CN106604551A - Circuit board production method through automatic pressing and profiling - Google Patents
Circuit board production method through automatic pressing and profiling Download PDFInfo
- Publication number
- CN106604551A CN106604551A CN201611178819.2A CN201611178819A CN106604551A CN 106604551 A CN106604551 A CN 106604551A CN 201611178819 A CN201611178819 A CN 201611178819A CN 106604551 A CN106604551 A CN 106604551A
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- China
- Prior art keywords
- pcb board
- pcb
- production method
- circuit board
- auto
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- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 title claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 238000003860 storage Methods 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 238000007688 edging Methods 0.000 claims description 8
- 238000002372 labelling Methods 0.000 claims description 6
- 210000004247 Hand Anatomy 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 230000000875 corresponding Effects 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract 2
- 238000000227 grinding Methods 0.000 abstract 2
- 239000003292 glue Substances 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 238000004064 recycling Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 230000003252 repetitive Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Abstract
The invention relates to a circuit board production method through automatic pressing and profiling, comprising the following steps: putting a PCB in an X-RAY drilling machine to make positioning holes, and grasping the PCB to a temporary storage platform through a manipulator; judging whether the PCB needs to wait, grasping the PCB to an alignment area, locating the positioning holes, and finely adjusting the position of the PCB; removing glue flow edges and copper foil edges around the PCB; grinding the edges of the PCB and rounding the corners; engraving the edge of the PCB with a corresponding code mark; cleaning the PCB; and measuring the thickness of the PCB, and recycling the PCB. The X-RAY drilling, edge milling, edge grinding and board thickness measuring processes are combined together to form a production line. All sorts of equipment are linked by the same system. All parameters are obtained by scanning a work order, and the parameters can be input all at once. The waiting time and artificial repeated operation are reduced. The production efficiency is improved, and the labor cost is reduced.
Description
Technical field
The present invention relates to printed circuit board processing and manufacturing field, more specifically refers to a kind of circuit board auto-stitching profile
Production method.
Background technology
After existing printed circuit board is come out of the stove from press, need to carry out tearing plate, X-RAY target practices, gong side, edging, drafting board thickness etc. open
Flow process, particular flow sheet are as shown in Figure 1；What the pressing profile flow process generally said referred to be exactly from X-RAY practice shooting to drafting board it is thick this
Flow process, before this by target in X-RAY transmittance plates, gets out 3-7 location hole and uses to follow-up workshop section, recycle X-RAY to practice shooting
The hole positioning for getting out, the gummosis produced when printed circuit half-finished product plate press while and gong goes during Copper Foil, the edges of boards behind gong side are logical
Horizontal line is crossed, using edging knife by edges of boards ground smooth, thickness of slab tester, the printed circuit half-finished product plate after measurement pressing is recycled
Thickness of slab, finally confirms whether printed circuit board meets the requirements.But, there is following defect in this way：1st, long flow path and waste
Many waiting time, before each workshop section's production, it is both needed to |input paramete；2nd, waste of manpower, each workshop section are both needed to a people and go operation；
3rd, need repeatedly to carry, easily cause the Copper Foil scratch of printed circuit half-finished product plate surface.
Therefore, it is necessary to design a kind of production method of circuit board auto-stitching profile, shorten the time of profile after pressing,
Reduction repeatedly inputs the time of parameter, initial workpiece inspection and wait；Manpower is saved simultaneously, and improve quality is reduced because manual operation
In handling process, the problem for causing printed circuit half-finished product plate scratch to scrap.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided a kind of producer of circuit board auto-stitching profile
Method.
