CN110519925B - Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole - Google Patents

Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole Download PDF

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CN110519925B
CN110519925B CN201910667432.0A CN201910667432A CN110519925B CN 110519925 B CN110519925 B CN 110519925B CN 201910667432 A CN201910667432 A CN 201910667432A CN 110519925 B CN110519925 B CN 110519925B
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copper
thickness
pcb
copper thickness
measuring
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CN110519925A (en
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詹少华
陈跃生
郭正平
张丽芳
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Fuzhou Ruihua Printed Circuit Board Co ltd
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Fuzhou Ruihua Printed Circuit Board Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention provides a method for rapidly calculating the thickness of copper in a PCB (printed circuit board) via hole, which comprises the following steps: get face copper thickness through face copper tester volume, get through hole copper thickness and calculate the deep-plating ability through section technique volume, the PCB board measured value of setting for quantity is no less than in the statistics, obtain the average value of face copper thickness and deep-plating ability respectively, later measure the face copper thickness of the PCB board that awaits measuring through face copper tester, the correction error has still been introduced, the measuring result to face copper tester is rectified, utilize the computational formula to calculate the via hole center copper thickness of the PCB board that awaits measuring fast through the face copper thickness of measuring the target PCB board at last. According to the invention, under the condition that the PCB only has the through hole, the thickness of the hole copper in the center of the through hole is rapidly calculated without damaging the PCB to be tested.

Description

Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole
Technical Field
The invention relates to a method for testing the thickness of electroplated copper of a printed circuit board, in particular to a method for rapidly calculating the thickness of copper of a PCB (printed circuit board) via hole.
Background
From the 20 th 60 s, the Printed Circuit Board (PCB) industry has adopted the technology of hole metallization and electroplating to solve the problem of interlayer connection or conduction, via holes and component holes on the PCB need to be electroplated to reach the hole copper thickness required by customers to meet the quality requirement, and copper is the main component determining the cost of the PCB, so how to scientifically control the copper thickness is very important.
The existing copper thickness test methods comprise the following steps:
1. the hole copper tester: the method is a nondestructive test and can carry out a rapid test, and has the disadvantages that the size of a test probe is limited, only the copper thickness in the plated element hole with the aperture larger than 0.8mm can be tested, the tested copper thickness is an average value in the element hole instead of the central lowest copper thickness value, and the copper thickness of a via hole with the aperture smaller than or equal to 0.5mm cannot be tested;
2. surface copper tester: the method is a nondestructive test, can test quickly, can test the surface copper thickness, but requires the area to be more than 10mm multiplied by 10mm, and has the defect that the copper thickness in the hole cannot be tested;
3. slice measurement: the measurement result is accurate, the disadvantage is that the PCB needs to be cut open for measurement, and the test is time-consuming for destructive test.
Disclosure of Invention
One of the technical problems to be solved by the present invention is to provide a method for rapidly calculating the copper thickness of a via hole of a PCB, wherein the copper thickness of the via hole at the center of the via hole is rapidly calculated without damaging the PCB to be tested when the PCB only has the via hole.
One of the technical problems to be solved by the invention is realized as follows:
a method for rapidly calculating the thickness of copper in a PCB via hole comprises the following steps:
step 1, measuring the thickness of base material copper of a PCB to obtain a first base material copper thickness;
step 2, measuring the surface copper thickness of the PCB to obtain a first surface copper thickness, then slicing the PCB, measuring the surface copper thickness to obtain a second surface copper thickness, then calculating a first difference value between the first surface copper thickness and the second surface copper thickness by the following formula,
d1＝y1－y2
wherein d is1Is a first difference value, y1Is the first side copper thickness, y2The second side copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCBs not less than the set number to obtain a plurality of first base material copper thicknesses and a plurality of first difference values, and then calculating the average value of the plurality of first base material copper thicknesses
Figure GDA0003305037930000021
Calculating an average of the plurality of first differences as a first correction error
Figure GDA0003305037930000022
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity;
step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure GDA0003305037930000023
Step 6, measuring the surface copper thickness of the target PCB to obtain a third surface copper thickness, and calculating the first via hole copper thickness of the target PCB according to the following formula:
Figure GDA0003305037930000024
wherein z is1Is the first via hole copper thickness, y3Third side copper thickness.
