JPH03119783A - Hybrid integrated circuit device, manufacture thereof and discrimination thereof - Google Patents

Abstract

PURPOSE:To make it possible to discriminate a type of product without producing any print process required to print discrimination display by forming a product discrimination thick film discolorable or eliminatable by the irradiation with a laser beam. CONSTITUTION:One product discrimination thick film 6a is printed on the left side of lead lands 5 while two product discrimination thick films 6b and 6c are printed on the right side. Under this state, a laser beam is applied to a resistor pattern formed on a substrate 1 so as to trim the resistor pattern, thereby controlling its resistance value. At that time, a laser beam is partially applied to the product discrimination thick films 6a to 6c so as to discolor or eliminate, which changes the pattern by the discolor or elimination even if they are the same printed product discrimination thick film 6a to 6c. It is, therefore possible to discriminate the type of product with ease.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention relates to a hybrid integrated circuit device in which a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3, a method for manufacturing the same, and a method for determining the type thereof. Regarding how to.

[Prior Art] When manufacturing a hybrid integrated circuit, the hybrid integrated circuit device itself is provided with an indication for identifying the product. In this case, conventionally, in order to provide identification marks for each item, a special printing plate, for example, a screen, was created for the identification marks, and the identification marks were printed on the circuit board using a printing method such as screen printing. .

[Problems to be Solved by the Invention] However, with the conventional discrimination display means, a printing plate such as a discrimination display screen must be prepared for each individual product.

Furthermore, in the prototyping and mass production processes of hybrid integrated circuits, different products may be manufactured with the same thick film pattern, but in such cases, a , a distinguishing display similar to a landmark may be provided. Even with such a discrimination display, with conventional means, a different printing plate had to be created for each discrimination display.

This poses a problem in that it takes time and money to produce the printing plate, which becomes an obstacle to reducing the cost of hybrid integrated circuits.

In view of the above-mentioned problems, the present invention aims to provide a hybrid integrated circuit device, a method for manufacturing the same, and a method for identifying the same, which can easily display the discrimination display without making a printing plate for printing the discrimination display. do.

[Means for Solving the Problems] In other words, the gist of the means employed in the present invention to achieve the above object is as follows: First, a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3. In the hybrid integrated circuit device, a thick film 6as6bt6C for product identification that can be discolored or removed by laser beam irradiation is formed on the circuit board 3 on which the thick film pattern 7 is not formed. It is.

Second, in a method for manufacturing a hybrid integrated circuit device by forming a thick film pattern 7 constituting an electronic circuit on a circuit board 3, a laser beam is applied to the circuit board 3 on which the thick film pattern 7 is not formed. This is a method for manufacturing a hybrid integrated circuit device in which a thickness of JIi 68% 6 bs 6 c for product identification that can be discolored or removed by irradiation is formed, and any part thereof is irradiated with a laser beam.

Thirdly, in a method for determining the type of a hybrid integrated circuit device in which a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3, a method for determining the type of a hybrid integrated circuit device in which a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3 on which the thick film pattern 7 is not formed. A method for identifying a hybrid integrated circuit device in which a thick film for product identification 6a16b16c that can be discolored or removed by irradiation with a laser beam is formed on the product, and the type of the product is determined based on the difference in appearance of the thick film for product identification 6as, 8bs, 6c. It is.

[Function] In the present invention, a thick film 6a for product identification that can be discolored or removed by laser beam irradiation is provided on the circuit board 3.
z 6 bs 6 c, even if these thick films 6 aN6 bs6 c for product identification are formed in the same pattern, if they are irradiated with a laser beam and discolored or removed, they will be discolored or removed. You will be able to clearly distinguish between what is not there. In addition, if a plurality of these thick films 6 as 6 bs 6 c for product identification are printed and some or all of them are discolored or deleted with a laser beam, the discolored or deleted thick films 5 as
It can be distinguished from others by the position and combination of 6bs and 6c. In this way, the same pattern of thick film 6
AS 6BS 6C can also be distinguished by processing it with a laser beam, so there is no need to use a separate printing plate for each item with a different discrimination display, and they can all be formed using the same printing plate.

In addition, the thick film 6a, 6bt 6C for product identification
If it is printed at the same time as the thick film pattern 7 constituting the electronic circuit, a separate printing process for displaying the discrimination becomes unnecessary, and labor saving in the printing process can be achieved. Furthermore, a thick film 68 for product identification
If laser beam irradiation to %6b16c is performed at the same time as when trimming the thick film resistor formed on the circuit board or when using the laser scriber, a special process for laser beam irradiation will not be necessary, and the process will also be reduced. Labor saving becomes possible.

[Embodiments] Next, embodiments of the present invention will be specifically described with reference to the drawings.

As shown in Figure 1, the mother board I of the insulating board is made up of several circuit boards, such as a ceramic board mainly made of insulating ceramic such as alumina, or a mother board mainly made of resin. A resin substrate or the like is generally used.

