JPH065674A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent a non-defective chip from being judged defective due to that a probing needle deviates from an electrode when a semiconductor integrated circuit device is checked. CONSTITUTION:Two contact check electrodes 3 which are of the same potential with a power supply and smaller than a usual electrode 2 in area are provided onto a semiconductor chip 1. By this setup, it is detected that a probing needle deviates from an electrode, and the deviation of a probing needle from a usual electrode is corrected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device having an electrode structure capable of advantageously performing a chip inspection (hereinafter referred to as a wafer check) in a wafer state.

[0002]

2. Description of the Related Art In an LSI manufacturing process, a wafer check is performed after the diffusion process and prior to the assembly process. FIG. 3 is a plan view showing a conventional chip state at the time of wafer check. In the figure, 1 is a semiconductor chip,
Reference numeral 2 is an electrode, where the electrode 2 includes a signal electrode and a power supply electrode. At the time of checking the wafer, the probing needle of the tester is brought into contact with the electrode 2 for the purpose of inputting / outputting signals and supplying power, and the characteristic is checked.

Since the electrode area is usually sufficiently large with respect to the contact area of the probing needle, even if the needle is displaced from the center of the electrode 2 by 20 to 30 μm, the needle will not be displaced from the electrode 2.

[0004]

In recent years, the number of chips formed on one wafer has been increasing due to the miniaturization of semiconductor chips or the increase in wafer area. Therefore, it may be necessary to perform a check several hundreds of times on one wafer, and in such a case, the probing needle may come off from the electrode 2 due to an error of the probing device while the check is repeated. Sometimes. Then, in the actual wafer check, it is possible that a deviation of 10 to 20 μm is already included in the first alignment between the probing needle and the electrode 2, so the above possibility is further increased. Therefore, in the conventional semiconductor integrated circuit device, an originally good chip may be determined to be a defective product because the probing needle is not in contact with the chip.

[0005]

A semiconductor integrated circuit device of the present invention is a regular electrode such as a power electrode for operating the semiconductor integrated circuit device or a signal electrode for inputting / outputting a signal on a chip. In addition to the above, a contact check electrode having a smaller area than the regular electrode is provided for detecting the positional deviation of the probing needle during wafer check.

[0006]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a schematic plan view showing a first embodiment of the present invention. As shown in FIG. 1, in this embodiment,
On the semiconductor chip 1, a contact check electrode 3 for checking the contact position of the probing needle is provided on the diagonal line of the chip in addition to the regular electrode 2 for supplying power to the circuit and inputting / outputting a signal. One pair is provided. Here, the area of the contact check electrode 3 is formed smaller than the area of the electrode 2, and the contact check electrode 3 is internally connected to the power supply electrode so that the power supply voltage is applied.

Now, for example, the regular electrode 2 is 100 × 100.
μm ² , contact check electrode 3 is 50 × 50 μm
^It has an area of ² and the probing needle is 30
If it is deviated from the center of the μm electrode, the electrode 2 and the probing needle are in contact with each other, but the probing needle that should be in contact with the electrode 3 is deviated from the electrode and a high impedance state is set. When the needle is disengaged from the checking electrode 3 and a high impedance state is detected, an alarm is generated and the position of the probing needle is reset.

The two contact check electrodes 3 are provided on the diagonal of the chip in order to detect not only the displacement in the xy direction but also the displacement in the θ direction. .

FIG. 2 is a partial plan view showing a second embodiment of the present invention. As shown in the figure, the power supply line 4 derived from the power supply electrode 2a and the contact check electrode 3 are provided with a first layer metal wiring 5, a second layer metal wiring 6 and a through hole 7. It is connected.

In this embodiment, the contact check electrode 3 can be used to detect the displacement of the probing needle, and the through hole resistance is checked by measuring the resistance between this electrode and the power supply electrode 2a. be able to.

[0011]

As described above, according to the present invention, in addition to the regular electrode on the chip, the relative displacement between the regular electrode having a smaller area than the regular electrode and the probing needle is detected. Since the contact check electrode is additionally provided, according to the present invention, when the probing needle is displaced, it is possible to prevent contact with the contact check electrode before the probing needle comes off the regular electrode. it can. Therefore, according to the present invention, when the check electrode and the probing needle are not in contact with each other, an alarm or the like is generated to prevent the probing needle from being separated from the regular electrode. Therefore, it is possible to avoid the inconvenience that a chip which is originally a good product is determined to be a defective product.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a partial plan view of the second embodiment of the present invention.

FIG. 3 is a plan view of a conventional example.

[Explanation of symbols]

 1 Semiconductor Chip 2, 2a Electrode 3 Contact Check Electrode 4 Power Line 5 First Layer Metal Wiring 6 Second Layer Metal Wiring 7 Through Hole

Claims (1)

[Claims] 1. A probing needle position deviation detection device having a regular electrode formed on a semiconductor substrate for applying a power supply voltage to a circuit or for inputting / outputting a signal, and having a smaller area than these regular electrodes. A semiconductor integrated circuit device in which electrodes are formed.