CN105376964B - A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board - Google Patents
A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board Download PDFInfo
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- CN105376964B CN105376964B CN201510885490.2A CN201510885490A CN105376964B CN 105376964 B CN105376964 B CN 105376964B CN 201510885490 A CN201510885490 A CN 201510885490A CN 105376964 B CN105376964 B CN 105376964B
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- inner plating
- target
- circuit board
- harmomegathus coefficient
- multilayer circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Abstract
The invention discloses the production method of a kind of harmomegathus coefficient acquisition methods of multilayer circuit board, multilayer circuit board, multilayer circuit board harmomegathus coefficient acquisition methods include the following steps：Multiple inner platings and lamina rara externa to be laminated are provided, three or more targets are added on inner plating, and make the target stagger setting between multiple inner platings；Multiple inner platings and lamina rara externa are subjected to lamination treatment；Target drone, which is bored, by X Ray obtains the target position information on multiple inner platings；The harmomegathus coefficient b of inner plating is calculated according to the target position information on inner plating.Above-mentioned multilayer circuit board harmomegathus coefficient acquisition methods, by the target stagger setting between each inner plating, after target stagger setting between each inner plating, just target drone can be bored by X Ray all to get the target position information on 2 inner platings of N simultaneously, it then then can be according to the harmomegathus coefficient of each inner plating of target position acquisition of information on each inner plating so that the Aligning degree of the line pattern between each inner plating can be improved.
Description
Technical field
The present invention relates to the manufacture technology fields of multilayer circuit board plate, more particularly, to a kind of harmomegathus system of multilayer circuit board
The production method of number acquisition methods and multilayer circuit board.
Background technology
The bonding processes of multilayer circuit board are by applying temperature of heat plate, moulding pressure, control duration and being taken out
Vacuum controls the process of pressing plate, so that the prepreg between neighboring layer lines plate is pressed into the resin being fully cured, and will be more
A internal substrate is Nian Jie with copper foil at one piece of multilayer circuit board, to ensure the electric property and mechanical performance of multilayer circuit board.It is more
The pressing plate mode of sandwich circuit board includes Mass Lam (large-scale pressing-plate method) and Pin Lam (pin positioning pressuring plate method).Wherein, for
Common Mass Lam techniques, plank can have harmomegathus phenomenon after the process such as high temperature and pressure.Therefore more in pressing
Before sandwich circuit board, generally requires and carry out pressure testing after being overlapped to multilayer circuit board.Then the pre- harmomegathus system of each sandwich circuit board is obtained
Number draws film graphic file further according to pre- harmomegathus coefficient.In this way so that the circuit being pressed on each sandwich circuit board has and sets
Count identical dimensions.
Wherein, the pre- harmomegathus coefficient of each sandwich circuit board in the prior art is obtained often by inquiry plank specification.That
, for the multilayer circuit board of the number of plies higher (6 layers or more), due to the residual copper ratio and plank on plank type, inner plating
The differences such as process, after harmomegathus occurs for the multilayer circuit board that Mass Lam techniques obtain, the Aligning degree between each layer is difficult to
Control is in +/- 4mil.
Invention content
Based on this, the invention reside in overcoming the deficiencies of existing technologies, a kind of harmomegathus coefficient acquisition of multilayer circuit board is provided
Method, the production method of multilayer circuit board, it can be convenient for obtaining the harmomegathus coefficient of each layer of multi-layered board, can improve between each layer
Aligning degree.
Its technical solution is as follows：A kind of multilayer circuit board harmomegathus coefficient acquisition methods, include the following steps：Multiple wait is provided
The inner plating and lamina rara externa of pressing add three or more targets on the inner plating, and so that between multiple inner platings
The target stagger setting；Multiple inner platings and the lamina rara externa are subjected to lamination treatment；It is obtained by X-Ray punch
Take the target position information on multiple inner platings；It is calculated in described according to the target position information on the inner plating
The harmomegathus coefficient b of laminate.