For achieving the above object, the present invention is employed the following technical solutions：A kind of producer of circuit board auto-stitching profile
Method, comprises the following steps：
Step one, the X-RAY target-shooting machines that pcb board is put on press equipment beat location hole, and then pcb board is grabbed by mechanical hand
Take to temporary storage platform；
Step 2, judge pcb board whether need wait, if pcb board is withouted waiting for, into step 3；If PCB
Plate needs to wait, then temporary storage platform is kept in pcb board；
Step 3, mechanical hand capture pcb board to para-position area, and location hole is positioned, the position of pcb board is finely tuned；
Step 4, by pcb board four while gummosis while and Copper Foil side by cutting knife remove；
Step 5, pcb board surrounding is polished smooth by edging knife, and fillet；
Step 6, respective code labelling is engraved in the edges of boards of pcb board；
Step 7, plate face and edges of boards to pcb board are cleaned；
Step 8, thickness of slab measurement is carried out to pcb board, check whether to meet design requirement, if thickness of slab meets design requirement,
Step 9 is entered then；If thickness of slab does not meet design requirement, pcb board is recycled；
Step 9, mechanical hand capture pcb board to transport vehicle.
Its further technical scheme is：The press equipment is networked, and couples ERP system, and operator uses scanner
Scanning work order, for from ERP system scanning setting in need parameter.
Its further technical scheme is：Mechanical hand in the step one is dual-arm robot.
Its further technical scheme is：The mechanical hand is at least provided with two or more pawl arms.
Its further technical scheme is：In the step 3, location hole is positioned by optics.
Its further technical scheme is：Area of carving characters is sent to by conveyer belt after pcb board polishing in the step 5.
Its further technical scheme is：Edges of boards in the step 6 in pcb board engrave respective code labelling, for follow-up
Quality review.
Its further technical scheme is：In the step 7, pcb board is cleaned by rinsing machine.
Its further technical scheme is：In the step 8, pcb board carries out thickness of slab test by radium-shine calibrator.
Its further technical scheme is：Including X-RAY target-shooting machines, gong side machine, edge polisher, radium-shine calibrator, bell machines
The production line of handss, conveyer belt, mechanical hand and unloader composition；Bell machines are provided between the X-RAY target-shooting machines and gong side machine
Handss, are provided with conveyer belt between gong side machine and edge polisher, conveyer belt is provided between the edge polisher and radium-shine calibrator, described
Mechanical hand is provided between radium-shine calibrator and unloader.
Compared with the prior art, the invention has the advantages that：A kind of production of the circuit board auto-stitching profile of the present invention
X-RAY target practices, gong side, edging, drafting board thickness flow process are combined together by mechanical hand and conveyer belt, form production line by method,
Various equipment are associated by same system, scan work order by scanner, are obtained all parameters, are disposably completed parameter defeated
Enter, reduce the artificial and waiting time, and reduce artificial repetitive operation, so as to reduce flow time, save manpower, Yi Jiyou
Problem is scrapped in the scratch caused in handling process.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
Description of the drawings
Fig. 1 be background technology in printed circuit board from press come out of the stove after process flow chart；
The FB(flow block) that Fig. 2 is provided for a kind of production method specific embodiment of circuit board auto-stitching profile of the invention；
The process flow that Fig. 3 is provided for a kind of production method specific embodiment of circuit board auto-stitching profile of the invention
Figure；
Fig. 4 is a kind of schematic diagram of the production method specific embodiment production line of circuit board auto-stitching profile of the invention.
Reference
10 production line, 20 X-RAY target-shooting machines
30 gong side machine, 40 edge polisher
50 radium-shine calibrator, 60 unloader
70 dual-arm robot, 80 conveyer belt
90 mechanical hands
Specific embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is entered with reference to specific embodiment
One step introduction and explanation, but it is not limited to this.
