JP2013010256A - Substrate for thermal head, thermal head, and thermal printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for a thermal head that can make an arbitrary thermal head easily.SOLUTION: The substrate for a thermal head includes: two or more heat generating sections 9; a control terminal group 11c that comprises forming two or more control terminals 11b for mounting a control section 11a for controlling the heat generation of these heat generating sections 9; two or more first electrode patterns 19 that connect these heat generating sections 9 and these control terminals 11b; two or more second electrode patterns 21 that connect these control terminals 11b and the outside substrate; and a terminal group for electric parts 28c comprising forming two or more terminals for electric parts 28b for mounting electric parts, wherein two or more partitions composed by these heat generating sections, one control terminal group 11c, these two or more first electrode patterns 19, these two or more electrode patterns 21, and these two or more terminal groups for electric parts 28c are disposed same and repeatedly in the direction of these heat generating sections 9.

Description

  The present invention relates to a thermal head substrate, a thermal head, and a thermal printer.

  Conventionally, various thermal heads have been proposed as printing devices such as facsimiles, video printers and card printers. These thermal heads are manufactured by dividing a thermal head substrate divided into a plurality of sections. A thermal head substrate in which a heating portion, a control section, and an electrode pattern are formed in each section is known. (For example, refer to Patent Document 1).

JP-A-6-171130

  However, such a thermal head substrate has a problem that it is difficult to produce an arbitrary thermal head by freely selecting and dividing a section.

  The thermal head substrate of the present invention connects a plurality of heat generating parts, a control terminal group formed with a plurality of control terminals for mounting a control part for controlling the heat generation of the heat generating part, and the heat generating part and the control terminal. A plurality of first electrode patterns, a plurality of second electrode patterns for connecting the control terminal and the external substrate, and an electronic component terminal group formed by forming a plurality of electronic component terminals for mounting electronic components. Prepare. In addition, the section constituted by the heat generating part, one control terminal group, a plurality of first electrode patterns, a plurality of second electrode patterns, and one electronic component terminal group is equal and repeated in the arrangement direction of the heat generating parts. Has been placed.

  Moreover, the thermal head of the present invention includes a substrate obtained by dividing the thermal head substrate described above at the position of the electronic component terminal group.

  The thermal printer of the present invention includes the thermal head described above, a transport mechanism that transports the recording medium onto the heat generating portion, and a platen roller that presses the recording medium onto the heat generating portion.

  According to the present invention, an arbitrary thermal head can be easily manufactured by freely selecting and dividing a section.

1 shows an embodiment of a thermal head substrate of the present invention, in which (a) is a plan view and (b) is an enlarged plan view showing a region surrounded by an alternate long and short dash line shown in (a). It is a top view of the thermal head produced by dividing the thermal head substrate shown in FIG. 3A is a left side view of the thermal head of FIG. 2, and FIG. 3B is a right side view of the thermal head of FIG. It is the II sectional view taken on the line of the thermal head of FIG. It is the II-II sectional view taken on the line of the thermal head of FIG. 1 is a schematic configuration diagram showing an embodiment of a thermal printer of the present invention. 4 shows another embodiment of the thermal head substrate of the present invention, in which (a) is a plan view and (b) is an enlarged plan view showing a region surrounded by a one-dot chain line shown in (a). FIG. It is a top view which shows the thermal head produced by dividing | segmenting the board | substrate for thermal heads shown in FIG. It is a top view which shows another one Embodiment of the board | substrate for thermal heads of this invention. FIG. 10 is a plan view of a thermal head produced by dividing the thermal head substrate shown in FIG. 9 along line E. (a), (b) is a top view which shows other embodiment of the thermal head produced by dividing | segmenting the board | substrate for thermal heads of this invention.

<First Embodiment>
FIG. 1A is a plan view showing a first embodiment of the thermal head substrate X1 of the present invention, and FIG. 1B is an enlarged plan view showing a region surrounded by an alternate long and short dash line in FIG. is there.

  As shown in FIGS. 1A and 1B, the thermal head substrate X1 has a plurality of heat generating portions 9 and a control terminal 11b for mounting a drive IC 11a which is a control portion for controlling the heat generation of the heat generating portions 9. A plurality of control terminal groups 11c, a plurality of individual electrodes 19 as first electrode patterns for connecting the heat generating portion 9 and the control terminal 11b, and a control terminal 11b and an external substrate (not shown). An electronic component terminal group formed by forming a plurality of IC-FPC connection electrodes 21 that are a plurality of second electrode patterns and a plurality of temperature measuring terminals 28b that are terminals for electronic components for mounting electronic components such as the temperature measuring member 28a. And a temperature measuring terminal group 28c. The drive IC 11a and the temperature measuring member 28a are not mounted on the thermal head substrate X1, but the mounting positions are indicated by a one-dot chain line.

  1B, the thermal head substrate X1 includes the heat generating portion 9, one control terminal group 11c, a plurality of individual electrodes 19, an IC electrode 22, a ground electrode 24, and an IC control electrode 26. And a plurality of IC-FPC connection electrodes 21 constituted by a plurality of IC-FPC connection electrodes 21 and one temperature measuring terminal group 28c. A plurality of compartments 14 are arranged equally and repeatedly in the arrangement direction of the heat generating portions 9, in the left-right direction in FIG. 1.

  A common electrode 17 having one end connected to the heat generating portion 9 and the other end connected to the external substrate is provided on the side opposite to the heat generating portion 9. The common electrode 17 has a main wiring portion 17a extending from one end to the other end in the arrangement direction of the heat generating portions 9, and a protruding portion 17b protruding from the main wiring portion 17a to the ground electrode 24 side.

  And the protrusion part 17b arrange | positioned at the both ends of the division 14 and the ground electrode 24 are the 1st reinforcement member 8 although the detail is mentioned later.

  By dividing such a thermal head substrate X1, the thermal head Y1 can be manufactured. Specifically, it can be divided by marking an arbitrary part to be cut and laser cutting. Alternatively, a groove called a scribe may be provided in a marked portion by laser processing, and then pressed to be divided.

  The thermal head Y1 is mounted on the divided thermal head substrate X1 by mounting electronic components such as the driving IC 11a, the temperature measuring member 28a, the capacitor (not shown), the resistor (not shown), or the coil (not shown). Can be produced.

  As described above, since the thermal head Y1 can be manufactured by dividing the thermal head substrate X1 on which the equal and repeated sections 14 are formed, the thermal head Y1 having an arbitrary length can be easily manufactured. . Further, since the section 14 has the temperature measuring terminal group 28c, after dividing the thermal head substrate X1, an arbitrary temperature measuring member 28a and the like can be mounted on the temperature measuring terminal group 28c in accordance with the purpose. Therefore, the structure of the thermal head Y1 can be easily changed, and the design change of the thermal head Y1 can be facilitated.

  Hereinafter, each member constituting the thermal head substrate X1 of the present invention will be described using a thermal head Y1 produced by dividing the thermal head substrate X1 along the alternate long and short dash line A shown in FIG.

  As shown in FIGS. 2 to 5, the thermal head Y <b> 1 includes a radiator 1, a head substrate 3 disposed on the radiator 1, and a flexible printed wiring board 5 (hereinafter referred to as an FPC 5) connected to the head substrate 3. And). In FIG. 2, illustration of the FPC 5 is omitted, and a region where the FPC 5 is arranged is indicated by a one-dot chain line. In FIG.3 (b), the protrusion part 1b of the heat radiator 1 is abbreviate | omitted and shown.

