CN106413293B - The application method of bonding sheet - Google Patents
The application method of bonding sheet Download PDFInfo
- Publication number
- CN106413293B CN106413293B CN201611122203.3A CN201611122203A CN106413293B CN 106413293 B CN106413293 B CN 106413293B CN 201611122203 A CN201611122203 A CN 201611122203A CN 106413293 B CN106413293 B CN 106413293B
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- China
- Prior art keywords
- bonding sheet
- core plate
- copper dish
- denoted
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The invention discloses a kind of application methods of bonding sheet, are related to PCB production field, comprising the following steps: provide core plate, at least four copper dish are made on the core plate；The distance between the copper dish is measured, initial range is denoted as；Identical bonding sheet is respectively set in the upper side and lower side of the core plate, copper foil is arranged far from the side of the core plate in the bonding sheet, carries out lamination treatment to the copper foil, the bonding sheet and the core plate；Measurement is denoted as final distance to the distance between the copper dish after the copper foil, the bonding sheet and the core plate progress lamination treatment；The difference for calculating the final distance and the initial range, is denoted as changing value.By measuring initial range and final distance between the copper dish, the change in size trend of bonding sheet is obtained, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process.
Description
Technical field
The present invention relates to PCB production field more particularly to a kind of application methods of bonding sheet.
Background technique
Bonding sheet is because contain resin, under the high temperature and pressure effect of lamination treatment, from semi-cured state to solid state
Transformation.There are multiple core plates in one piece of multi-layer PCB, when making multi-layer PCB, because of the bonding sheet of different glass clothes in lamination process
Size changing value is not identical, causes the size changing value of core plate also not identical.If every core plate size harmomegathus is inconsistent, can lead
Reason layer is partially overproof to bring the failure modes such as internal layer short circuit and internal layer open circuit.The partially overproof approach of preventive stratum is first to do a batch at present
Or multiple batches of plate, each layer core plate size harmomegathus value is measured, a precompensation coefficient is provided, then answers this precompensation coefficient
In next group plate, to reach the partially overproof purpose of eliminating layer.Although this method is to be able to solve layer to a certain degree partially super
Poor bring is scrapped, but needs to test multiple batches of verifying, is caused production efficiency low and is wasted raw material.Meanwhile this method does not have
There is the influence for considering bonding sheet to core plate size harmomegathus, core plate is caused to be easy the influence by PCB procedure for processing and generate core plate
The overproof bring layer of size harmomegathus is partially overproof to be scrapped.
Summary of the invention
The purpose of the present invention is to provide a kind of application methods of bonding sheet, measure the change in size trend of bonding sheet, into
And derive influence of the bonding sheet to core plate size harmomegathus.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of application method of bonding sheet, comprising the following steps:
S10, core plate is provided, at least four copper dish is made on the core plate；
Distance between S20, the measurement copper dish, is denoted as initial range；
Preferably, the distance between the copper dish is specially the distance between the center of each copper dish.
S30, identical bonding sheet is respectively set in the upper side and lower side of the core plate, the bonding sheet is far from the core plate
Copper foil is arranged in side, carries out lamination treatment to the copper foil, the bonding sheet and the core plate；
S40, measurement are between the copper dish after the copper foil, the bonding sheet and the core plate progress lamination treatment
Distance is denoted as final distance；
S50, the difference for calculating the final distance and the initial range, are denoted as changing value.
Preferably, the difference for calculating the final distance and the initial range, specifically:
The result that the final distance subtracts the initial range is denoted as changing value；
Alternatively, the absolute value that the initial range subtracts the result of the final distance is denoted as changing value.
Preferably, further comprising the steps of after step S50:
S60, the bonding sheet selected according to the changing value in PCB manufacturing process.
Preferably, described select the bonding sheet according to the changing value in PCB manufacturing process, specifically:
It selects the bonding sheet to be arranged between core plate according to the changing value, makes the institute of the bonding sheet of adjacent position
The difference for stating changing value is less than or equal to predictive error.
Preferably, the predictive error is determined according to the copper dish size on the core plate, wherein the size of the copper dish can
To be the length or width or diameter of copper dish.The copper dish size is bigger, then the predictive error is bigger；The copper dish size is got over
Small, then the predictive error is smaller.
Further, the predictive error is equal to 10% or less the copper dish size.
Preferably, further comprising the steps of after step S50:
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the change of the different bonding sheet of several correspondences
Change value.
Preferably, further comprising the steps of after step S55:
S56, obtain corresponding to according to the corresponding changing value of different types of bonding sheet it is different types of described viscous
The change in size tendency chart of sheeting.
Preferably, use is identical during obtaining different types of bonding sheet corresponding changing value
The core plate and the copper foil, the copper dish position on the core plate is identical, and laminater used in lamination treatment is identical, and
The parameter of the setting of the laminater is identical.
Preferably, described make at least four copper dish on the core plate specifically:
At least four copper dish are made on the core plate by the way of etching.
Preferably, step S20 specifically:
Between the center the copper dish away from being measured more than twice, the center measured every time is denoted as original away from being averaged
Beginning distance；
And/or step S40 specifically:
To the copper foil, the bonding sheet and the core plate carry out lamination treatment after the copper dish between center away from into
Row measures more than twice, and the center measured every time is denoted as final distance away from being averaged.
Preferably, the shape of the core plate is rectangle, the diagonal of the core plate be arranged the copper dish and or
In the side length direction of the core plate, the copper dish are set.
Beneficial effects of the present invention: by measuring initial range and final distance between the copper dish, bonding sheet is obtained
Change in size trend, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process, further guarantee is more
The size harmomegathus of adjacent core plate has consistency in layer PCB.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the application method of bonding sheet of the invention.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of application method of bonding sheet as shown in Figure 1, comprising the following steps:
S10, core plate is provided, at least four copper dish is made on core plate.
In this present embodiment, the core plate provided is rectangle, and copper dish are arranged in the diagonal line of core plate and the side of four edges
On length direction.Certainly, in other embodiments, if core plate is rectangle, copper dish can be provided separately within to two diagonal lines of core plate
Above or by copper dish it is provided separately on the side length direction of the four edges of core plate.
Specifically, copper dish are made on core plate by the way of etching.The quantity of the core plate of offer is muti-piece, every piece of core plate
Specification it is just the same；Meanwhile the position that copper dish are made on every piece of core plate is also fixed.That is, complete in muti-piece specification
Fixation position on the same core plate opens up identical copper dish.
Distance between S20, measurement copper dish, obtains initial range.
Specifically, the distance between number machine measurement copper dish is drawn using high-precision Quadratic Finite Element.In this present embodiment, between copper dish away from
The distance between center from specially each copper dish, in other embodiments, the distance between copper dish can also be some of copper dish
The distance between fixed position.Distance between copper dish is multiple numerical value, four including distance, core plate between copper dish on diagonal line
The distance between copper dish on the side length direction on side.The numerical value of these distances is all used as the initial range of copper dish.In order to eliminate measurement
Error obtains most accurate initial range numerical value, and the number of measurement is more than twice, the average value of all measurement numerical value to be taken to make
For the numerical value of determining initial range.
S30, lamination treatment is carried out to copper foil, bonding sheet and core plate.
In this present embodiment, it is respectively provided with identical bonding sheet in the upper side and lower side of core plate, every piece of bonding sheet is far from core plate
Side be equipped with copper foil, to all copper foils, bonding sheet and core plate carry out lamination treatment.Specifically, the bonding sheet provided is not
With the bonding sheet of type glass cloth, further, above-mentioned lamination treatment is carried out respectively to the bonding sheet of variety classes glass cloth.
Simultaneously, it is ensured that laminater used in each lamination treatment is same device, and the pressing of lamination treatment every time
Processing procedure is identical.This avoid the errors that itself is generated in lamination process, ensure that copper foil, bonding after each lamination treatment
Change in size between piece and core plate both is from the variation of self attributes, will not be because of used equipment or the process of processing
And generate mismachining tolerance.
S40, measurement to copper foil, bonding sheet and core plate carry out lamination treatment after copper dish between distance, obtain finally away from
From.
In this present embodiment, using having the X-RAY for surveying number function to bore target drone, measure after lamination treatment between copper dish away from
From.Specifically, the distance after measurement lamination treatment between copper dish is also multiple numerical value, including carries out diagonal line after lamination treatment
The distance between copper dish on the side length direction of the four edges of distance, core plate between upper copper dish.Further, it is missed to eliminate measurement
Difference obtains most accurate final distance values, and the number of measurement is more than twice, to take the average value conduct of all measurement numerical value
The numerical value of determining final distance.
S50, the difference for calculating final distance and initial range, are denoted as changing value.
In this present embodiment, the result that final distance subtracts initial range is denoted as changing value；In other embodiments
The absolute value for the result that initial range can be subtracted to final distance is denoted as changing value.
Specifically, as the distance and conduct between copper dish on the diagonal line after the carry out lamination treatment of one of final distance
Distance on the diagonal line of one of initial distance between copper dish is corresponding；After the carry out lamination treatment of one of final distance
The distance and the side length of the four edges of the core plate as one of initial distance between copper dish on the side length direction of the four edges of core plate
The distance between copper dish on direction is corresponding.Therefore, changing value includes the changing value of diagonal and the variation in side length direction
Value.
Because the distance change between copper dish is as caused by the change in size of core plate, and the change in size of core plate is by gluing
What the change in size of sheeting was influenced, show that the changing value of the distance between copper dish has also just obtained the variation of the size of core plate
Value, has also just obtained the size changing value and variation tendency of bonding sheet, so that it may further anti-to release bonding sheet in PCB manufacturing process
The trend that core plate size harmomegathus is influenced.
It is further comprising the steps of after step S50:
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the changing value of the different bonding sheet of several correspondences.
Further, the survey of the changing value of the distance between above-mentioned copper dish is all carried out for the bonding sheet of variety classes glass cloth
Amount, and show that the size changing value of the bonding sheet of every kind of glass cloth and the bonding sheet of every kind of glass cloth influence core plate size harmomegathus
Trend.
It is further comprising the steps of after step S55:
S56, become according to the size that the corresponding changing value of different types of bonding sheet obtains corresponding to different types of bonding sheet
Change tendency chart.
In this present embodiment, in order to which subsequent more convenient bonding sheet using various glass clothes influences core plate size harmomegathus
Trend, obtain corresponding to the change in size trend of different types of bonding sheet according to the corresponding changing value of different types of bonding sheet
Figure thus can obtain every kind of bonding sheet to core by observing the corresponding change in size tendency chart of bonding sheet of variety classes glass cloth
The trend that board size harmomegathus influences.Certainly, in other embodiments, the bonding sheet change in size trend of variety classes glass cloth is obtained
It can be the mode or other suitable modes of drafting table.
S60, in PCB manufacturing process according to changing value select bonding sheet.
After obtaining the bonding sheet change in size trend of variety classes glass cloth, by the bonding sheet for observing variety classes glass cloth
Change in size trend can derive the trend of influence of the bonding sheet to core plate size harmomegathus.Bonding sheet will be derived to core plate ruler
The trend of the influence of very little harmomegathus applies in the production of PCB, and PCB is made of muti-piece core plate, and bonding sheet, In are additionally provided between core plate
Before core plate and bonding sheet pressing, bonding sheet is selected according to changing value, the structure of core plate and bonding sheet is adjusted, makes adjacent position
The difference of changing value of bonding sheet be less than or equal to predictive error, to ensure to carry out core plate and bonding sheet phase after lamination treatment
The size harmomegathus variation of adjacent core plate is consistent.Also it is inconsistent to avoid every piece of core plate size harmomegathus in multi-layer PCB, and then avoids
Because the partially overproof bring internal layer short circuit of layer and internal layer are opened a way.
Specifically, above-mentioned predictive error determines that wherein the size of copper dish can be copper dish according to the copper dish size on core plate
Length or width or diameter.Copper dish size is bigger, then predictive error is bigger；Copper dish size is smaller, then predictive error is smaller.Into
One step, predictive error is equal to 10% or less copper dish size.
In other embodiments, the shape of core plate can be different from the rectangular shape provided in the present embodiment.Specifically, if core
Plate is circular slab, copper dish can be arranged along the diametrical direction and circumferencial direction of core plate, the distance between corresponding measurement copper dish obtains
Out before and after lamination treatment between copper dish distance changing value.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (7)
1. a kind of application method of bonding sheet, which comprises the following steps:
S10, core plate is provided, at least four copper dish is made on the core plate；
Distance between S20, the measurement copper dish, is denoted as initial range；
S30, identical bonding sheet, side of the bonding sheet far from the core plate are respectively set in the upper side and lower side of the core plate
Copper foil is set, lamination treatment is carried out to the copper foil, the bonding sheet and the core plate；
S40, measurement to the copper foil, the bonding sheet and the core plate carry out lamination treatment after the copper dish between away from
From being denoted as final distance；
S50, the difference for calculating the final distance and the initial range, are denoted as changing value；
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the variation of the different bonding sheet of several correspondences
Value；
S56, it obtains corresponding to different types of bonding sheet according to the corresponding changing value of different types of bonding sheet
Change in size tendency chart；
During obtaining different types of bonding sheet corresponding changing value, using the identical core plate and institute
Copper foil is stated, the copper dish position on the core plate is identical, and laminater used in lamination treatment is identical, and the laminater
The parameter of setting is identical.
2. the application method of bonding sheet according to claim 1, which is characterized in that described to calculate the final distance and institute
The difference of initial range is stated, specifically:
The result that the final distance subtracts the initial range is denoted as changing value；
Alternatively, the absolute value that the initial range subtracts the result of the final distance is denoted as changing value.
3. the application method of bonding sheet according to claim 1, which is characterized in that after step S50 further include following
Step:
S60, the bonding sheet selected according to the changing value in PCB manufacturing process.
4. the application method of bonding sheet according to claim 3, which is characterized in that the basis in PCB manufacturing process
The changing value selects the bonding sheet, specifically:
It selects the bonding sheet to be arranged between core plate according to the changing value, makes the change of the bonding sheet of adjacent position
The difference of change value is less than or equal to predictive error.
5. the application method of bonding sheet according to claim 1, which is characterized in that described to be made at least on the core plate
Four copper dish specifically:
At least four copper dish are made on the core plate by the way of etching.
6. the application method of bonding sheet according to claim 1, which is characterized in that step S20 specifically:
Between the center the copper dish away from being measured more than twice, by the center measured every time away from be averaged be denoted as it is original away from
From；
And/or step S40 specifically:
To the center between the copper dish after the copper foil, the bonding sheet and the core plate progress lamination treatment away from progress two
The center measured every time is denoted as final distance away from being averaged by the secondary above measurement.
7. the application method of bonding sheet according to claim 1, which is characterized in that the shape of the core plate is rectangle, In
The diagonal of the core plate be arranged the copper dish and or in the side length direction of the core plate, the copper dish are set.
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| CN201611122203.3A CN106413293B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611122203.3A CN106413293B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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| CN106413293B true CN106413293B (en) | 2019-12-03 |
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| CN108088401A (en) * | 2017-12-06 | 2018-05-29 | 广州兴森快捷电路科技有限公司 | Prepreg harmomegathus measuring method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246258A (en) * | 2015-10-27 | 2016-01-13 | 珠海方正科技高密电子有限公司 | Circuit board expanding-shrinking proportion control method and system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0529764A (en) * | 1991-07-24 | 1993-02-05 | Toppan Printing Co Ltd | Manufacture of multilayer printed wiring board |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246258A (en) * | 2015-10-27 | 2016-01-13 | 珠海方正科技高密电子有限公司 | Circuit board expanding-shrinking proportion control method and system |
Non-Patent Citations (2)
| Title |
|---|
| HDI印制板制作中涨缩控制及爆板问题研究;黄志远等;《印制电路信息》;20120531(第5期);第50-53页 * |
| 多层板涨缩性层偏改善方法及监控方式解析;龚俊等;《印制电路信息》;20120131(第1期);第28-33页 * |
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