JP5094639B2 - RECORDING HEAD AND RECORDING DEVICE HAVING THE SAME - Google Patents

Description

  The present invention relates to a heating element, a control element for the heating element, a recording head having a control wiring for connecting the control element and the heating element, and a recording apparatus including the recording head.

  As a printer such as a facsimile or a register, a thermal printer including a thermal head and a platen roller is used. A thermal head mounted on such a thermal printer has a plurality of heating elements arranged on a substrate, and a control element that is located on the substrate and has a function of controlling driving of the heating elements. is there. The platen roller has a function of pressing a recording medium such as thermal paper on the heating element. In the thermal printer having such a configuration, the heat generating element generates heat according to a desired image, and the heat generated by the heat generating element is well transmitted to the recording medium by pressing the recording medium on the heat generating element with a platen roller. I am letting. Desired printing on the recording medium is performed by repeating this process.

Such a thermal head is formed by coating a heating element, a control element, a control wiring for electrically connecting them, and a precursor having fluidity on the control wiring, and then curing the coating. Some have protective material. A thermal head having such a configuration is described in Patent Document 1, for example.
JP-A-7-186428

  However, in the thermal print head described in Patent Document 1, the glass paste, which is a precursor of the protective layer, has fluidity, and an individual electrode pattern (corresponding to the “control wiring” described above) covers the glass paste. In some cases, it may become impossible to electrically connect to the driving IC (corresponding to the above-described “control element”), while the glass paste is used to reduce the possibility that the individual electrode pattern is covered. If the amount is reduced, the individual electrode pattern may be exposed and the individual electrode pattern may not be well protected, so it is necessary to adjust the amount of the glass paste to a predetermined range.

  While having such a technical problem, if the separation distance of the heat generating elements of the thermal head is reduced in order to increase the pixel density of the printed image, the separation distance between the control wirings is correspondingly reduced. Due to the capillary action that occurs, the precursor of the protective material tends to extend toward the control element. For this reason, the adjustment range of the coating amount of the precursor of the protective material is narrowing, and it is difficult to satisfactorily coat the control wiring with the protective material. Such a narrowing of the adjustment range is not limited to the increase in the density of the heat generating elements, but can also be caused by a reduction in the distance between the heat generating elements and the control element.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of satisfactorily covering a control wiring with a protective material and a recording apparatus including the recording head. To do.

The recording head according to the first aspect of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and the plurality of heating elements spaced apart from each other in the sub-scanning direction. A control element disposed on a substrate; and a plurality of control wirings for electrically connecting the plurality of heating elements and a plurality of terminals provided on the control element. Has a first wiring region located on the plurality of heating element sides, and a second wiring region located on the control element side from the first wiring region, and the first wiring region in the first wiring region A separation distance between the plurality of control wirings in the main scanning direction is shortened from the heating element side toward the control element side, and the main scanning between the plurality of control wirings in the second wiring region is performed. The separation distance along the direction is the heating element side The separation distance along the main scanning direction between the plurality of control wirings at the boundary between the first wiring region and the second wiring region is longer toward the control element side. Control wiring that is shorter than the separation distance along the main scanning direction between the elements and the separation distance between the plurality of terminals of the control element, and is located on the outermost side among the plurality of control wirings in the first wiring region The width along the main scanning direction is shorter from the heating element side toward the control element side, and between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region The width along the main scanning direction is longer from the heating element side toward the control element side, and the control wiring located on the outermost side among the plurality of control wirings in the first wiring region The angle between the serial main scanning direction is smaller than the angle between the main scanning direction of the control wire outermost among the plurality of control lines in the second wiring region, at least the first wiring The plurality of control wirings in the region and the gaps between the plurality of control wirings are covered with a first protective material formed by solidifying a fluid precursor, and the control element has fluidity. It is characterized by being covered with a second protective material formed by solidifying the precursor .

The recording head according to the second aspect of the present invention includes a substrate, a plurality of heating elements arranged on the substrate along the main scanning direction, and the plurality of heating elements spaced apart from each other in the sub-scanning direction. A control element disposed on a substrate; and a plurality of control wirings for electrically connecting the plurality of heating elements and a plurality of terminals provided on the control element. Includes a first wiring region located on the plurality of heating element sides, a second wiring region located on the control element side from the first wiring region, the first wiring region, and the second wiring region. A third wiring region located between the wiring regions, and a separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is from the heating element side to the control element side Toward the second wiring region. The separation distance along the main scanning direction between the plurality of control wirings is longer from the heating element side toward the control element side, and the distance between the plurality of control wirings in the third wiring region is The separation distance along the main scanning direction is shorter than the separation distance along the main scanning direction between the plurality of heating elements and the separation distance between the plurality of terminals of the control element, and the first wiring region side The width along the main scanning direction between the control wirings that are located on the outermost side among the plurality of control wirings in the first wiring area is substantially the same over the second wiring area side from the first wiring area. The width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region is shortened from the element side toward the control element side. Front to side Towards the control element side is longer, the outermost of the plurality of control lines in the first wiring region
An angle formed between the control wiring and the main scanning direction is smaller than an angle formed between an outermost control wiring of the plurality of control wirings in the second wiring region and the main scanning direction, and at least the first wiring. The plurality of control wirings in one wiring region and the gaps between the plurality of control wirings are covered with a first protective material formed by solidifying a fluid precursor, and the control element It is characterized by being covered with a second protective material formed by solidifying a precursor having a property .

