, and between the heat generating portion 51 of the thermal head 10 and the platen roller 111. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 112, 113, 114, and 115 may be formed of, for example, a metal columnar member. For example, like the platen roller 111, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control device 12 has a function of supplying image information to the drive IC 21. That is, the control device 12 plays a role of supplying image information for selectively driving the heat generating portion 51 to the drive IC 21 via the external connection member 22.

  The thermal printer 1 includes a thermal head 10. Therefore, the thermal printer 1 can enjoy the effects of the thermal head 10. Therefore, the thermal printer 1 can improve the long-term reliability of the thermal printer 1 by maintaining the function as the protective layer of the protective layer 70 of the thermal head 10 well.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  The heat storage layer 40 of the present embodiment is provided on the entire upper surface of the substrate 30, but is not limited to such a configuration, and is on a region including at least the end portion on the D3 direction side in the sub-scanning directions D3 and D4. As long as it is provided.

  Although the electrical resistance layer 50 of this embodiment is directly provided on the heat storage layer 40, it is not restricted to such a structure, For example, in order to protect the heat storage layer 40 from the etching at the time of manufacture, the heat storage layer 40 is provided. Another layer may be formed between the first and second electric resistance layers 50.

  As shown in FIG. 10, the fourth conductive layer 64 of the present embodiment further has an independent portion 64Ac that is electrically independent from the base portion 64Aa and the extending portion 64Ab in the region between the extending portions 64Ab. May be. In this case, even when a crack occurs in the heat storage layer 40, the progress of the crack can be further reduced, and the reliability can be further increased.

  In the present embodiment, the fourth conductive layer 64 made of a metal or an alloy thereof is taken as an example of the crack reducing layer, but is not limited to such a material. Examples of other materials include a material having higher ductility than the heat storage layer 40 and a material having higher toughness than the heat storage layer 40. Here, examples of the material having high ductility include a silicon resin, a urethane resin, and a fluorine resin in addition to the above-described metals or alloys thereof. Moreover, as a material with high toughness, for example, a urethane acrylate resin, an epoxy resin, and an oxetane resin can be cited in addition to the above-described metals or alloys thereof. When the above-described resin material is employed as the crack reducing layer, it is preferably formed between the patterning step and the substrate dividing step.

  The multi-cavity substrate 20X of the present embodiment is provided with the third conductive layer 63 and the fourth connection conductive layer 64X separately, but is not limited to such a configuration. For example, as shown in FIG. 11, you may have 5th connection conductive layer 65BX which has the area | region used as the 3rd conductive layer 63 and the 4th conductive layer 64. As shown in FIG.

DESCRIPTION OF SYMBOLS 1 Thermal printer 10 Thermal head 11 Conveyance mechanism (conveyance part)
111 Platen Rollers 112, 113, 114, 115 Conveying Roller 12 Controller 20 Base 20X Multi-Piece Base 21 Drive IC
22 External connection member 30 Substrate 30a One side 30X extending along the main scanning direction Substrate 30Xa Substrate region 30Xb Split 40 Heat storage layer 40X Linked heat storage layer 50 Electrical resistance layer 51 Heat generating part 60 Conductive layer 60X Linked conductive layer 61 1 conductive layer 62 2nd conductive layer 63 3rd conductive layer 64 4th conductive layer (crack reduction layer)
64a Base portion 64b Extension portion 64X Fourth connection conductive layer 64Xb Extension region 65 Fifth conductive layer (second crack reduction layer)
70 protective layer P recording medium D1, D2 main scanning direction D3, D4 sub-scanning direction D5, D6 of the extending portion of the base in the thickness direction _{L a} sub-scanning direction in the length _{L b} sub-scanning direction length _{L Xb} subscanning direction extending portion spacing adjacent in the width d _b main scanning direction of the extending portion in the length W _b main scanning direction of the extending region in

Claims (8)

A substrate having one side extending along the main scanning direction;
A heat storage layer provided on an area including at least the one side edge of the substrate;
A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer spaced from the one side of the substrate;
A base extending along the main scanning direction on the heat storage layer located between the one side of the substrate and the plurality of heat generating units, and from the base along a direction intersecting the main scanning direction A recording head comprising: a crack reducing layer having a plurality of extending portions extending to the one side.   2. The recording according to claim 1, wherein the crack reducing layer is configured to include a second crack reducing layer on the heat storage layer located between the plurality of extending portions in a plan view. head. Comprising a protective layer covering the crack reducing layer,
The recording head according to claim 1, wherein the protective layer has a residual stress larger than that of the heat storage layer. A base substrate partitioned into two or more regions at a boundary extending in the main scanning direction;
A heat storage layer provided across the boundary on the substrate;
A plurality of heat generating portions arranged along the main scanning direction on the heat storage layer located on the section;
A base portion extending along the main scanning direction on the heat storage layer located between the plurality of heat generating portions and the boundary in the one partition, and the one partition beyond the boundary from the base And a crack reducing layer having a plurality of extending portions extending to the other section adjacent to the recording section.   In the plurality of heat generating portions arranged apart from the extending portion along the main scanning direction on the heat storage layer located between the plurality of heat generating portions and the boundary in the other section. 5. The multiple-printing substrate of a recording head according to claim 4, wherein the substrate is configured to include a plurality of conductive layers for electrical connection. A first step of preparing a base substrate partitioned into two or more regions at a boundary extending in the main scanning direction;
A second step of providing a heat storage layer across the boundary on the substrate;
A plurality of heat generating sections arranged along the main scanning direction on the heat storage layer in the section, and extending along the main scanning direction between the plurality of heat generating sections and the boundary in one section. A third step of forming a base and a crack reducing layer having a plurality of extending portions extending from the base to the other section adjacent to the one section beyond the boundary;
And a fourth step of dividing the base substrate along the boundary.   In the third step, the heat storage layer located between the plurality of heat generating portions and the boundary in the other section is arranged apart from the extending portion along the main scanning direction. The method of manufacturing a recording head according to claim 6, further comprising: forming a plurality of conductive layers to be electrically connected to the plurality of heat generating portions.   A recording apparatus comprising: the recording head according to claim 1; and a transport unit that transports a recording medium.

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