JPH03259591A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPH03259591A JPH03259591A JP5651190A JP5651190A JPH03259591A JP H03259591 A JPH03259591 A JP H03259591A JP 5651190 A JP5651190 A JP 5651190A JP 5651190 A JP5651190 A JP 5651190A JP H03259591 A JPH03259591 A JP H03259591A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- alumina substrate
- alumina
- substrate
- laser scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 abstract description 3
- 235000011089 carbon dioxide Nutrition 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 210000005069 ears Anatomy 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ハイブリッド集積回路装置のごとく、多品種
少量生産の回路基板を製造する回路基板製造方法に係り
、特に、アルミナ基板を分割する際に発生するバリを除
去する方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a circuit board manufacturing method for manufacturing a high-mix low-volume circuit board such as a hybrid integrated circuit device, and particularly relates to a circuit board manufacturing method for manufacturing a high-mix low-volume circuit board, such as a hybrid integrated circuit device. The present invention relates to a method for removing burrs that occur in the process.
回路基板を形成するための基板の形状寸法は、その回路
基板を組込むための電子機器の内部構造や、回路ユニッ
トの規模により決定される。そのため、多品種少量生産
になる場合が多い。そこで、回路基板の種別毎に基板の
形状寸法が異なると、回路基板の種別が変わる度に、各
工程における製造装置の設定条件を変えなくてはならな
い。そのために行われる回路基板の位置決めや支持等の
調整作業は、非常に繁雑になる。The shape and dimensions of a board for forming a circuit board are determined by the internal structure of an electronic device into which the circuit board is installed and the scale of the circuit unit. Therefore, high-mix, low-volume production is often required. Therefore, if the shape and dimensions of the circuit board differ depending on the type of circuit board, the setting conditions of the manufacturing equipment in each process must be changed every time the type of circuit board changes. Therefore, the adjustment work such as positioning and supporting the circuit board becomes extremely complicated.
上記問題を解決するために、耳部を付けて所定の形状寸
法の回路基板にしたり、あるいは必要により複数個の回
路基板を連結した集合回路基板として、これらの回路基
板の周囲に捨て去ることのできる耳部を設け、集合回路
基板の外形寸法を所定の大きさに揃えていた。In order to solve the above problem, it is possible to attach ears to make a circuit board with a predetermined shape and size, or if necessary, it is possible to create a collective circuit board by connecting multiple circuit boards and discard it around these circuit boards. Ears were provided to align the external dimensions of the collective circuit board to a predetermined size.
このようにすると、外形寸法が一定であるだけでなく、
耳部が製造装置の搬送部または支持部になるので、回路
基板全面に電子部品を搭載できる。In this way, not only the external dimensions are constant, but also
Since the ear part becomes the transport part or support part of the manufacturing device, electronic components can be mounted on the entire surface of the circuit board.
以上のような集合回路基板の従来例について第２図およ
び第３図（イ〉、（ロ）を参照しつつ説明する。A conventional example of the collective circuit board as described above will be explained with reference to FIGS. 2 and 3 (a) and (b).
第２図は従来例における分割可能な集合回路基板説明図
、第３図（イ）および（ロ）は従来例における厚膜回路
基板説明図である。FIG. 2 is an explanatory diagram of a dividable collective circuit board in a conventional example, and FIGS. 3(A) and (B) are explanatory diagrams of a thick film circuit board in a conventional example.
第２図において、集合回路基板ＩＯはたとえば、純度９
６％のアルミナ基板からなり、複数の回路基板１１と耳
部１３とから構成される。そして、各回路基板１１の周
囲には、分割溝１２が設けられて所定の外形寸法に形成
されている。また、分割溝１２は、たとえば、レーザー
スクライブ加工により形成される。このようにしてでき
た回路基板１１は、分割溝１２の部分から、たとえば、
手によって分割される。分割された回路基板１１の分割
溝１２の周辺表面には、レーザースクライブ加工の際に
第３図（イ）図示のごとく、アルミナ粉末が付着してバ
リ１５を形成している。このアルミナ粉末からなるバリ
は、回路基板１１の当該部分を擦り合わせて除去される
。In FIG. 2, the integrated circuit board IO has a purity of 9, for example.
