JP2014093340A - Test coupon for managing characteristic impedance and print circuit board with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a test coupon for managing a characteristic impedance (Z0) that allows the Z0 of wiring inside and outside a BGA (Ball Grid Array) in a product region to be confirmed and managed even when manufacturing factors such as fluidity of etchant vary.SOLUTION: In the test coupon for managing a characteristic impedance formed within a test coupon region on a print circuit board, first wiring under a first design rule has a first straight part, second wiring under the first design rule has a second straight line that is approximately perpendicular to the first straight part, and third wiring under a second design rule has a third straight part that is approximately perpendicular to any one of the first straight part and the second straight part, where the first wiring, second wiring, and third wiring are connected in series.

Description

  The present invention relates to a test coupon for measuring and managing a characteristic impedance of a printed circuit board and a printed circuit board including the test coupon.

  Products inside the BGA that have a narrow line-and-space (hereinafter abbreviated as L / S) pitch indicating the width and spacing of the ball grid array (Ball Grid Array; hereinafter abbreviated as BGA) such as LSI packages. The test coupon that guarantees the finished value of the characteristic impedance (hereinafter abbreviated as Z0) of the wiring and the product wiring outside the BGA that has a wider L / S pitch specification is on the printed circuit board and is the product wiring area Z0 of the product wiring is guaranteed by measuring Z0 after completion of the printed circuit board manufacturing process.

  In the test coupon, wirings having the same specifications as the wiring specifications (design rules) such as L / S and wiring thickness of the product wiring formed on the printed circuit board are arranged at an arbitrary length outside the product. Z0 is determined to be a unique value according to the above wiring specification. Therefore, Z0 of the product wiring is confirmed and managed by measuring Z0 of the test coupon.

  However, the etching amount of the wiring and the plating film thickness in the manufacturing process vary depending on the density of the wiring and various factors in the manufacturing process, thereby causing variations on the printed circuit board. In order to suppress the influence of this variation on Z0 of the test coupon, the techniques of Patent Document 1 and Patent Document 2 are disclosed.

  In Patent Document 1, dummy patterns are provided on both sides of the test coupon pattern so that the etching conditions of the wiring pattern in the product wiring area and the test coupon pattern in the test coupon area are equal to each other. . Thereby, the wiring of the product area and the test coupon are made to have the same finish.

  On the other hand, Patent Document 2 includes a zigzag wiring portion that is wired in a zigzag manner so that the wiring interval is constant, and a straight wiring portion that is wired in a straight line in a region different from the product wiring region on the printed circuit board. A test coupon for measuring characteristic impedance is provided. As a result, it is possible to check and manage the variation in characteristic impedance caused mainly by the difference in finish due to the maximum and minimum adjacent wiring intervals.

JP 2005-197556 A JP 2011-181785 A

  However, the techniques of Patent Document 1 and Patent Document 2 have the following problems. That is, in the technique of Patent Document 1, since it is a linear test coupon, it is affected by the fluidity of the etching solution. The fluidity of the etchant is, in part, the direction in which the etchant flows with respect to a pattern such as wiring. For example, when the wiring direction of the test coupon matches the wiring direction of the product area, the wiring of the product area and the wiring of the test coupon are finished in the same way. You can check and manage with Z0. However, if they do not match, there is a shift in the mutual Z0, so it was not possible to confirm and manage with a test coupon. Further, when wiring areas having different design rules such as the inside and outside of the BGA of the product area are provided, it is impossible to simultaneously cope with Z0 of both wiring areas having different design rules. Furthermore, an extra area for forming the dummy pattern is required.

  In the technology of Patent Document 2, the test coupon has a structure including a zigzag wiring portion wired in a zigzag manner and a straight wiring portion wired in a straight line. As a result, it is possible to check and manage the variation in characteristic impedance caused mainly by the difference in finish due to the maximum and minimum adjacent wiring intervals. However, also in this case, it was influenced by the fluidity of the etching solution. That is, the straight wiring portion of the test coupon of Patent Literature 2 and the straight portion of the zigzag wiring portion have the same problems as the linear test coupon of Patent Literature 1. Further, when wiring areas having different design rules such as the inside and outside of the BGA of the product area are provided, it is impossible to simultaneously cope with Z0 of both wiring areas having different design rules.

