JPH0645722A - Pin-erected type printed circuit substrate - Google Patents

Abstract

PURPOSE:To prevent the solder, to be used when a pin-erecting operation is conducted, from becoming obstruction to the other part by a method wherein the configuration and dimensions of the used pin are changed or the configuration of the through hole, where the pin is inserted, are changed. CONSTITUTION:In the pin-erected type printed circuit substrate on which the desired pin 3 is planted in the through hole provided on a printed circuit substrate 1, the length of the pin-inserting part (the length of the part, located upper than a flange 5, where the pin is inserted into the through hole) is made smaller than the depth of the through hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin stand type printed circuit board, and more particularly, to improve the shape and size of a pin to be used or to change the shape of a through hole into which the pin is inserted. The present invention relates to a pin stand type printed circuit board in which the solder used during the pin stand operation does not interfere with other parts.

[0002]

2. Description of the Related Art FIG. 7 is a schematic view of a conventional pin stand type printed circuit board. First, (A) of FIG.
In the printed circuit board 1, a flat-headed pin 3 with a brim 5 is inserted into a through hole 2 provided at an appropriate position so as to be substantially flush with the surface of the printed circuit board 1, and a suitable solder 4 is used. It is fixed. Further, FIG. 7B shows a state in which the pin 3 is inserted in an appropriate place around the printed circuit board 1 on which the required component 6 is provided. In the conventional example shown in FIG. 7, a flat-headed pin 3 with a brim 5 is inserted into a through hole 2 provided at an appropriate position of a printed circuit board 1 and then the side on which the pin 3 stands (solder). Required soldering is performed by performing a solder dipping operation on the surface side).

However, the above-mentioned conventional example has some problems as described below. That is, (1) When the required soldering is performed by performing the solder dip operation, the solder 4 rises on the side where the pin 3 is not standing (the side of the component surface). (2) Due to the swelling of the solder 4, when a required cream solder is printed using a corresponding metal mask (not shown), the space between the metal mask and the printed circuit board 1 is increased. The gap is too large. (3) As described above, since the gap between the metal mask and the printed circuit board becomes too large, the amount of cream solder used in the printing process increases, or the amount of cream solder applied to the peripheral portion increases. Blurring may occur. (4) The occurrence of an undesired short-circuit phenomenon increases when soldering by reflow processing after mounting the required components (this is particularly remarkable when a QFP is provided near the pin 3). Is).
Further, during the reflow process, the solder for soldering the pins 3 (so-called 9: 1 solder) is melted and rises. (5) For this reason, after the predetermined soldering work is completed, it is necessary to make various modifications such as repairing the short-circuited portion.

[0004]

As described above, in the above-mentioned prior art, when the required soldering is performed by the solder dip operation, the side where the pins 3 of the printed circuit board 1 are not raised (component surface). The swelling of the solder 4 occurs on the side); because of the swelling of the solder 4, the gap between the corresponding metal mask (not shown) and the printed circuit board 1 becomes too large, so that the printing process is performed. The amount of cream solder in the
Periphery may occur on the peripheral part; undesired short-circuit phenomenon increases when soldering by reflow processing after mounting required components; therefore, after predetermined soldering work is completed It is necessary to make various modifications such as repair of the short-circuited portion;

The present invention has been made in order to solve the above-mentioned problems, and by devising the shape and size of the pin to be used or changing the shape of the through hole into which the pin is inserted. An object of the present invention is to provide a pin stand type printed circuit board in which the solder used in the pin stand operation does not interfere with other parts.

[0006]

SUMMARY OF THE INVENTION According to the present invention, in a pin stand type printed circuit board in which required pins are planted in through holes provided in the printed circuit board, the length of the insertion portion of the pin is the through-hole. It is characterized in that it is made smaller than the depth of the hole portion.

[0007]

In the pin stand type printed circuit board according to the present invention, a desired pin is planted in a through hole portion provided in the printed circuit board, and the length of the insertion portion of the pin is the through hole portion. It is characterized by being made smaller than the depth of. And
Because of the structure having such characteristics, there is an advantage that the solder used at the time of pin raising work for the printed circuit board does not interfere with other parts.

