JP2500222B2 - Method of manufacturing printed wiring board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board which is suitable for a so-called hybrid integrated circuit board.

[0002]

2. Description of the Related Art A substrate of a so-called hybrid integrated circuit is formed on a ceramic substrate by using a thick film printing technique in which a conductor pattern, a resistor and the like are printed by a so-called screen printing method, drying and firing are repeated. .

Thereafter, cream solder is printed on the substrate completed by such a method, and electronic parts such as chip resistors are mounted. Mounting of electronic components on a board is performed, for example, in a cream solder printer and a component mounter with the board mounted at a predetermined mounting position. The loading position is guided by a transport rail attached to these devices.

[0004]

In the above-mentioned prior art,
The board does not have a character indicating the transport direction, and in the case of a hybrid integrated circuit in particular, the area required for each type of the hybrid integrated circuit is one board with a common outer shape. A plurality of substrates are formed, and each substrate is divided into a product. Therefore, the substrate can be transported in either the normal or reverse direction. Therefore, there is a problem that the electronic component is mounted in the wrong direction and the yield is reduced.

An object of the present invention is to provide a method for manufacturing a printed wiring board, which can clarify the carrying direction in the processing step of the printed wiring board and improve the yield.

[0006]

The present invention has a plurality of substrates to be divided and a peripheral portion common to the plurality of substrates.
In a method of manufacturing a printed wiring board in which one substrate is created through one or a plurality of printing steps, a conveyance direction in a processing step of the printed wiring board is performed on a common peripheral edge of the substrate by an overglass printing step. Is a method for manufacturing a printed wiring board, which is characterized in that characters related to are printed together.

[0007]

[0008]

According to the present invention, one substrate made of ceramic or the like and having a plurality of divided substrates and a peripheral portion common to the plurality of substrates is produced through one or a plurality of printing steps. , Used in so-called hybrid integrated circuits. In such an overglass printing process of a printed wiring board, characters such as arrows, letters, and symbols indicating the transport direction in the printed wiring board processing step are also formed by printing.

That is, for example, first, a conductor pattern is thick-film printed by a so-called screen printing method on a plurality of divided printed wiring boards, and then a conductor pattern is formed through drying and firing steps. After a resistor is printed on the printed wiring board on which the conductor pattern is formed by the same printing method, drying and firing are performed again. Next, the overglass is printed by a similar printing method.
At this time, characters such as the arrow indicating the transport direction in the process of processing the printed wiring board are also printed on the peripheral edge common to the plurality of boards. After that, the printed wiring board is completed by drying and baking, and resistance trimming and the like. In this way, the printed wiring board that is a finished product is mounted in the cream solder printer, the component mounter, or the like in the predetermined transport direction, and the electronic components are mounted between the predetermined conductor patterns.

Therefore, by printing the above-mentioned characters together in the overglass printing process, the carrying direction in the printed wiring board processing process is clarified, defective products are prevented from occurring, and the yield is increased. Can be improved. Further, in the printing process of the over-glass of the wiring board, by forming the character on the peripheral portion, it is possible to suppress the manufacturing cost of the printed wiring board as compared with the case of forming the conductor pattern with silver / palladium paste or the like. At the same time, the printing area of each of the plurality of substrates can be widened.

[0011]

1 is a plan view of a printed wiring board 1 on which an electronic component according to an embodiment of the present invention is mounted. The printed wiring board 1 on which this electronic component is mounted is configured as follows. A plurality of conductor patterns 3 to 8 are formed by printing on a substrate body 2 made of ceramic or the like, and a resistor 9 is formed on the conductor patterns 3 to 8.
10 and 11 are formed by printing. Further, after the overglass 50 shown by hatching is formed by printing on it, the resistors 9, 10, 11 are trimmed 9a, 10a, 11a with a laser beam or the like to obtain a desired resistance value.
Is done. The electronic component 12 is connected between the conductor patterns 4 and 5, and the electronic component 1 is connected between the conductor patterns 3 and 7.
3 and 14 are connected.