  The present invention has been made in view of the above problems, and its purpose is to design wiring areas having different design rules for product areas on a printed circuit board even if manufacturing factors such as the fluidity of an etchant change. The object is to provide a test coupon for characteristic impedance management that can simultaneously confirm and manage Z0 for each wiring region with different rules.

  In the test coupon for characteristic impedance management formed in the test coupon area on the printed circuit board, the first wiring based on the first design rule has a first straight line portion, and the second wiring based on the first design rule. The second wiring has a second straight line portion that is substantially perpendicular to the first straight line portion, and a third wiring according to the second design rule is formed between the first straight line portion and the second straight line portion. The test coupon for characteristic impedance management has a third straight line portion that is substantially perpendicular to any one of the first wiring, the second wiring, and the third wiring.

  According to the test coupon for characteristic impedance management according to the present invention, even if manufacturing factors such as the fluidity of the etching solution change, the wiring areas having different design rules in the product area on the printed circuit board It is possible to provide a test coupon for characteristic impedance management that can simultaneously confirm and manage Z0.

It is a figure which shows the structure of the test coupon for characteristic impedance management of embodiment of this invention. It is a figure which shows the structure of the test coupon for characteristic impedance management of embodiment of this invention. It is a figure which shows the measurement result of characteristic impedance Z0 of the test coupon for characteristic impedance management of embodiment of this invention. It is a figure which shows the measurement result of characteristic impedance Z0 of the test coupon for characteristic impedance management of embodiment of this invention. It is a figure which shows the structure of the test coupon for characteristic impedance management as a comparative example. It is a figure which shows the measurement result of characteristic impedance Z0 of the test coupon for characteristic impedance management as a comparative example. It is a figure which shows the structural example of the printed circuit board which has the test coupon for characteristic impedance management of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the preferred embodiments described below are technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following.

  FIG. 1 is a diagram showing the structure of a characteristic impedance management test coupon according to an embodiment of the present invention. The test coupon 10 is formed on the test coupon region 31 with respect to the product region 32 on the printed circuit board 30 shown in FIG.

  In FIG. 1, the vertical wiring 11 corresponding to the wiring area of the first design rule and the horizontal wiring 12 corresponding to the first design rule wiring area which are substantially the left half of the test coupon 10 are the first in the product area 32 of FIG. Like the wiring region 34 of the design rule, the wiring corresponds to a narrow pitch wiring width, wiring interval, and wiring direction. This corresponds to, for example, wiring specifications inside the BGA on the printed circuit board. Further, the second design rule wiring area corresponding vertical wiring 13 which is substantially the right half of the test coupon 10 is a wide pitch wiring like the second design rule wiring area 35 of the product area 32 of FIG. The wiring corresponds to the width, wiring interval, and wiring direction. This corresponds to, for example, wiring specifications outside the BGA on the printed circuit board.

  Furthermore, the test coupon of the approximately half on the left side has a wiring having a plurality of vertical straight portions 3 extending in parallel to each other (vertical wiring 11 corresponding to the wiring area of the first design rule) and the vertical straight portion 3 rotated by approximately 90 degrees. In addition, a wiring having a plurality of horizontal straight portions 5 extending in parallel with each other (first design rule wiring region corresponding horizontal wiring 12) is provided. The vertical straight line portions 3 are connected and folded at the vertical folding portion 4, and the horizontal straight line portions 5 are connected and folded at the horizontal folding portion 6.

  Further, the vertical wiring 13 corresponding to the wiring area of the second design rule has a configuration in which a plurality of vertical straight portions 7 extending in parallel with each other are connected to each other by a vertical turn-back portion 8. Here, the vertical straight portion 7 is substantially parallel to the vertical straight portion 3 and substantially vertical to the horizontal straight portion 5. The vertical wiring 11 corresponding to the wiring area of the first design rule, the horizontal wiring 12 corresponding to the wiring area of the first design rule, and the vertical wiring 13 corresponding to the wiring area of the second design rule are connected in series. The order in which the wirings are arranged in series connection is not limited to FIG.