Further, the "calculating the deep plating ability" specifically includes: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
Further, the PCB is an online scrapped PCB.
Further, the "measuring the surface copper thickness of the PCB board to obtain the first surface copper thickness, then slicing the PCB board, measuring the surface copper thickness to obtain the second surface copper thickness" specifically includes: the method comprises the steps of measuring the surface copper thickness of a PCB at a copper surface position which is not smaller than a set area through a surface copper tester to obtain the first surface copper thickness, slicing the PCB at the same copper surface position through a slicing technology, and measuring the surface copper thickness to obtain the second surface copper thickness.
Further, the step of measuring the thickness of the copper substrate of the PCB to obtain the first thickness of the copper substrate specifically comprises: measuring the thickness of the base material copper of the PCB at the position of the copper surface with the area not less than the set area through a surface copper tester to obtain the first base material copper thickness; the step of measuring the surface copper thickness of the target PCB to obtain the third surface copper thickness specifically comprises the following steps: and measuring the surface copper thickness of the target PCB at the copper surface position not less than the set area through a surface copper tester to obtain the third surface copper thickness.
The second technical problem to be solved by the present invention is to provide a method for rapidly calculating the copper thickness of a via hole of a PCB, wherein the copper thickness of the via hole at the center of the via hole is rapidly calculated without damaging the PCB to be tested under the condition that the PCB only has the via hole.
The second technical problem to be solved by the invention is realized as follows:
a method for rapidly calculating the thickness of copper in a PCB via hole comprises the following steps:
step 1, measuring the thickness of base material copper of a PCB to obtain a first base material copper thickness;
step 2, slicing the PCB, measuring the thickness of the copper substrate to obtain the thickness of the copper substrate, calculating a second difference value between the thickness of the copper substrate and the thickness of the copper substrate through the following formula,
d2＝x1－x2
wherein d is2Is the second difference, x1Is the first substrate copper thickness, x2Second substrate copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCBs not less than the set number to obtain a plurality of first base material copper thicknesses and a plurality of second difference values, and calculating the average value of the plurality of first base material copper thicknesses
Figure GDA0003305037930000031
Calculating an average of the plurality of second differences as a second correction error
Figure GDA0003305037930000032
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity t;
step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure GDA0003305037930000033
Step 6, measuring the surface copper thickness of the target PCB to obtain a third surface copper thickness y3Calculating the second via hole copper thickness z of the target PCB board according to the following formula2：
Figure GDA0003305037930000034
Wherein z is2Is the second via hole copper thickness, y3Third side copper thickness.
Further, the "calculating the deep plating ability" specifically includes: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
Further, the PCB is an online scrapped PCB.
Further, the step of measuring the thickness of the copper substrate of the PCB to obtain the first thickness of the copper substrate specifically comprises: measuring the thickness of the base material copper of the PCB at the position of the copper surface with the area not less than the set area through a surface copper tester to obtain the first base material copper thickness; "right the PCB board section, measure substrate copper thickness, obtain second substrate copper thickness" specifically does: and slicing the PCB at the same copper surface position by a slicing technology, and measuring the thickness of the copper of the base material to obtain the thickness of the copper of the second base material.
Further, the "measuring the surface copper thickness of the target PCB to obtain the third surface copper thickness" specifically includes: and measuring the surface copper thickness of the target PCB at the copper surface position not less than the set area through a surface copper tester to obtain the third surface copper thickness.