  As shown in FIGS. 2 to 5, the radiator 1 is arranged on a plate-like base 1 a that is rectangular in plan view, and the upper surface of the base 1 a, and one long side ( 1 is provided with a protrusion 1b extending along the right long side in FIG. In addition, you may comprise the heat radiator 1 only by the plate-shaped base part 1a. The radiator 1 is made of, for example, a metal material such as copper or aluminum, and radiates a part of the heat generated in the heat generating portion 9 of the head base 3 that does not contribute to printing as will be described later. It is like that.

  As shown in FIGS. 1 and 2, the head base 3 is provided on a rectangular substrate 7 in plan view and one end surface 7a (hereinafter referred to as a first end surface 7a) extending along the longitudinal direction of the substrate 7. A plurality of heat generating portions 9 arranged along the longitudinal direction of the substrate 7, and a plurality of drive ICs 11 a arranged side by side on the first main surface 7 c of the substrate 7 along the arrangement direction of the heat generating portions 9. ing.

  The substrate 7 includes a first end surface 7a on which the heat generating portion 9 is provided, a second end surface 7b (hereinafter referred to as a second end surface 7b) located on the opposite side of the first end surface 7a, and a drive IC 11a. It is constituted by a main surface 7c and a second main surface 7d located on the opposite side of the first main surface 7c.

  The head base 3 is disposed on the upper surface of the base portion 1 a of the radiator 1, and the second end surface 7 b is disposed to face the protrusion 1 b of the radiator 1. Further, the lower surface of the head substrate 3, more specifically, the lower surface of the third protective layer 29 described later and the upper surface of the base portion 1a are bonded by the double-sided tape 12, thereby supporting the head base 3 on the base portion 1a. Has been.

  The substrate 7 is made of an electrically insulating material such as alumina ceramic, a semiconductor material such as single crystal silicon, or the like.

  As shown in FIGS. 4 and 5, the heat storage layer 13 is formed on the first end surface 7 a of the substrate 7. The first end surface 7a of the substrate 7 has a convex curved surface shape in sectional view, and the heat storage layer 13 is formed on the first end surface 7a. Therefore, the surface of the heat storage layer 13 is also curved. The heat storage layer 13 functions so as to favorably press the recording medium to be printed against a first protective layer 25 described later formed on the heat generating portion 9.

The heat storage layer 13 is formed of, for example, glass having low thermal conductivity, and the time required to raise the temperature of the heat generating part 9 by temporarily storing a part of the heat generated in the heat generating part 9. And the thermal response characteristic of the thermal head Y1 is enhanced. In the present embodiment, as shown in FIG. 4, the heat storage layer 13 is formed only on the first end surface 7 a of the substrate 7 and can store heat at a position close to the heat generating portion 9. Thermal response characteristics can be improved more effectively. The heat storage layer 13 is obtained by, for example, applying a predetermined glass paste obtained by mixing a glass powder with an appropriate organic solvent onto the first end surface 7a of the substrate 7 by screen printing or the like known in the art, and firing the same. It is formed by.

  As shown in FIG. 4, an electrical resistance layer 15 is provided on the first main surface 7 c of the substrate 7, the heat storage layer 13, and the second main surface 7 d and the second end surface 7 b of the substrate 7. The electrical resistance layer 15 is interposed between the substrate 7 and the heat storage layer 13, the individual electrode 19, and the common electrode 17. Further, the IC-FPC connection electrode 21 is provided on the first main surface 7c.

  The region of the electrical resistance layer 15 located on the first main surface 7c of the substrate 7 is formed in a shape equivalent to the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 in plan view as shown in FIG. Has been.

  As shown in FIG. 3A, the region of the electrical resistance layer 15 located on the heat storage layer 13 includes a region formed in the same shape as the common electrode 17 and the individual electrode 19, and the common electrode 17 and the individual electrode 17. It has a plurality of regions exposed from between the electrodes 19 (hereinafter referred to as exposed regions).

  The region of the electric resistance layer 15 located on the second main surface 7d of the substrate 7 is provided over the entire second main surface 7d of the substrate 7 as shown in FIGS. It is formed into a shape.

  In FIG. 3, the electric resistance layer 15 is hidden by the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21, and is not illustrated. In FIG. 3, the electric resistance layer 15 is hidden by the common electrode 17 and the individual electrode 19, and only the exposed region is illustrated.

  Each exposed region of the electrical resistance layer 15 generates heat when a voltage is applied to form the heat generating portion 9 described above. The plurality of exposed regions are arranged in a row on the heat storage layer 13 as shown in FIG. For convenience of explanation, the plurality of heat generating portions 9 are illustrated in a simplified manner in FIG. 3, but are arranged at a density of, for example, 180 dpi to 2400 dpi.

  The electric resistance layer 15 is made of a material having a relatively high electric resistance, such as TaN, TaSiO, TaSiNO, TiSiO, TiSiCO, or NbSiO. Therefore, when a voltage is applied between the common electrode 17 and the individual electrode 19 described later and a current is supplied to the heat generating portion 9, the heat generating portion 9 generates heat due to Joule heat.

  As shown in FIGS. 1 to 5, a common electrode 17, a plurality of individual electrodes 19, and a plurality of IC-FPC connection electrodes 21 are provided on the electrical resistance layer 15. The common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are formed of a conductive material. For example, any one of aluminum, gold, silver, and copper, or an alloy thereof Is formed by.

  Hereinafter, these electrodes will be described in detail with reference to FIGS.

  The plurality of individual electrodes 19 are for connecting each heat generating part 9 and the control terminal 11b. As shown in FIGS. 1 to 3, each individual electrode 19 has one end connected to the heat generating portion 9 and extends individually from the first end surface 7 a of the substrate 7 to the first main surface 7 c of the substrate 7 in a band shape. Yes.

  The other end of each individual electrode 19 is arranged in the arrangement area of the drive IC 11a, and the other end of each individual electrode 19 is connected to the control terminal 11b, so that between each heat generating part 9 and the control terminal 11b. Are electrically connected. More specifically, the individual electrodes 19 are electrically connected to a plurality of heat generating portions 9 divided into a plurality of groups, and the heat generating portions 9 of each group are connected to a control terminal group 11c formed with a plurality of control terminals 11b. ing. The control element group 11c is a group of control terminals 11b connected to one drive IC 11a.

  The plurality of IC-FPC connection electrodes 21 are for connecting the control terminal 11b and the FPC 5, and are formed so as to send an electrical signal to the drive IC 11a mounted on the control terminal 11b. As shown in FIG. 1 and FIG. 2, each IC-FPC connection electrode 21 extends in a strip shape on the first main surface 7c of the substrate 7, one end is disposed in a region where the drive IC 11a is disposed, and the other end is disposed on the substrate. 7 is disposed in the vicinity of a main wiring portion 17a of a common electrode 17 (described later) located on the first main surface 7c. The plurality of IC-FPC connection electrodes 21 are electrically connected between the control terminal 11b and the FPC 5 by having one end connected to the control terminal 11b and the other end connected to the FPC 5. Yes.