First, a laser scriber is used to separate each circuit board 3.3.
. . . are formed on the mother board l, and through holes are formed on the circuit boards 3. 3 . . . . Next, a thick film pattern is printed on this motherboard l according to a predetermined circuit pattern. This thick film pattern is made by printing a conductor pattern, a resistor pattern, and a dielectric pattern one after the other using a thick film printing screen for each pattern using conductive paste, resistance paste, dielectric paste, etc., and then printing them. . Furthermore, a resist pattern is formed using a solder resist so as to partially cover the conductor pattern, resistor pattern, and dielectric pattern.

In the present invention, a thick film 6as 6bs for product identification is provided on a portion of the circuit board 3 where the thick film pattern 7 is not formed.
Print 6c. This printing includes the conductor pattern,
It is desirable to print at the same time as printing either the resistor pattern or the dielectric pattern. The thick film 6a16bs6c for product discrimination is formed to a size that can be visually recognized, for example, about 0.5 mm square. Furthermore, it is necessary that these thickness III 8 as 6 bs 6 c can be discolored or removed by laser beam irradiation, and should be formed at the same time as the resistor pattern using a resistor paste such as ruthenium oxide. However, it is of course possible to form other patterns at the same time.

As shown in FIGS. 1 and 2, in the illustrated embodiment, one thick film 6az 6bt 6c for product identification is printed on the left side of the lead land 5.5 and two on the right side. . Of course, the number and printing positions of these thick films 6a16b16C are not limited to these.

The mother board 1 manufactured in this way is shown in FIG. Adjust values. At this time, a part of the thick film 6a16bs6c for product identification is irradiated with a laser beam to discolor or remove it. As a result, even if the thick films 6 as 6 bs 6 c for product discrimination are printed with the same pattern, the pattern changes due to discoloration or deletion, so that it is possible to distinguish between different products.

In addition, when performing so-called function trimming after this,
The thick film 6 as for product identification during this functional trimming
6 bt 6 c may be irradiated with a laser beam to discolor or delete it.

Next, cream solder is printed on the soldering land that is not covered with the resist pattern in the thick film pattern 7 of the circuit board 3.3, and electronic components (not shown) are attached to the circuit board 3.3. After mounting on..., these electronic components are soldered through reflow soldering.

After that, depending on the product, the circuit after mounting the components may be
Comprehensive characteristic adjustment, so-called functional trimming, may be performed. That is, the contact bottle of the measuring device is applied to the lead lands 5.5 connected to the thick film pattern 7, and while measuring the characteristics of the circuit, laser trimming is performed to adjust the characteristics of the hybrid integrated circuit.

Finally, after separating into individual circuit boards 3.3 along cutting lines 2.2,... Solder lead terminals (not shown) to lead lands 5.5.... This completes the hybrid integrated circuit device.

[Effects of the Invention] As explained above, according to the present invention, there is no need to create a separate printing plate for each product identification display of a hybrid integrated circuit device (and it is possible to save labor in the process). This has the effect of saving labor and streamlining the manufacturing process of hybrid integrated circuit devices.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a mother board of a circuit board of a hybrid integrated circuit device, which is an embodiment of the present invention, and FIG.
FIG.

Claims (5)

[Claims] (1) In a hybrid integrated circuit device in which a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3, the circuit board 3 on which the thick film pattern 7 is not formed is discolored by irradiation with a laser beam. Alternatively, a hybrid integrated circuit device is characterized in that thick films 6a, 6b, and 6c are formed for product discrimination, which can be removed. (2) The hybrid integrated circuit device according to claim 1, wherein any of the thick films 6a, 6b, and 6c for product discrimination are discolored or removed by laser beam irradiation. (3) In a method for manufacturing a hybrid integrated circuit device by forming a thick film pattern 7 constituting an electronic circuit on a circuit board 3, the circuit board 3 on which the thick film pattern 7 is not formed is irradiated with a laser beam. 1. A method for manufacturing a hybrid integrated circuit device, which comprises forming thick films 6a, 6b, and 6c for product identification that can be discolored or removed by irradiating a laser beam onto any of the thick films 6a, 6b, and 6c. (4) The method of manufacturing a hybrid integrated circuit device according to claim 3, wherein the thick films 6a, 6b, 6c for product discrimination are formed simultaneously with the thick film pattern 7. (5) In a method for determining the type of a hybrid integrated circuit device in which a thick film pattern 7 constituting an electronic circuit is formed on a circuit board 3, a circuit board 3 on which the thick film pattern 7 is not formed. Forming thick films 6a, 6b, and 6c for product identification that can be discolored or removed by laser beam irradiation,
A method for discriminating a hybrid integrated circuit device, characterized in that the type of the product is discriminated based on the difference in appearance of these thick films 6a, 6b, and 6c for discriminating the product.