  The vertical wiring 13 corresponding to the wiring area of the second design rule can also be configured such that a plurality of horizontal straight lines extending in parallel with each other perpendicular to the vertical straight line 7 are connected and folded at the horizontal turn-back portions (FIG. 1). Not listed in). In addition, a configuration in which a plurality of horizontal straight lines extending perpendicularly to each other and extending in parallel with each other at the vertical straight line portion 7 are connected to each other at the horizontal turn-back portion can be connected to the vertical wiring 13 corresponding to the wiring area of the second design rule ( (Not described in FIG. 1).

  In FIG. 1, only the vertical wiring 13 corresponding to the wiring area of the second design rule is used, and the horizontal wiring corresponding to the wiring area of the second design rule may not be provided. Because it is a design rule, it is less susceptible to variations due to the manufacturing process.

  In the vertical wiring 11 corresponding to the wiring area corresponding to the first design rule and the horizontal wiring corresponding to the wiring area corresponding to the first design rule, when the wiring direction of the product area is only the direction of the vertical straight line portion 3, The horizontal wiring 12 corresponding to the wiring area of the design rule can be omitted. Further, when the wiring direction of the product area is only the direction of the horizontal straight line portion 5, the wiring area corresponding vertical wiring 11 of the first design rule can be omitted. Furthermore, in the vertical wiring 13 corresponding to the wiring area of the second design rule, when the wiring direction of the product area is perpendicular to the vertical linear part 7, a horizontal linear part obtained by rotating the vertical linear part 7 by 90 degrees and It can be used as a BGA non-compatible coupon.

  As described above, the wiring region corresponding vertical wiring 11 of the first design rule, the wiring region corresponding horizontal wiring 12 of the first design rule, and the wiring region corresponding vertical wiring 13 of the second design rule are different designs in the product region. The combination can be changed corresponding to the wiring direction of different areas having rules.

  In FIG. 1, the vertical wiring 11 corresponding to the wiring area of the first design rule, the horizontal wiring 12 corresponding to the wiring area of the first design rule, and the vertical wiring 13 corresponding to the wiring area of the second design rule are parallel to each other. A plurality of extending straight portions are connected and turned back at the turn-back portion. However, as shown in FIG. 2, in the embodiment of the present invention, the vertical wiring 15 corresponding to the wiring area of the first design rule, the first design rule Excludes the case where each of the wirings corresponding to the wiring area corresponding to the horizontal wiring 16 and the wiring area corresponding to the vertical wiring 17 corresponding to the second design rule is a test coupon 14 comprising one vertical line portion, five horizontal straight line portions, and seven vertical straight line portions. do not do. Moreover, although the wiring of the test coupon of FIG. 1, FIG. 2 is a single wire structure, it can also be made into the double line structure corresponding to a differential wiring.

  During the production of a printed circuit board, the finished width of the wiring varies due to the influence of the wiring direction and the distance (roughness / density) between adjacent wirings. When a general printed circuit board is assumed, a difference occurs in the etching amount of the copper foil due to the wiring direction and the distance between adjacent wirings, and the wiring width and the wiring interval are different. Taking the wiring interval as an example, when the wiring interval is large, the etching amount tends to increase, and the wiring width is narrowed. As a result, Z0 becomes higher than the design value. Conversely, when the wiring interval is small, the etching amount tends to be small, and the wiring width is thick. As a result, Z0 becomes lower than the design value.

  Taking a build-up substrate as an example, in the panel plating method, a difference in plating thickness (wiring thickness) occurs due to the size (roughness) of the distance between adjacent wirings. When the wiring interval is large, the plating current density is increased and the plating thickness is increased. As a result, Z0 becomes lower than the design value. Conversely, when the wiring interval is small, the plating current density is small and the plating thickness is thin. As a result, Z0 becomes higher than the design value.

