JPH02336A - Semiconductor device - Google Patents

Abstract

PURPOSE:To effectively check migration by providing a substrate surface with a check pattern which is composed of the same metal as the wiring of semiconductor circuit, and electrically independent of the semiconductor circuit, and has wedge type constriction parts. CONSTITUTION:On a semiconductor substrate, a metal wiring 10 having constrictions 11 partially is arranged as a check pattern, in two perpendicular directions so as to coincide with the wiring direction of semiconductor circuit on the substrate. The wiring 10 is constituted by using the same metal as the metal used for the wiring of the semiconductor circuit, and forms an electrically independent pattern. The width of the constriction part 11 is made equal to or less than the minimum line width of the semiconductor circuit. Thereby stress concentration occurs at the constriction parts 11, and at the same time current density also increases, so that migration can be checked in an accelerated state by observing said part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device provided with a check pattern for checking metal wiring breakage caused by migration and progress of migration.

[Conventional technology]

Conventionally, in a semiconductor device, checking for disconnection of metal wiring due to migration and progress of migration has been performed by checking the wiring itself within the semiconductor device.

[Problem to be solved by the invention]

The conventional checking method described above involves checking the wiring itself within the semiconductor device, which makes it difficult to detect, and it is also impossible to check under conditions that accelerate the progress of migration during the manufacturing process. Therefore, it took a lot of time to investigate the relationship between manufacturing conditions and migration. Furthermore, even when conducting a reliability test, the test takes a long time because there is no pattern in the semiconductor device that is intentionally bad for migration.

An object of the present invention is to solve such problems and provide a semiconductor device in which migration can be efficiently checked by providing a check pattern in a semiconductor device with a shape that intentionally accelerates migration. It is in.

[Means to solve the problem]

The structure of the semiconductor device of the present invention includes a metal wiring disposed on a substrate forming a semiconductor circuit, made of the same metal as the wiring of the semiconductor circuit, and electrically independent of the semiconductor circuit. A wedge-shaped constriction in a part of the
A check pattern is formed in such a shape that the line width of the constriction is equal to or less than the minimum wiring width of the semiconductor circuit, and two check patterns are arranged at right angles to each other. It is characterized by

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partial plan view of one embodiment of the present invention.

In this embodiment, a metal wiring 10 made of Aj2 or AA alloy disposed on a semiconductor substrate etc. has a wedge-shaped wedge part 11 in a part thereof, and this pattern is similar to the wiring of an actual semiconductor circuit. It is characterized by being located in two directions that are perpendicular to each other. The migration check pattern of this embodiment is formed from metal wiring 10) used for wiring of a semiconductor device, and is composed of wiring that is electrically independent from the wiring of this semiconductor device.
A part of this wiring has a constricted portion 11 whose width is equal to or less than the minimum line width within the device.

When tensile stress is applied to the check pattern of the metal wiring 10 due to the constricted portion 11, stress concentration tends to occur in the constricted portion 11, and stress migration is particularly likely to occur in this portion. Furthermore, when a current is applied, the current density is highest at the constriction.

Therefore, by observing this part, it is possible to check migration in an accelerated state.

FIG. 2 is a partial plan view of a second embodiment of the invention. In this embodiment, a narrow portion 12 is provided only on one side of a partial wiring of a metal wiring 10 made of AA or Al-based alloy on a substrate. Since this constricted portion 12 is also shaped so that stress concentration occurs, by observing this portion, it is possible to check for accelerated migration.

In Example 2, although the degree of acceleration is slightly lower than in Example 1, it has the advantage of being easier to create a mask.

〔Effect of the invention〕

As explained above, the present invention can effectively perform a migration check of a semiconductor device by providing in advance on a check pattern a shape that is in the worst state or accelerated state with respect to migration. .

Figure 1

[Brief explanation of the drawing]

1 and 2 are partial plan views showing first and second embodiments of the present invention. 10... Metal wiring made of AA or Ai7 alloy, 11.12... Constriction. Agent Patent Attorney Uchihara Sound Diagram Z

Claims (1)

[Claims] A substrate forming a semiconductor circuit is provided with a metal wiring made of the same metal as the wiring of the semiconductor circuit and arranged electrically independently of the semiconductor circuit, and a part of the metal wiring has a wedge-shaped constriction. The part is formed as a check pattern such that the line width of the constricted part is equal to or less than the minimum wiring width of the semiconductor circuit, and two check patterns are arranged so as to be perpendicular to each other. A semiconductor device characterized by: