CN106793586B - The application method of bonding sheet - Google Patents
The application method of bonding sheet Download PDFInfo
- Publication number
- CN106793586B CN106793586B CN201611122202.9A CN201611122202A CN106793586B CN 106793586 B CN106793586 B CN 106793586B CN 201611122202 A CN201611122202 A CN 201611122202A CN 106793586 B CN106793586 B CN 106793586B
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- Prior art keywords
- bonding sheet
- copper foil
- distance
- location hole
- changing value
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention discloses a kind of application methods of bonding sheet, are related to PCB production field, comprising the following steps: provide at least two blocks of copper foils, at least four location holes are made on the copper foil；The distance between the location hole is measured, initial range is denoted as；Bonding sheet is provided, the copper foil is respectively set in the two sides of the bonding sheet, lamination treatment is carried out to the copper foil and the bonding sheet；Measurement is denoted as final distance to the distance between the location hole after the copper foil and bonding sheet progress lamination treatment；The difference for calculating the final distance and the initial range, is denoted as changing value.By measuring initial range and final distance between the location hole, the change in size trend of bonding sheet is obtained, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process.
Description
Technical field
The present invention relates to PCB production field more particularly to a kind of application methods of bonding sheet.
Background technique
Bonding sheet is because contain resin, under the high temperature and pressure effect of lamination treatment, from semi-cured state to solid state
Transformation.There are multiple core plates in one piece of multi-layer PCB, when making multi-layer PCB, because of the bonding sheet of different glass clothes in lamination process
Size changing value is not identical, causes the size changing value of core plate also not identical.If every core plate size harmomegathus is inconsistent, can lead
Reason layer is partially overproof to bring the failure modes such as internal layer short circuit and internal layer open circuit.The partially overproof approach of preventive stratum is first to do a batch at present
Or multiple batches of plate, each layer core plate size harmomegathus value is measured, a precompensation coefficient is provided, then answers this precompensation coefficient
In next group plate, to reach the partially overproof purpose of eliminating layer.Although this method is to be able to solve layer to a certain degree partially super
Poor bring is scrapped, but needs to test multiple batches of verifying, is caused production efficiency low and is wasted raw material.Meanwhile this method does not have
There is the influence for considering bonding sheet to core plate size harmomegathus, core plate is caused to be easy the influence by PCB procedure for processing and generate core plate
The overproof bring layer of size harmomegathus is partially overproof to be scrapped.
Summary of the invention
The purpose of the present invention is to provide a kind of application methods of bonding sheet, measure the change in size trend of bonding sheet, into
And derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of application method of bonding sheet, comprising the following steps:
S10, at least two blocks of copper foils are provided, at least four location holes is made on the copper foil；
Distance between S20, the measurement location hole, is denoted as initial range；
Preferably, the distance between the location hole is specially the distance between the center of each location hole.
S30, bonding sheet is provided, the copper foil is respectively set in the two sides of the bonding sheet, to the copper foil and described viscous
Sheeting carries out lamination treatment；
S40, measurement are to the distance between the location hole after the copper foil and bonding sheet progress lamination treatment, note
For final distance；
S50, the difference for calculating the final distance and the initial range, are denoted as changing value.
Preferably, the difference for calculating the final distance and the initial range, specifically:
The result that the final distance subtracts the initial range is denoted as changing value；
Alternatively, the absolute value that the initial range subtracts the result of the final distance is denoted as changing value.
Preferably, further comprising the steps of after step S50:
S60, the bonding sheet selected according to the changing value in PCB manufacturing process.
Preferably, described select the bonding sheet according to the changing value in PCB manufacturing process, specifically:
It selects the bonding sheet to be arranged between core plate according to the changing value, makes the institute of the bonding sheet of adjacent position
The difference for stating changing value is less than or equal to predictive error.
Preferably, the predictive error is determined according to the size of the location hole on the copper foil, wherein the location hole
Size can be the length or width or diameter of location hole.The size of the location hole is bigger, then the predictive error is bigger；Institute
The size for stating location hole is smaller, then the predictive error is smaller.
Further, the predictive error is equal to 10% or less the size of the location hole.
Preferably, further comprising the steps of after step S50:
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the change of the different bonding sheet of several correspondences
Change value.