The portion 21 shown by the solid line of the printed wiring board 1 on which the electronic components 12 to 14 are mounted forms one hybrid integrated circuit. Also, the part 2 surrounded by the two-dot chain line
A hybrid integrated circuit similar to the portion 21 is formed in 2, 23, and 24. It should be noted that the arrow 26 is printed with overglass on the peripheral portion 25 of the printed wiring board 1 on which the electronic components 12 to 14 are not mounted. When the electronic components 12, 13, 14 are mounted on the printed wiring board 1 by the arrow 26 which is a character, the operator can accurately load the printed wiring board 1 on the transport rail of the mounting device without mistaking the direction of the printed wiring board 1. You can

2A to 2D are process drawings for explaining the manufacturing procedure of the printed wiring board 1. In step n1, silver / palladium paste or the like is printed and formed on the substrate body 2 by a thick film screen printing method or the like. As a result, FIG.
Conductor patterns 3 to 8 as shown by are formed. Then, drying is performed in step n2, and in step n3,
For example, it is fired for about 1 hour in an atmosphere of maximum 850 degrees.

At step n4, the resistors 9, 10 and 11 as shown in FIG. 4 are printed and formed on the wiring board 1 on which the conductor patterns 3 to 8 are formed by the same printing method. Then, drying is performed in step n5, and firing is performed in step n6.

In step n7, the overglass 50 shown by hatching in FIG. 5 is printed by the same printing method on the wiring board 1 on which the conductor patterns 3 to 8 and the resistors 9, 10 and 11 are formed. It is formed. At this time, the substrate body 2
An arrow 26 and the like are also printed and formed on the peripheral edge portion 25 of the over glass 50. The arrow 26 indicates the carrying direction in a processing step such as mounting an electronic component on the completed printed wiring board 1. Then, after drying is performed in step n8, firing is performed in step n9, and the wiring board 1
Is formed. In step n10, trimming 9a, 10a, 11a is performed to obtain a desired resistance value,
The printed wiring board 1 is completed.

Cream solder is printed on the completed printed wiring board 1, and electronic components 12, 13, such as chip resistors,
14 is implemented. The electronic components 12, 13 and 14 are mounted by, for example, a cream solder printer and a component mounter by mounting the printed wiring board 1 at a predetermined mounting position. The loading position is guided by a transport rail attached to these devices. At this time, the conveying direction of the printed wiring board 1 is clarified by the arrow 26,
The yield can be improved by preventing the occurrence of defective products due to work mistakes. Further, since the arrow 26 is also formed by printing in the printing process of the overglass 50, the manufacturing cost can be suppressed.

In this way, the electronic components 12, 13, 1
The printed wiring board 1 on which 4 is mounted is cut into each of the portions 21 to 24 along the V groove shown by the chain double-dashed line in FIG. 1 to form a hybrid integrated circuit board as shown in FIG. Thereafter, lead terminals are attached to the lands 3a and 5a to 8a formed by being connected to the conductor patterns 3, 5 to 8, and a mold of resin or the like is further applied to prevent moisture, and thus the hybrid integrated circuit board. Is completed.

[0018]

As described above, according to the present invention, a character such as an arrow indicating the carrying direction is printed on the wiring board at the common peripheral edge of the board during the overglass printing process. Therefore, the printing area of each of the plurality of substrates can be widened, the carrying direction in the process of processing the printed wiring board can be clarified, defective products can be prevented from occurring, and the yield can be improved.

Further, since the character is formed in the step of printing the overglass of the wiring board, the manufacturing cost can be suppressed as compared with the case where the character is formed of silver / palladium paste for the conductor pattern.

[Brief description of drawings]

FIG. 1 is a plan view of a printed wiring board 1 on which an electronic component according to an embodiment of the present invention is mounted.

FIG. 2 is a process drawing for explaining the manufacturing procedure of the printed wiring board 1.

FIG. 3 is a plan view of the printed wiring board 1 on which conductor patterns 3 to 8 are formed.

FIG. 4 is a plan view of the printed wiring board 1 on which resistors 9, 10 and 11 are formed by printing.

FIG. 5 is a plan view of the printed wiring board 1 on which an overglass 50 is formed by printing.

FIG. 6 is a perspective view showing a completed hybrid integrated circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Board body 3-8 Conductor patterns 9, 10, 11 Resistors 9a, 10a, 11a Trimming 12, 13, 14 Electronic parts 25 Peripheral part 26 Arrows 50 Over glass

Claims (1)

(57) [Claims] 1. A method of manufacturing a printed wiring board, wherein a single substrate having a plurality of divided substrates and a peripheral portion common to the plurality of substrates is produced through one or a plurality of printing steps. A method for manufacturing a printed wiring board, wherein characters related to a conveying direction in a processing step of the printed wiring board are also printed and formed on a common peripheral portion of the board by an overglass printing step.