JPH03283599A - Inspecting method for continuity of ceramic multilayer board - Google Patents

Abstract

PURPOSE:To accurately and rapidly check a conducting state between a semiconductor element connecting terminal and an outer connection terminal of a lead pattern, etc., by providing a redundancy part having a plurality of checking terminals at a ceramic multilayer board to be inspected, and removing the part after the inspection of its continuity. CONSTITUTION:Redundancy parts 1A, 1B are provided at both ends of a ceramic multilayer board 3, and a ceramic multilayer board 10 to be inspected is manufactured. A plurality of check terminals 2 are provided at the parts 1A, 1B, and grooves 9 are provided between the parts 1A, 1B and the board 3. Even if it is difficult that, since the pitches of lead pattern 4, wire bonding pads 5 are excessively short, a probe pin is effectively brought into contact, interconnections are provided between the pattern 4, the pads 5 and a checking electrode 2, the pin is brought into contact with the electrode 2 to inspect the continuity state. Accordingly, the inspection can be effectively and rapidly conducted to prevent malfunction. Then, the parts 1A, 1B are separated by the groove 9 and removed to obtain the board 3.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for testing continuity of a ceramic multilayer substrate.

(Prior Art) Ceramic multilayer substrates such as thick film multilayer substrates, green sheet printed multilayer substrates, and green sheet laminated multilayer substrates are tested for continuity when the ceramic multilayer substrate package is completed.

For example, to conduct a continuity test on a ceramic multilayer board 3 as schematically shown in FIG. Make contact with wire bonding pad No. 5 and die bonding pad 6. Then, each probe pin of the continuity test jig is connected to a computer terminal, a combination of probe pins is selected according to a predetermined program input into the computer, a check signal is input, and the corresponding wire is It is inspected whether there is any conduction failure between the bonding pad 5 and the lead pattern 4. In addition, in FIG. 2, 7 indicates a semiconductor element housing part.

(Problems to be Solved by the Invention) However, with recent advances in wafer processing, semiconductor devices are rapidly becoming more highly integrated and have more terminals. Therefore, in order to keep the dimensions of the chip constant, the intervals between the wire bonding pads 5 and the intervals between the lead patterns 4 have become extremely small, improving bonding accuracy. This makes it difficult to accurately bring the probe pins of the jig into contact with the corresponding wire bonding pads 5 and lead patterns 4 during a continuity test.
A contact failure occurs between the lead pattern 4 and the lead pattern 4.

As a result, the continuity test takes a very long time, and since some wiring remains that cannot be checked for continuity, proper checks cannot be carried out and defective products may be overlooked, which is a problem.

An object of the present invention is to provide a ceramic multilayer board that can accurately and quickly check the continuity state between semiconductor element connection terminals such as wire bonding pads and external connection terminals such as lead patterns. An object of the present invention is to provide a continuity testing method.

(Means for Solving the Problems) The present invention provides a redundant section having a plurality of check terminals on a ceramic multilayer substrate test object, and electrically connects the check terminals to external connection terminals or semiconductor element connection terminals. The present invention relates to a method for testing continuity of a ceramic multilayer board, the method comprising connecting a terminal of a continuity testing jig to the checking terminal to perform a continuity test, and then removing the redundant portion. .

(Example) In this example, first, as shown in FIG. 1, redundant portions IA and IB are provided on both sides of a ceramic multilayer substrate 3, and a ceramic multilayer substrate test object 10 is manufactured.

Each redundant part IA, IB is provided with a predetermined number of check terminals 2, and each check terminal 2 is connected to the broken line A, for example.
, B, wires are connected to the corresponding wire bonding pads 5 and lead patterns 4, respectively, and electrically connected. A groove 9 is provided between the redundant parts IA, IB and the ceramic multilayer substrate 3.

To manufacture this test object 10, a ceramic fired substrate or green sheet that is larger than the product ceramic multilayer board 3 by a predetermined dimension is fired or formed in advance, and then an insulating layer and a conductive layer are formed in accordance with a usual method. are formed alternately and fired. In this case, conventionally, it is sufficient to provide a predetermined wiring between the wire bonding pad 5 and the lead pattern 4, but in the present invention, as shown by broken lines A and B, for example, a check terminal 2 is provided. Wiring is provided between the lead pattern 4 or the wire bonding pad 5 using a conductive pattern. When providing this wiring, the vacant space after the necessary wiring has been provided on the ceramic multilayer substrate 3 is used, and the wiring is designed so that the wiring does not intersect with each other. This design method itself is a design matter that can be applied by applying the usual wiring method for ceramic multilayer substrates.

For all of the wire bonding pads 5 and lead patterns 4, it is possible to provide corresponding check terminals and conduct wiring as described above, but of course, for all of the lead patterns 4 and wire bonding pads 5. There is no need to provide a check terminal.

