JP2010025751A - Characteristic measuring method and substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a characteristic measuring method useful for analysis of generation of a defect of an element found after shipping, and a substrate used for this method. <P>SOLUTION: This characteristic measuring method is a method of measuring the characteristic (resistance value) of many elements to be measured (thick resistors 20) disposed on the substrate 11. Many elements to be measured are classified into a plurality of groups (first to seventh groups), and elements to be measured belonging to each group are sequentially measured for each group. A measurement result of the elements to be measured belonging to each group is recorded as markings A-G in a predetermined part of a marking area 25 disposed on the substrate 11. When the measurement result shows a failure, the predetermined part is kept to be blank. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a characteristic measuring method and a substrate, and more particularly to a method for measuring characteristics of a large number of elements to be measured provided on the substrate and a substrate used in the method.

  In general, to measure the resistance value of elements such as thick film resistors formed on a circuit board at high density, and to distinguish good products from defective products, a large number of thick film resistors are divided into a plurality of groups, Characteristics were measured for each thick film resistor belonging to each group. If the resistance values of the thick film resistors are all good, the board has been shipped as a good product.

  However, when a defect is discovered after shipment, it is difficult to determine whether there is a mistake in the manufacturing process including characteristic measurement or whether a defect has occurred due to a trouble after shipment.

  In Patent Document 1, a separate probe card is prepared for each measurement group, and every time one round of trimming of all the pieces of a multi-chip substrate for one probe card is performed, the process proceeds to the next probe card. It is described that the operation is repeated. When a defect in a thick film resistor is detected in a piece, the thick film resistor whose resistance value is first measured with a probe card after that piece is trimmed to a disconnected state, and the defect is detected. The trimming of the next piece is performed without trimming the remaining thick film resistors in the measurement group in which the defect is detected.

The trimming method described in Patent Document 1 certainly improves the efficiency of the trimming operation. If all the trimmings are completed, it can be determined that all the thick film resistors satisfy the characteristics. However, when a defect is found after shipment, it is still difficult to determine whether there is a mistake in the manufacturing process including measurement of the resistance value or whether the defect has occurred due to a trouble after shipment.
JP 2001-307911 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a characteristic measurement method useful for analyzing the occurrence of a defect of an element discovered after shipment, and a substrate that can be suitably used in this method.

In order to achieve the above object, a characteristic measuring method according to the first aspect of the present invention comprises:
In a method for measuring the characteristics of a large number of elements to be measured provided on a substrate,
Dividing the plurality of measured elements into a plurality of groups, and sequentially measuring the measured elements belonging to each group for each group; and
Recording the measurement results of the elements to be measured belonging to each group at a predetermined location in the marking area provided on the substrate;
It is provided with.

The substrate according to the second embodiment of the present invention is
A substrate provided with a large number of elements to be measured,
Dividing the large number of measured elements into a plurality of groups, and having a marking area for recording the measured elements belonging to each group sequentially for each group in a predetermined location for each group;
It is characterized by.

  In the characteristic measurement method and the substrate, the measurement results of the elements to be measured belonging to each group are recorded at predetermined locations in the marking area. Only substrates with good marking area records will be shipped. Therefore, when a defect of an element is discovered after shipment, it is immediately determined that no error has occurred in the manufacturing process until measurement, and the trouble after shipment may be solved.

  According to the present invention, since the measurement results of the elements to be measured belonging to a plurality of groups are recorded at predetermined locations in the marking area, it is easy to determine whether or not the device is good. Analysis of defect occurrence becomes easy.

  Embodiments of a characteristic measuring method and a substrate according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 illustrates a substrate according to an embodiment of the present invention. This substrate is formed as a collective substrate 10 including child substrates 11 partitioned by a cut line 12 indicated by a dotted line. FIG. 1 shows the rear surface side of the collective substrate 10, and predetermined electronic components are mounted on the front surface side (not shown) of each child substrate 11. On the back side, a large number of thick film resistors 20 are formed in a predetermined pattern and trimmed to a resistance value that falls within a predetermined range.

  FIG. 2 shows an enlarged view of one daughter board 11. The outline of the sub board 11 corresponds to the cut line 12 shown in FIG. A large number of thick film resistors 20 formed on the back surface of the sub board 11 are respectively printed across a pair of electrode pads 21 and 21 formed on the sub board 11 as shown in FIG. The resistance value of the thick film resistor 20 is measured by bringing the tips of the pair of probes 32 and 32 into contact with the vicinity of the junction between the thick film resistor 20 and the electrode pads 21 and 21.

  It is impossible to measure the resistance values of a large number of thick film resistors 20 on the sub board 11 at a time. The thick film resistors 20 are divided into a plurality of groups, and the thick film resistors 20 belonging to each group are assigned to one group. Measure sequentially for each group. In this embodiment, the thick film resistors 20 are divided into seven groups of first to seventh. In FIG. 2, the numbers 1 to 7 attached to the thick film resistors 20 indicate the classifications of the first to seventh groups.

  As shown in FIG. 4, the resistance value measuring tool 30 is provided with dedicated probes 32 and 32 for measuring the resistance values of the thick film resistors 20 belonging to the first to seventh groups in the frame 31. It is. The measuring tool 30 shown in FIG. 4 (A) is for collectively measuring the thick film resistors 20 belonging to the first group, and the measuring tool 30 shown in FIG. 4 (B) is a thick film belonging to the second group. It is for measuring the resistor 20 collectively. Although a measuring tool for measuring the thick film resistor 20 belonging to the third to seventh groups is not shown, it is basically the same as FIGS. 4 (A) and 4 (B).