  More specifically, the plurality of IC-FPC connection electrodes 21 connected to each control terminal 11b are composed of a plurality of electrodes having different functions. Specifically, as will be described with reference to FIG. 1B, the plurality of IC-FPC connection electrodes 21 include, for example, an IC electrode 22 for applying a voltage for operating the drive IC 11a, and a control terminal. 11b and the ground electrode 24 for holding the individual electrode 19 connected to the control terminal 11b at a ground potential (for example, 0V to 1V) and the driving IC 11a so as to control the on / off state of the switching element in the driving IC 11a. And an IC control electrode 26 for supplying an electric signal for operating the IC. The IC electrode 22, the ground electrode 24, the IC control electrode 26, and the like are formed by the second electrode pattern, and can be referred to as the IC-FPC connection electrode 21.

  The temperature measuring terminal 28b is a terminal for electrically connecting the mounted temperature measuring member 28a and the FPC 5, and is mounted on a temperature measuring terminal group 28c formed by forming a plurality of temperature measuring terminals 28b. The member 28a is electrically connected. The temperature measuring terminal group 28c includes a plurality of temperature measuring terminals 28b. The temperature measuring terminal group 28c indicates a group of temperature measuring terminals 28b connected to one temperature measuring member 28a.

  As shown in FIGS. 1 and 2, the drive IC 11 a is disposed corresponding to each group of the plurality of heat generating portions 9, and is connected to the other end of the individual electrode 19 and one end of the IC-FPC connection electrode 21. It is connected. This drive IC 11a is for controlling the energization state of each heat generating part 9, and has a plurality of switching elements inside, and is energized when each switching element is in an on state. A well-known thing which becomes a non-energized state in an OFF state can be used. In addition, although drive IC11a was illustrated as a control part, a control part should just be able to control the electricity supply state of the heat generating part 9, and is not limited to drive IC.

Each drive IC 11a is provided with a plurality of switching elements (not shown) inside so as to correspond to each individual electrode 19 connected to each drive IC 11a. As shown in FIG. 4, each drive IC 11a has one connection terminal 11a (hereinafter referred to as a first connection terminal 11d) connected to each switching element (not shown) connected to the individual electrode 19. The other connection terminal 11 b (hereinafter, second connection terminal 11 e) connected to each switching element is connected to the ground electrode 24 of the IC-FPC connection electrode 21. More specifically, the first connection terminal 11d and the second connection terminal 11e of the drive IC 11a are soldered onto a coating layer 30 (described later) formed on the individual electrode 19 and the IC-FPC connection electrode 21 with solder (not shown), respectively. It is joined. Thereby, when each switching element of the driving IC 11a is in the ON state, the individual electrode 19 connected to each switching element and the ground electrode wiring 24 of the IC-FPC connection electrode 21 are electrically connected.

  The common electrode 17 is for connecting the plurality of heat generating portions 9 and the FPC 5. As shown in FIGS. 1, 4 and 5, the common electrode 17 is formed over the entire second main surface 7d and the second end surface 7b of the substrate 7 and is formed on the first main surface 7c of the substrate 7. The main wiring portion 17a formed so as to extend along the two end surfaces 7b, and the arrangement direction of the heat generating portions 9 of the substrate 7 formed on the first main surface 7c of the substrate 7 as shown in FIGS. Projecting portions 17b projecting from the main wiring portion 17a located at the end of the substrate, and individually from the main wiring portion 17a located on the second major surface 7d of the substrate 7 toward each heat generating portion 9 as shown in FIG. And an extending lead portion 17c. Each lead portion 17c has a tip portion disposed opposite one end of the individual electrode 19 with each heat generating portion 9 interposed therebetween.

  Thus, one end of the common electrode 17 is connected to the heat generating part 9 on the first end surface 7 a of the substrate 7. And it is provided in the state extended from the 1st end surface 7a of the board | substrate 7 to the 1st main surface 7c via the 2nd main surface 7d and the 2nd end surface 7b. The other end of the common electrode 17 is disposed at one end of the first main surface 7c.

  As shown in FIGS. 1, 3, and 4, the common electrode 17 includes a main wiring portion 17 a located on the first major surface 7 c of the substrate 7 and a protruding portion 17 b located at the end of the common electrode 17. Is connected to the FPC 5 to electrically connect the FPC 5 and each heat generating portion 9.

  For example, the electric resistance layer 15, the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 may be formed by, for example, forming a material layer on each substrate 7 on the substrate 7 on which the heat storage layer 13 is formed. After sequentially laminating by a well-known thin film forming technique, the laminate is formed by processing into a predetermined pattern using a conventionally well-known photo-etching or the like. In the present embodiment, the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 can be simultaneously formed by the same process. Moreover, the thickness of the electrical resistance layer 15 is, for example, 0.01 μm to 0.2 μm, and the thicknesses of the common electrode 17, the individual electrode 19, and the IC-FPC connection electrode 21 are, for example, 0.05 μm to 2.5 μm. be able to.

  An electrode pattern formed on the first main surface 7c of the substrate 7 will be described with reference to FIG.

  As shown in FIG. 1B, the region surrounded by the alternate long and short dash line C is a section 14 formed on the thermal head substrate X1. A similar section 14 is also formed in the thermal head Y1 that is manufactured by dividing the thermal head substrate X1. In the section 14, the control terminal group 11 c is arranged at the center, and the individual electrode 19 connected to the control unit 11 extends toward a heat generating part (not shown) on one side of the substrate 7. Further, the IC-FPC electrode 21 connected to the control terminal group 11 c extends toward the other side of the substrate 7. The common electrode 17 extends from the second end surface 7b of the substrate 7 to the other side of the first main surface 7c.

  A temperature measuring terminal group 28c is provided between the control terminal group 11c and the common electrode 17, and the IC electrode 22, the ground electrode 24, and the IC control electrode 26 are disposed so as to surround the temperature measuring terminal group 28c. Yes.

As shown in FIG. 1A, the section 14 includes one control unit 11, a plurality of individual electrodes 19, a plurality of IC-FPC electrodes 21, and one temperature measuring terminal group 28c. 14 are provided equally and repeatedly in the arrangement direction of the heat generating portions 9. On the first main surface 7c, a main wiring portion 17a of the common electrode 17 is provided from one end portion to the other end portion in the arrangement direction of the heat generating portions 9 continuously from the second end surface 7b. And the protrusion part 17b is provided in the one end part and other end part of the division 14 in the sequence direction of the heat generating part 9. As shown in FIG.

  That is, when the thermal head substrate X1 is divided into sections 14 to produce the thermal head Y1, the thermal head Y1 has the first main surface 7c and the second main surface at one end and the other end in the arrangement direction of the heat generating portions 9. Projections 17b are provided on the surface 7d and the second end surface 7b, respectively. As a result, the common electrodes 17 are provided at both ends of the substrate 7 in the arrangement direction of the heat generating portions 9, and thus function to improve the strength of both ends of the substrate 7. Therefore, it is possible to suppress the occurrence of chipping and cracks occurring at both end portions of the substrate 7 in the arrangement direction of the heat generating portions 9. That is, the common electrodes 17 provided at both ends of the substrate 7 that are a part of the common electrode 17 function as the first reinforcing member 8.

  An IC electrode 22, a ground electrode 24, an IC control electrode 26, and a temperature measuring terminal group 28c are provided on the first main surface 7c. As shown in FIG. 3, the ground electrode 24 is disposed so as to surround the IC electrode 22, the IC control electrode 26, and the temperature measuring terminal group 28c. The ground electrode 24 is provided from one end to the other end in the arrangement direction of the heat generating portions 9 of the first main surface 7c. That is, the ground electrodes 24 are provided at both ends of the substrate 7 in the arrangement direction of the heat generating portions 9, and the ground electrode 24 acts to improve the strength of both ends of the substrate 7. That is, the ground electrodes 24 provided at both ends of the substrate 7 also function as the first reinforcing member 8.