It is made of a 6% alumina substrate and includes a plurality of circuit boards 11 and ears 13. A dividing groove 12 is provided around each circuit board 11 to have a predetermined outer size. Moreover, the dividing groove 12 is formed by laser scribing, for example. The circuit board 11 made in this way is separated from the dividing groove 12 by, for example,
Divided by hand. As shown in FIG. 3(a), alumina powder adheres to the peripheral surface of the dividing groove 12 of the divided circuit board 11 during laser scribing, forming a burr 15. This burr made of alumina powder is removed by rubbing the relevant portion of the circuit board 11 together.
次に、回路基板１１の上に導体ペースト、たとえばＡｇ
Ｐｄ系導体ペースト、を印刷して乾燥後焼成することに
より導体パターン１４を形成する。Next, a conductive paste, for example Ag, is applied onto the circuit board 11.
A conductor pattern 14 is formed by printing a Pd-based conductor paste, drying it, and then firing it.
その後、抵抗ペーストを印刷して乾燥後焼成することに
より抵抗体を形成し、当該抵抗体の上から抵抗値を安定
させるためのオーバーコート・ガラスペーストを印刷し
て乾燥する。そして、上記抵抗体の抵抗値を決めるため
にオーバーコート・ガラス膜の上から抵抗体をトリミン
グする。Thereafter, a resistor is formed by printing a resistor paste, drying and firing it, and an overcoat glass paste for stabilizing the resistance value is printed over the resistor and dried. Then, in order to determine the resistance value of the resistor, the resistor is trimmed from above the overcoat glass film.
回路基板を大量生産する場合には、アルミナ基板を型抜
きするため、その端面近傍の表面あらさは、他の表面と
変わりなく、導体パターンを形成する際に何ら影響を与
えない。しかし、前述のごとく少量生産の場合には、ア
ルミナ基板をレーザースクライブ加工で分割溝を形成し
、この分割溝にしたがって個々のアルミナ基板に分割す
る。そして、この分割溝にしたがって分割する際に発生
したバリは、回路基板の擦り合わせにより除去されるが
、このバリが除去された後の表面のあらさは、他の表面
のあらさより粗い。また、前記バリが完全に除去されず
に残されていると、その表面はアルミナの微粉末からな
る凹凸面となる。When mass-producing circuit boards, the alumina substrate is die-cut, so the surface roughness near the end face is no different from other surfaces and does not affect the formation of conductive patterns. However, as mentioned above, in the case of small-volume production, the alumina substrate is laser scribed to form dividing grooves, and the alumina substrates are divided into individual alumina substrates according to the dividing grooves. The burrs generated when dividing the circuit board along the dividing grooves are removed by rubbing the circuit boards together, but the surface roughness after the burrs are removed is rougher than other surfaces. Further, if the burrs are not completely removed and remain, the surface becomes an uneven surface made of fine alumina powder.
上記のような凹凸面あるいは表面あらさの粗い面に導体
ペーストおよび抵抗ペーストを印刷した場合、印刷がか
すれてしまい、導体パターンの断線あるいは抵抗値の不
良が発生するという問題を有している。When a conductive paste and a resistive paste are printed on an uneven surface or a surface with a rough surface roughness as described above, there is a problem that the printing becomes blurred, resulting in disconnection of the conductive pattern or defective resistance value.
また、バリが発生した部分を避けて導体ペーストあるい
は抵抗ペーストを印刷すると、回路基板の有効面積が少
なくなるという問題を有する。Furthermore, if the conductive paste or the resistive paste is printed avoiding areas where burrs are generated, there is a problem in that the effective area of the circuit board decreases.
以上のような問題を解決するために、本発明は、レーザ
ースクライブ加工によって発生したバリを再焼成により
除去する回路基板の製造方法を提供することを目的とす
る。In order to solve the above problems, an object of the present invention is to provide a method for manufacturing a circuit board in which burrs generated by laser scribing are removed by re-baking.
前記目的を達成するために、本発明におけるアルミナ基
板を用いた回路基板の製造方法は、焼成されたアルミナ
基板から個々の回路基板に分割するための分割溝を形成
するレーザースクライブ加工の後、前記レーザースクラ
イブ加工により発生したバリを除去するために、前記ア
ルミナ基板を１５００度Ｃで４時間再焼成することを特
徴とする。In order to achieve the above object, the method of manufacturing a circuit board using an alumina substrate according to the present invention includes a laser scribing process for forming dividing grooves for dividing a fired alumina substrate into individual circuit boards. In order to remove burrs generated by laser scribing, the alumina substrate is re-baked at 1500 degrees Celsius for 4 hours.
