JPH06196836A - Memory module - Google Patents

Abstract

PURPOSE:To improve the reliability of memory modules and reduce the number of components and processes by omitting a chip capacitor for noise cut. CONSTITUTION:A pattern of a capacitor 6 is formed on a memory module substrate 1 and connected with wiring patterns 8 and 9. A memory IC 4 is connected with a land pattern 2. This allows omitting soldering chip capacitors and visual inspections.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory module having a chip capacitor and a memory IC mounted on a substrate.

[0002]

2. Description of the Related Art FIG. 2 is a side sectional view showing a conventional memory module. In the figure, 1 is a substrate, 2 and 3 are land patterns provided on the substrate 1, and 4 is a land pattern 2.
The memory ICs 5 mounted by soldering are chip capacitors for noise cutting mounted by soldering on the land patterns 3 below the memory ICs 4.

Next, the operation will be described. In the process of assembling the memory module, first, the chip capacitor 5 is mounted on the land pattern 3 on the substrate 1. Next, the memory IC 4 is mounted on the land pattern 2 on the substrate 1. As a result, the chip capacitor 5 is mounted in the gap between the memory IC 4 and the substrate 1. After the mounting is completed, the soldering state of the chip capacitor 5 and the memory IC 4 is visually inspected in the appearance inspection process.

[0004]

Since the conventional memory module is constructed as described above, the chip capacitor located below the memory IC 4 is subjected to the visual inspection process after mounting the memory IC 4 and the chip capacitor 5. It is difficult to visually inspect the soldering state of No. 5, and therefore, there is a problem that defective soldering is overlooked and the quality of the product is deteriorated.

The present invention has been made to solve the above problems, and an object of the present invention is to obtain a memory module in which a chip capacitor, which is difficult to inspect after mounting, can be omitted.

[0006]

In the memory module according to the present invention, a capacitor having the same function as a conventional chip capacitor is provided on a substrate by patterning.

[0007]

In the memory module according to the present invention, by patterning the capacitor on the substrate, the conventional chip capacitor, which was difficult to inspect by appearance, can be omitted, and the reliability is improved and the number of parts and the number of steps are reduced. Is possible.

[0008]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, the same parts as those in FIG. In FIG. 1, reference numeral 6 is a noise-cutting capacitor provided on the substrate 1 by patterning and is arranged below the memory IC 4. Reference numeral 7 is a concave portion provided in the substrate 1 to form the capacitor 6, 8 and 9 are wiring patterns provided on both sides of the concave portion 7 of the substrate 1, 10 is a wiring pattern provided at the bottom of the concave portion 7 and one end thereof is extended. 8 is a metal foil, 11 is a recess 7
Insulator provided on the metal foil 10 inside, insulator 12
1 is a metal foil which is provided on 1 and whose one end is connected to the wiring pattern 9. These metal foils 10 and 12 and the insulator 11 constitute the patterned capacitor 6.

Next, the operation will be described. Metal foil 10,
12 is an electrode of the capacitor 6 to which a predetermined voltage is applied via the wiring patterns 8 and 9, respectively. This capacitor 6 functions as a noise cuter like the conventional chip capacitor 5 in FIG.

As described above, by patterning the capacitor 6 on the substrate 1, the conventionally used chip capacitor 5 can be omitted. Since the chip capacitor 5 was mounted in the gap between the substrate 1 and the memory IC 4, it was difficult to visually inspect the appearance. However, by omitting this, it becomes unnecessary to perform the appearance inspection on the chip capacitor 5. As a result, it is possible to improve reliability and reduce the number of parts of the chip capacitor 5 and the number of steps such as soldering and visual inspection.

[0011]

As described above, according to the present invention, since the capacitor is patterned on the substrate,
Since the conventionally used chip capacitor can be omitted, the reliability of the product can be improved, and the number of parts and the number of steps can be reduced.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a memory module according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing a conventional memory module.

[Explanation of symbols]

 1 substrate 2 land pattern 4 memory IC 6 capacitor 8 and 9 wiring pattern

Claims (1)

[Claims] 1. A substrate on which a land pattern and a wiring pattern are provided, a memory IC connected to the land pattern and mounted on the substrate, and patterned on the substrate to be provided and connected to the wiring pattern. A memory module having a capacitor.