  The temperature measuring member 28a provided in the temperature measuring terminal group 28c is provided for measuring the temperature of the thermal head Y1, and controls the drive IC 11a based on the temperature measured by the temperature measuring member 28a. The thermal head Y1 is controlled. Thus, by providing the temperature measuring member 28a on the first main surface 7c of the substrate 7, the temperature of the thermal head Y1 can be accurately measured.

  As the temperature measuring member 28a, a member having a function of measuring temperature can be used. For example, a member such as a thermistor can be used.

  Further, other members may be mounted on the temperature measuring terminal group 28c. Examples of other members to be mounted include capacitors, resistors, coils, and the like. A capacitor is mounted on the temperature measuring terminal group 28c, and a circuit is formed by wiring on the FPC 5 side, so that noise generated in the IC-FPC electrode 21 can be reduced.

  In addition, when a resistor is mounted, noise generated in the IC-FPC electrode 21 can be reduced similarly to the capacitor. Furthermore, by forming a circuit with the wiring on the FPC 5 side and connecting the IC-FPC electrode 21 in series, the current flowing through the IC-FPC electrode 21 can be controlled. Further, both the temperature measuring terminal group 28c and the capacitor may be mounted.

  As shown in FIGS. 1 to 5, on the heat storage layer 13 and on the first main surface 7 c and the second main surface 7 d of the substrate 7, a part of the heat generating part 9, a part of the common electrode 17 and one of the individual electrodes 19 are provided. A first protective layer 25 that covers the portion is formed. The first protective layer 25 is provided so as to cover the entire surface of the heat storage layer 13, and the second main surface 7 d of the substrate 7 is provided so as to cover a region corresponding to the first main surface 7 c of the substrate 7. .

The first protective layer 25 protects the area covered with the heat generating portion 9, the common electrode 17 and the individual electrode 19 from corrosion due to adhesion of moisture contained in the atmosphere and wear due to contact with the recording medium to be printed. Is to do. The first protective layer 25 can be formed of a material such as SiC, SiN, SiO, and SiON, for example. The first protective layer 25 can be formed by using a conventionally well-known thin film forming technique such as a sputtering method or a vapor deposition method, or a thick film forming technique such as a screen printing method. The first protective layer 25 may be formed by laminating a plurality of material layers. The first protective layer 25 is likely to have a level difference on the surface due to the level difference between the surface of the common electrode 17 and the individual electrode 19 and the surface of the heat generating part 9, but the thickness of the common electrode 17 and the individual electrode 19 is For example, by reducing the thickness to about 0.2 μm or less, the step formed on the surface of the first protective layer 25 can be eliminated or reduced.

  As shown in FIGS. 1, 4, and 5, a second protective layer 27 that partially covers the individual electrode 19 and the IC-FPC connection electrode 21 is provided on the first main surface 7 c of the substrate 7. It has been. For convenience of explanation, in FIG. 1, the formation region of the second protective layer 27 is indicated by a one-dot chain line, and the illustration is omitted.

  This second protective layer 27 protects the region covered with the individual electrode 19 and the IC-FPC connection electrode 21 from oxidation due to contact with the atmosphere and corrosion due to adhesion of moisture contained in the atmosphere. Is. The second protective layer 27 can be formed of a resin material such as an epoxy resin or a polyimide resin, for example. The second protective layer 27 can be formed using a thick film forming technique such as a screen printing method.

  As shown in FIG. 1, an end portion of an IC-FPC connection electrode 21 for connecting an FPC 5 described later is exposed from the second protective layer 27 so that the exposed region and the substrate 7 are connected. It has become.

  Further, the second protective layer 27 is formed with an individual electrode 19 for connecting the drive IC 11a, an end of the IC-FPC connection electrode 21, and an opening 27a (see FIG. 4) for exposing the temperature measuring terminal group 28c. These electrodes are connected to the control terminal 11b through the opening 27a. More specifically, a coating layer 30 described later is formed on the individual electrode 19 exposed from the opening 27a, the end of the IC-FPC connection electrode 21, and the temperature measuring terminal group 28c, as described above. These electrodes are soldered to the driving IC 11a via the covering layer 30. Thus, the connection strength of the drive IC 11a on the individual electrode 19 and the IC-FPC connection electrode 21 can be improved by soldering the drive IC 11a on the coating layer 30 formed by plating.

  The temperature measuring member 28a may be mounted on all the temperature measuring terminal groups 28c, but the above-described capacitor or the like may be mounted instead of the temperature measuring member 28a. Further, there may be a temperature measuring terminal group 28c in which the temperature measuring member 28a, the capacitor and the like are not mounted.

  The drive IC 11a is connected to the individual electrode 19 and the IC-FPC connection electrode 21 to protect the drive IC 11a itself and to protect the connection portion between the drive IC 11a and these electrodes, such as epoxy resin or silicon resin. It is sealed by being covered with a covering member (not shown) made of resin.

  As shown in FIGS. 4 and 5, a third protective layer 29 that partially covers the common electrode 17 is provided on the second main surface 7 d of the substrate 7. The third protective layer 29 is provided so as to partially cover a region on the right side of the second main surface 7d of the substrate 7 with respect to the first protective layer 25.

  The third protective layer 29 is for protecting the region covered with the common electrode 17 from oxidation due to contact with the atmosphere and corrosion due to adhesion of moisture or the like contained in the atmosphere. As with the second protective layer 27, the third protective layer 29 can be formed of a resin material such as an epoxy resin or a polyimide resin. The third protective layer 29 can be formed using a thick film forming technique such as a screen printing method.

  As shown in FIGS. 4 and 5, the region near the second end surface 7 b of the common electrode 17 located on the second main surface 7 d of the substrate 7 is not covered with the third protective layer 29. The coating layer 30 is used for the coating.

  As shown in FIGS. 4 and 5, it is formed on the corner 7e formed by the first main surface 7c and the second end surface 7b of the substrate 7, and by the second main surface 7d and the second end surface 7b of the substrate. The region of the common electrode 17 located on the corner 7f is covered with a coating layer 30 formed by plating. More specifically, the coating layer 30 includes the entire region of the common electrode 17 located on the first main surface 7c and the second end surface 7b of the substrate 7, and the common electrode located on the second main surface 7d of the substrate 7. The area | region of the 2nd end surface 7b vicinity of 17 is continuously coat | covered.

  The coating layer 30 can be formed by, for example, well-known electroless plating or electrolytic plating. Further, as the coating layer 30, for example, a first coating layer made of nickel plating may be formed on the common electrode 17, and a second coating layer made of gold plating may be formed on the first coating layer. In that case, the thickness of the first coating layer can be set to, for example, 1.5 μm to 4 μm, and the thickness of the second coating layer can be set to, for example, 0.02 μm to 0.1 μm.

  Further, in the present embodiment, as shown in FIG. 3, the coating layer 30 formed by plating has an end portion (end portion exposed from the second protective layer 27) of the IC-FPC connection electrode 21 that connects the FPC 5 described later. ) Is also formed on the top. Thereby, as will be described later, the FPC 5 is connected to the coating layer 30.