In the recording head of the present invention, before Symbol first width along the main scanning direction of each of the plurality of control wirings in the wiring region from the heating element side has become shorter toward the control element side More preferred.

  In the recording head of the present invention, the length of the control element along the main scanning direction is longer than the width along the main scanning direction of the arrangement region of the plurality of heating elements controlled by the control element. Is preferred.

In the recording head of the present invention, the peripheral end portion of the second protective material is preferably positioned on the first protective material on.

  A recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium.

  The recording apparatus of the present invention includes the recording head of the present invention, in which the control element is covered with a second protective material formed by solidifying a fluid precursor, and a transport mechanism for transporting the recording medium. The transport mechanism is configured to transport the recording medium while sliding the recording medium on the second protective material.

A recording head according to a first embodiment of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of heating elements spaced apart from the plurality of heating elements in the sub-scanning direction. And a plurality of control wirings for electrically connecting a plurality of heating elements and a plurality of terminals provided on the control elements. A first wiring region located on the element side is provided, and a separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side to the control element side. In addition, the width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side. The width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the wiring region is longer from the heating element side toward the control element side, and the plurality of control wirings in the first wiring region are The angle formed by the main scanning direction of the outermost control wiring among the wirings is smaller than the angle formed by the main scanning direction of the outermost control wiring among the plurality of control wirings in the second wiring region. . Therefore, in the recording head according to the first embodiment of the present invention, when applied to the precursor of the first protective material having fluidity in the first wiring region, between the control line in the first wiring region due to the distance along the main scanning direction are shorter towards the control element side from the heat generating element side and cause capillary action, the precursor of the first protective material the first wiring region The first wiring region can be satisfactorily covered with the first protective material. Thereby, in the recording head according to the first embodiment of the present invention, for example, even when the coating amount of the precursor of the first protective material is smaller than a desired amount, the first protective material is formed in the first wiring region . Can be coated satisfactorily.

  In the recording head according to the first aspect of the present invention, the plurality of control wirings have a second wiring region located closer to the control element than the first wiring region. The separation distance along the main scanning direction between the plurality of control wirings becomes longer from the heating element side to the control element side, and between the plurality of control wirings at the boundary between the first wiring region and the second wiring region. The separation distance along the main scanning direction is shorter than the separation distance along the main scanning direction between the plurality of heating elements and the separation distance between the plurality of terminals of the control element. Therefore, in the recording head according to the first embodiment of the present invention, the separation distance along the main scanning direction between the respective control wirings in the second wiring region becomes longer from the heating element side toward the control element side. As a result, the surface tension acts favorably on the precursor of the protective material that tries to extend from the first wiring region to the second wiring region, and the precursor is the end on the control element side in the second wiring region. It can reduce that it is going to extend to a part. Thereby, in the recording head according to the first embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is larger than the desired amount, the end of the second wiring region to the end on the control element side Covering with the precursor can be reduced well.

  Therefore, in the recording head according to the first embodiment of the present invention, the control wiring can be satisfactorily covered with the protective material.

A recording head according to a second aspect of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of heating elements spaced apart from each other in the sub-scanning direction. And a plurality of control wirings for electrically connecting a plurality of heating elements and a plurality of terminals provided on the control elements. A first wiring region located on the element side is provided, and a separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side to the control element side. In addition, the width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the first wiring region is shortened from the heating element side to the control element side, and the second wiring The width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the region is longer from the heating element side toward the control element side, and the plurality of control wirings in the first wiring region Of these, the angle formed with the main scanning direction of the outermost control wiring is smaller than the angle formed with the main scanning direction of the outermost control wiring among the plurality of control wirings in the second wiring region. Therefore, in the recording head according to a second embodiment of the present invention, when applied to the precursor of the first protective material having fluidity in the first wiring region, between the control line in the first wiring region due to the distance along the main scanning direction are shorter towards the control element side from the heat generating element side and cause capillary action, the precursor of the first protective material the first wiring region The first wiring region can be satisfactorily covered with the first protective material. Thereby, in the recording head according to the second embodiment of the present invention, for example, even when the coating amount of the precursor of the first protective material is smaller than a desired amount, the first protective material is provided in the first wiring region . Can be coated satisfactorily.