回路基板を分割するためにレーザースクライブ加工を用
いると、分割溝は細く形成されるが、この際に発生する
熱は２０００度Ｃを越える。そのためにアルミナの結晶
は、破壊されて微粉末の形すなわち、バリとなって分割
溝の周辺に付着する。When laser scribing is used to divide a circuit board, the dividing grooves are formed to be thin, but the heat generated at this time exceeds 2000 degrees Celsius. For this reason, the alumina crystals are broken and form fine powder, that is, burrs, which adhere to the periphery of the dividing groove.
バリが発生している回路基板を１５００度Ｃで４時間再
焼成すると、結晶のくずれたアルミナは、溶けｋして軟
化した状態で回路基板の表面が平滑になる。この場合の
表面のあらさを測定すると他の表面と変わりがないこと
を発見した。再焼戒後の回路基板は、従来と同様な方法
で各種ペーストを印刷し、乾燥後焼成してトリミング等
の処理を行う。When a circuit board with burrs is re-fired at 1500 degrees Celsius for 4 hours, the alumina with broken crystals melts and softens, resulting in a smooth surface of the circuit board. When we measured the roughness of the surface in this case, we discovered that it was no different from other surfaces. After re-burning, the circuit board is printed with various pastes in the same manner as in the past, dried, fired, trimmed, etc.
このようにして得られた回路基板には、導体パターンの
断線および抵抗値の不良等の障害は発生しない。The circuit board obtained in this way does not suffer from failures such as disconnection of conductor patterns or poor resistance values.
第１図を参照しつつ本発明における厚膜回路基板の製造
方法を説明する。第１図において、アルミナ基板ｌは、
たとえば、純度９６％のアルミナからなる磁器基板で、
このアルミナ基板１を分割して個々の厚膜回路基板を作
製する。アルミナ基板１の表面を所望の大きさに、たと
えば、炭酸ガスレーザーによるレーザースクライブ加工
で分割溝３を形成する。その後、上記アルミナ基板１を
１５００度Ｃで４時間再焼成を行う。なお、レーザース
クライブ加工後のアルミナ基板に対して、再焼成温度を
１３００度Ｃないし１７００度Ｃ１焼成時間を２ないし
５時間で実験を行った結果、アルミナ基板の分割溝３近
傍の表面あらさは、１５００度Ｃで４時間かけて焼成し
た場合が一番良かった口
そして、上記アルミナ基板ｌ上に、導体ペーストを分割
溝３の中央部から２００μｍの位置ａに３００μｍの幅
すでスクリーン印刷をし、１５０度ＣでＩＯ分乾燥を行
った後、８５０度Ｃで焼成を行った。A method for manufacturing a thick film circuit board according to the present invention will be explained with reference to FIG. In FIG. 1, the alumina substrate l is
For example, a porcelain substrate made of 96% pure alumina,
This alumina substrate 1 is divided into individual thick film circuit boards. Dividing grooves 3 are formed on the surface of the alumina substrate 1 to a desired size by, for example, laser scribing using a carbon dioxide laser. Thereafter, the alumina substrate 1 is re-fired at 1500 degrees Celsius for 4 hours. In addition, as a result of conducting an experiment on the alumina substrate after laser scribing processing at a re-firing temperature of 1300 degrees C to 1700 degrees C1 firing time of 2 to 5 hours, the surface roughness near the dividing groove 3 of the alumina substrate was as follows. The best results were obtained by firing at 1500 degrees C for 4 hours.Then, on the alumina substrate L, conductive paste was screen printed at a position a 200 μm from the center of the dividing groove 3 with a width of 300 μm. After drying for IO minutes at 150 degrees Celsius, baking was performed at 850 degrees Celsius.