Specific embodiment as shown in Figures 1 to 4, a kind of production of circuit board auto-stitching profile that the present embodiment is provided
Method, comprises the following steps：
Step one, the X-RAY target-shooting machines that pcb board is put on press equipment beat location hole, and then pcb board is grabbed by mechanical hand
Take to temporary storage platform；
Step 2, judge pcb board whether need wait, if pcb board is withouted waiting for, into step 3；If PCB
Plate needs to wait, then temporary storage platform is kept in pcb board；
Step 3, mechanical hand capture pcb board to para-position area, and location hole is positioned, the position of pcb board is finely tuned；
Step 4, by pcb board four while gummosis while and Copper Foil side by cutting knife remove；
Step 5, pcb board surrounding is polished smooth by edging knife, and fillet；
Step 6, respective code labelling is engraved in the edges of boards of pcb board；
Step 7, plate face and edges of boards to pcb board are cleaned；
Step 8, thickness of slab measurement is carried out to pcb board, check whether to meet design requirement, if thickness of slab meets design requirement,
Step 9 is entered then；If thickness of slab does not meet design requirement, pcb board is recycled；
Step 9, mechanical hand capture pcb board to transport vehicle.
Wherein, press equipment is networked, and couples ERP system, and operator scans work order using scanner, for from ERP
In system scanning setting in need parameter.Realization only needs operator in press equipment front amplifying board, and follow-up process can be automatic
Complete, save flow time and artificial repetitive operation.
Wherein, the mechanical hand in step one is dual-arm robot.Mechanical hand is at least provided with two or more
Pawl arm, for capturing pcb board.In step 3, location hole is positioned to pcb board by optical alignment instrument, and pcb board is located at
On rotatable platform, the position of pcb board can be finely tuned after positioning, and after position adjustment, pcb board is captured to Cai Ban areas by mechanical hand.
Area of carving characters is sent to by conveyer belt after pcb board polishing in step 5.Edges of boards in pcb board in step 6 engrave corresponding generation
Code labeling, reviews for follow-up quality, is then sent to water wash zone by conveyer belt.In step 7, pcb board passes through rinsing machine
Cleaned, thickness measuring area is sent to by conveyer belt after cleaning.In step 8, pcb board carries out thickness of slab test by radium-shine calibrator,
After test, check it is qualified captured to transport vehicle by mechanical hand, disqualified upon inspection is sent to recovery area by conveyer belt.
Wherein, in initial workpiece inspection, it is only necessary to check once, it is to avoid the inspection that equipment repeats, saved time and into
This.
Specifically, as shown in figure 4, the invention provides a kind of production line 10, including X-RAY target-shooting machines 20, gong side machine 30,
Edge polisher 40, radium-shine calibrator 50, dual-arm robot 70, conveyer belt 80, mechanical hand 90 and unloader 60 are constituted；X-RAY practices shooting
Dual-arm robot 70 is provided between machine 20 and gong side machine 30, between gong side machine 30 and edge polisher 40, conveyer belt 80, edge polisher is provided with
Conveyer belt 80 is provided between 40 and radium-shine calibrator 50, mechanical hand 70 between radium-shine calibrator 50 and unloader 60, is provided with so that
X-RAY target practices, gong side, edging, drafting board thickness operation are bound tightly together, and various equipment are associated by same system,
Work order is scanned by scanner, all parameters are obtained, parameter input is disposably completed, is reduced the artificial and waiting time, and reduce
Artificial repetitive operation, so as to reduce flow time, saves manpower, and is scrapped due to the scratch caused in handling process and ask
Topic, greatly increases production efficiency and reduces cost of labor.
In sum, the production method of a kind of circuit board auto-stitching profile of the invention, by mechanical hand and conveyer belt
X-RAY target practices, gong side, edging, drafting board thickness operation are bound tightly together, production line is formed, various equipment are by same
System is associated, and scans work order by scanner, obtains all parameters, disposably completes parameter input, reduces artificial and waits
Treat the time, and reduce artificial repetitive operation, so as to reduce flow time, save manpower, and due to making in handling process
Into scratch scrap problem, greatly increase and production efficiency and reduce cost of labor.