The invention has the following advantages:
utilize scrapping the PCB board on line, get face copper thickness through face copper tester volume, get through the section technique volume and cross hole copper thickness and calculate the deep-plating ability, the statistics is no less than the PCB board measured value of scrapping on line of settlement quantity, obtain the average value of face copper thickness and deep-plating ability respectively, later measure the face copper thickness of the PCB board that awaits measuring through face copper tester, utilize the computational formula can calculate out the via hole center copper thickness of the PCB board that awaits measuring fast, the unable via hole copper thickness that is less than or equal to 0.5mm of measuring of current hole copper tester has been overcome, the slicing technique need destroy the defect of PCB board again, the hole copper thickness at via hole center is calculated out fast accurately, reach scientific management and control, control manufacturing cost when guaranteeing the production quality.
Drawings
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
Fig. 1 is a flowchart of a method for rapidly calculating a copper thickness of a PCB via hole according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for rapidly calculating the thickness of copper in a via hole of a PCB according to another embodiment of the present invention.
Fig. 3 is a schematic view of deep-plating capability measurement of a method for rapidly calculating the copper thickness of a PCB via hole according to an embodiment of the present invention.
Fig. 4 is a second schematic view illustrating a deep-plating capability measurement method for rapidly calculating a copper thickness of a PCB via according to an embodiment of the present invention.
Detailed Description
Referring to fig. 1, fig. 3 and fig. 4, a method for rapidly calculating a thickness of copper in a via hole of a PCB according to an embodiment of the present invention includes the following steps:
a method for rapidly calculating the thickness of copper in a PCB via hole comprises the following steps:
step 1, measuring the thickness of base material copper of a PCB (printed Circuit Board) at a copper surface position (such as 10mm multiplied by 10mm) which is not smaller than a set area through a surface copper tester to obtain a first base material copper thickness;
step 2, measuring the surface copper thickness of the PCB at a copper surface position (such as 10mm multiplied by 10mm) which is not smaller than a set area through a surface copper tester to obtain a first surface copper thickness, then slicing the PCB at the same copper surface position through a slicing technology, measuring the surface copper thickness to obtain a second surface copper thickness, calculating a first difference value between the first surface copper thickness and the second surface copper thickness through the following formula,
d1＝y1－y2
wherein d is1Is a first difference value, y1Is the first side copper thickness, y2The second side copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCB boards with the number not less than the set number (the specific number is determined according to the production test requirement) to obtain a plurality of first base material copper thicknesses and a plurality of first difference values, and then calculating the average value of the plurality of first base material copper thicknesses
Figure GDA0003305037930000051
The average thickness of the PCB substrate copper is obtained, and the average value of a plurality of first difference values is obtained as a first correction error
Figure GDA0003305037930000052
The first surface copper thickness and the second surface copper thickness are obtained by respectively measuring through a surface copper tester and a slicing technology at the same position, namely, the error between the reading value and the actual value of the surface copper tester is obtained, and the average value of a plurality of error values is taken as the correction error when the via hole copper thickness is calculated.
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity;
the specific calculation method of the deep plating capacity comprises the following steps: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
The deep plating capability is the covering capability of the electroplating solution, and is the capability of the electroplating solution for depositing metal on the concave part or the deep hole on the surface of the cathode under a specific electroplating condition, and the copper plating layer thickness at the center position of the via hole can be calculated through the surface copper thickness value by utilizing the deep plating capability.
Step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure GDA0003305037930000066
Step 6, measuring the surface copper thickness of the target PCB at a copper surface position (such as 10mm multiplied by 10mm) which is not smaller than a set area through a surface copper tester to obtain a third surface copper thickness, and calculating the first via hole copper thickness of the target PCB according to the following formula:
Figure GDA0003305037930000061
wherein z is1Is the first via hole copper thickness, y3The thickness of the copper on the third surface,
Figure GDA0003305037930000062
average thickness, y, of PCB substrate copper obtained for surface copper tester measurements3The thickness value of the electroplated copper obtained by the surface copper tester,
Figure GDA0003305037930000063
the difference value between the measured value of the surface copper thickness of the target PCB and the measured value of the average thickness of the PCB substrate copper is the electroplated copper thickness value measured by the instrument, and the first correction error is subtracted
Figure GDA0003305037930000064
The reading error of the surface copper tester can be corrected to obtain the actual thickness value of the electroplated copper and the average value of the deep plating capacity multiplied by the actual thickness value
Figure GDA0003305037930000065
The thickness value of the electroplated copper at the center position of the via hole can be calculated and used as the thickness z of the copper in the first via hole1。
In a preferred embodiment, the PCB is an online scrapped PCB, and the online scrapped PCB is used for guaranteeing that the test cost can be greatly saved because the slicing measurement is a destructive test.
When the calculated value of the via hole copper thickness is lower than the hole copper thickness value required by production, the production process should be adjusted, the thickness of the electroplated copper is increased, and the PCB is ensured to meet the production requirement; when the calculated value of the thickness of the via hole copper is higher than the value of the thickness of the via hole copper required by production, the production process can be adjusted, the thickness of the electroplated copper is reduced, and the production cost is saved.
When the surface copper thickness is obtained by measuring after a copper electroplating procedure, and the deep plating capacity is also obtained by measuring after the copper electroplating procedure, the calculated copper thickness of the via hole is the copper electroplating thickness value of the center position of the via hole after the copper electroplating procedure; correspondingly, when the surface copper thickness is obtained by measurement after the second copper electroplating process, and the deep plating capacity is also obtained by measurement after the second copper electroplating process, the calculated copper thickness of the via hole is the copper electroplating thickness value of the via hole center position after the second copper electroplating process; each electroplating process is controlled, so that the control effect can be further improved, and the production cost is controlled while the production quality is ensured.
Referring to fig. 2 to 4, a second method for rapidly calculating the thickness of the copper in the via hole of the PCB according to the embodiment of the present invention includes the following steps:
step 1, measuring the thickness of base material copper of a PCB (printed Circuit Board) at a copper surface position (such as 10mm multiplied by 10mm) which is not smaller than a set area through a surface copper tester to obtain a first base material copper thickness;
step 2, slicing the PCB at the same copper surface position by a slicing technology, measuring the thickness of the base material copper to obtain the thickness of the second base material copper, then calculating a second difference value between the thickness of the first base material copper and the thickness of the second base material copper by the following formula,
d2＝x1－x2
wherein d is2Is the second difference, x1Is the first substrate copper thickness, x2Second substrate copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCB boards with the number not less than the set number (the specific number is determined according to the production test requirement), obtaining a plurality of first base material copper thicknesses and a plurality of second difference values, and solving the average value of the plurality of first base material copper thicknesses
Figure GDA0003305037930000071
The average thickness of the PCB substrate copper is obtained, and the average value of a plurality of second difference values is obtained as a second correction error
Figure GDA0003305037930000072
The thickness of the first base material copper and the thickness of the second base material copper are obtained at the same position through measurement of a surface copper tester and a slicing technology respectively, namely, the error between the reading value and the actual value of the surface copper tester is obtained, and the average value of a plurality of error values is taken as the correction error when the thickness of the via hole copper is calculated.
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity t;
the specific calculation method of the deep plating capacity comprises the following steps: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
The deep plating capability is the covering capability of the electroplating solution, and is the capability of the electroplating solution for depositing metal on the concave part or the deep hole on the surface of the cathode under a specific electroplating condition, and the copper plating layer thickness at the center position of the via hole can be calculated through the surface copper thickness value by utilizing the deep plating capability.
Step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure GDA0003305037930000081
Step 6, measuring the surface copper thickness of the target PCB at the position (such as 10mm multiplied by 10mm) of the copper surface with the area not less than the set area through a surface copper tester to obtain the third surface copper thickness, and calculating the second via hole copper thickness z of the target PCB according to the following formula2：
Figure GDA0003305037930000082
Wherein z is2Is the second via hole copper thickness, y3Is the third surface copper thickness, x1Average thickness, y, of PCB substrate copper obtained for surface copper tester measurements3The thickness value of the electroplated copper obtained by the surface copper tester,
Figure GDA0003305037930000083
the difference value between the measured value of the surface copper thickness of the target PCB and the measured value of the average thickness of the PCB substrate copper is the thickness value of the electroplated copper measured by the instrument, and the second correction error is subtracted
Figure GDA0003305037930000084
The reading error of the surface copper tester can be corrected to obtain the actual thickness value of the electroplated copper and the average value of the deep plating capacity multiplied by the actual thickness value
Figure GDA0003305037930000085
The thickness of the copper plating layer at the center position of the via hole can be calculated and used as the copper thickness z of the second via hole2。
In a preferred embodiment, the PCB is an online scrapped PCB, and the online scrapped PCB is used for guaranteeing that the test cost can be greatly saved because the slicing measurement is a destructive test.
When the calculated value of the via hole copper thickness is lower than the hole copper thickness value required by production, the production process should be adjusted, the thickness of the electroplated copper is increased, and the PCB is ensured to meet the production requirement; when the calculated value of the thickness of the via hole copper is higher than the value of the thickness of the via hole copper required by production, the production process can be adjusted, the thickness of the electroplated copper is reduced, and the production cost is saved.
Measuring the surface copper thickness and the deep plating capacity after a copper electroplating process, wherein the calculated copper thickness of the via hole is the copper electroplating thickness value of the center position of the via hole after the copper electroplating process; correspondingly, the thickness of the current surface copper and the deep plating capacity are obtained by measuring after the second copper electroplating process, and the calculated copper thickness of the via hole is the copper electroplating thickness value of the center position of the via hole after the second copper electroplating process; each electroplating process is controlled, so that the control effect can be further improved, and the production cost is controlled while the production quality is ensured.
According to the invention, online scrapped PCBs are utilized, the surface copper thickness is measured by a surface copper tester, the through hole copper thickness is measured by a slicing technology, the deep plating capability is calculated, the average value of the surface copper thickness and the deep plating capability is respectively obtained by counting no less than a set number of online scrapped PCBs, then the through hole center copper thickness of the PCBs to be measured can be rapidly calculated by a calculation formula through the reading of the surface copper tester, the defects that the existing hole copper tester cannot measure the through hole copper thickness less than or equal to 0.5mm, the slicing technology needs to damage the PCBs are overcome, the hole copper thickness at the center of the through hole is rapidly and accurately calculated, scientific control is achieved, the production quality is ensured, and the production cost is controlled.
Although specific embodiments of the invention have been described above, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the appended claims.

Claims (10)

1. A method for rapidly calculating the copper thickness of a PCB via hole is characterized by comprising the following steps:
step 1, measuring the thickness of base material copper of a PCB to obtain a first base material copper thickness;
step 2, measuring the surface copper thickness of the PCB to obtain a first surface copper thickness, then slicing the PCB, measuring the surface copper thickness to obtain a second surface copper thickness, then calculating a first difference value between the first surface copper thickness and the second surface copper thickness by the following formula,
d1＝y1－y2
wherein d is1Is a first difference value, y1Is the first side copper thickness, y2The second side copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCBs not less than the set number to obtain a plurality of first base material copper thicknesses and a plurality of first difference values, and then calculating the average value of the plurality of first base material copper thicknesses
Figure FDA0003305037920000011
Calculating an average of the plurality of first differences as a first correction error
Figure FDA0003305037920000012
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity;
step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure FDA0003305037920000013
Step 6, measuring the surface copper thickness of the target PCB to obtain a third surface copper thickness, and calculating the first via hole copper thickness of the target PCB according to the following formula:
Figure FDA0003305037920000014
wherein z is1Is the first via hole copper thickness, y3Third side copper thickness.
2. The method of claim 1, wherein the method comprises the steps of: the calculation of the deep plating capacity specifically comprises the following steps: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
3. The method of claim 1, wherein the method comprises the steps of: the PCB is an online scrapped PCB.
4. The method of claim 1, wherein the method comprises the steps of: "measure the face copper thickness of PCB board, obtain first face copper thickness, then right the PCB board section, measure face copper thickness, obtain second face copper thickness" specifically does: the method comprises the steps of measuring the surface copper thickness of a PCB at a copper surface position which is not smaller than a set area through a surface copper tester to obtain the first surface copper thickness, slicing the PCB at the same copper surface position through a slicing technology, and measuring the surface copper thickness to obtain the second surface copper thickness.