  In the recording head according to the second embodiment of the present invention, the plurality of control wirings have a second wiring region located closer to the control element than the first wiring region. The separation distance along the main scanning direction between the plurality of control wirings becomes longer from the heating element side toward the control element side. For this reason, in the recording head according to the second embodiment of the present invention, the separation distance along the main scanning direction between the control wirings in the second wiring region becomes longer from the heating element side to the control element side. As a result, the surface tension acts favorably on the precursor of the protective material that tries to extend from the first wiring region to the second wiring region, and the precursor is the end on the control element side in the second wiring region. It can reduce that it is going to extend to a part. Thereby, in the recording head according to the first embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is larger than the desired amount, the end of the second wiring region to the end on the control element side Covering with the precursor can be reduced well.

  Further, in the recording head according to the second embodiment of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the third wiring region is the separation distance along the main scanning direction between the plurality of heating elements and The distance from the first wiring region to the second wiring region is shorter than the distance between the plurality of terminals of the control element and is substantially the same from the first wiring region side to the second wiring region side. The surface tension acts favorably on the precursor of the protective material to be extended to the wiring region, and the extension of the precursor to the second wiring region can be reduced.

  Therefore, in the recording head according to the second embodiment of the present invention, the control wiring can be satisfactorily covered with the protective material.

  In the recording head of the present invention, the width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the first wiring region is shortened from the heating element side to the control element side. In this case, even when the amount of the precursor of the protective material is small, by reducing the area covered by the precursor, the precursor is guided to the second wiring region side, and the first wiring region is satisfactorily covered. be able to. In this recording head, when the width along the main scanning direction of each of the plurality of control wirings in the first wiring region is shortened from the heating element side to the control element side, the plurality of control wirings positioned between the control wirings are arranged. The separation distance between the precursors of the protective material can be reduced. Therefore, in this recording head, the upper surface of the control wiring can be satisfactorily covered with the protective material even when the plurality of control wirings extend long.

  In the recording head of the present invention, the width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region becomes longer from the heating element side toward the control element side. In this case, even when the amount of the precursor of the protective material is large, by increasing the area covered by the precursor, the surface tension is favorably applied to the precursor, and the precursor is applied to the second wiring region. Can be reduced.

  In the recording head of the present invention, even when the length along the main scanning direction of the control element is longer than the width along the main scanning direction of the arrangement region of the plurality of heating elements controlled by the control element, the first Good surface tension with respect to the precursor of the protective material because the separation distance along the main scanning direction between the control wires in the wiring region is longer from the control element side toward the heating element side. By acting, it is possible to further reduce the covering of the precursor on the heating element.

  In the recording head of the present invention, the control element is covered with a second protective material formed by solidifying a fluid precursor, and the peripheral end portion of the second protective material is on the protective material. When located, when the precursor of the second protective material having fluidity is applied to the second wiring region, the separation distance along the main scanning direction between the control wirings in the second wiring region Is shortened from the control element side toward the heating element side, thereby causing a capillary phenomenon, and the precursor of the second protective material can be satisfactorily extended to the first wiring region. The second protective material can be satisfactorily covered with the two wiring regions.

  The recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium. Therefore, the recording apparatus of the present invention can enjoy the effects of the recording head described above. Therefore, in the recording apparatus of the present invention, the control wiring of the recording head is satisfactorily covered with the protective material, so that the influence of the outside atmosphere can be reduced and the recording head can be driven stably for a long time.

  The recording apparatus of the present invention includes the above-described recording head covered with a protective material formed by solidifying a fluid precursor with a control element, and a transport mechanism for transporting a recording medium. However, the recording medium is transported by sliding on the second protective material. Therefore, in the recording apparatus of the present invention, the region covered with the second protective film can be adjusted well, and can function well as a guide for the recording medium.

<First Embodiment of Recording Head>
FIG. 1 is a plan view showing a schematic configuration of a thermal head X1, which is an example of a first embodiment of a recording head of the present invention.

  FIG. 2 is a plan view in which the main part of the thermal head X1 shown in FIG.

  FIG. 3 is an enlarged plan view of a main part of the thermal head X1 shown in FIG.

  4 is a cross-sectional view taken along line IV-IV in FIG.

  The thermal head X1 includes a substrate 10, a heat storage layer 20, an electric resistance layer 30, a conductive layer 40, a protective layer 50, and a control IC 60 as a control element.

  The substrate 10 has a function of supporting the heat storage layer 20, the electric resistance layer 30, the conductive layer 40, the protective layer 50, and the control IC 60. The substrate 10 is configured in a rectangular shape extending in the main scanning direction (arrow directions D1 and D2) in plan view. Examples of the material for forming the substrate 10 include a ceramic substrate, a glass substrate, a silicon substrate, and a sapphire substrate. Among these materials, a glass substrate, a silicon substrate, and a sapphire substrate are preferable from the viewpoint of increasing the density of printing. Furthermore, a sapphire substrate is preferable from the viewpoint of increasing printing speed, and a glass substrate is more preferable from the viewpoint of reducing power consumption of printing.