  Further, in the present embodiment, as shown in FIG. 3, the coating layer 30 formed by plating is on the individual electrode 19 and the end of the IC-FPC connection electrode 21 exposed from the opening 27 a of the second protective layer 27. Also formed. Thereby, as described above, the drive IC 11a is connected to the individual electrode 19 and the IC-FPC connection electrode 21 via the coating layer 30.

  As shown in FIGS. 1, 4, and 5, the FPC 5 extends along the arrangement direction of the heat generating portions 9, and the common electrode 17 provided on the first main surface 7 c of the substrate 7 as described above. It is connected to the main wiring portion 17a, the protruding portion 17b of the common electrode 17, and each IC-FPC connection electrode 21. This FPC 5 is a well-known one in which a plurality of printed wirings 5b are wired inside an insulating resin layer, and each printed wiring 5b is electrically connected to an external power supply device and control device (not shown) via a connector 31. To be connected to. Such a printed wiring 5b is generally formed of, for example, a metal foil such as a copper foil, a conductive thin film formed by a thin film forming technique, or a conductive thick film formed by a thick film printing technique. The printed wiring 5b formed of a metal foil, a conductive thin film, or the like is patterned by, for example, partially etching these by photoetching or the like.

  More specifically, as shown in FIGS. 4 and 5, in the FPC 5, each printed wiring 5b formed inside the insulating resin layer 5a is exposed at the end portion on the head base 3 side, and conductive bonding is performed. Connected to the common electrode 17 and the IC-FPC connection electrode 21 by a bonding material 32 made of a material such as a solder material or an anisotropic conductive material (ACF) in which conductive particles are mixed in an electrically insulating resin. Has been.

In the thermal head Y1, since the coating layer 30 is formed on the common electrode 17 located on the first main surface 7c of the substrate 7, as described above, the printed wiring 5b connected to the common electrode 17 is used. Are connected on the covering layer 30 via the bonding material 32. Moreover, as shown in FIG. 4, since the coating layer 30 is also formed on the end part of each IC-FPC connection electrode 21, the printed wiring 5b connected to each IC-FPC connection electrode 21 is a bonding material. It is connected to this coating layer 30 via 32. Thus, the connection strength of the printed wiring 5b on the common electrode 17 and the IC-FPC connection electrode 21 can be improved by connecting the printed wiring 5b onto the coating layer 30 formed by plating.

  When each printed wiring 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via the connector 31, the common electrode 17 is held at a positive potential (for example, 20V to 24V). A power source that is electrically connected to the plus side terminal of the power supply device, and the individual electrode 19 is held at a ground potential (for example, 0 V to 1 V) via the control terminal group 11 c and the ground electrode 24 of the IC-FPC connection electrode 21. It is electrically connected to the negative terminal of the device. For this reason, when the switching element of the drive IC 11a is in the on state, a voltage is applied to the heat generating portion 9, and the heat generating portion 9 generates heat.

  Similarly, when each printed wiring 5b of the FPC 5 is electrically connected to an external power supply device and control device (not shown) via the connector 31, the IC electrode 22 of the IC-FPC connection electrode 21 is Similar to the common electrode 17, it is electrically connected to the positive terminal of the power supply device held at a positive potential. Thus, a voltage for operating the drive IC 11a is applied to the control terminal group 11c due to the potential difference between the IC electrode 22 and the ground electrode 24 of the IC-FPC connection electrode 21 to which the drive IC 11a is connected. Further, the IC electrode 22 of the IC-FPC connection electrode 21 is electrically connected to an external control device that controls the drive IC 11a. Thereby, the electrical signal transmitted from the control device is supplied to the control terminal group 11c. By operating the drive IC 11a so as to control the on / off state of each switching element in the drive IC 11a by this electric signal, each heat generating portion 9 can be selectively heated.

  The FPC 5 is fixed on the radiator 1 by being bonded to the upper surface of the protrusion 1b of the radiator 1 by a double-sided tape or an adhesive (not shown).

  According to the thermal head substrate X1 according to the first embodiment, each section 14 includes a plurality of heating portions 9, one control terminal group 11c, a plurality of individual electrodes 19, a plurality of IC-FPC connection electrodes 21, and Since one temperature measuring terminal group 28c is provided, the thermal head Y1 having an arbitrary effective recording width can be easily manufactured by dividing the section 14 units. Thereby, the thermal head substrate X1 can be divided for each of the sections 14 constituting the thermal head Y1, and the degree of freedom in manufacturing the thermal head Y1 can be increased. The effective recording width indicates a width that can be printed by the thermal head.

  Further, a short circuit or short circuit occurs in the control terminal group 11c, the individual electrode 19, the IC-FPC connection electrode 21, and the temperature measuring terminal group 28c in a part of the section 14 constituting the thermal head substrate X1, and the protective film 30 Even when a defect such as inclusion of foreign matter occurs, the thermal head substrate X1 is divided so as not to include the section 14, thereby reducing the loss caused by the defect during the production of the thermal head Y1. it can. That is, since the thermal head Y1 is larger than one section 14, the thermal head Y1 can be manufactured from the thermal head substrate X1 with little loss.

  Furthermore, each section 14 is provided with a heat generating portion 9, a control terminal group 11c, an individual electrode 19, an IC-FPC connection electrode 21, and a temperature measuring terminal group 28c, and the thermal head Y1 is divided from the thermal head substrate X1. After that, an arbitrary temperature measuring member 28a or the like can be mounted on the temperature measuring terminal group 28c in accordance with the purpose. Therefore, the structure of the thermal head Y1 can be easily changed, and the design change of the thermal head Y1 can be facilitated.

Further, an arbitrary temperature measuring member 28a and the like can be mounted on the temperature measuring terminal group 28c, and the temperature measuring member 28a and the like can be mounted on the temperature measuring terminal group 28c at an arbitrary position in the thermal head Y1. . Therefore, the temperature measuring member 28a and the like can be easily mounted according to the mode of the thermal head Y1.

  Here, when a thermal head is manufactured by dividing the thermal head substrate, there are cases in which chipping or cracking occurs at the end of the substrate in the arrangement direction of the heat generating portions of the thermal head. In addition, when mounting the thermal head on a radiator or mounting a thermal head on a thermal printer, the end of the substrate in the direction of arrangement of the heating elements collides with other members, so that the arrangement of the heating sections of the thermal head In some cases, the edge of the substrate in the direction was chipped or cracked.

  According to the thermal head substrate X1 according to the first embodiment, the common electrode 17 includes the first main surface 7c, the second end surface 7b, and the second main surface at the end of the substrate 7 in the arrangement direction of the heat generating units 9. 7d, and the protrusion 17b of the common electrode 17 functions as the first reinforcing member 8. As a result, the possibility of chipping or cracking at the end of the substrate 7 in the arrangement direction of the heat generating portions 9 can be reduced. Therefore, the reliability of the thermal head Y1 can be improved. Even when a plurality of thermal heads Y1 are divided from the thermal head substrate X1, it is possible to reduce the possibility of chipping or cracking at the end of the substrate 7 in the arrangement direction of the heat generating portions 9 of the thermal head Y1. .

  Further, since the first reinforcing member 8 is formed as a part of the protruding portion 17b of the common electrode 17, it is not necessary to provide a first manufacturing member and to provide the first reinforcing member 8, and the first reinforcing member 8 can be easily provided. The thermal head Y1 provided with can be manufactured.

