JP2005337811A - Method for inspecting continuity of wiring circuit board - Google Patents

Method for inspecting continuity of wiring circuit board Download PDF

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JP2005337811A
JP2005337811A JP2004155108A JP2004155108A JP2005337811A JP 2005337811 A JP2005337811 A JP 2005337811A JP 2004155108 A JP2004155108 A JP 2004155108A JP 2004155108 A JP2004155108 A JP 2004155108A JP 2005337811 A JP2005337811 A JP 2005337811A
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terminal
continuity
insulating layer
circuit board
board
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JP4358682B2 (en
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Hitonori Kanekawa
仁紀 金川
Tetsuya Osawa
徹也 大澤
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Nitto Denko Corp
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Nitto Denko Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for inspecting continuity of wiring circuit boards and capable of reliably executing continuity inspection while reducing unit prices of products and improving manufacturing efficiency. <P>SOLUTION: Each terminal 18 of a substrate-side terminal part 7 formed at a rear end part of a suspension substrate 1 with a circuit is formed as a flying lead having its back surface exposed from a supporting substrate 2 and a base insulating layer 3 and its surface exposed from a cover insulating layer 5. Continuity inspection is executed with the surface as a terminal 13 for connection for connecting to a control circuit substrate and the back surface as a terminal 15 for continuity inspection for connecting to a probe 14 for inspection for continuity inspection. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、配線回路基板の導通検査方法、詳しくは、回路付サスペンション基板の導通検査に、好適に用いられる、配線回路基板の導通検査方法に関する。   The present invention relates to a method for inspecting continuity of a printed circuit board, and more particularly, to a method for inspecting continuity of a wired circuit board, which is preferably used for continuity inspection of a suspension board with circuit.

導体パターンを備えた配線回路基板は、通常、製造時において、電気的な導通検査が実施されている。
例えば、回路付サスペンション基板と制御回路基板とを中継するための配線回路基板では、サスペンション基板側接点と制御回路基板側接点とが長手方向において所定間隔を隔てて設けられており、それらサスペンション基板側接点と制御回路基板側接点との間よりも長手方向外方に、電気的な導通検査を実施するための検査用接点が設けられている（例えば、特許文献１参照。）。 A printed circuit board having a conductor pattern is usually subjected to an electrical continuity test at the time of manufacture.
For example, in a wired circuit board for relaying a suspension board with circuit and a control circuit board, the suspension board side contact and the control circuit board side contact are provided at predetermined intervals in the longitudinal direction. An inspection contact for performing an electrical continuity inspection is provided on the outer side in the longitudinal direction than between the contact and the control circuit board side contact (for example, refer to Patent Document 1).

また、近年、上記した中継のための配線回路基板を一体的に備える、ロングテールタイプの回路付サスペンション基板が知られており、このようなロングテールタイプの回路付サスペンション基板においても、やはり、検査用接点は、磁気ヘッド側接点と制御回路基板側接点との間よりも長手方向外方に設けられている。
そして、このような検査用接点は、検査後は不要であるため、特許文献１に記載されるように、検査後に切断除去される。
特開２０００−３０６２２０号公報 In addition, in recent years, a long tail type suspension board with a circuit that is integrally provided with the above-described wiring circuit board for relay is known. Even in such a long tail type suspension board with a circuit, inspection is still performed. The contact is provided on the outer side in the longitudinal direction than between the magnetic head side contact and the control circuit board side contact.
Since such an inspection contact is unnecessary after the inspection, as described in Patent Document 1, it is cut and removed after the inspection.
JP 2000-306220 A

しかし、上記したような検査用接点を設けると、サスペンション基板側接点（または磁気ヘッド側接点）と制御回路基板側接点との間よりも長手方向外方に検査用接点を設ける分だけ、回路付サスペンション基板が、長手方向において長くなる。そのため、例えば、多数の回路付サスペンション基板を打ち抜きにより製造する場合には、一定面積内で製造できる製品の数量が減少し、製品単価の上昇を生じる。   However, when the inspection contact as described above is provided, the circuit is provided by the amount that the inspection contact is provided on the outer side in the longitudinal direction than between the suspension board side contact (or the magnetic head side contact) and the control circuit board side contact. The suspension board becomes longer in the longitudinal direction. Therefore, for example, when a large number of suspension boards with circuits are manufactured by punching, the number of products that can be manufactured within a certain area is reduced, resulting in an increase in product unit price.

また、検査用接点と、その検査用接点に隣り合う制御回路基板側接点またはサスペンション基板側接点（または磁気ヘッド側接点）との間に、断線または短絡を生じると、製品自体に異常のない良品であっても、導通検査において不良品と判定されるので、その不良と判定された良品を省いてしまい（オーバーキル）、製造効率の低下を生じる。
本発明の目的は、製品単価の低減および製造効率の向上を図りつつ、確実な導通検査を実施することのできる、配線回路基板の導通検査方法を提供することにある。 In addition, if a disconnection or short circuit occurs between the inspection contact and the control circuit board side contact or suspension board side contact (or magnetic head side contact) adjacent to the inspection contact, the product itself is not defective. Even so, since it is determined as a defective product in the continuity test, the non-defective product determined to be defective is omitted (overkill), resulting in a decrease in manufacturing efficiency.
An object of the present invention is to provide a printed circuit board continuity testing method capable of performing a reliable continuity test while reducing the product unit price and improving the manufacturing efficiency.

上記の目的を達成するため、本発明の配線回路基板の導通検査方法は、導体パターンを備えた配線回路基板の導通検査方法であって、前記導体パターンの表面の一部が、接続用端子として用いられ、その接続用端子として用いられる導体パターンの表面に対応する裏面を、導通検査用端子として用いることを特徴としている。
本発明の配線回路基板の導通検査方法では、前記配線回路基板が、回路付サスペンション基板であることが好適である。 In order to achieve the above object, a wired circuit board continuity inspection method of the present invention is a wired circuit board continuity inspection method provided with a conductor pattern, wherein a part of the surface of the conductor pattern serves as a connection terminal. The back surface corresponding to the surface of the conductor pattern used as the connection terminal is used as a continuity test terminal.
In the wired circuit board continuity inspection method of the present invention, it is preferable that the wired circuit board is a suspension board with circuit.

本発明の配線回路基板の導通検査方法によれば、接続用端子として用いられる導体パターンの表面に対応する裏面を導通検査用端子として用いるので、接続用端子間よりも長手方向外方に導通検査用端子を設ける場合に比べて、長手方向の長さを短縮することができる。そのため、多数の配線回路基板を打ち抜きにより製造する場合において、一定面積内で製造できる製品の数量を増加させて、製品単価を減少させることができる。   According to the method for inspecting continuity of a printed circuit board according to the present invention, the back surface corresponding to the surface of the conductor pattern used as the connection terminal is used as the continuity test terminal. The length in the longitudinal direction can be shortened as compared with the case where the service terminal is provided. Therefore, when a large number of printed circuit boards are manufactured by punching, it is possible to increase the quantity of products that can be manufactured within a certain area and to reduce the product unit price.

また、本発明の配線回路基板の導通検査方法によれば、接続用端子間よりも長手方向外方に導通検査用端子を設ける場合のように、導通検査用端子と、その導通検査用端子に隣り合う接続用端子との間に断線または短絡を生じないので、導通検査において、確実な判定を確保することができる。そのため、製造効率の向上を図ることができる。   Further, according to the method for inspecting continuity of a printed circuit board according to the present invention, the continuity test terminal and the continuity test terminal are provided, as in the case where the continuity test terminal is provided outside in the longitudinal direction from between the connection terminals. Since disconnection or a short circuit does not occur between adjacent connection terminals, reliable determination can be ensured in the continuity test. Therefore, the manufacturing efficiency can be improved.

図１は、本発明の回路付サスペンション基板の一実施形態を示す平面図、図２は、図１に示す回路付サスペンション基板における基板側端子部の側断面図（回路付サスペンション基板の長手方向に沿う断面図）である。
図１において、この回路付サスペンション基板１は、ハードディスクドライブの磁気ヘッド（図示せず）を実装して、その磁気ヘッドを、磁気ヘッドと磁気ディスクとが相対的に走行するときの空気流に抗して、磁気ディスクとの間に微小な間隔を保持しながら支持するものであり、磁気ヘッドと制御回路基板とを接続するための導体パターン４が、一体的に形成されている、ロングテールタイプの回路付サスペンション基板である。 FIG. 1 is a plan view showing an embodiment of a suspension board with circuit of the present invention, and FIG. 2 is a side sectional view of a terminal portion on the board side in the suspension board with circuit shown in FIG. FIG.
In FIG. 1, this suspension board with circuit 1 mounts a magnetic head (not shown) of a hard disk drive, and resists the air flow when the magnetic head and the magnetic disk travel relatively. A long tail type that supports the magnetic disk while maintaining a minute gap and is integrally formed with a conductor pattern 4 for connecting the magnetic head and the control circuit board. This is a suspension board with circuit.

この回路付サスペンション基板１は、図２に示すように、長手方向に延びる金属支持層としての支持基板２と、その支持基板２の上に形成された絶縁層としてのベース絶縁層３と、そのベース絶縁層３の上に形成された導体パターン４と、その導体パターン４を被覆するように、ベース絶縁層３の上に形成された被覆層としてのカバー絶縁層５とを備えている。   As shown in FIG. 2, the suspension board with circuit 1 includes a support board 2 as a metal support layer extending in the longitudinal direction, a base insulation layer 3 as an insulation layer formed on the support board 2, A conductor pattern 4 formed on the base insulating layer 3 and a cover insulating layer 5 as a covering layer formed on the base insulating layer 3 so as to cover the conductor pattern 4 are provided.

なお、回路付サスペンション基板１は、通常、連続する長尺の支持基板２の上に、複数のベース絶縁層３、導体パターン４およびカバー絶縁層５を順次積層した後に、最終工程において、各回路付サスペンション基板１ごとに打ち抜くことにより、製造される。
支持基板２は、例えば、ステンレスや４２アロイなどの金属薄板からなり、図１に示すように、長手方向に沿って略クランク形状に形成され、その先端部（長手方向一端部）には、ジンバル部６が形成され、その後端部（長手方向他端部）には、制御回路基板と接続するための基板側端子部７が形成されている。 Note that the suspension board with circuit 1 is usually formed by sequentially laminating a plurality of insulating base layers 3, a conductive pattern 4, and an insulating cover layer 5 on a continuous long supporting substrate 2, and then in the final process, It is manufactured by punching each attached suspension board 1.
The support substrate 2 is made of, for example, a thin metal plate such as stainless steel or 42 alloy, and is formed in a substantially crank shape along the longitudinal direction, as shown in FIG. 1, and has a gimbal at its tip (one longitudinal end). A portion 6 is formed, and a substrate side terminal portion 7 for connecting to the control circuit board is formed at the rear end portion (the other end portion in the longitudinal direction).

ベース絶縁層３は、例えば、ポリイミド樹脂などの合成樹脂からなり、支持基板２の上に連続して形成されており、先端部においては、ジンバル部６の後述する磁気ヘッド側端子部８に形成され、また、後端部においては、基板側端子部７に形成されている。また、先端部および後端部の間においては、支持基板２の幅方向（長手方向に直交する方向）両側にそれぞれ形成されている。   The base insulating layer 3 is made of, for example, a synthetic resin such as a polyimide resin, and is continuously formed on the support substrate 2. In addition, the rear end portion is formed on the substrate side terminal portion 7. Moreover, between the front-end | tip part and a rear-end part, it forms in the width direction (direction orthogonal to a longitudinal direction) both sides of the support substrate 2, respectively.

導体パターン４は、例えば、銅箔などの金属箔からなり、先端部および後端部の間において、支持基板２の幅方向両側に形成されているベース絶縁層３の上に、並列配置される複数（各２つ）の配線１６（以下、各配線１６を区別する場合には、１６ａ、１６ｂ、１６ｃおよび１６ｄとする。）として形成されている。
すなわち、各配線１６は、長手方向に沿って設けられ、１対の配線１６ａおよび１６ｂ、１６ｃおよび１６ｄが、幅方向において互いに間隔を隔てて、各ベース絶縁層３の上に並列配置されている。 The conductor pattern 4 is made of, for example, a metal foil such as a copper foil, and is arranged in parallel on the base insulating layer 3 formed on both sides in the width direction of the support substrate 2 between the front end portion and the rear end portion. It is formed as a plurality (two each) of wirings 16 (hereinafter, when the wirings 16 are distinguished, they are referred to as 16a, 16b, 16c and 16d).
That is, each wiring 16 is provided along the longitudinal direction, and a pair of wirings 16a and 16b, 16c and 16d are arranged in parallel on each base insulating layer 3 at intervals in the width direction. .

また、各配線１６は、先端部において、その遊端部が、磁気ヘッド側端子部８の複数の端子１７（以下、各端子１７を区別する場合には、１７ａ、１７ｂ、１７ｃおよび１７ｄとする。）とされ、後端部において、その遊端部が、基板側端子部７の複数の端子１８（以下、各端子１８を区別する場合には、１８ａ、１８ｂ、１８ｃおよび１８ｄとする。）とされている。   In addition, each wiring 16 has a free end portion at a tip portion of a plurality of terminals 17 of the magnetic head side terminal portion 8 (hereinafter referred to as 17a, 17b, 17c and 17d when each terminal 17 is distinguished). The free end portion of the rear end portion is a plurality of terminals 18 of the board side terminal portion 7 (hereinafter, when the terminals 18 are distinguished, they are referred to as 18a, 18b, 18c and 18d). It is said that.

また、カバー絶縁層５は、例えば、ポリイミド樹脂などの合成樹脂からなり、図１では省略されているが、図２に示すように、各配線１６を被覆するように、ベース絶縁層３の上に、ベース絶縁層３に沿って形成されている。
また、基板側端子部７では、各配線１６の遊端部が、上記したように、制御回路基板と接続するための平面視略矩形状の端子１８とされている。 The insulating cover layer 5 is made of, for example, a synthetic resin such as polyimide resin, and is omitted in FIG. 1, but as shown in FIG. 2, the insulating cover layer 5 is formed on the insulating base layer 3 so as to cover each wiring 16. In addition, it is formed along the base insulating layer 3.
Moreover, in the board | substrate side terminal part 7, the free end part of each wiring 16 is made into the terminal 18 of the substantially rectangular shape in planar view for connecting with a control circuit board | substrate as mentioned above.

各端子１８は、幅方向に沿って互いに間隔を隔てて並列配置されている。また、支持基板２およびベース絶縁層３における各端子１８に対応する位置を含む部分、および、カバー絶縁層５における各端子１８に対応する位置を含む部分は、平面視略矩形状に開口されている。これによって、各端子１８は、その裏面が支持基板２およびベース絶縁層３から露出され、その表面がカバー絶縁層５から露出され、つまり、各端子１８の両面が露出されるように形成されている。   The terminals 18 are arranged in parallel at intervals from each other along the width direction. Further, the portion including the position corresponding to each terminal 18 in the support substrate 2 and the base insulating layer 3 and the portion including the position corresponding to each terminal 18 in the cover insulating layer 5 are opened in a substantially rectangular shape in plan view. Yes. Thereby, each terminal 18 is formed such that the back surface thereof is exposed from the support substrate 2 and the base insulating layer 3, and the front surface thereof is exposed from the cover insulating layer 5, that is, both surfaces of each terminal 18 are exposed. Yes.

このような、基板側端子部７の各端子１８は、例えば、回路付サスペンション基板１の製造において、まず、各端子１８に対応する位置を含む平面視略矩形部分に、開口部分９が形成されるように、支持基板２の上にベース絶縁層３を形成し、次いで、導体パターン４の各配線１６の形成と同時に、ベース絶縁層３の開口部分９から露出される支持基板２の上に各端子１８を形成した後、各端子１８に対応する位置を含む平面視略矩形部分に、開口部分１０が形成されるように、導体パターン４を含むベース絶縁層３の上にカバー絶縁層５を形成し、その後、支持基板２における各端子１８に対応する位置を含む平面視略矩形部分を、エッチングなどにより除去して、開口部分１１を形成することにより、形成することができる。   For example, in manufacturing the suspension board with circuit 1, each of the terminals 18 of the board-side terminal portion 7 is formed with an opening portion 9 in a substantially rectangular portion in plan view including a position corresponding to each terminal 18. Thus, the base insulating layer 3 is formed on the support substrate 2, and then, simultaneously with the formation of each wiring 16 of the conductor pattern 4, on the support substrate 2 exposed from the opening 9 of the base insulating layer 3. After each terminal 18 is formed, the cover insulating layer 5 is formed on the base insulating layer 3 including the conductor pattern 4 so that the opening 10 is formed in a substantially rectangular portion in plan view including a position corresponding to each terminal 18. After that, the substantially rectangular portion in plan view including the position corresponding to each terminal 18 in the support substrate 2 is removed by etching or the like to form the opening portion 11.

なお、開口部分９が形成されるベース絶縁層３、および、開口部分１１が形成されるカバー絶縁層５は、特に制限されず、例えば、感光性樹脂を用いて露光および現像するパターンニング法や、プラズマエッチングなどのエッチング法、あるいは、予めパンチング加工により開口部分を形成した樹脂フィルムの貼着など、公知の方法により形成することができる。   The base insulating layer 3 in which the opening 9 is formed and the cover insulating layer 5 in which the opening 11 is formed are not particularly limited. For example, a patterning method in which exposure and development are performed using a photosensitive resin, Further, it can be formed by a known method such as an etching method such as plasma etching or a pasting of a resin film in which an opening is previously formed by punching.

なお、このようにして形成された基板側端子部７では、各端子１８は、各配線１６から連続して、カバー絶縁層５の開口部分９において、カバー絶縁層５の厚さ方向に、凹状に窪むように形成されている。また、支持基板２の開口部分１１は、カバー絶縁層５の開口部分９よりも大きく形成されており、これによって、各端子１８と、支持基板２の開口部分１１の端縁との接触による短絡が防止されている。   In the substrate-side terminal portion 7 formed in this way, each terminal 18 is formed in a concave shape in the thickness direction of the cover insulating layer 5 at the opening 9 of the cover insulating layer 5 continuously from the wiring 16. It is formed so as to be recessed. In addition, the opening portion 11 of the support substrate 2 is formed larger than the opening portion 9 of the insulating cover layer 5, whereby a short circuit due to contact between each terminal 18 and the edge of the opening portion 11 of the support substrate 2. Is prevented.

また、ベース絶縁層３の開口部分９および支持基板２の開口部分１１から露出される各端子１８の裏面、および、カバー絶縁層５の開口部分１０から露出される各端子１８の表面には、それぞれ、ニッケルめっき層や金めっき層からなるめっき層１２が形成されている。
ジンバル部６には、図１に示すように、磁気ヘッドが搭載されるスライダーを実装するために、舌状に切り欠かれたタング部１９と、そのタング部１９の幅方向両側に設けられるアウトリガー部２０とが形成されている。また、タング部１９の先端部には、磁気ヘッドと接続するための磁気ヘッド側端子部８が形成されている。 In addition, on the back surface of each terminal 18 exposed from the opening portion 9 of the base insulating layer 3 and the opening portion 11 of the support substrate 2 and the surface of each terminal 18 exposed from the opening portion 10 of the cover insulating layer 5, A plating layer 12 made of a nickel plating layer or a gold plating layer is formed.
As shown in FIG. 1, the gimbal portion 6 has a tongue portion 19 cut out in a tongue shape and outriggers provided on both sides in the width direction of the tongue portion 19 in order to mount a slider on which a magnetic head is mounted. Part 20 is formed. Further, a magnetic head side terminal portion 8 for connecting to the magnetic head is formed at the tip of the tongue portion 19.

磁気ヘッド側端子部８において、各配線１６の遊端部が、上記したように、磁気ヘッドと接続するための平面視略矩形状の端子１７とされている。
各端子１７は、幅方向に沿って互いに間隔を隔てて並列配置されている。また、支持基板２およびベース絶縁層３における各端子１７に対応する位置を含む部分、および、カバー絶縁層５における各端子１７に対応する位置を含む部分は、平面視略矩形状に開口されている。これによって、各端子１７は、基板側端子部７の各端子１８と同様に、その裏面が支持基板２およびベース絶縁層３から露出され、その表面がカバー絶縁層５から露出され、つまり、各端子１７の両面が露出されるように形成されている。 In the magnetic head side terminal portion 8, the free end portion of each wiring 16 is a terminal 17 having a substantially rectangular shape in plan view for connection to the magnetic head as described above.
The terminals 17 are arranged in parallel at intervals from each other along the width direction. Further, the portion including the position corresponding to each terminal 17 in the support substrate 2 and the base insulating layer 3 and the portion including the position corresponding to each terminal 17 in the cover insulating layer 5 are opened in a substantially rectangular shape in plan view. Yes. As a result, each terminal 17 has its back surface exposed from the support substrate 2 and the base insulating layer 3 and its surface exposed from the cover insulating layer 5 in the same manner as each terminal 18 of the substrate-side terminal portion 7. It is formed so that both surfaces of the terminal 17 are exposed.

このような、磁気ヘッド側端子部８の各端子１７は、上記した基板側端子部７の各端子１８と同様の方法により、形成することができる。
なお、このような基板側端子部７および磁気ヘッド側端子部８を備える回路付サスペンション基板１は、特に制限されず、公知の方法により製造することができる。例えば、特開２００１−３５０２７２号公報に準拠して、製造することができる。但し、特開２００１−３５０２７２号公報に準拠する場合には、ベース絶縁層３の上に、クロム薄膜をスパッタリングで形成することにより、ベース絶縁層３の開口部分９から露出する支持基板２の上にもクロム薄膜を形成し、そのクロム薄膜をバリア層として、各端子１７および１８を形成する。 Each terminal 17 of the magnetic head side terminal portion 8 can be formed by the same method as that of each terminal 18 of the substrate side terminal portion 7 described above.
Note that the suspension board with circuit 1 including the board-side terminal section 7 and the magnetic head-side terminal section 8 is not particularly limited and can be manufactured by a known method. For example, it can be manufactured according to JP-A-2001-350272. However, when conforming to Japanese Patent Application Laid-Open No. 2001-350272, a chromium thin film is formed on the base insulating layer 3 by sputtering, so that the support substrate 2 exposed from the opening 9 of the base insulating layer 3 is formed. Further, a chromium thin film is formed, and the terminals 17 and 18 are formed using the chromium thin film as a barrier layer.

そして、本発明の配線回路基板の導通検査方法は、このようにして得られた回路付サスペンション基板１において、例えば、図２に示すように、基板側端子部７の各端子１８の表面を、制御回路基板と接続するための接続用端子１３とする一方で、基板側端子部７の各端子１８の裏面を、導通検査のための検査用プローブ１４と接続するための導通検査用端子１５とする。   And the continuity inspection method for a wired circuit board according to the present invention, in the suspension board with circuit 1 thus obtained, for example, as shown in FIG. The connection terminal 13 for connection to the control circuit board is used, while the back surface of each terminal 18 of the board side terminal portion 7 is connected to the inspection probe 14 for connection inspection, To do.

そして、導通検査は、通常、回路付サスペンション基板１の製造後、工場出荷前に、良品と不良品とを判定するために実施される。例えば、図２の仮想線で示すように、導通検査用端子１５と、検査用プローブ１４とを接続して、その検査用プローブ１４から、通電することにより、導通が正常か不良かを検査する。正常である場合には、良品と判定して、製品として出荷する。また、導通が不良である場合には、不良品と判定して、製品としての出荷を停止する。   And a continuity test is normally implemented in order to determine a good product and a defective product after manufacture of the suspension board with circuit 1 and before factory shipment. For example, as shown by a virtual line in FIG. 2, the continuity test terminal 15 and the test probe 14 are connected, and the test probe 14 is energized to test whether the continuity is normal or defective. . If it is normal, it is judged as a non-defective product and shipped as a product. Further, if the continuity is defective, it is determined as a defective product and the shipment as a product is stopped.

なお、検査用プローブ１４と接続された導通検査用端子１５は、その接続に起因して損傷などを生じる場合があり、そのため、その後に、制御回路基板との接続に用いないようにする。
そして、このような導通検査方法では、各端子１８において、接続用端子１３として用いられる表面に対応する裏面が、導通検査用端子１５として用いられるので、例えば、従来のように、磁気ヘッド側端子部８と基板側端子部７との間よりも長手方向外方に導通検査用端子１５を設ける必要がなく、回路付サスペンション基板１の長手方向の長さを短縮することができる。そのため、多数の回路付サスペンション基板１を、連続するシート状に形成し、その後、各回路付サスペンション基板１ごとに、打ち抜きにより製造する場合において、一定面積内で製造できる製品の数量を増加させて、製品単価を減少させることができる。 Note that the continuity test terminal 15 connected to the test probe 14 may be damaged due to the connection, so that it is not used for connection to the control circuit board thereafter.
In such a continuity test method, the back surface of each terminal 18 corresponding to the front surface used as the connection terminal 13 is used as the continuity test terminal 15. For example, as in the conventional case, the magnetic head side terminal is used. It is not necessary to provide the continuity testing terminal 15 in the longitudinal direction outwardly between the portion 8 and the board-side terminal portion 7, and the longitudinal length of the suspension board with circuit 1 can be shortened. Therefore, in the case where a large number of suspension boards with circuits 1 are formed in a continuous sheet shape, and thereafter each suspension board with circuits 1 is manufactured by punching, the number of products that can be manufactured within a certain area is increased. , The product unit price can be reduced.

また、この導通検査方法によれば、磁気ヘッド側端子部８と基板側端子部７との間よりも長手方向外方に導通検査用端子１５を設ける場合のように、導通検査用端子１５と、その導通検査用端子１５に隣り合う基板側端子部７または磁気ヘッド側端子部８との間に断線または短絡を生じないので、導通検査において、確実な判定を確保することができる。そのため、製造効率の向上を図ることができる。   Further, according to this continuity test method, the continuity test terminal 15 and the continuity test terminal 15 are provided as in the case where the continuity test terminal 15 is provided on the outer side in the longitudinal direction than between the magnetic head side terminal unit 8 and the substrate side terminal unit 7. Since no disconnection or short circuit occurs between the substrate-side terminal portion 7 or the magnetic head-side terminal portion 8 adjacent to the continuity test terminal 15, reliable determination can be ensured in the continuity test. Therefore, the manufacturing efficiency can be improved.

なお、上記の導通検査方法では、基板側端子部７の各端子１８の表面を接続用端子１３とし、その裏面を導通検査用端子１５としたが、いずれを表面および裏面とするかは、適宜選択することができ、例えば、基板側端子部７の各端子１８の表面を導通検査用端子１５とし、その裏面を接続用端子１３としてもよい。
また、上記の導通検査方法では、基板側端子部７の各端子１８の表面および裏面を、接続用端子１３および導通検査用端子１５としたが、例えば、磁気ヘッド側端子部８の各端子１７の表面および裏面を、接続用端子１３および導通検査用端子１５としてもよい。 In the above continuity inspection method, the surface of each terminal 18 of the board-side terminal portion 7 is the connection terminal 13 and the back surface thereof is the continuity test terminal 15. For example, the surface of each terminal 18 of the board-side terminal portion 7 may be the continuity test terminal 15 and the back surface thereof may be the connection terminal 13.
Further, in the above continuity inspection method, the front and back surfaces of each terminal 18 of the board-side terminal portion 7 are the connection terminal 13 and the continuity inspection terminal 15, but for example, each terminal 17 of the magnetic head side terminal portion 8. The front surface and the back surface may be used as the connection terminal 13 and the continuity test terminal 15.

また、上記の導通検査方法では、回路付サスペンション基板１の導通検査を例示して説明したが、本発明の導通検査方法は、上記した回路付サスペンション基板１に限定されず、その他、公知の配線回路基板に適用することができる。   In the above continuity inspection method, the continuity inspection of the suspension board with circuit 1 has been described as an example. However, the continuity inspection method of the present invention is not limited to the suspension board with circuit 1 described above, and other well-known wiring. It can be applied to a circuit board.