  The heat storage layer 20 has a function of temporarily storing a part of heat generated in a heating element H described later of the electric resistance layer 30. That is, the heat storage layer 20 plays a role of improving the thermal response characteristics of the thermal head X1 by shortening the time required to raise the temperature of the heating element H. The heat storage layer 20 is located over the entire surface of the substrate 10. Further, the heat storage layer 20 has a protruding portion whose cross-sectional shape in the sub-scanning direction (arrow directions D3 and D4) orthogonal to the main scanning direction (arrow directions D1 and D2) is substantially semi-elliptical. Yes.

  The electrical resistance layer 30 has a portion that functions as the heating element H. The electrical resistance layer 30 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 40. A part of the electric resistance layer 30 is located on the heat storage layer 20. In the present embodiment, a portion of the electrical resistance layer 30 to which a voltage is applied from the conductive layer 40 where the conductor layer 40 is not formed functions as the heating element H. Examples of the material mainly forming the electric resistance layer 30 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material.

The heating element H generates heat when a voltage is applied. The heat generating element H is configured such that a heat generation temperature due to voltage application from the conductive layer 40 is in a range of, for example, 200 [° C.] or more and 550 [° C.] or less. The heating element H is located above the heat storage layer 20, are arranged at substantially the same distance d _H in the main scanning direction (direction of the arrow D1, D2). Further, each of the heating elements H is configured in a rectangular shape in plan view. In addition, the heating element H is configured so that the dimensions of the planar view width W _H (length in the arrow directions D1 and D2) along the arrow directions D1 and D2 are substantially the same. Further, the heating element H is configured such that the dimensions of the planar view length L _H (the length in the arrow directions D3 and D4) along the arrow directions D3 and D4 are substantially the same. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to an average value of dimensions of each part is within 10%. Here, the “plan view” means a view in the direction of arrow D6. Here, the distance between the center of one heating element H and the center of another heating element H adjacent to the heating element H is, for example, not less than 5.2 [μm] and not more than 84.7 [μm]. A range is mentioned.

  The conductive layer 40 has a function of applying a voltage to the heating element H. The conductive layer 40 is located on the electric resistance layer 30. The conductive layer 40 includes a first conductive layer 41 and a second conductive layer 42. As a material for mainly forming the conductive layer 40, for example, any one metal of aluminum, gold, silver, and copper, or an alloy thereof can be given.

  The first conductive layer 41 includes a first wiring part 411, a second wiring part 412, a third wiring part 413, and a fourth wiring part 414. The first conductive layer 41 functions as a control wiring together with the resistor layer 30 positioned in the direction of the arrow D6.

One end of the first wiring part 411 is connected to one end of the heating element H on the arrow D4 direction side. First wiring portion 411, the size of the plan view width W ₁ along its direction of arrow D1, D2 are substantially identical to each other. Further, the first wiring portion 411, the direction of the arrow D1, the mutual distance d ₁ along the D2 is configured substantially the same as the separation distance d _H of the heating element H.

One end of the second wiring portion 412 is connected to the other end of the first wiring portion 411. The second wiring portion 412 is configured to be shorter as the direction of the arrow D1, the dimension of the plan view width W ₂ along the D2 is directed to the control IC60 side from the heating element H side (the arrow D4) , shorter than the dimension of the plan view width _{W 1} of the first wiring portion 411. The second wiring portion 412, the direction of the arrow D1, the mutual distance d ₂ along the D2 is configured to be shorter toward the arrow D4. Further, among the second wiring portion 412 of the plurality of second forming region _{f 2} of the second wiring portion 412 is electrically connected to one of the control IC60, the length _{W f2} along the direction of the arrow D1, D2 The length W _f1 of the first formation region f ₁ of the first wiring portion 411 connected to the second wiring portion 412 along the arrow directions D 1 and D 2 is configured to become shorter in the direction of the arrow D 4. Shorter than

One end of the third wiring portion 413 is connected to the other end of the second wiring portion 412. The third wiring 413, the size of the plan view width W ₃ that along the direction of the arrow D1, D2 is configured to be longer toward the arrow D4. Further, the third wiring 413, the direction of the arrow D1, D2 mutual distance d ₃ along the is configured to be longer toward the arrow D4. Further, the plurality of third wiring portion 413 of the formation region _{f 3} of the third wiring 413 is electrically connected to one of the control IC60, the direction of the arrow D1, D2 length _{W f3} along arrow D4 It is configured to become longer as it goes in the direction, and a part of the length W _f3 is configured to be shorter than the length W _f1 of the first formation region f ₁ .

The fourth wiring portion 414 has one end connected to the other end of the third wiring portion 413 and is electrically connected to the heating element H. The other end of the fourth wiring portion 414 is connected to the control IC 60. The fourth wiring portion 414 of the present embodiment, the dimension of the plan view width W ₄ along the direction of the arrow D1, D2 is shorter than the dimension of the plan view width W ₁ of the first wiring portion 411. The fourth wiring portion 414, the direction of the arrow D1, D2 mutual distance _{d 4} along is substantially equal to the distance below connecting terminal 60a of the control IC 60. The fourth of the wiring portion 414 of the plurality of fourth forming region _{f 4} of the fourth wiring portion 414 is electrically connected to one of the control IC60, the length _{W f4} along the direction of the arrow D1, D2 the third is configured to be longer than the length _{W f3} of the third forming region _{f 3} of the wiring portion 413, a portion of the length _{W f4} is compared with the second forming region _{f 2} of length _{W f2} It is configured to be long.