Preferably, further comprising the steps of after step S55:
S56, obtain corresponding to according to the corresponding changing value of different types of bonding sheet it is different types of described viscous
The change in size tendency chart of sheeting.
Preferably, use is identical during obtaining different types of bonding sheet corresponding changing value
The copper foil, the position of the location hole on the copper foil is identical, and laminater used in lamination treatment is identical, and the layer
The parameter of the setting of pressure device is identical.
Preferably, the location hole is located at the bonding sheet in the view field on the copper foil；
With or, the copper foil close to the side of the bonding sheet be the copper foil hair side.
Preferably, step S20 specifically:
The number of distance between the measurement location hole is that more than twice, the distance measured every time is averaged
It is worth the initial range；
With or, step S40 specifically:
The measurement is to the distance between the location hole after the copper foil and bonding sheet progress lamination treatment
Number is more than twice, the distance measured every time to be averaged and obtains the final distance.
Preferably, described make at least four location holes on the copper foil specifically:
The shape of the copper foil is rectangle, the diagonal of the copper foil be arranged the location hole and or described
The location hole is arranged in the side length direction of copper foil.
Beneficial effects of the present invention: by measuring initial range and final distance between the location hole, bonding sheet is obtained
Change in size trend, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process, it is further to guarantee
The size harmomegathus of adjacent core plate has consistency in multi-layer PCB.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the application method of bonding sheet of the invention.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of application method of bonding sheet as shown in Figure 1, comprising the following steps:
S10, at least two blocks of copper foils are provided, at least four location holes is made on copper foil.
In this present embodiment, the copper foil provided be rectangle, by location hole be arranged in copper foil two diagonal lines and four
On the side length direction on side.Certainly, in other embodiments, if copper foil is rectangle, location hole can be provided separately within to pair of copper foil
It is provided separately on the side length direction of the four edges of copper foil on linea angulata or by location hole.
Specifically, the specification for providing every block of copper foil is just the same, meanwhile, the position of location hole is made on every block of copper foil
Be it is fixed, in this present embodiment, copper foil with a thickness of [0.3,0.7] OZ, location hole be diameter be [0.8,1.2] mm circle
Hole.That is, the fixation position on the duplicate copper foil of muti-piece specification opens up identical location hole.Certainly, in other implementations
In example, the thickness of copper foil can be [0.2,1.2] OZ, [0.5,0.9] OZ, 0.3OZ, 0.5OZ or 0.7OZ；The diameter of location hole
It can be [0.4,1.8] mm, [0.9,2] mm, 0.8mm, 1mm or 1.2mm.
Distance between S20, measurement and positioning hole, is denoted as initial range.
Specifically, the distance between number machine measurement and positioning hole is drawn using high-precision Quadratic Finite Element.In this present embodiment, between location hole
Distance be specially each location hole the distance between center, in other embodiments, the distance between location hole can also be fixed
Some of position hole fixes the distance between position.Distance between location hole is multiple numerical value, including between location hole on diagonal line
Distance, copper foil four edges side length direction on location hole between distance.The numerical value of these distances is all used as the original of location hole
Beginning distance.Most accurate initial range numerical value is obtained in order to eliminate measurement error, the number of measurement is more than twice, to take all
Measure numerical value of the average value of numerical value as determining initial range.
S30, bonding sheet is provided, copper foil is respectively set in the two sides of bonding sheet, lamination treatment is carried out to copper foil and bonding sheet.
In this present embodiment, one block of copper foil is respectively provided in the upper side and lower side of bonding sheet.Specifically, copper foil is single side processing
Copper foil, the hair side of copper foil contact fitting with the side of bonding sheet.Lamination treatment is carried out to all copper foils and bonding sheet.Specifically
Ground, the bonding sheet provided are that the bonding sheet of variety classes glass cloth further carries out the bonding sheet of variety classes glass cloth respectively
Above-mentioned lamination treatment.Certainly, in other embodiments, copper foil can also handle copper foil and dual light for double treated foil, smooth surface
Copper foil.
Specifically, in order to ensure the influence that the variation of distance between location hole both is from bonding sheet, location hole is located at bonding
Piece is in the view field on copper foil, namely ensures that bonding sheet covers all location holes when bonding sheet is bonded with copper foil.