以下に実施例を示し、本発明をさらに具体的に説明するが、本発明は、何ら実施例に限定されることはない。
実施例１
厚さ２５μｍのステンレス箔（ＳＵＳ３０４ Ｈ−ＴＡ）からなる支持基板の上に、感光性ポリイミド樹脂の前駆体の溶液を、乾燥後の厚さが２４μｍとなるように塗工した後、１３０℃で乾燥することにより、感光性ポリイミド樹脂の前駆体の皮膜を形成した。次いで、皮膜を、フォトマスクを介して露光（４０５ｎｍ、１５００ｍＪ／ｃｍ2）させ、露光部分を１８０℃に加熱した後、アルカリ現像液を用いて現像することにより、その皮膜をネガ型の画像でパターン化した。次いで、パターン化された感光性ポリイミド樹脂の前駆体の皮膜を、３５０℃で加熱して、硬化（イミド化）させ、これによって、厚さ１０μｍのポリイミド樹脂からなるベース絶縁層を、上記した所定のパターン（すなわち、基板側端子部および磁気ヘッド側端子部の各端子に対応する位置を含む平面視略矩形部分に、開口部分が形成されるパターン）で形成した。 EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the examples.
Example 1
On a support substrate made of a stainless steel foil (SUS304 H-TA) having a thickness of 25 μm, a solution of a precursor of a photosensitive polyimide resin was applied so that the thickness after drying was 24 μm, and then at 130 ° C. By drying, a film of a precursor of a photosensitive polyimide resin was formed. Next, the film is exposed through a photomask (405 nm, 1500 mJ / cm 2 ), the exposed portion is heated to 180 ° C., and then developed using an alkali developer, whereby the film is a negative image. Patterned. Next, the patterned film of the photosensitive polyimide resin precursor is heated at 350 ° C. to be cured (imidized), whereby the base insulating layer made of polyimide resin having a thickness of 10 μm is formed as described above. (That is, a pattern in which an opening is formed in a substantially rectangular portion in plan view including positions corresponding to the terminals of the substrate-side terminal portion and the magnetic head-side terminal portion).

次いで、支持基板およびベース絶縁層の全面に、種膜として、厚さ３００Åのクロム薄膜と厚さ７００Åの銅薄膜とをスパッタリングによって順次形成した。その後、種膜の上に、導体パターンの反転パターンでめっきレジストを、ドライフィルムレジストを用いて形成した。そして、電解銅めっきにより、めっきレジストから露出する種膜の上に、導体パターンを形成した。   Next, a chromium thin film having a thickness of 300 mm and a copper thin film having a thickness of 700 mm were sequentially formed as seed films on the entire surface of the support substrate and the base insulating layer by sputtering. Thereafter, a plating resist was formed on the seed film using a reverse pattern of the conductor pattern using a dry film resist. Then, a conductive pattern was formed on the seed film exposed from the plating resist by electrolytic copper plating.

このようにして形成された導体パターンは、その厚さが２０μｍで、そのパターンが、各配線の幅２０μｍ、各配線間の間隔が３０μｍの、互いに所定の間隔を隔てて平行状に配置される４本の配線パターンとして形成した。また、この導体パターンの各配線の形成と同時に、ベース絶縁層の開口部分に対応する種膜の上に、基板側端子部および磁気ヘッド側端子部の各端子を、導体パターンにおける他の部分に対して、支持基板側に厚さ方向に凹むようにして形成した。   The conductor pattern thus formed has a thickness of 20 μm, and the pattern is arranged in parallel with a predetermined distance from each other, with the width of each wiring being 20 μm and the spacing between the wirings being 30 μm. Four wiring patterns were formed. Simultaneously with the formation of each wiring of this conductor pattern, the terminals of the substrate side terminal portion and the magnetic head side terminal portion are placed on other portions of the conductor pattern on the seed film corresponding to the opening portion of the base insulating layer. On the other hand, it was formed so as to be recessed in the thickness direction on the support substrate side.

その後、めっきレジストを、化学エッチングによって除去した後、導体パターンから露出する種膜（銅薄膜およびクロム薄膜）を、化学エッチングにより除去した。
次いで、導体パターンの表面および支持基板の表面に、無電解ニッケルめっきによって、厚さ０．１μｍの硬質のニッケル薄膜を形成した。
次いで、ニッケル薄膜およびベース絶縁層の上に、感光性ポリイミド樹脂の前駆体の溶液を塗工した後、１３０℃で加熱することにより、感光性ポリイミド樹脂の前駆体の皮膜を形成した。その後、皮膜を、フォトマスクを介して露光（４０５ｎｍ、１５００ｍＪ／ｃｍ2）させ、露光部分を１８０℃に加熱した後、アルカリ現像液を用いて現像することにより、この皮膜によって導体パターンが被覆されるようにパターン化した。次いで、パターン化された感光性ポリイミド樹脂の前駆体の皮膜を、３５０℃で加熱して、硬化（イミド化）させ、これによって、厚さ３μｍのポリイミド樹脂からなるカバー絶縁層を、導体パターンが被覆されるように、上記した所定のパターン（すなわち、基板側端子部および磁気ヘッド側端子部の各端子に対応する位置を含む平面視略矩形部分に、開口部分が形成されるパターン）で、ベース絶縁層の上に形成した。 Thereafter, the plating resist was removed by chemical etching, and then the seed films (copper thin film and chromium thin film) exposed from the conductor pattern were removed by chemical etching.
Next, a hard nickel thin film having a thickness of 0.1 μm was formed on the surface of the conductor pattern and the surface of the support substrate by electroless nickel plating.
Next, a solution of a photosensitive polyimide resin precursor was applied onto the nickel thin film and the base insulating layer, and then heated at 130 ° C. to form a photosensitive polyimide resin precursor film. Thereafter, the film is exposed (405 nm, 1500 mJ / cm 2 ) through a photomask, and the exposed portion is heated to 180 ° C. and then developed using an alkali developer, so that the conductor pattern is covered with this film. Patterned as follows. Subsequently, the patterned film of the photosensitive polyimide resin precursor is heated at 350 ° C. to be cured (imidized), whereby a cover insulating layer made of polyimide resin having a thickness of 3 μm is formed on the conductor pattern. In the predetermined pattern described above (that is, a pattern in which an opening is formed in a substantially rectangular portion in plan view including a position corresponding to each terminal of the substrate side terminal portion and the magnetic head side terminal portion) so as to be covered, It was formed on the base insulating layer.