  Further, the common electrode 17 is provided from the first end surface 7a of the substrate 7 to the second main surface 7d, the second end surface 7b, and the first main surface 7c, and the second main surface 7d and the second end surface 7b Since it is provided over the entire surface, the area of the common electrode 17 can be increased, and the wiring resistance of the common electrode 17 can be reduced. Further, the current capacity of the common electrode 17 can be increased by increasing the area of the common electrode 17. Further, when the first reinforcing member 8 is formed as a part of the common electrode 17, the common electrode 17 is provided integrally, so that the first reinforcing member 8 is moved from the first end surface 7 a of the substrate 7 to the second main surface. The surface 7d, the second end surface 7b, and the first main surface 7c are provided. Therefore, the edge part of the board | substrate 7 in the sequence direction of the heat generating part 9 can further be reinforced, and the possibility that a chip | tip and a crack generate | occur | produce can be suppressed.

  Further, by using the common electrode 19 or the ground electrode 24 as the first reinforcing member 8, the first reinforcing member 8 can be easily provided on the substrate 7 without providing a separate pattern.

  Furthermore, since the temperature measuring terminal group 28c is disposed so as to be surrounded by the IC-FPC electrode 21 in plan view, the influence of noise on the temperature signal measured by the temperature measuring member 28a can be reduced. .

  In the first embodiment, the common electrode 17 is provided over the entire surface of the second main surface 7d. However, the common electrode 17 may not be provided over the entire surface of the second main surface 7d.

In the thermal head substrate X1 according to the present embodiment, the common electrode 17 constituting the partition 14 is provided with the protruding portions 17b at one end and the other end of the partition 14, but the present invention is not limited thereto. Is not to be done. For example, it may be provided only at one end of the compartment 14 or may not be provided at one end and the other end of the compartment 14. That is, the thermal head substrate X1 does not have to have the protruding portion 17b.
<Thermal printer>
Next, a thermal printer Z using the thermal head Y1 according to the first embodiment will be described with reference to FIG. FIG. 6 is a schematic configuration diagram of the thermal printer Z of the present embodiment.

  As shown in FIG. 6, the thermal printer Z of the present embodiment includes the above-described thermal head Y1, the transport mechanism 40, the platen roller 50, the power supply device 60, and the control device 70. The thermal head Y1 is attached to an attachment surface 80a of an attachment member 80 provided in a housing (not shown) of the thermal printer Z. The thermal head Y1 is attached to the attachment member 80 so that the arrangement direction of the heat generating portions 9 is in a direction perpendicular to the conveyance direction S of the recording medium P, which will be described later, in other words, in the main scanning direction.

  The transport mechanism 40 transports the recording medium P such as thermal paper, image receiving paper, card, etc. in the direction of arrow S in FIG. 6 and on the plurality of heat generating portions 9 of the thermal head Y1 (more specifically, on the protective layer 25). And has conveying rollers 43, 45, 47, and 49. The transport rollers 43, 45, 47, and 49 are formed by, for example, covering cylindrical shaft bodies 43a, 45a, 47a, and 49a made of metal such as stainless steel with elastic members 43b, 45b, 47b, and 49b made of butadiene rubber or the like. Can be configured. Although not shown, when the recording medium P is an image receiving paper or a card, an ink film is transported together with the recording medium P between the recording medium P and the heat generating portion 9 of the thermal head Y1.

  The platen roller 50 is for pressing the recording medium P onto the heat generating portion 9 of the thermal head Y1, and is arranged so as to extend along a direction orthogonal to the conveyance direction S of the recording medium P. Both ends are supported so as to be rotatable while being pressed on the heat generating portion 9. The platen roller 50 can be configured by, for example, covering a cylindrical shaft body 50a made of metal such as stainless steel with an elastic member 50b made of butadiene rubber or the like.

  The power supply device 60 is for supplying a current for causing the heat generating portion 9 of the thermal head Y1 to generate heat and a current for operating the drive IC 11a as described above. The control device 70 is for supplying the control terminal group 11c with a control signal for controlling the operation of the drive IC 11a in order to selectively heat the heat generating portion 9 of the thermal head Y1 as described above.

In the thermal printer Z of the present embodiment, as shown in FIG. 6, the heating mechanism 9 is selected by the power supply device 60 and the control device 70 while the recording mechanism P is being transported onto the heating portion 9 of the thermal head Y1 by the transport mechanism 40. By generating heat automatically, a predetermined printing can be performed on the recording medium P. When the recording medium P is an image receiving paper, a card, or the like, printing on the recording medium P can be performed by thermally transferring ink of an ink film (not shown) conveyed with the recording medium P to the recording medium P. .
<Second Embodiment>
A thermal head substrate X2 according to the second embodiment of the present invention will be described with reference to FIGS.

  The thermal head substrate X2 shown in FIG. 7 is provided with second reinforcing members 10 at both ends in the arrangement direction of the heat generating portions 9. And it has further the protrusion part 17b which protruded toward the temperature measuring terminal group 28c from the main wiring part 17a of the common electrode 17. FIG.

  As shown in FIG. 7B, the part surrounded by the alternate long and short dash line D functions as the second reinforcing member 10. The second reinforcing member 10 is provided with the IC-FPC connection electrode 21, and constitutes the IC electrode 22, the ground electrode 24, the IC control electrode 26, and the second reinforcing member 10 as described above. Further, the temperature measuring terminal group 28 c also constitutes the second reinforcing member 10. Other configurations are the same as those of the thermal head substrate X1 according to the first embodiment.

  As described above, since the second reinforcing member 10 is provided at the end portion in the arrangement direction of the heat generating portions 9, when the thermal head Y2 is divided and manufactured, the second reinforcing member 10 is provided at the end portion of the thermal head Y2. Can be provided.

  A thermal head Y2 produced by dividing the thermal head substrate X2 along line B shown in FIG. 7A will be described.

  The thermal head Y <b> 2 shown in FIG. 8 is provided with a second reinforcing member 10 at a portion surrounded by a two-dot chain line D. The IC-FPC connection electrode 21 and the temperature measuring terminal group 28 c constitute the second reinforcing member 10. The thermal head substrate X2 is divided at the position of the temperature measuring terminal group 28c, and the thermal head Y2 is manufactured. Furthermore, the common electrode 17 further includes a protruding portion 16 that protrudes toward the temperature measuring terminal group 28c. Other configurations are the same as those of the thermal head Y1 according to the first embodiment.

  Also in the second embodiment, the common electrode 17 is provided at the end of the substrate 7 in the arrangement direction of the heat generating portions 9. Therefore, the common electrode 17 becomes the first reinforcing member 8 and the strength of the end portion of the substrate 7 in the arrangement direction of the heat generating portions 9 can be improved.

  In the thermal head Y <b> 2 according to the second embodiment, the FPC 5 and the substrate 7 are electrically connected at the other end of the common electrode 17. More specifically, the main wiring portion 17a and the protruding portion 17b are electrically connected. Similarly, the other end of the IC-FPC connection electrode 21 and the FPC 5 are electrically connected. More specifically, the IC electrode 22, the ground electrode 24, the IC control electrode 26, the temperature measuring terminal group 28c, and the FPC 5 are electrically connected.