The present invention also provides a kind of production methods of multilayer circuit board, include the following steps：It provides multiple to be laminated interior
Laminate and lamina rara externa obtain the pre- harmomegathus coefficient a of the inner plating and the lamina rara externa according to plank type；Pre- risen according to described
Contracting coefficient a makes the line pattern of the inner plating, wherein the above target there are three being set on the inner plating, and it is multiple described
The target stagger setting between inner plating；Multiple inner platings and the lamina rara externa are subjected to lamination treatment；Pass through X-
Ray bores target drone while obtaining the target position information on multiple inner platings；According to the target position confidence on the inner plating
The practical harmomegathus coefficient b of the inner plating is calculated in breath；Judge whether pre- harmomegathus coefficient a meets with practical harmomegathus coefficient b | a-
b|≤0.2mil/inch；If it is satisfied, then the laminate that the inner plating obtains after being pressed with the lamina rara externa meets the requirements；
If conditions are not met, the laminate that then inner plating obtains after being pressed with the lamina rara externa is undesirable, and will be according to described
Practical harmomegathus coefficient b makes the line pattern of the inner plating.
In one of the embodiments, the target on the inner plating be four, four targets it is in rectangular layout
Four apex angles of the inner plating.
The region that four targets on any one of inner plating surround in one of the embodiments, is in it
The inside in the region that four targets on inner plating described in last layer surround, and/or it is in its next described inner plating of layer
On four targets surround the outside in region.
In one of the embodiments, in the target upright projection to the lamina rara externa on multiple inner platings
Afterwards, projection point of the target on multiple inner platings on lamina rara externa is on two straight lines arranged side by side.
The institute of two targets of the same apex angle of the arbitrary neighborhood layer inner plating in one of the embodiments,
State projection point distance S1It is equal, and S1For 5~10mm.
In one of the embodiments, in two straight lines arranged side by side innermost two targets distance S2For
200~300mm.
More than two alignment targets are both provided on the inner plating and the lamina rara externa in one of the embodiments,
The alignment target on the inner plating is corresponded with the alignment target on the lamina rara externa.
Character is provided on the inner plating in one of the embodiments, the character is located at the periphery of the target,
The size of the character is 1~15pt, the character and the target distance S3For 5~10mm.
The target includes copper sheet and the annular slab positioned at copper sheet periphery, the copper in one of the embodiments,
The diameter R of piece is 1~2mm, and the ring width of the annular slab is 6~8mm.
The principle of the present invention, effect are further illustrated with reference to above-mentioned technical proposal：
1, above-mentioned multilayer circuit board harmomegathus coefficient acquisition methods, by the target stagger setting between each inner plating, respectively
It, just can be by X-Ray punch by the target position confidence on N-2 inner plating after target stagger setting between a inner plating
Breath is all got simultaneously, then then can be according to the harmomegathus system of each inner plating of target position acquisition of information on each inner plating
Number so that the Aligning degree of the line pattern between each inner plating can be improved.
2, four targets compared with the existing technology on middle inner plating are in cross distribution, four targets on inner plating of the present invention
Mark rectangular distribution so that two groups of two targets are all had in X-direction or Y-direction.Internal layer is being recognized by X-Ray punch
After four targets on plate, according to the practical target position information of two targets of one of which in X-direction or Y-direction and design target
Location information, which is calculated, just can be derived that a harmomegathus coefficient.In this way, just X can be obtained according to four targets of distributed rectangular
Direction and each two harmomegathus coefficients of Y-direction so that the harmomegathus coefficient of inner plating is more acurrate.
3, after in the target upright projection to lamina rara externa on N-2 inner plating, the target on N-2 inner plating is outside
Projection point on laminate is on two straight lines arranged side by side.In this way, the target of each inner plating is known by X-Ray punch
, can be convenient for corresponding with the inner plating of the corresponding number of plies by target after being clipped to, and be convenient for that the harmomegathus coefficient of each laminate is calculated.