Further, it is ensured that laminater used in each lamination treatment is same device, and lamination treatment every time
Pressure programming is identical.This avoid the errors that itself is generated in lamination process, ensure that copper foil after each lamination treatment
It both is from the variation of self attributes with the change in size of bonding sheet, will not be produced because of used equipment or the process of processing
Raw mismachining tolerance.
S40, measurement are denoted as final distance to the distance between the location hole after copper foil and bonding sheet progress lamination treatment.
In this present embodiment, the distance after drawing number machine to measure lamination treatment using high-precision Quadratic Finite Element between location hole.Tool
Body, the distance after measurement lamination treatment between location hole is also multiple numerical value, including after progress lamination treatment on diagonal line
The distance between location hole on the side length direction of the four edges of distance, copper foil between location hole.Further, it is measured to eliminate
Error obtains most accurate final distance values, and the number of measurement is more than twice, the average value of all measurement numerical value to be taken to make
For the numerical value of determining final distance.
S50, the difference for calculating the final distance and the initial range, are denoted as changing value.
In this present embodiment, the result that final distance subtracts initial range is denoted as changing value；In other embodiments
The absolute value for the result that initial range can be subtracted to final distance is denoted as changing value.
Specifically, as the distance and work between location hole on the diagonal line after the carry out lamination treatment of one of final distance
Distance between location hole on the diagonal line of one of initial distance is corresponding；As one of final distance carry out lamination treatment it
The distance and the four edges of the copper foil as one of initial distance between location hole on the side length direction of the four edges of copper foil afterwards
Side length direction on location hole between distance it is corresponding.Therefore, changing value includes changing value and the side length side of diagonal
To changing value.
Because the distance change between location hole be as caused by the change in size of copper foil, and the change in size of copper foil be by
What the change in size of bonding sheet was influenced, also just obtain the size changing value and variation tendency of bonding sheet.It can be further anti-
Release the trend that bonding sheet influences core plate size harmomegathus in the manufacturing process of multi-layer PCB.
It is further comprising the steps of after step S50:
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the changing value of the different bonding sheet of several correspondences.
Further, the survey of the changing value of the distance between above-mentioned location hole is all carried out for the bonding sheet of variety classes glass cloth
Amount, and obtain the size changing value of the bonding sheet of every kind of glass cloth, and anti-release every kind of glass cloth in the manufacturing process of multi-layer PCB
Bonding sheet trend that core plate size harmomegathus is influenced.
It is further comprising the steps of after step S55:
S56, become according to the size that the corresponding changing value of different types of bonding sheet obtains corresponding to different types of bonding sheet
Change tendency chart.
In this present embodiment, in order to which subsequent more convenient bonding sheet using various glass clothes influences core plate size harmomegathus
Trend, obtain corresponding to the change in size trend of different types of bonding sheet according to the corresponding changing value of different types of bonding sheet
Figure thus can obtain every kind of bonding sheet to core by observing the corresponding change in size tendency chart of bonding sheet of variety classes glass cloth
The trend that board size harmomegathus influences.Certainly, in other embodiments, the bonding sheet change in size trend of variety classes glass cloth is obtained
It can be the mode or other suitable modes of drafting table.
S60, in PCB manufacturing process according to changing value select bonding sheet.
After obtaining the bonding sheet change in size trend of variety classes glass cloth, by the bonding sheet for observing variety classes glass cloth
Change in size trend can derive the trend of influence of the bonding sheet to core plate size harmomegathus.By the bonding sheet derived to core plate
The effect tendency of size harmomegathus applies in the production of multi-layer PCB, and multi-layer PCB is made of muti-piece core plate, is additionally provided between core plate
Bonding sheet selects bonding sheet according to changing value, adjusts the structure of core plate and bonding sheet before to core plate and bonding sheet pressing,
The difference of the changing value of the bonding sheet of adjacent position is set to be less than or equal to predictive error, to ensure to be laminated core plate and bonding sheet
The size harmomegathus variation of adjacent core plate is consistent after processing.Also it is inconsistent to avoid every piece of core plate size harmomegathus in multi-layer PCB,
And then it avoids because of the partially overproof bring internal layer short circuit of layer and internal layer open circuit.