  Here, the substrate 7 and the FPC 5 have different coefficients of thermal expansion due to the difference in the material formed when the above-described materials are formed, and the FPC 5 is arranged in the heating unit 9 in comparison with the substrate 7 when the thermal head Y1 is operated. Deformation extending in the direction may occur. The FPC 5 may peel from the substrate 7 due to the stress generated by the deformation. This may occur at the end portion of the substrate 7 in the arrangement direction of the heat generating portions 9 having a particularly large deformation amount. The thermal head Y2 is obtained by dividing the thermal head substrate X2 so as to include the second reinforcing member 10 because the second reinforcing member 10 is provided at at least one end in the arrangement direction of the heat generating portions 9. The 2nd reinforcement member 10 will be provided in the edge part of the obtained thermal head Y2. When the IC-FPC connection electrode 21 and the printed wiring 5b of the FPC 5 are connected by solder, the stress generated by the deformation of the FPC 5 by the solder can be relaxed, and the substrate 7 and the FPC 5 may be peeled off. Can be suppressed. That is, compared to the case where the second reinforcing member 10 is not provided, the bonding area between the substrate 7 and the FPC 5 can be increased, and the stress generated in each solder connecting the substrate 7 and the FPC 5 can be dispersed. Therefore, the possibility that the substrate 7 and the FPC 5 are separated can be suppressed.

  Further, by providing the common electrode 17 as the first reinforcing member 8 at the end of the substrate 7 in the arrangement direction of the heat generating portions 9, the end of the substrate 7 in the arrangement direction of the heat generating portions 9 that are particularly likely to be peeled off. Can be reduced. Thereby, the possibility that the substrate 7 and the FPC 5 are separated can be suppressed.

In addition, even when the substrate 7 and the FPC 5 are connected by ACF connection using an anisotropic conductive adhesive, the common electrode 17 or the IC-FPC connection electrode 21 as the second reinforcing member 10 is provided. The thickness of the anisotropic conductive adhesive in the arrangement direction of the heat generating portions 9 can be made close to uniform. That is, if the second reinforcing member 10 is not provided, the thickness of the end portion of the substrate 7 in the arrangement direction of the heat generating portions 9 is reduced by a thickness equivalent to the thickness of the second reinforcing member 10, and the heat generating portions 9 are arranged in the arrangement direction. The bonding strength at the end of the substrate 7 is weakened. However, by providing the first reinforcing member 8, the thickness of the anisotropic conductive adhesive in the arrangement direction of the heat generating portions 9 can be made close to uniform. Therefore, the connection strength between the substrate 7 and the FPC 5 can be improved.

  Furthermore, by dividing the thermal head substrate X2 at the position of the temperature measuring terminal group 28c to produce the thermal head Y2, the second reinforcing member 10 can be easily provided on the thermal head Y2. Further, by providing the second reinforcing member 10, it is difficult to cut off the electrical continuity of the section 14 located next to the second reinforcing member 10, and the reliability of the thermal head Y2 can be improved.

  The temperature measuring terminal group 28c can be used as a marker by dividing the temperature measuring terminal group 28c to produce the thermal head Y2. Therefore, it is not necessary to divide the thermal head substrate X2 after marking the division position, and the manufacturing process of the thermal head Y2 can be simplified.

  In addition, since the common electrode 17 includes the protruding portion 16 protruding toward the temperature measuring terminal group 28c, heat is accumulated in the dense IC-FPC electrodes 21, and the generated heat is generated even when the temperature rises. Can be released to the second main surface 7 d of the substrate 7 through the protrusion 16. Thereby, the temperature measured by the temperature measuring member 33 can be made accurate, and the control of the thermal head Y2 can be made accurately.

In addition, the connection method of the board | substrate 7 and FPC5 is not limited to the connection by solder and ACF connection. For example, even when a conductive adhesive is used instead of solder, the connection between the substrate and the FPC can be strengthened by the second reinforcing member.
<Third Embodiment>
As shown in FIG. 9, the thermal head substrate X3 according to the third embodiment has the heat generating portion 9 on the upper surface shown in FIG. 9, and the configuration of the partition 14 is different from that of the above-described embodiment. is there. In addition, a plurality of sections 14 are provided in a direction perpendicular to the arrangement direction of the heat generating units 9 and the arrangement direction of the heat generating units 9.

  Although not shown, the common electrode 17 is provided over the entire area of the second main surface of the thermal head substrate X3, and the main wiring portion is provided on the heat generating portion 9 side of the first main surface of the thermal head substrate X3. 17a is provided. The common electrode 17 provided on the second main surface is drawn out to the first main surface of the thermal head substrate X3 by the via-hole conductor, and is electrically connected to the main wiring portion 17a and is opposite to the heat generating portion 9. Also on the side, it is drawn out to the first main surface of the thermal head substrate X3 and is connected to the FPC 5 at this portion to obtain electrical conduction. As an electrical lead method, after the thermal head substrate X3 is divided and cut, the common electrode 17 is formed by film formation such as sputtering and printing, so that the thermal head Y3 is removed from the thermal head substrate X3. Can be produced.

  The thermal head substrate X3 is divided in the arrangement direction of the heat generating portion 9 by laser processing, and the thermal head substrate X3 is divided in the direction perpendicular to the arrangement direction of the heat generating portion 9 by forming a scribe. Good. Even in this case, the division method may be changed depending on the direction.

  Thus, even in the thermal head substrate X3 including a plurality of sections 14 having a configuration in which the heat generating portion 9 is provided on the first main surface 7c of the substrate 7, an arbitrary thermal head Y3 can be easily manufactured.

  A thermal head Y3 produced by dividing the thermal head substrate X3 according to the third embodiment by E lines will be described with reference to FIG.

  A plurality of heat generating portions 9 are arranged on the first main surface 7c of the substrate 7, and the heat generating portion 19 and the main wiring portion 17a of the common electrode 17 are connected on the first main surface 7c.

  Although not shown, the common electrode 17 is provided over the entire area of the second main surface 7d of the substrate 7, and the main wiring portion 17a is provided on the heat generating portion 9 side of the first main surface 7c of the substrate 7. Is provided. The common electrode 17 provided on the second main surface 7d is drawn out to the first main surface 7c of the substrate 7 by the via-hole conductor and is electrically connected to the main wiring portion 17a, and on the opposite side of the heat generating portion 9 Is drawn out to the first main surface 7c of the substrate 7 and is connected to the FPC 5 at this portion to obtain electrical conduction.

  The thermal heads Y4 and Y5, which are other embodiments of the present invention, will be described with reference to FIG. The thermal head Y4 shown in FIG. 11 (a) is composed of six sections 14, and a temperature measuring member 28a is provided in a temperature measuring terminal group 28c of one section 14 arranged in the center. Thus, the thermal head Y4 can be provided with the driving IC 11 and the temperature measuring member 28a after being divided from the thermal head substrate X3, and the temperature measuring member 28a and the like can be mounted at an arbitrary position. Accordingly, the temperature measuring member 28a and the like can be mounted according to the size of the thermal head and the required characteristics. Therefore, the thermal head Y5 having a high degree of freedom during production can be obtained.

  The thermal head Y5 shown in FIG. 11 (b) is composed of nine sections 14, and measures one section 14 arranged at the center and sections 14 located at both ends in the arrangement direction of the heat generating sections 9. A temperature measuring member 28a is provided in each of the temperature terminals 28c.

  Here, when the length of the heat generating portion of the thermal head is long in the arrangement direction, a temperature distribution in which both ends are lower in temperature than the center portion in the length direction of the heat generating portion in the arrangement direction causes uneven printing on the thermal head. May occur.