  The end of the second conductive layer 42 is connected to the other ends of the plurality of heating elements H and a power source (not shown). The second conductive layer 42 is located on the arrow D3 direction side of the heating element H.

  The protective layer 50 includes a first protective layer 51, a second protective layer 52, and a third protective layer 53. In FIG. 2, the protective layer 50 is omitted.

The first protective layer 51 has a function of protecting the heat generating element H and a part of the conductive layer 40. The first protective layer 51 is configured to cover the heating element H and a part of the conductive layer 40. As a material mainly forming the first protective layer 51, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, SiO ₂ -based material, Ta ₂ O ₅ -based material, TaSiO-based material, TiC-based material, TiN-based material, TiO ₂ -based material, TiB ₂ -based material, AlC-based material, and AlN-based material Al ₂ O ₃ -based material, ZnO-based material, B ₄ C-based material, and BN-based material. Here, the “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. In addition, “a material mainly composed of a system material” herein refers to a material whose main material is 50 wt% or more with respect to the whole, and may contain, for example, an additive.

The second protective layer 52 has a function of protecting a part of the second wiring part 412. The second protective layer 52 is configured to cover a part of the first wiring part 411 and the second wiring part 412. Examples of the material for forming the second protective layer 52 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins. In the present embodiment, the second protective layer 52 is formed by applying a fluidic precursor of the second protective layer 52 on the first wiring part 411 after the first protective layer 51 is formed, and curing the precursor. Formed by. The second protective layer 52 does not cover the region including the end of the third wiring portion 413 on the arrow D4 direction side, and a part of the third wiring portion 413 is exposed. When the second protective layer 52 is formed, if the distance d _H between the centers of the heat generating elements is 21.2 [μm] or less, the second protective layer 52 extends over the gaps between the plurality of first conductive layers 41. force by capillary phenomenon exerted to the precursor of the second protective layer 52, due to increased contrary to the separation distance d _H, it can extend the precursor good. On the other hand, the adjustment range of the coating amount of the precursor of the second protective layer 52 is reduced by increasing the acting force due to the capillary phenomenon. The present invention produces a more remarkable effect when the action force due to the capillary action is increased.

  The third protective layer 53 has a function of protecting the control wiring 60 and the third wiring portion 413 and the fourth wiring portion 414 of the first conductive layer 41. The third protective layer 53 is configured to cover the third wiring portion 413, the fourth wiring portion 414, and the control IC 60. Examples of the material for forming the third protective layer 53 include a thermosetting resin such as an epoxy resin or a silicone resin, or an ultraviolet curable resin. The third protective layer 53 in this embodiment is formed by applying a precursor of the third protective layer 53 having fluidity on the control IC 60 after the formation of the second protective layer 52 and curing the precursor. The

  The control IC 60 has a function of controlling the heat generation of the plurality of heating elements H. The control IC 60 is separated from the heating element H in the sub-scanning direction (arrow directions D3 and D4). The control IC 60 has a connection terminal 60a, and the other end of the fourth wiring part 414 of the plurality of first conductive layers 41 and one end of the third conductive layer 61 via the connection terminal 60a. It is connected to the. With such a configuration, the heating element H can be selectively heated. Further, the third conductive layer 61 and the external connection member 62 are electrically connected to the control IC 60. 2 and 3, the control IC is omitted.

  The third conductive layer 61 is connected to the control IC 60 at one end thereof. The third conductive layer 61 is disposed away from the first conductive layer 41. As a material mainly forming the third conductive layer 61, for example, any one metal of aluminum, gold, silver, and copper, or an alloy thereof can be given.

  The external connection member 62 has a function of supplying an electrical signal for driving the heating element H. Examples of the external connection member 62 include a combination of a flexible cable and a connector. The external connection member 62 is electrically connected to the control IC 60 through the third conductive layer 61.

The thermal head X1 includes a substrate 10, a plurality of heating elements H arranged on the substrate 10 along the main scanning direction (arrow directions D1, D2), and a plurality of heat generations in the sub-scanning direction (arrow directions D3, D4). A control IC 60 disposed on the substrate 10 apart from the element H, and a plurality of first conductive layers 41 that electrically connect the plurality of heating elements H and the plurality of terminals 60a provided in the control IC 60 are provided. and has a plurality of first conductive layer 41 has a second formation region f ₂ positioned in a plurality of heat generating elements H side, the arrow direction between the plurality of second wiring portion 412 in the second forming region f ₂ D1, the distance _{d 2} along the D2 is shorter towards the control IC60 side (arrow D4) from the heater element H side. Therefore, in the thermal head X1, when applied to the precursor of the second protective layer 52 having fluidity second forming region f _2, each of the second forming region f ₂ second wiring portion 41
Distance d ₂ along the direction of the arrow D1, D2 between the two is due to is shorter in the arrow direction D4, by causing capillary action, the precursor of the second protective layer 52 second The formation region f ₂ can be spread, and the second formation region f ₂ can be satisfactorily covered with the second protective layer 52. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 52 becomes less than the desired amount, to satisfactorily cover the second protective layer 5 in the second forming region f ₂ it can.

