JPS5934154Y2 - Printed board - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a printed circuit board on which chip components (electronic components such as resistors and capacitors that are separated into individual pieces by eliminating lead wires) are mounted.

For this type of printed circuit board, after chip components are temporarily attached to the copper foil surface, the presence or absence of chip components and directionality can be inspected by irradiating the copper foil surface with light and capturing the reflected light with a camera. It is being done.

As shown in FIG. 1, the printed circuit board has a plate grain C1 on the copper foil surface B on the board body A during the manufacturing process.
In other words, since the streaks are formed by brushing, etc., when the light from the light source is irradiated from a direction perpendicular to the grain C, it will be diffusely reflected, and this, together with the reflected light from the chip components, will be reflected by the camera E.
It was not possible to conduct an accurate inspection because the light was entering the area.

The board grain C of such a printed circuit board is formed in the manufacturing process, for example, in the following case.

(a) When laminating and pressing copper foil onto the substrate body, scratches from the pressing roller occur in the transfer direction and grains are formed.

(b) When screen printing a pattern on a copper foil surface, the copper foil surface is brushed, and this brushing process forms grains.

(c) Immediately before applying flux, grains are formed by brushing for polishing.

Therefore, in order to minimize the reflection from the copper foil surface B itself, it is a good idea to set the printed circuit board so that the direction of the grain C of the copper foil surface B is parallel to the light projection direction of the light source. If the direction of the board grain C is set while visually checking, the inspection takes time and there is a risk of misidentification.

This invention attempts to solve the above-mentioned drawbacks.
By displaying a mark on the board body that indicates the grain direction of the copper foil surface formed on the board body, it is easy, quick, and without fear of misidentification, and reduces diffuse reflection on the copper foil surface.
The present invention aims to provide a printed circuit board that can accurately inspect the presence and orientation of chip components.

Hereinafter, the present invention will be described in detail with reference to illustrated embodiments.
The figure is a perspective view of the printed circuit board according to the present invention, and FIG. 4 is an explanatory diagram showing the mounting inspection of chip components using the same board.

In the figure, 1 is a board body made of phenol or the like, and 2 is a copper foil surface formed on the board body 1. After a chip component F is temporarily attached to this copper foil surface 2 with adhesive, it is soldered. It is fixed.

3 is a plate grain formed on the copper foil surface 2. This plate grain 3 is a scratch caused by brushing during the printed circuit board manufacturing process, but the plate grain 3 is shaped so that the direction of the plate grain 3 is all in the same direction. It is desirable to remove it.

4 is an arrow-shaped arrow indicating the direction of the grain 3 formed on the board body 1. However, other shapes may be used, and letters may also be used in combination, as long as the direction of the grain 3 can be clearly indicated.

Therefore, this mark 4 can be formed with copper foil at the same time when forming the copper foil surface 2, displayed with the resist when applying the solder resist, or displayed with the copper pattern when the copper pattern is formed. or may be displayed in other ways.

5 indicates a light source, and 6 indicates a camera.

Note that the above mark 4 may be formed on both sides of the substrate body 1.

Therefore, as shown in FIG. 4, if the printed circuit board is set so that the mark 4 matches the light emission direction of the light source 50, the direction of the grain 3 of the copper foil surface 2 will be parallel to the light emission direction of the light source 5. Therefore, there is no diffuse reflection on the copper foil surface 2, and most of the light escapes in the opposite direction to the light source 5, so there is no light entering the camera 6 from the copper foil surface 2, and the chip temporarily attached on the copper foil surface 2. Only the light enters from the component F, so the presence or absence and direction of the chip component can be clearly confirmed.

Note that, as described above, a plurality of grains may be formed in the process, and the direction of the grains is not always constant.

In this case, a mark 4 is displayed to indicate at least the last crease as the board grain C.

In the present invention, as shown diagonally above, a mark 4 is provided to indicate the direction of scratches formed by brushing or the like during the manufacturing process of the board body 1. Therefore, when inspecting the mounting of chip components, the printed circuit board is inserted according to the instructions of the mark 4. By simply setting it so that it matches the light emitting direction of the light source 5, the three directions of the grains of the copper foil surface 2 can be easily and quickly made parallel to the light emitting direction of the light source 5, and there is no risk of misidentification. The amount of reflected light from the copper foil surface 2 is reduced, and the presence or absence and orientation of the chip component F can be accurately measured.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of chip component mounting inspection using a conventional printed circuit board, Fig. 2 is a perspective view of a printed circuit board according to the present invention, and Fig. 3 is a plan view showing another embodiment of the same printed circuit board. In the figure, FIG. 4 shows an explanatory diagram of chip component mounting inspection using the same printed circuit board. 1... Board body, 2... Copper foil surface, 3.
...Board grain, 4...mark.

Claims (1)

[Scope of utility model registration request] A light source of a device that optically inspects the mounting state of electronic components mounted on a printed circuit board in which scratches in a certain direction have been formed on the copper foil surface of the substrate due to brushing etc. during the manufacturing process. A printed circuit board, characterized in that a mark indicating the direction of the striations is displayed on the printed circuit board so that the direction of light projection matches the striations of the printed circuit board.