  Further, the fluidity of the etching solution changes depending on the wiring direction. When the fluidity is good depending on the wiring direction, the etching amount is increased, the wiring width is narrowed, and Z0 is higher than the design value. On the other hand, when the fluidity is poor, the etching amount is reduced, the wiring width is finished wide, and Z0 is lower than the design value.

  As shown in FIG. 1, the wiring of the characteristic impedance management test coupon 10 is represented by the wiring area of the first design rule and the second design rule representing the difference in finish due to the wiring direction, wiring width and wiring interval in the product. By using wiring corresponding to each wiring area, check the Z0 variation of in-product wiring, which is mainly caused by finishing variation (etching variation) due to the wiring direction, wiring width, and distance between adjacent wires. Can be managed. Furthermore, by using an integrated coupon having the wiring specifications of the wiring areas of both design rules, it becomes possible to grasp the Z0 of the wiring area according to each design rule with a single measurement, thereby reducing the measurement man-hours. be able to.

  FIG. 3A shows an example of the measurement result of Z0 of the characteristic impedance management test coupon 10 of FIG. The vertical axis is Z0, and the horizontal axis is time. Z0 is measured by the Time Domain Reflexometry (TDR) method. In measuring Z0 of the test coupon, a signal is input from the measuring instrument 1 toward the measurement terminal unit 2, and Z0 of each wiring is obtained from the voltage value of the reflected wave returning from the other end terminal unit 9. In FIG. 3A, all of Z0 of the vertical wiring 11 corresponding to the wiring area of the first design rule, the horizontal wiring 12 corresponding to the wiring area of the first design rule, and the vertical wiring 13 corresponding to the wiring area of the second design rule are Has been confirmed to be within.

  FIG. 3B shows another example of the measurement result of Z0 of the characteristic impedance management test coupon 10 of FIG. The test coupon measured in FIG. 3B is manufactured by changing the flow of the etchant in the etching process when the test coupon of FIG. 3A is manufactured by 90 degrees. Therefore, the magnitude relationship between Z0 of the wiring region corresponding vertical wiring 11 of the first design rule of FIG. 3B and Z0 of the wiring region corresponding horizontal wiring 12 of the first design rule is opposite to that of FIG. 3A. . That is, the characteristic impedance management test coupon 10 according to the present embodiment can confirm the variation due to the change in the manufacturing process.

  In FIG. 3B, Z0 of the wiring area corresponding vertical wiring 11 of the first design rule and the wiring area corresponding horizontal wiring 12 of the first design rule is within the standard, and the wiring area corresponding vertical wiring 13 of the second design rule It has been confirmed that Z0 is not within the standard. From this result, it is determined that this product is out of specification.

  As a comparative example, FIG. 4 shows a test coupon 27 for characteristic impedance management disclosed in Patent Document 2. In FIG. 4, the test coupon 27 consists of a zigzag coupon 28 consisting of a straight line portion 23 and a folded portion 24 on the left half, and a straight coupon 29 consisting of a straight line portion 25 on the right half. Further, the wiring of the test coupon 27 can be a design rule of either the wiring area of the first design rule or the wiring area of the second design rule. In FIG. 4, the design rule of the wiring area of the first design rule is used. That is, when it is necessary to set the design rule for the wiring area of the second design rule, a test coupon for characteristic impedance management having the wiring of the design rule for the wiring area of the second design rule is provided separately from FIG. There is a need.

  FIG. 5 shows an example of the measurement result of Z0 of the characteristic impedance management test coupon 27 of FIG. Z0 is measured by a TDR method in which a signal is input from the measuring instrument 21 toward the measurement terminal unit 22 and Z0 of each wiring is obtained from the voltage value of the reflected wave returning from the other end terminal unit 26. In FIG. 5, it is confirmed that both Z0 of the BGA corresponding zigzag coupon 28 and the BGA corresponding linear coupon 29 are within the standard. However, from this result, it cannot be confirmed whether or not Z0 of the wiring in the wiring area of the second design rule is within the standard. Therefore, it is not possible to determine whether or not this product is within the standard based on the result of FIG.