Further, in the thermal head X1, a plurality of first conductive layer 41 has a third forming region _{f 3} located in the second forming region _{f 2} from the control IC60 side (arrow D4), the third forming region distance _{d 4} along a plurality of third main scanning direction between the wiring portion 413 (the direction of the arrow D1, D2) in f ₃ is the control IC60 side from the heating element H side is longer toward (arrow D4) , the distance along the direction of the arrow D1, D2 between the plurality of first conductive layer 41 at the boundary between the second forming region f ₂ and the third forming region f ₃ is the arrow direction D1 between the plurality of heat generating elements H, D2 shorter than the distance between a plurality of terminals 60a of the separation distance _{d H} and control IC60 along. Therefore, in the thermal head X1, the distance d ₃ along the direction of the arrow D1, D2 between the third wiring portion 413 in the third forming region f ₃ is due to is longer in the arrow direction D4 The surface tension acts favorably on the precursor of the second protective layer 52 that tends to extend from the second formation region f ₂ to the third formation region f ₃ , and the precursor is on the control element side in the third formation region f ₃ . It can reduce that it is going to extend to the edge part of this. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 52 becomes greater than the desired amount, covered by a third said to the end of the control IC60 side in the formation region f ₃ precursor Can be reduced satisfactorily.

  Therefore, in the thermal head X1, the second wiring part 412 of the first conductive layer 41 can be satisfactorily covered with the second protective layer 52.

In the thermal head X1, the plan view width _{W f2} along the direction of the arrow D1, D2 between the second wiring portion 412 is located in the outermost among the plurality of the second wiring portion 412 in the second forming region _{f 2} is, arrow D4 Accordingly, even when the amount of the precursor of the second protective layer 52 is small, the precursor of the second protective layer 52 is reduced by reducing the area covered by the precursor of the second protective layer 52. guidance to the third forming region f ₃ side, a second forming region f ₂ can be well coated.

In the thermal head X1, the plan view width W ₂ along each direction of the arrow D1, D2 of a plurality of the second wiring portion 412 in the second forming region f ₂ is, since the shorter toward the arrow D4, the second The separation distance between the precursors of the plurality of second protective layers 52 positioned between the two wiring parts 412 can be reduced. Therefore, in the thermal head X1, even when the plurality of second wiring parts 412 extend long, the upper surface of the second wiring part 412 can be satisfactorily covered with the second protective layer 52.

In the thermal head X1, the plan view width _{W f3} along the direction of the arrow D1, D2 between the third wiring portion 413 which is positioned on the outermost side among the plurality of third wiring portion 413 in the third placement region _{f 3} is, arrow D4 Therefore, even when the amount of the precursor of the second protective layer 52 is large, by increasing the area covered by the precursor of the second protective layer 52, the precursor of the second protective layer 52 is increased. satisfactorily allowed to act surface tension against, can be a precursor of the second protective layer 52 in the third placement region f ₃ is reduced from being coated.

In the thermal head X1, the control IC 60 is covered with a third protective layer 53 formed by solidifying a fluid precursor, and the peripheral end portion of the third protective layer 53 is on the second protective layer 52. since located, when the precursor of the third protective layer 53 having fluidity is applied to the fourth forming region f _4, along the direction of the arrow D1, D2 between the plurality of fourth wirings 414 distance d ₄ is due to becomes shorter toward the direction of the arrow D3, cause capillary action, the third protective layer 53 in the third forming region f ₃ can be satisfactorily coated.
<Second Embodiment of Recording Head>
FIG. 5 is a plan view showing a schematic configuration of a thermal head X2, which is an example of the second embodiment of the recording head of the present invention.

  FIG. 6 is an enlarged plan view of a main part in which the protective layer 50 of the thermal head X2 shown in FIG. 1 is omitted.

  The thermal head X2 is different from the thermal head X1 in that the first conductive layer 41A is used instead of the first conductive layer 41. Other configurations of the thermal head X2 are the same as those described above with respect to the thermal head X1.

  The first conductive layer 41A is different from the first conductive layer 41 in that it has a fifth wiring portion 415. Other configurations of the first conductive layer 41A are the same as those described above with respect to the first conductive layer 41.