Specifically, above-mentioned predictive error determines that wherein the size of location hole can be according to the positioning pore size on copper foil
The length or width or diameter of location hole.Positioning pore size is bigger, then predictive error is bigger；It is smaller to position pore size, then makes a reservation for
Error is smaller.Further, predictive error is equal to 10% or less positioning pore size.
In other embodiments, the shape of copper foil can be different from the rectangular shape provided in the present embodiment.Specifically, if copper
Foil is circular slab, and location hole can be arranged along the diametrical direction and circumferencial direction of copper foil, between corresponding measurement and positioning hole away from
From the changing value for obtaining lamination treatment front and back positioning distance between borehole.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (9)
1. a kind of application method of bonding sheet, which comprises the following steps:
S10, at least two blocks of copper foils are provided, at least four location holes is made on the copper foil；
Distance between S20, the measurement location hole, is denoted as initial range；
S30, bonding sheet is provided, the copper foil is respectively set in the two sides of the bonding sheet, to the copper foil and the bonding sheet
Carry out lamination treatment；
S40, measurement are denoted as most the distance between the location hole after the copper foil and bonding sheet progress lamination treatment
Whole distance；
S50, the difference for calculating the final distance and the initial range, are denoted as changing value；
It is further comprising the steps of after step S50:
S60, the bonding sheet selected according to the changing value in PCB manufacturing process.
2. the application method of bonding sheet according to claim 1, which is characterized in that described to calculate the final distance and institute
The difference of initial range is stated, specifically:
The result that the final distance subtracts the initial range is denoted as changing value；
Alternatively, the absolute value that the initial range subtracts the result of the final distance is denoted as changing value.
3. the application method of bonding sheet according to claim 1, which is characterized in that the basis in PCB manufacturing process
The changing value selects the bonding sheet, specifically:
It selects the bonding sheet to be arranged between core plate according to the changing value, makes the change of the bonding sheet of adjacent position
The difference of change value is less than or equal to predictive error.
4. the application method of bonding sheet according to claim 1, which is characterized in that after step S50 further include following
Step:
S55, step S10, S20, S30, S40 and S50 are repeated, obtains the variation of the different bonding sheet of several correspondences
Value.
5. the application method of bonding sheet according to claim 4, which is characterized in that after step S55 further include following
Step:
S56, it obtains corresponding to different types of bonding sheet according to the corresponding changing value of different types of bonding sheet
Change in size tendency chart.
6. the application method of bonding sheet according to claim 4, which is characterized in that obtaining different types of bonding
During the corresponding changing value of piece, using the identical copper foil, the position of the location hole on the copper foil is identical, layer
It is identical that pressure handles used laminater, and the parameter of the setting of the laminater is identical.
7. the application method of bonding sheet according to claim 1, which is characterized in that the location hole is located at the bonding sheet
In the view field on the copper foil；
With or, the copper foil close to the side of the bonding sheet be the copper foil hair side.
8. the application method of bonding sheet according to claim 1, which is characterized in that step S20 specifically:
The number of distance between the measurement location hole is that more than twice, the distance measured every time is averaged
The initial range out；
With or, step S40 specifically:
Number of the measurement to the distance between the location hole after the copper foil and bonding sheet progress lamination treatment
More than twice, the distance measured every time to be averaged and obtains the final distance.
9. the application method of bonding sheet according to claim 1, which is characterized in that described to be made at least on the copper foil
Four location holes specifically:
The shape of the copper foil is rectangle, the diagonal of the copper foil be arranged the location hole and or in the copper foil
Side length direction the location hole is set.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611122202.9A CN106793586B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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|---|---|---|---|
| CN201611122202.9A CN106793586B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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| CN106793586A CN106793586A (en) | 2017-05-31 |
| CN106793586B true CN106793586B (en) | 2019-05-07 |
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| CN108088401A (en) * | 2017-12-06 | 2018-05-29 | 广州兴森快捷电路科技有限公司 | Prepreg harmomegathus measuring method |
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| CN102036511B (en) * | 2010-12-01 | 2012-12-12 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN102098884B (en) * | 2010-12-29 | 2014-07-23 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN105376963A (en) * | 2015-11-04 | 2016-03-02 | 江门崇达电路技术有限公司 | Method for grabbing internal layer compensation coefficients |
| CN105376964B (en) * | 2015-12-03 | 2018-09-07 | 皆利士多层线路版(中山)有限公司 | A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board |
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