[0008]

1 is a schematic explanatory view of a pin stand type printed circuit board according to an embodiment of the present invention. In FIG. 1, a pin 3 having a collar 5 lower than that of the printed circuit board 1 is inserted into a through hole 2 provided at an appropriate position of the printed circuit board 1 and fixed by an appropriate solder 4. Also in the embodiment shown in FIG. 1, after the pin 3 with the brim 5 is inserted into the through hole 2 provided at a proper position of the printed circuit board 1, the side where the pin 3 stands (solder surface) Required soldering is performed by performing a solder dip operation on the side).
Here, as described above, since the height of the pin 3 when viewed from the brim 5 is smaller than the thickness of the printed circuit board 1, an escape area for the excess solder 4 is generated,
The swelling of the solder 4 does not occur on the side where the pins 3 of the printed circuit board 1 are not raised (component side), and the inconvenience as in the above-described conventional example does not occur even during printing processing with cream solder.

FIG. 2 is a view showing an example of the shapes of various pins used in the above embodiment. 2 (A) in this
The head 3A of the pin 3 with the brim 5 has a flat head shape, which is the same as that used in FIG. 2B to 2G exemplify a two-step layered shape, a steeple shape, or a weight-shaped or cross-shaped shape when viewed two-dimensionally, and may be arbitrary as necessary. Can be selected and used. In addition, in these (B)-(G) of FIG. 2, 3B-3G represent the pin head, respectively. Then, for example, the groove-like portion 5A shown in FIGS. 2B and 2D.
Is provided for facilitating the inflow of bonding solder.

FIG. 3 is another schematic illustration of the pin stand type printed circuit board according to the embodiment of the present invention. First, in FIG. 3A, a through hole 2 provided at an appropriate position of the printed circuit board 1 has pins 3 lower than those of the printed circuit board 1 with a brim 5 (for example, in FIG. 2C). (With a pin head 3C) is inserted and secured with a suitable solder 4. Also in the case shown in FIG. 3A, after the pin 3 with the brim 5 is inserted into the through hole 2 provided at the proper position of the printed circuit board 1, the side on which the pin 3 stands. Required soldering is performed by performing a solder dip operation on the (solder surface side). Since the height of the pin 3 when viewed from the flange 5 (that is, the pin head 3C described above) is smaller than the thickness of the printed circuit board 1, the component surface side of the printed circuit board 1 is The swelling of the solder 4 does not occur, and the inconvenience as in the above-described conventional example does not occur during the printing process of the cream solder. Next, in FIG. 3B, a pin 3 lower than the printed circuit board 1 with a brim 5 is provided in a through hole 2 provided at an appropriate position of the printed circuit board 1.
(For example, the one provided with the pin head 3F in FIG. 2F) is inserted and fixed by an appropriate solder 4. Also in the case shown in FIG. 3B, after the pin 3 with the brim 5 is inserted into the through hole 2 provided at an appropriate position of the printed circuit board 1, the side on which the pin 3 stands. Required soldering is performed by performing a solder dip operation on the (solder surface side). Since the height of the pin 3 when viewed from the flange 5 (that is, the pin head 3F described above) is smaller than the thickness of the printed circuit board 1, the component surface side of the printed circuit board 1 is The swelling of the solder 4 does not occur, and the inconvenience as in the above-described conventional example does not occur during the printing process of the cream solder.

FIG. 4 is another schematic illustration of the pin stand type printed circuit board according to the embodiment of the present invention. In FIG. 4, an upper outer layer pattern 41, a first inner layer pattern 42, a second inner layer pattern 43 and a lower outer layer pattern 44 are laminated in this order on the pin stand type printed circuit board 1 according to the above embodiment. An appropriate through hole is provided at an appropriate position of the printed circuit board 1, and the first inner layer pattern 42 and the lower outer layer pattern 44 are electrically connected to each other so that the pin-forming through hole 45 is formed. Has been A via hole 46 having an appropriate shape and size is also formed in order to electrically connect the through hole 45 for standing the pin and the upper outer layer pattern 41.