The fifth wiring portion 415 has one end connected to the other end of the second wiring portion 412 and the other end connected to the other end of the third wiring portion 413. The fifth wiring unit 415, the size of the plan view width _{W 5} along its direction of arrow D1, D2 are substantially identical over the direction of the arrow D3, D4. The fifth wiring unit 415, the mutual distance d ₅ along that direction of the arrow D1, D2 is configured to be substantially identical over the direction of the arrow D3, D4. Further, the fifth out wiring portion 415 of the plurality, is formed region f ₅ of the fifth wiring 415 which is electrically connected to one of the control IC 60, configured to be substantially the same throughout the direction of the arrow D3, D4 Has been.

The thermal head X2, the first conductive layer 41A has a fifth forming region f ₅ located between the second forming region f ₂ and the third forming region f _3, a plurality of fifth forming region f ₅ The distance d _f5 between the fifth wiring portions 415 along the arrow directions D1 and D2 is shorter than the distance d _H between the plurality of heating elements H and the distance between the plurality of terminals 60a of the control IC, and it is substantially identical distance _{W 5} along the main direction of the arrow D1, D2 across the second forming region _{f 2} in the third formation region _{f 3} of the. Therefore, in the thermal head X2, satisfactorily allowed to act surface tension to the precursor of the second protective layer 52 to be Nobiyo from the second forming region f ₂ in the third formation region f _3, the precursors third forming region it is possible to reduce the extend to f _3. Thereby, in the thermal head X2, the adjustment range of the coating amount of the precursor of the second protective layer 52 can be increased.

Therefore, in the thermal head X2, the first conductive layer 41A can be better covered with the second protective layer 52.
<Recording device>
FIG. 7 is a diagram showing a schematic configuration of a thermal printer Y which is an example of an embodiment of a recording medium of the present invention.

  The thermal printer Y includes a thermal head X, a transport mechanism 70, and a control mechanism 80.

  The transport mechanism 70 has a function of bringing the recording medium P into contact with the heating element H of the thermal head X while transporting the recording medium P in the direction of the arrow D3. The transport mechanism 70 includes a platen roller 71 and transport rollers 72, 73, 74, and 75. The transport mechanism 70 is configured to transport the recording medium P by sliding on the third protective layer 53.

  The platen roller 71 has a function of pressing the recording medium P against the heating element H. The platen roller 71 is rotatably supported in contact with the protective layer 50 located on the heating element H. The platen roller 71 has a configuration in which the outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 [mm] to 15 [mm].

  The transport rollers 72, 73, 74, and 75 have a function of transporting the recording medium P. That is, the transport rollers 72, 73, 74, and 75 supply the recording medium P between the heating element H of the thermal head X and the platen roller 71, and between the heating element H of the thermal head X and the platen roller 71. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 72, 73, 74, 75 may be formed of, for example, a metal columnar member. For example, like the platen roller 71, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control mechanism 80 has a function of supplying image information to the control IC 60. That is, the control mechanism 80 plays a role of supplying image information for selectively driving the heating element H to the control IC 60 via the external connection member 62.

  The thermal printer Y includes a thermal head X. Therefore, the thermal printer Y can enjoy the effects of the thermal head X. Therefore, when the first conductive layer 41 of the thermal head X is satisfactorily covered with the second protective layer 52, the thermal printer Y can reduce the influence of the outside atmosphere and can be driven stably over a long period of time. it can.

  The thermal printer Y includes a thermal head X covered with a third protective layer 53 formed by the control IC 60 solidifying a fluid precursor, and a transport mechanism 70 for transporting the recording medium P. The transport mechanism 70 is configured to slide and transport the recording medium P on the third protective layer 53. Therefore, in the thermal printer Y, the area covered with the third protective layer 53 can be adjusted well and can function well as a guide for the recording medium P.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In the present embodiment, the thermal head X is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in, for example, an inkjet head or an LED head, the same effect can be achieved.

The first conductive layer 41 of the present embodiment is not limited to the configuration illustrated in FIG. 2, and may have a configuration illustrated in FIG. 6, for example. One length _{W fH} along the direction of the arrow D1, D2 forming region _{f H} of the plurality of heat generating elements H are connected to the drive IC60 as shown in FIG. 8, the arrow direction of the ground area _{f 60} of the drive IC60 D1, D2 in the thermal head X3 as smaller than the length W ₆₀ along the capillary phenomenon becomes easy to occur in the precursor of the second protective layer 52, the second protective layer 52 precursor coating amount of the The adjustment range becomes narrower. Even in such a case, the thermal head X3 can satisfactorily coat the first conductive layer 41 with the precursor of the second protective layer 52.

  The first conductive layer 41 of the present embodiment includes the first wiring portion 411 and the fourth wiring portion 414. However, the first conductive layer 41 is not limited to such a configuration. For example, the first conductive layer 41 includes the second conductive layer 41. A configuration including only the wiring portion 412 and the third wiring portion 413 may be adopted.

  The second conductive layer 42 of the present embodiment is connected to three or more heating elements H, but is not limited to this structure. For example, as shown in FIG. It may be configured to be connected to two heating elements.