焼成後、１５０μｍ以下の導体パターン２の幅の部分が
存在した場合を不良として、３００個の試料について調
査を行った。その結果、本発明の製造方法でバリを除去
したアルミナ基板１に導体パターン２を形成した場合に
は、不良が０個であるのに対して、再焼成なしのアルミ
ナ基板を擦り合わせてバリを除去したアルミナ基板に導
体パターンを形成した場合には、３００個の試料で９２
個の不良が発生した。After firing, 300 samples were examined, with the presence of a portion of the width of the conductor pattern 2 of 150 μm or less as defective. As a result, when the conductor pattern 2 was formed on the alumina substrate 1 from which burrs were removed by the manufacturing method of the present invention, there were no defects, whereas the burrs were removed by rubbing the alumina substrates without re-firing. When a conductive pattern was formed on the removed alumina substrate, 92
A number of defects occurred.
以上、本発明の実施例を詳述したが、本発明は、前記実
施例に限定されるものではない。そして、特許請求の範
囲に記載された本発明を逸脱することがなければ、種々
の設計変更を行うことが可能である。Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.
たとえば、本実施例において、アルミナ基板上に厚膜を
形成する厚膜回路基板について説明したが、厚膜回路基
板に限定するものではなく、アルミナ基板を用いた回路
基板であれば、印刷配線板等にも適用できることはいう
までもない。For example, in this embodiment, a thick film circuit board in which a thick film is formed on an alumina substrate has been described, but this is not limited to thick film circuit boards, and any circuit board using an alumina substrate can be used as a printed wiring board. Needless to say, it can also be applied to
本発明によれば、アルミナ基板をレーザースクライブ加
工した後に、再焼成しているので、アルミナ基板の分割
溝近傍の表面が他の表面と同様なあらさであるため、こ
の部分に形成された導体パターンまたは抵抗等の印刷不
良が発生しない。According to the present invention, since the alumina substrate is laser scribed and then re-fired, the surface near the dividing groove of the alumina substrate has the same roughness as other surfaces, so the conductive pattern formed on this part Or printing defects such as resistors do not occur.
また、本発明によれば、スクライブ加工によって形成さ
れた分割溝近傍におけるアルミナ基板の表面あらさが他
の表面と同じであるから、実装密度を上げるために分割
溝近傍に導体パターンまたは抵抗を設けることができる
。Further, according to the present invention, since the surface roughness of the alumina substrate near the dividing grooves formed by scribing is the same as other surfaces, it is necessary to provide a conductive pattern or a resistor near the dividing grooves in order to increase the packaging density. I can do it.
第１図は本発明における厚膜回路基板説明図、第２図は
従来例における分割可能な集合回路基板説明図、第３図
（イ）および（ロ）は従来例における厚膜回路基板説明
図である。
■・・・アルミナ基板
２・・・導体パターン
３・・・分割溝
第
１
図
第
図Fig. 1 is an explanatory diagram of a thick film circuit board in the present invention, Fig. 2 is an explanatory diagram of a divisible collective circuit board in a conventional example, and Figs. 3 (a) and (b) are explanatory diagrams of a thick film circuit board in a conventional example. It is. ■...Alumina substrate 2...Conductor pattern 3...Dividing groove 1 Figure 1
Claims (1)
、 焼成されたアルミナ基板１から個々の回路基板に分割す
るための分割溝３を形成するレーザースクライブ加工の
後、前記レーザースクライブ加工により発生したバリを
除去するために、前記アルミナ基板１を１５００度Ｃで
４時間再焼成することを特徴とする回路基板の製造方法
。[Claims] In a method for manufacturing a circuit board using an alumina substrate 1, after a laser scribing process for forming dividing grooves 3 for dividing the fired alumina substrate 1 into individual circuit boards, the laser scribe process is performed. A method for manufacturing a circuit board, characterized in that the alumina substrate 1 is re-fired at 1500 degrees Celsius for 4 hours in order to remove burrs generated during processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5651190A JPH03259591A (en) | 1990-03-09 | 1990-03-09 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5651190A JPH03259591A (en) | 1990-03-09 | 1990-03-09 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03259591A true JPH03259591A (en) | 1991-11-19 |
Family
ID=13029151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5651190A Pending JPH03259591A (en) | 1990-03-09 | 1990-03-09 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03259591A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225910A (en) * | 2009-03-24 | 2010-10-07 | Ngk Spark Plug Co Ltd | Multiple patterning ceramic wiring board |
-
1990
- 1990-03-09 JP JP5651190A patent/JPH03259591A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010225910A (en) * | 2009-03-24 | 2010-10-07 | Ngk Spark Plug Co Ltd | Multiple patterning ceramic wiring board |
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