  Since the thermal head Y5 is provided with the temperature measuring members 28a at both end portions and the central portion in the arrangement direction of the heat generating portions 9, the temperature distribution in the arrangement direction of the heat generating portions 9 can be accurately grasped. Thereby, the temperature distribution in the arrangement direction of the heat generating portions 9 can be made closer to smooth by applying more voltage to both ends than the central portion.

  In addition, a resistor may be provided in the temperature measuring terminal group 28c at both ends in the arrangement direction of the heat generating portions 9. In that case, the temperature distribution in the arrangement direction of the heat generating portions 9 can be made closer to smooth by applying a voltage so that the resistor generates heat.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning.

  For example, instead of forming the first reinforcing member 8 as a part of the common electrode 17, the first reinforcing member 8 may be formed as a separate member. In that case, the first reinforcing member can be formed of a material equivalent to the second protective layer 27 or the first protective layer 25, for example.

By providing the first reinforcing member 8 as a separate member, the first reinforcing member 8 can be easily provided in a predetermined shape, and it is not necessary to have a function as an electrode. Examples of a method for forming the first reinforcing member 8 include printing, sputtering, dipping, and the like. The first reinforcing member 8 may be formed using a predetermined method depending on the material to be formed.

  Alternatively, the first reinforcing member 8 may be formed by a part of the common electrode 17, and the first reinforcing member 8 may be provided as a separate member. Thereby, the strength of the end portion of the substrate 7 can be further improved.

  In the thermal head Y1, the common electrode 17 and the IC-FPC connection electrode 21 provided on the substrate 7 of the head base 3 are electrically connected to an external power supply device, a control device, etc. via the FPC 5. However, the present invention is not limited to this. For example, the flexible printed wiring board having flexibility such as the FPC 5 is used, and various wirings of the head base 3 are connected to an external power supply device through a hard printed wiring board. You may electrically connect to. In this case, for example, the common electrode 17 and the IC-FPC connection electrode 21 of the head substrate 3 and the printed wiring of the printed wiring board may be connected by wire bonding or the like.

  In the thermal head Y1 of the above embodiment, as shown in FIGS. 4 and 5, the electrical resistance layer 15 is not only on the heat storage layer 13, but also the first main surface 7c and the second main surface 7d of the substrate 7. Although it is provided also on the top, it is not limited to this as long as it is connected to the common electrode 17 and the individual electrode layer 19 on the first end surface 7a of the substrate 7, for example, on the heat storage layer 13 May be provided. Further, the common electrode 17 and the individual electrode 19 on the first end surface 7 a of the substrate 7 are formed directly on the heat storage layer 13, and between the tip of the common electrode 17 on the heat storage layer 13 and the tip of the individual electrode 19. The electric resistance layer 15 may be provided only in the region.

  As another thermal head configuration, for example, the common electrode 17 extends from the first end surface 7 a of the substrate 7 to the second main surface 7 d of the substrate 7, and is folded back on the second main surface 7 d of the substrate 7. In this way, the first main surface 7c of the substrate 7 may be extended via the first end surface 7a of the substrate 7.

  Furthermore, in the thermal head Y of the above embodiment, as shown in FIGS. 3 and 4, the first end surface 7 a of the substrate 7 has a convex curved surface, but the surface of the first end surface 7 a of the substrate 7. The shape and the inclination angle are not particularly limited, and can take any form. For example, the first end surface 7a of the substrate 7 may have a planar shape or a bent surface. In addition, the angle formed between the first main surface 7c and the second main surface 7d of the substrate 7 and the first end surface 7a of the substrate 7 may not be a right angle but may be an obtuse angle or an acute angle.

  In the thermal head of the above embodiment, the common electrode 17 is formed on the first end surface 7 a of the substrate 7, on the second main surface 7 d of the substrate 7, and on the second end surface 7 b of the substrate 7. Although it extends over 1 main surface 7c, it is not limited to this. For example, the common electrode 17 may be formed only on the first end surface 7 a and the second main surface 7 d of the substrate 7. In this case, the common electrode 17 formed on the second main surface 7d of the substrate 7 and the printed wiring 5b of the FPC 5 may be connected by a separately provided jumper line.

  In the embodiment shown in the present specification, the example in which the first reinforcing members 8 are provided at both end portions in the arrangement direction of the heat generating portions 9 is shown, but the first reinforcing members 8 may be provided only in one of them. Even in this case, the first reinforcing member 8 can suppress the possibility of chipping or cracking of the substrate 7. It should be noted that the substrate 7 is preferably provided at both ends of the substrate 7 in the arrangement direction of the heat generating portions 9 in order to prevent the substrate 7 from being chipped or cracked.

  Further, the first reinforcing member 8 may be provided on the end surface of the substrate 7 orthogonal to the arrangement direction of the heat generating portions 9. Even in that case, the strength of the end portion of the substrate 7 in the arrangement direction of the heat generating portions 9 can be further improved.

  In the thermal heads Y4 and Y5, an example in which the temperature measuring member 28a or the like is not mounted on the temperature measuring terminal group 28c of all the compartments 14 is shown, but the temperature measuring terminal group 28c of all the compartments 14 has a temperature measuring terminal. The member 28a may be mounted.

X1 to X3 Thermal head substrate Y1 to Y5 Thermal head Z Thermal printer 1 Radiator 3 Head base 5 Flexible printed wiring board 7 Substrate 7a First end surface 7b Second end surface 7c First main surface 7d Second main surface 8 First reinforcement Member 9 Heat generating part 10 Second reinforcing member 11a Drive IC
11b Control terminal 11c Control terminal group 14 Partition 16 Protrusion 17 Common electrode 19 Individual electrode 21 IC-FPC connection electrode 28a Temperature measuring member 28b Temperature measuring terminal 28c Temperature measuring terminal group

Claims (8)

A plurality of heat generating parts;
A control terminal group comprising a plurality of control terminals for mounting a control unit for controlling the heat generation of the heat generating unit;
A plurality of first electrode patterns connecting the heat generating portion and the control terminal;
A plurality of second electrode patterns connecting the control terminal and an external substrate;
An electronic component terminal group comprising a plurality of electronic component terminals for mounting the electronic component;
A section composed of the heat generating unit, one control terminal group, a plurality of first electrode patterns, a plurality of second electrode patterns, and one electronic component terminal group is arranged in the arrangement direction of the heat generating units. A substrate for a thermal head, wherein a plurality of substrates are arranged repeatedly and equally.   The thermal head substrate according to claim 1, wherein the electronic component terminal group is disposed so as to be surrounded by the second electrode pattern in a plan view.   The thermal head substrate according to claim 1, wherein a first reinforcing member is provided on at least one end in the arrangement direction of the heat generating portions.   A thermal head comprising a substrate obtained by dividing the thermal head substrate according to claim 1 at the position of the electronic component terminal group.   The thermal head according to claim 4, wherein a second reinforcing member is provided at an end portion of at least one of the substrates in the arrangement direction of the heat generating portions.   6. The thermal head according to claim 4, wherein a capacitor is mounted on the electronic component terminal group.   The thermal head according to claim 4, wherein a resistor is mounted on the terminal group for electronic components.   A thermal head comprising: the thermal head according to claim 4; a transport mechanism that transports a recording medium onto the heat generating portion; and a platen roller that presses the recording medium onto the heat generating portion. Printer.

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