次いで、支持基板におけるカバー絶縁層の開口部分に対応する部分に、ベース絶縁層の開口部分が露出するように、その開口部分よりも大きな開口部分を、化学エッチングにより形成した。なお、この開口部分の形成と同時に、化学エッチングにより、ジンバル部のタング部を切り抜いて形成した。
次いで、カバー絶縁層の開口部分から露出するニッケル薄膜、および、支持基板の上に形成されているニッケル薄膜を剥離した。 Next, an opening portion larger than the opening portion was formed by chemical etching so that the opening portion of the base insulating layer was exposed at a portion corresponding to the opening portion of the cover insulating layer in the support substrate. At the same time as forming the opening, the tongue of the gimbal was cut out by chemical etching.
Subsequently, the nickel thin film exposed from the opening part of a cover insulating layer and the nickel thin film formed on the support substrate were peeled.

その後、ベース絶縁層の開口部分から露出する種膜を剥離し、露出した各端子の両面に、めっき層を、電解ニッケルめっきと電解金めっきとにより、厚さ２μｍのニッケルめっき層および厚さ１μｍの金めっき層を形成することによって、形成した。
そして、このようにして得られた回路付サスペンション基板を、以下の方法により、電気的に導通検査した。 Thereafter, the seed film exposed from the opening of the base insulating layer is peeled off, and a plated layer is formed on both surfaces of each exposed terminal by nickel electrolysis and electrogold plating, and a nickel plating layer having a thickness of 2 μm and a thickness of 1 μm. The gold plating layer was formed.
The suspension board with circuit thus obtained was electrically inspected by the following method.

すなわち、上記により得られた回路付サスペンション基板の磁気ヘッド側端子部の各端子の表面を磁気ヘッドと接続するための接続用端子とし、その裏面を磁気ヘッド側導通検査用端子とした。また、基板側端子部の各端子の表面を、制御回路基板と接続するための接続用端子とし、その裏面を基板側導通検査用端子とした。そして、磁気ヘッド側導通検査用端子および基板側導通検査用端子に検査用プローブを接触させて導電することにより、両端子間の導通が正常か不良かを検査した。   That is, the surface of each terminal of the magnetic head side terminal portion of the suspension board with circuit obtained as described above was used as a connection terminal for connecting to the magnetic head, and the back surface thereof was used as a magnetic head side continuity test terminal. Moreover, the surface of each terminal of the board | substrate side terminal part was used as the connection terminal for connecting with a control circuit board, and the back surface was used as the board | substrate side conduction | electrical_connection test terminal. Then, an inspection probe was brought into contact with the magnetic head side continuity inspection terminal and the substrate side continuity inspection terminal to conduct electricity, thereby inspecting whether the continuity between both terminals was normal or defective.

本発明の回路付サスペンション基板の一実施形態を示す平面図である。It is a top view which shows one Embodiment of a suspension board with a circuit of this invention. 図１に示す回路付サスペンション基板における基板側端子部の側断面図である。It is a sectional side view of the board | substrate side terminal part in the suspension board with a circuit shown in FIG.

符号の説明Explanation of symbols

１ 回路付サスペンション基板
４ 導体パターン
１３ 接続用端子
１５ 導通検査用端子 1 Suspension board with circuit 4 Conductor pattern 13 Terminal for connection 15 Terminal for continuity test

Claims (2)

導体パターンを備えた配線回路基板の導通検査方法であって、
前記導体パターンの表面の一部が、接続用端子として用いられ、
その接続用端子として用いられる導体パターンの表面に対応する裏面を、導通検査用端子として用いることを特徴とする、配線回路基板の導通検査方法。 A method for inspecting the continuity of a printed circuit board provided with a conductor pattern,
A part of the surface of the conductor pattern is used as a connection terminal,
A continuity inspection method for a printed circuit board, wherein a back surface corresponding to a surface of a conductor pattern used as a connection terminal is used as a continuity inspection terminal. 前記配線回路基板が、回路付サスペンション基板であることを特徴とする、請求項１に記載の配線回路基板の導通検査方法。
The continuity inspection method for a wired circuit board according to claim 1, wherein the wired circuit board is a suspension board with circuit.
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CN104422851A (en) * 2013-09-05 2015-03-18 日东电工株式会社 Conductivity inspection method of printed circuit board and manufacturing method of printed circuit board
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CN111722154A (en) * 2013-09-05 2020-09-29 日东电工株式会社 Method for inspecting conduction of printed circuit board and method for manufacturing printed circuit board

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