4, the production method of above-mentioned multilayer circuit board, after the harmomegathus coefficient by obtaining each inner plating, then basis
Whether pre- harmomegathus coefficient meets rule used by the harmomegathus coefficient of each inner plating got judges the preceding each inner plating of pressing
Model requirement.If it is determined that pre- harmomegathus coefficient used by inner plating does not meet code requirement, then by each inner plating of acquisition
Harmomegathus coefficient is used for the making of the line pattern of the follow-up inner plating.So as it can be seen that the making of multilayer circuit board of the present invention
Method can improve the alignment precision of the line pattern between each inner plating, improve the product quality of Multi-layer force fit plate.
Description of the drawings
Fig. 1 projects to the structural schematic diagram of lamina rara externa for the target on N-2 inner plating of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of target described in the embodiment of the present invention.
Reference sign：
10, lamina rara externa, 11, alignment target, 12, character, 21, copper sheet, 22, annular slab, B2, second layer target subpoint
Position, BN-2, N-2 layers of target project points, BN-1, N-1 layers of target project points.
Specific implementation mode
The embodiment of the present invention is described in detail below：
Multilayer circuit board harmomegathus coefficient acquisition methods of the present invention, include the following steps：
N-2 inner platings to be laminated are provided and lamina rara externa 10, four apex angles on each inner plating add target respectively
Mark, and make the target stagger setting between each inner plating；Referring to Fig. 1, Fig. 1 is illustrated on N-2 inner plating
Target project to the structural schematic diagram on lamina rara externa 10, after the target stagger setting between each laminate, just can pass through X-Ray
Target drone is bored all to get the target position information on N-2 inner plating simultaneously, it then then can be according to the target on each inner plating
The harmomegathus coefficient of cursor position acquisition of information inner plating.
The N-2 inner platings are subjected to lamination treatment with the lamina rara externa 10；Pass through Mass Lam in the prior art
Technique is pressed inner plating and lamina rara externa 10 to obtain multi-layer board.During pressing inner plating with lamina rara externa 10, due to plate
Material can have harmomegathus phenomenon after the process such as high temperature and pressure.Therefore, it is necessary to obtain plate by subsequent measuring process
The material harmomegathus coefficient b that harmomegathus changes in lamination process.
The target position information on the N-2 inner platings is obtained by X-Ray punch；Multi-layer board is put into X-
Ray is bored in target drone, when X-Ray punch irradiates multi-layer board, since the target of each inner plating is stagger setting, is not weighed
It is folded.In this way, the target position acquisition of information on the N-2 inner platings can be arrived simultaneously by X-Ray punch.
The harmomegathus coefficient b of the inner plating is calculated according to the target position information on the inner plating.It will get
Inner plating on target position D2Preset target position D in information, with inner plating1Information is compared, and passes through harmomegathus
Coefficient formulasObtain harmomegathus coefficient b.
Above-mentioned multilayer circuit board harmomegathus coefficient acquisition methods, it is each by the target stagger setting between each inner plating
It, just can be by X-Ray punch by the target position information on N-2 inner plating after target stagger setting between inner plating
Simultaneously all get, then then can according to the harmomegathus coefficient of each inner plating of target position acquisition of information on each inner plating,
Make it possible to improve the Aligning degree of the line pattern between each inner plating.
Referring to Fig. 1, the target on the inner plating is four.Four targets are in rectangular layout in the inner plating
Four apex angles.Four targets on middle inner plating are in cross distribution compared with the existing technology, four on inner plating of the present invention
The rectangular distribution of target so that two groups of two targets are all had in X-direction or Y-direction.In being recognized by X-Ray punch
After four targets on laminate, according to the practical target position information of two targets of one of which in X-direction or Y-direction and design target
Cursor position information, which is calculated, just can be derived that a harmomegathus coefficient.In this way, just can be obtained according to four targets of distributed rectangular
To X-direction and each two harmomegathus coefficients of Y-direction so that the harmomegathus coefficient of inner plating is more acurrate.