5. The method of claim 1, wherein the method comprises the steps of: the step of measuring the thickness of the copper substrate of the PCB to obtain the thickness of the first copper substrate specifically comprises the following steps: measuring the thickness of the base material copper of the PCB at the position of the copper surface with the area not less than the set area through a surface copper tester to obtain the first base material copper thickness; the step of measuring the surface copper thickness of the target PCB to obtain the third surface copper thickness specifically comprises the following steps: and measuring the surface copper thickness of the target PCB at the copper surface position not less than the set area through a surface copper tester to obtain the third surface copper thickness.
6. A method for rapidly calculating the copper thickness of a PCB via hole is characterized by comprising the following steps:
step 1, measuring the thickness of base material copper of a PCB to obtain a first base material copper thickness;
step 2, slicing the PCB, measuring the thickness of the copper substrate to obtain the thickness of the copper substrate, calculating a second difference value between the thickness of the copper substrate and the thickness of the copper substrate through the following formula,
d2＝x1－x2
wherein d is2Is the second difference, x1Is the first substrate copper thickness, x2Second substrate copper thickness;
step 3, repeating the step 1 and the step 2, operating the PCBs not less than the set number to obtain a plurality of first base material copper thicknesses and a plurality of second difference values, and calculating the average value of the plurality of first base material copper thicknesses
Figure FDA0003305037920000021
Calculating an average of the plurality of second differences as a second correction error
Figure FDA0003305037920000022
Step 4, slicing the PCB at the position of the via hole, and then calculating the deep plating capacity t;
step 5, repeating the step 4, operating the PCB plates with the number not less than the set number to obtain a plurality of deep plating capacities, and calculating the average value of the plurality of deep plating capacities
Figure FDA0003305037920000023
Step 6, measuring the surface copper thickness of the target PCB to obtain a third surface copper thickness y3Calculating the second via hole copper thickness z of the target PCB board according to the following formula2：
Figure FDA0003305037920000031
Wherein z is2Is the second via hole copper thickness, y3Third side copper thickness.
7. The method of claim 6, wherein the method comprises the steps of: the calculation of the deep plating capacity specifically comprises the following steps: the copper thickness value delta is respectively measured at the A, B positions on the left side and the right side of the upper orificeA、δBAnd measuring copper thickness values delta at C, D positions on the left side and the right side of the center of the hole respectivelyC、δDThe copper thickness value delta is respectively measured at E, F positions on the left side and the right side of the lower holeE、δFThen, the throwing power is calculated by the following formula:
t＝((δC+δD)÷2)÷((δA+δB+δE+δF)÷4)
wherein t is the throwing power.
8. The method of claim 6, wherein the method comprises the steps of: the PCB is an online scrapped PCB.
9. The method of claim 6, wherein the method comprises the steps of: the step of measuring the thickness of the copper substrate of the PCB to obtain the thickness of the first copper substrate specifically comprises the following steps: measuring the thickness of the base material copper of the PCB at the position of the copper surface with the area not less than the set area through a surface copper tester to obtain the first base material copper thickness; "right the PCB board section, measure substrate copper thickness, obtain second substrate copper thickness" specifically does: and slicing the PCB at the same copper surface position by a slicing technology, and measuring the thickness of the copper of the base material to obtain the thickness of the copper of the second base material.
10. The method of claim 6, wherein the method comprises the steps of: the step of measuring the surface copper thickness of the target PCB to obtain the third surface copper thickness specifically comprises the following steps: and measuring the surface copper thickness of the target PCB at the copper surface position not less than the set area through a surface copper tester to obtain the third surface copper thickness.
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CN110375696B (en) * 2019-07-23 2021-07-09 福州瑞华印制线路板有限公司 Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole
CN112198195B (en) * 2020-09-10 2022-12-09 广州兴森快捷电路科技有限公司 PCB hole inner plating quality detection method, device and storage medium
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