  On the other hand, each child substrate 11 is provided with a marking area 25, and the measurement results of the thick film resistors 20 belonging to the first to seventh groups are recorded in a predetermined location of the marking area 25. The marking area 25 is made of a conductor film containing Ag as a main component, and markings A to G are recorded at predetermined positions by a laser.

  Marking A is recorded if the measurement result of the first group is good (see steps S1 and S2 in FIG. 6), and marking B is recorded if the measurement result of the second group is good (steps S3 and S3 in FIG. 6). In the same manner, the marking C is recorded in the third group, the marking D is in the fourth group, the marking E is recorded in the fifth group, and the marking F is recorded in the sixth group if the measurement results are good. If the measurement result of the group is good, it is recorded (see steps S13 and S14 in FIG. 6). If there is at least one defective resistance value in the measurement of each group, the entire group is regarded as defective and the marking portion is left blank.

  Note that the measurement results of the thick film resistors 20 belonging to the first to seventh groups may be stored in a memory, and the recording may be performed collectively in the marking area 25 after all the measurements are completed.

  FIG. 5A shows a case where all of the markings A to G are recorded, and shows that the measurement results of all the thick film resistors 20 are good. FIG. 5B shows a case where the markings A to F are recorded, but the marking G is blank, indicating that any of the thick film resistors 20 belonging to the seventh group is defective. Yes. FIG. 5C shows a case where recording is performed excluding the marking C, and indicates that any of the thick film resistors 20 belonging to the third group has a defect.

  The markings A to G can be visually confirmed that they are recorded and left blank, and can be easily judged by visual inspection at the time of shipment. Only the collective board 10 or the sub board 11 marked with is shipped.

  According to the present embodiment, when a defect of the thick film resistor 20 is discovered after the collective substrate 10 or the sub substrate 11 is shipped, it is immediately determined that no error has occurred in the manufacturing process up to the measurement. Therefore, the trouble after shipment should be solved. Further, if a large number of defects are measured in a specific group, it can be estimated that there is a flaw in the manufacturing process of the thick film resistor 20 belonging to the group.

  FIG. 7 shows another example of the collective substrate 10. In the collective substrate 10, the marking area 25 is provided on the collective substrate 10 itself instead of each child substrate 11. Accordingly, when the measurement results of the thick film resistors 20 belonging to each of the first to seventh groups in all the sub-boards 11 are good, recording is performed at a predetermined location in the marking area 25.

(Other examples)
The characteristic measurement method and the substrate according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist.

  In particular, the marking area 25 may employ various methods other than recording on the conductor film with a laser, and may be a marking that does not easily disappear, such as oil-based ink. Further, the marking is not necessarily visible, and may be detectable by an optical technique. If the measurement result is defective, the marking portion may not be left blank, but an x mark or the like may be recorded.

  Furthermore, the element to be measured is not limited to the thick film resistor 20, but may be a capacitor. In this case, the capacitance value is measured. Other elements and characteristics may be measured.

It is a top view which shows the aggregate substrate which is one Example of this invention. It is a top view which shows the sub board | substrate divided | segmented from the said collective board. It is sectional drawing which shows the thick film resistor formed in the child substrate, and its characteristic measurement state. It is a top view which shows the measuring tool provided with the probe. It is a top view which shows the marking area where the measurement result was recorded. It is a flowchart figure which shows the procedure of a characteristic measurement. It is a top view which shows the aggregate substrate which is the other Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Assembly board | substrate 11 ... Sub board | substrate 20 ... Thick film resistor 25 ... Marking area 30 ... Measuring tool 32 ... Probe AG ... Marking

Claims (10)

In a method for measuring the characteristics of a large number of measured elements provided on a substrate,
Dividing the large number of measured elements into a plurality of groups and sequentially measuring the measured elements belonging to each group for each group; and
Recording the measurement results of the elements to be measured belonging to each group at a predetermined location in the marking area provided on the substrate;
A characteristic measuring method comprising:   Measure the characteristics of the elements to be measured belonging to one group, record the measurement results at a predetermined location in the marking area, and then measure the characteristics of the elements to be measured that belong to another group. The characteristic measurement method according to claim 1, wherein recording is performed at a predetermined location in the marking area.   3. The substrate according to claim 1, wherein the substrate is a collective substrate in which a plurality of child substrates each having a large number of elements to be measured are arranged, and the marking area is provided on each of the child substrates. The characteristic measuring method described in 1.   3. The substrate according to claim 1, wherein the substrate is a collective substrate in which a plurality of sub-substrates having a large number of elements to be measured are arranged, and the marking area is provided on the collective substrate. The characteristic measurement method described.   The characteristic measurement method according to claim 1, wherein the measurement result is recorded in the marking area so as to be visible.   2. When the measurement result of the element to be measured belonging to each group is good, the fact is recorded in a predetermined portion of the marking area, and when the measurement result is defective, the predetermined portion is left blank. The method for measuring characteristics according to claim 5.   7. The characteristic measuring method according to claim 1, wherein the element to be measured is a thick film resistor, and a resistance value of the thick film resistor is measured. A substrate provided with a large number of elements to be measured,
Dividing the large number of measured elements into a plurality of groups, and having a marking area for recording the measured elements belonging to each group sequentially for each group in a predetermined location for each group;
A substrate characterized by.   9. The substrate according to claim 8, wherein the substrate is a collective substrate in which a plurality of child substrates each having a large number of elements to be measured are arranged, and the marking area is provided on each child substrate.   9. The substrate according to claim 8, wherein the substrate is a collective substrate in which a plurality of sub-substrates having a large number of elements to be measured are arranged, and the marking area is provided on the collective substrate.

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