  As described above, according to the test coupon for characteristic impedance management of the embodiment of the present invention, even if manufacturing factors such as the fluidity of the etchant change, the wiring area having a different design rule for the product area on the printed circuit board can be used. Thus, it is possible to provide a test coupon for characteristic impedance management that can confirm and manage Z0 for each wiring region with different design rules at a time.

  In the present embodiment, the first and second types of different design rules have been described. However, in the present invention, the case of two different types of design rules is also possible for any of a plurality of different design rules. By repeating the structure, it is possible to obtain a test coupon for managing characteristic impedance.

  The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the invention described in the claims, and it is also included within the scope of the present invention. Not too long.

DESCRIPTION OF SYMBOLS 1,21 Measuring device 2,22 Measuring terminal part 3 Vertical straight line part 4 Vertical turning part 5 Horizontal straight line part 6 Horizontal folding part 7 Vertical straight line part 8 Vertical turning part 9, 26 Other terminal part 10, 27 Test coupon 11 1st Vertical wiring corresponding to the wiring area of the first design rule 12 Horizontal wiring corresponding to the wiring area of the first design rule 13 Vertical wiring corresponding to the wiring area of the second design rule 23 Linear portion 24 Folded portion 25 Linear portion 28 BGA corresponding zigzag coupon 29 BGA Inside corresponding linear coupon 30 Printed circuit board 31 Test coupon area 32 Product area 33 Test coupon 34 Wiring area of first design rule 35 Wiring area of second design rule

Claims (9)

In the test coupon for characteristic impedance management formed in the test coupon area on the printed circuit board,
The first wiring according to the first design rule has a first straight portion,
The second wiring according to the first design rule has a second straight line portion that is substantially perpendicular to the first straight line portion;
The third wiring according to the second design rule has a third straight line portion that is substantially perpendicular to either the first straight line portion or the second straight line portion;
A test coupon for characteristic impedance management in which the first wiring, the second wiring, and the third wiring are connected in series. The first wiring includes a plurality of the first straight portions extending in parallel with each other, and a first folded portion that connects the first straight portions to each other,
The second wiring has a plurality of the second straight portions extending in parallel with each other, and a second folded portion connecting the second straight portions to each other,
2. The characteristic impedance management device according to claim 1, wherein the third wiring has a plurality of first third straight portions extending in parallel with each other and a third folded portion that connects the third straight portions to each other. Test coupon.   3. The characteristic impedance management test coupon according to claim 1, wherein the first design rule is smaller in both or one of a wiring width and a wiring interval than the second design rule. 4.   The first design rule corresponds to a design rule for wiring in a ball grid array formed in a product area on a printed circuit board on which the characteristic impedance management test coupon is formed, and the second design rule is The test coupon for characteristic impedance management according to any one of claims 1 to 3, corresponding to a design rule for wiring outside the ball grid array.   5. The device according to claim 1, further comprising a fourth wiring according to the second design rule, wherein the fourth wiring has a fourth straight line portion that is substantially perpendicular to the third straight line portion. Test coupon for characteristic impedance management.   6. The characteristic impedance management according to claim 5, wherein the fourth wiring has a plurality of the fourth straight portions extending in parallel with each other and a fourth folded portion that connects the fourth straight portions to each other. Test coupon. Has wiring corresponding to each different design rule of wiring in different areas in the product area on the printed circuit board,
Each of the wirings has a straight line portion parallel to the vertical and horizontal directions of the wirings of the different regions,
A test coupon for managing characteristic impedance, wherein each of the wires is connected in series.   The characteristic impedance management test coupon according to claim 7, wherein the straight line portions are a plurality of straight line portions extending in parallel with each other, and the straight line portions are connected to each other at a turn-back portion.   A printed circuit board comprising the test coupon for managing characteristic impedance according to claim 1.

Images