For example, if a large number of wire bonding pads 5 are provided at a constant pitch, the wire bonding pads 5 may be placed regularly at predetermined intervals such as every other or every two.
The check terminal 2 may be provided only for the selected wire bonding pad 5, and wiring may be performed.
Thereby, the number and density of probe pins that should come into contact with the wire bonding pad 5 (lead pattern 4) can be reduced.

In addition, if only a portion of the wire bonding pads 5 (or lead patterns 4) are provided very closely, or due to board design considerations, the wire bonding pads 5 (or lead patterns 4) may be There may be cases where it is difficult to bring the probe pin into contact with a portion.

In such a case, of course, it is only necessary to provide check terminals corresponding to the wire bonding pads 5 (or lead patterns 4) and perform wiring only in areas where it is difficult to contact these probe pins.

Although it is preferable to provide the groove 9 in advance before firing the test object, it is also possible to provide it after firing.

Next, after baking and producing the test object 10, a continuity test jig (not shown) is placed in a predetermined position, and the probe pins are brought into contact with the corresponding wire bonding pads 5, lead patterns 4, and check terminals 2, respectively. , perform a continuity test. At this time, probe pins are provided in advance according to the pattern of the check terminal 2, and probe pins are not provided at the positions of the lead pattern 4 and the wire bonding pad 5 that are wired to the check terminal 2. put.

Next, the continuity state is sequentially checked according to a program input into the computer in advance. At this time, for example, if a specific lead pattern 4A is wired to the check terminal 2A and a specific wire bonding pad 5B is wired to the check terminal 2B, the lead pattern 4A,
There is no need to contact the probe pin with the wire bonding pad 5B, and the probe pin is connected to the check terminal 2A.
, 2B to check for conductivity defects, the lead pattern 4A and the wire bonding pad 5B
You can check the continuity between the If the conduction state between the check terminals 2A and 2B is good, the test is passed. In addition, if the continuity between the check terminals 2A and 2B is poor, after completing the continuity test,
Lead pattern 4A and wire bonding pad 5B
Contact the probe pin to directly check for continuity defects. Of course, unlike a continuity test in which a large number of probe pins are brought into contact with a large number of terminals all at once, it is easy to reliably bring a probe pin into contact with only a specific terminal. Thereby, even if a conduction failure occurs between the check terminals 2A, 2B and the lead pattern 4A or wire bonding pad 5B, no problem will occur.

As described above, according to this embodiment, even if it is difficult to bring the probe pins into reliable contact with each other due to reasons such as the lead pattern 4 and the wire bonding pad 5 being too small, the lead pattern 4 , a wiring is provided between the wire bonding pad 5 and the check electrode 2, and the continuity state is tested by bringing the probe pin into contact with the check electrode 2, so that the continuity test can be performed reliably and quickly. It is possible to prevent the occurrence of defective products.

Next, the redundant parts IA and 1B are separated and removed by the groove 9, and
A ceramic multilayer substrate 3 is obtained. At this time, the subject 10 can be held down manually and broken by the groove 9, but it may also be done by a machine.

The redundant portions do not need to be provided at two locations as shown in FIG. 1, but may be provided at one location or three or more locations, and the shape may also be changed.

The present invention is applicable to various ceramic multilayer substrates, such as thick film multilayer substrates, green sheet printed multilayer substrates, green sheet laminated multilayer substrates, thick film/Wl film combination substrates, CR-containing substrates, low temperature firing ceramic substrates, and low shrinkage rate substrates. It is applicable to etc.

(Effects of the Invention) According to the method for testing continuity of a ceramic multilayer board according to the present invention, the check terminal of the redundant portion is electrically connected to the external connection terminal or the semiconductor element connection terminal, and the continuity test jig is used. Since the continuity test is performed by bringing the terminals of the above jig into contact with the check terminals, if the pitch of the external connection terminals or semiconductor element connection terminals is too small, etc. Even if it is difficult to reliably contact the check terminal, the check can be performed by bringing the terminal of the jig into contact with the check terminal. Therefore, the continuity test can be performed reliably and quickly, and the occurrence of defective products can be prevented.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view showing a ceramic multilayer substrate to be tested, and FIG. 2 is a schematic plan view showing the ceramic multilayer substrate. IA, IB...Redundant parts 2, 2A, 2B...Check terminal 3...Ceramic multilayer board 4.4A...Lead pattern (terminal for external connection)5.
5B... Wire bonding pad (semiconductor element connection terminal) 6... Die bonding pad 9... Groove 10... Ceramic multilayer board test object

Claims (1)

[Claims] 1. A redundant part having a plurality of check terminals is provided on the ceramic multilayer substrate test object, and the check terminals are electrically connected to an external connection terminal or a semiconductor element connection terminal,
A method for testing continuity of a ceramic multilayer board, comprising: performing a continuity test by bringing a terminal of a continuity test jig into contact with the check terminal, and then removing the redundant portion.