It is above-mentioned only with embodiment further illustrating the technology contents of the present invention, be easier to understand in order to reader, but not
Represent embodiments of the present invention and be only limitted to this, it is any to extend or recreate according to the technology done by the present invention, by the present invention's
Protection.Protection scope of the present invention is defined by claims.
Claims (10)
1. a kind of production method of circuit board auto-stitching profile, it is characterised in that comprise the following steps：
Step one, the X-RAY target-shooting machines that pcb board is put on press equipment beat location hole, then pcb board by mechanical hand capture to
Temporary storage platform；
Step 2, judge pcb board whether need wait, if pcb board is withouted waiting for, into step 3；If pcb board is needed
Wait, then temporary storage platform is kept in pcb board；
Step 3, mechanical hand capture pcb board to para-position area, and location hole is positioned, the position of pcb board is finely tuned；
Step 4, by pcb board four while gummosis while and Copper Foil side by cutting knife remove；
Step 5, pcb board surrounding is polished smooth by edging knife, and fillet；
Step 6, respective code labelling is engraved in the edges of boards of pcb board；
Step 7, plate face and edges of boards to pcb board are cleaned；
Step 8, thickness of slab measurement is carried out to pcb board, check whether to meet design requirement, if thickness of slab meets design requirement, enter
Enter step 9；If thickness of slab does not meet design requirement, pcb board is recycled；
Step 9, mechanical hand capture pcb board to transport vehicle.
2. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the pressing
Equipment is networked, and couples ERP system, and operator scans work order using scanner, and for the scanning from ERP system, institute is in need
The parameter of setting.
3. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
Mechanical hand in one is dual-arm robot.
4. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the machinery
Handss are at least provided with two or more pawl arms.
5. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
In three, location hole is positioned by optics.
6. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
Area of carving characters is sent to by conveyer belt after pcb board polishing in five.
7. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
Edges of boards in six in pcb board engrave respective code labelling, review for follow-up quality.
8. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
In seven, pcb board is cleaned by rinsing machine.
9. a kind of production method of circuit board auto-stitching profile according to claim 1, it is characterised in that the step
In eight, pcb board carries out thickness of slab test by radium-shine calibrator.
10. the production method of a kind of circuit board auto-stitching profile according to claim 1, it is characterised in that including X-
The production of RAY target-shooting machines, gong side machine, edge polisher, radium-shine calibrator, dual-arm robot, conveyer belt, mechanical hand and unloader composition
Line；Dual-arm robot is provided between the X-RAY target-shooting machines and gong side machine, transmission between gong side machine and edge polisher, is provided with
Band, is provided with conveyer belt, is provided with mechanical hand between the radium-shine calibrator and unloader between the edge polisher and radium-shine calibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611178819.2A CN106604551A (en) | 2016-12-19 | 2016-12-19 | Circuit board production method through automatic pressing and profiling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611178819.2A CN106604551A (en) | 2016-12-19 | 2016-12-19 | Circuit board production method through automatic pressing and profiling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106604551A true CN106604551A (en) | 2017-04-26 |
Family
ID=58599575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611178819.2A Pending CN106604551A (en) | 2016-12-19 | 2016-12-19 | Circuit board production method through automatic pressing and profiling |