FIG. 5 is another schematic illustration of the pin stand type printed circuit board according to the embodiment of the present invention. First, in FIG. 5A, the upper outer layer pattern 4 is formed.
The first inner layer pattern 42, the second inner layer pattern 43, and the lower outer layer pattern 44 are laminated inside and outside the pin stand type printed circuit board 1 in this order. Then, the pin 3 with a brim is inserted into a through hole 45 for pin stand, which is provided at an appropriate position of the printed circuit board 1 and electrically connects the first inner layer pattern 42 and the lower outer layer pattern 44. , Filled with solder 4. In addition,
In order to electrically connect the through hole 45 for raising the pin and the upper outer layer pattern 41, a via hole 46 having an appropriate shape and size is also formed. Next, also in FIG. 5B, the upper outer layer pattern 41, the first inner layer pattern 42, the second inner layer pattern 43, and the lower outer layer pattern 44 are sequentially laminated inside and outside the pin stand type printed circuit board 1. . And this printed circuit board 1
A pin 3 with a brim is inserted into a through hole 45 for pin stand, which is provided at a proper position in order to electrically connect the first inner layer pattern 42 and the lower outer layer pattern 44,
It is filled with solder 4. Further, in order to electrically connect the through hole 45 for pin up and the upper outer layer pattern 41, the via hole 4 having an appropriate shape and size is formed.
6 is also formed.

FIG. 6 is another schematic explanatory view of the pin stand type printed circuit board according to the embodiment of the present invention. First, as shown in FIG. 6A, the upper outer layer pattern 4 is formed on the pin stand type printed circuit board 1 according to the above embodiment.
The first inner layer pattern 42, the second inner layer pattern 43, and the lower outer layer pattern 44 are laminated in this order. Appropriate blind holes are provided at appropriate places on the printed circuit board 1, and the first inner layer pattern 42 and the lower outer layer pattern 4 are formed.
The first via hole 45A for the pin stand is formed by electrically connecting the first via hole 4A and the fourth via hole 4A. In addition, a small hole portion 45C for venting air is formed above the first via hole 45A. Then, the first via hole 45A for the pin stand and the upper outer layer pattern 4 are formed.
A second via hole 45B having an appropriate shape and size is formed in order to electrically connect 1 and 2. Next, as shown in FIG. 6B, the first via hole 45A provided at a proper position of the printed circuit board 1 is provided with a brim 5 (flat head 3
Pin 3 (with A) is inserted and filled with solder 4. At this time, the first via hole 45A
The air remaining inside is discharged through the small hole portion 45C for venting air. 6C that follows this is pin 3
6B is the same as the case of FIG. 6B except that the head portion of the head is a two-step layered portion 3F.

[0014]

As described in detail above, in the pin stand type printed circuit board according to the present invention, the required pins are planted in the through holes provided in the printed circuit board. It is characterized in that the length of the insertion portion is smaller than the depth of the through hole portion. Further, because of the structure having such characteristics, it is possible to provide an escape area for the excess solder generated when the required soldering process is performed, and to use the solder used during the pin raising work for the printed circuit board. Has the effect of not interfering with other parts.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a pin stand type printed circuit board according to an embodiment of the present invention.

FIG. 2 is a view showing an example of shapes of various pins used in the above embodiment.

FIG. 3 is another schematic explanatory diagram relating to the pin stand type printed circuit board according to the embodiment.

FIG. 4 is another schematic explanatory view of the pin stand type printed circuit board according to the embodiment.

FIG. 5 is another schematic explanatory diagram of the pin stand type printed circuit board according to the embodiment.

FIG. 6 is another schematic explanatory diagram related to the pin stand type printed circuit board according to the embodiment.

FIG. 7 is a schematic illustration of a conventional pin stand type printed circuit board.

[Explanation of symbols]

 1: printed wiring board; 2: through hole; 3: pin; 4: solder; 5: brim;

Claims (1)

[Claims] 1. A pin stand type printed circuit board in which a required pin is implanted in a through hole portion provided in a printed circuit board, wherein a length of an insertion portion of the pin is smaller than a depth of the through hole portion. A pin stand type printed circuit board characterized by being provided.