  The first protective layer 51 of the present embodiment is configured separately from the second protective layer 52, but is not limited to such a configuration, and the first protective layer 51 and the second protective layer 52 are integrated. It may be configured.

1 is a plan view showing a schematic configuration of a thermal head which is an example of a first embodiment of a recording head of the present invention. It is the top view to which the principal part which abbreviate | omitted the protective layer of the thermal head shown in FIG. 1 was expanded. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. FIG. 4 is a sectional view taken along line IV-IV shown in FIG. 3. It is a top view which shows schematic structure of the thermal head which is an example of 2nd Embodiment of the recording head of this invention. It is the top view to which the principal part which abbreviate | omitted the protective layer of the thermal head shown in FIG. 5 was expanded. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. FIG. 3 is a diagram showing a schematic configuration of a modified example of the thermal head shown in FIG. 2. It is a figure which shows schematic structure of the other modification of the thermal head shown in FIG.

Explanation of symbols

X1, X2 Thermal head Y Thermal printer 10 Substrate 20 Thermal storage layer 30 Electrical resistance layer 40 Conductive layers 41, 41A First conductive layer (control wiring)
411 1st wiring part 412 2nd wiring part 413 3rd wiring part 414 4th wiring part 415 5th wiring part 42 2nd conductive layer 50 Protective layer 51 1st protective layer 52 2nd protective layer (protective material)
53 3rd protective layer (2nd protective material)
60 Control IC (Control element)
61 Third conductive layer 62 External connection member 70 Conveying mechanism 71 Platen rollers 72, 73, 74, 75 Conveying roller 80 Drive mechanism H Heating element f ₁ First forming region f ₂ Second forming region (first wiring region)
f ₃ Third formation region (second wiring region)
f ₄ The fourth forming region _{f 5} 5 forming region (third wiring region)
P Recording medium

Claims (7)

A substrate,
A plurality of heating elements arranged along the main scanning direction on the substrate;
A control element disposed on the substrate apart from the plurality of heating elements in the sub-scanning direction;
A plurality of control wirings for electrically connecting the plurality of heating elements and a plurality of terminals provided in the control element;
The plurality of control wirings include a first wiring region located on the plurality of heating element sides, and a second wiring region located on the control element side from the first wiring region,
The separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings at the boundary between the first wiring region and the second wiring region is a separation distance along the main scanning direction between the plurality of heating elements. Shorter than the separation distance between the plurality of terminals of the control element,
The width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
The width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The angle formed by the main scanning direction of the control wiring located on the outermost side among the plurality of control wirings in the first wiring area is located on the outermost side among the plurality of control wirings in the second wiring area. Smaller than the angle formed by the main scanning direction of the control wiring to be
At least gaps between the plurality of control wirings and the plurality of control wirings in the first wiring region are covered with a first protective material formed by solidifying a fluid precursor .
The recording head is characterized in that the control element is covered with a second protective material formed by solidifying a fluid precursor . A substrate,
A plurality of heating elements arranged along the main scanning direction on the substrate;
A control element disposed on the substrate apart from the plurality of heating elements in the sub-scanning direction;
A plurality of control wirings for electrically connecting the plurality of heating elements and a plurality of terminals provided in the control element;
The plurality of control wirings include a first wiring region located on the plurality of heating element sides, a second wiring region located on the control element side from the first wiring region, and the first wiring region. And a third wiring region located between the second wiring regions,
The separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings in the third wiring region is the separation distance along the main scanning direction between the plurality of heating elements and between the plurality of terminals of the control element. Shorter than the separation distance and substantially the same from the first wiring region side to the second wiring region side,
The width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
The width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The angle formed by the main scanning direction of the control wiring located on the outermost side among the plurality of control wirings in the first wiring area is located on the outermost side among the plurality of control wirings in the second wiring area. Smaller than the angle formed by the main scanning direction of the control wiring to be
At least gaps between the plurality of control wirings and the plurality of control wirings in the first wiring region are covered with a first protective material formed by solidifying a fluid precursor .
The recording head is characterized in that the control element is covered with a second protective material formed by solidifying a fluid precursor . Width along the main scanning direction of each of said plurality of control wiring in the first wiring region, according to claim 1 or 2, characterized in that it is shorter from the heat generating element side toward the control element side The recording head described in 1. The main length along the scanning direction of the control element, according to claim 1, characterized in that the control element is longer than in the main scanning direction along the width of the arrangement region of the plurality of heating elements for controlling 4. A recording head according to any one of items 1 to 3 . The peripheral end portion of the second protective material, the first recording head according to any one of claims 1 to 4, characterized in that positioned on the protective material. A recording head according to any one of claims 1 to 5, the recording apparatus characterized by comprising a transport mechanism for transporting the recording medium. The recording head according to claim 5 and a transport mechanism for transporting the recording medium,
The recording apparatus is characterized in that the transport mechanism is configured to transport the recording medium while sliding the recording medium on the second protective material.

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