Country Status (1)
| Country | Link |
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| CN (1) | CN106604551A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567191A (en) * | 2017-09-21 | 2018-01-09 | 江门崇达电路技术有限公司 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
| CN108115367A (en) * | 2017-12-30 | 2018-06-05 | 苏州宁林光电科技有限公司 | A kind of Screw thread process method of pcb board |
| CN108161550A (en) * | 2017-12-30 | 2018-06-15 | 苏州宁林光电科技有限公司 | A kind of gong machine structure |
| CN108337806A (en) * | 2018-01-30 | 2018-07-27 | 江西景旺精密电路有限公司 | Target, which is bored, after a kind of PCB pressing cuts out mill connection line operation production line and operational method |
| TWI637670B (en) * | 2017-10-18 | 2018-10-01 | 捷惠自動機械有限公司 | Circuit board cutting process and equipment |
| CN109905966A (en) * | 2017-12-07 | 2019-06-18 | 捷惠自动机械有限公司 | A kind of circuit twist drill target and cut out the method that mill promotes production capacity |
| TWI667948B (en) * | 2017-10-18 | 2019-08-01 | 捷惠自動機械有限公司 | Circuit board drilling target and method of cutting and increasing production capacity |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN111587065A (en) * | 2020-05-26 | 2020-08-25 | 深圳市前海中软信息技术有限公司 | Method for accurately tracing single piece flow of drilling workshop based on PCB industry |
| CN112512216A (en) * | 2020-11-06 | 2021-03-16 | 龙南骏亚电子科技有限公司 | Circuit board interlayer alignment control method |
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| CN103929893A (en) * | 2014-04-18 | 2014-07-16 | 高怡达科技(深圳)有限公司 | Automatic transformer PCB assembling line |
| CN104822230A (en) * | 2015-05-12 | 2015-08-05 | 珠海智新自动化科技有限公司 | Novel multifunctional PCB production automation system |
| CN105376942A (en) * | 2015-10-30 | 2016-03-02 | 江苏博敏电子有限公司 | Stitching process equipment automatic device |
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| CN103929893A (en) * | 2014-04-18 | 2014-07-16 | 高怡达科技(深圳)有限公司 | Automatic transformer PCB assembling line |
| CN104822230A (en) * | 2015-05-12 | 2015-08-05 | 珠海智新自动化科技有限公司 | Novel multifunctional PCB production automation system |
| CN105376942A (en) * | 2015-10-30 | 2016-03-02 | 江苏博敏电子有限公司 | Stitching process equipment automatic device |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567191A (en) * | 2017-09-21 | 2018-01-09 | 江门崇达电路技术有限公司 | It is a kind of to improve the process that precision is bored outside mechanical blind hole plate |
| TWI637670B (en) * | 2017-10-18 | 2018-10-01 | 捷惠自動機械有限公司 | Circuit board cutting process and equipment |
| TWI667948B (en) * | 2017-10-18 | 2019-08-01 | 捷惠自動機械有限公司 | Circuit board drilling target and method of cutting and increasing production capacity |
| CN109905966B (en) * | 2017-12-07 | 2021-04-27 | 捷惠自动机械股份有限公司 | Method for drilling and cutting and grinding circuit board to improve productivity |
| CN109905966A (en) * | 2017-12-07 | 2019-06-18 | 捷惠自动机械有限公司 | A kind of circuit twist drill target and cut out the method that mill promotes production capacity |
| CN108115367A (en) * | 2017-12-30 | 2018-06-05 | 苏州宁林光电科技有限公司 | A kind of Screw thread process method of pcb board |
| CN108161550A (en) * | 2017-12-30 | 2018-06-15 | 苏州宁林光电科技有限公司 | A kind of gong machine structure |
| CN108337806A (en) * | 2018-01-30 | 2018-07-27 | 江西景旺精密电路有限公司 | Target, which is bored, after a kind of PCB pressing cuts out mill connection line operation production line and operational method |
| CN111050477B (en) * | 2019-12-23 | 2021-04-20 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN111587065A (en) * | 2020-05-26 | 2020-08-25 | 深圳市前海中软信息技术有限公司 | Method for accurately tracing single piece flow of drilling workshop based on PCB industry |
| CN111587065B (en) * | 2020-05-26 | 2022-02-15 | 深圳市前海中软信息技术有限公司 | Method for accurately tracing single piece flow of drilling workshop based on PCB industry |
| CN112512216A (en) * | 2020-11-06 | 2021-03-16 | 龙南骏亚电子科技有限公司 | Circuit board interlayer alignment control method |
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Application publication date: 20170426 |