The region that four targets on any one of inner plating surround is on inner plating described in its last layer
Four targets inside, and/or four targets on its next described inner plating of layer region for surrounding
It is external.After in the target upright projection to the lamina rara externa 10 on the N-2 inner platings, on the N-2 inner platings
Projection point of the target on lamina rara externa 10 be on two straight lines arranged side by side and (illustrated in Fig. 1 and project to outer layer
Four second layer targets projection point B on plate 102, four N-2 layers of target projection point BN-2And four N-1 layers of targets
Project point BN-1It is located on two dotted lines arranged side by side).In this way, the target of each inner plating is known by X-Ray punch
, can be convenient for corresponding with the inner plating of the corresponding number of plies by target after being clipped to, and be convenient for that the harmomegathus coefficient of each laminate is calculated.
The projection point distance S of two targets of the same apex angle of the arbitrary neighborhood layer inner plating1Phase
Deng, and S1For 5~10mm.The distance S of innermost two targets in two straight lines arranged side by side2For 200~300mm.
Character 12 is provided on the inner plating.The character 12 is located at the periphery of the target, and the size of the character 12 is 1~
15pt, the character 12 and target distance S3For 5~10mm.Referring to Fig. 2, the target includes copper sheet 21 and is located at
The annular slab 22 of 21 periphery of the copper sheet.The diameter R of the copper sheet 21 is 1~2mm, the ring width of the annular slab 22 is 6~
8mm.So set, target is convenient for being recognized by X-Ray punch.
It is both provided with more than two alignment targets 11 on the inner plating and the lamina rara externa 10.Institute on the inner plating
Alignment target 11 is stated to correspond with the alignment target 11 on the lamina rara externa 10.Internal layer is obtained by X-Ray punch
The location information of plate and the alignment target 11 on lamina rara externa 10 after carrying out optical identification alignment target 11, can be convenient for internal layer
Plate aligns together with lamina rara externa 10.
The production method of multilayer circuit board of the present invention, includes the following steps：Multiple inner platings to be laminated are provided
With lamina rara externa 10, the pre- harmomegathus coefficient a of the inner plating and the lamina rara externa 10 is obtained according to plank type；Pre- risen according to described
Contracting coefficient a makes the line pattern of the inner plating, wherein the above target there are three being set on the inner plating, and it is multiple described
The target stagger setting between inner plating；Multiple inner platings and the lamina rara externa 10 are subjected to lamination treatment；Pass through
X-Ray punch obtains the target position information on multiple inner platings simultaneously；According to the target position on the inner plating
The practical harmomegathus coefficient b of the inner plating is calculated in information；Judge whether pre- harmomegathus coefficient a meets with practical harmomegathus coefficient b |
a-b|≤0.2mil/inch；If it is satisfied, then the laminate that the inner plating obtains after being pressed with the lamina rara externa 10 conforms to
It asks；If conditions are not met, the laminate that then inner plating and the lamina rara externa 10 obtain after pressing is undesirable, and will be according to
The practical harmomegathus coefficient b makes the line pattern of the inner plating.
The production method of above-mentioned multilayer circuit board, after the harmomegathus coefficient by obtaining each inner plating, then according to obtaining
Whether pre- harmomegathus coefficient meets specification used by the harmomegathus coefficient for each inner plating got judges the preceding each inner plating of pressing
It is required that.If it is determined that pre- harmomegathus coefficient used by inner plating does not meet code requirement, then rising each inner plating of acquisition
Contracting coefficient is used for the making of the line pattern of the follow-up inner plating.So as it can be seen that the making side of multilayer circuit board of the present invention
Method can improve the alignment precision of the line pattern between each inner plating, improve the product quality of Multi-layer force fit plate.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of multilayer circuit board harmomegathus coefficient acquisition methods, which is characterized in that include the following steps：
Multiple inner platings and lamina rara externa to be laminated are provided, three or more targets are added on the inner plating, and make multiple
The target stagger setting between the inner plating；
Multiple inner platings and the lamina rara externa are subjected to lamination treatment；
The target position information on multiple inner platings is obtained by X-Ray punch；
The harmomegathus coefficient b of the inner plating is calculated according to the target position information on the inner plating；
Wherein, the target on the inner plating is four, and four targets are in rectangular layout on four tops of the inner plating
Angle；The region that four targets on any one of inner plating surround is in four on inner plating described in its last layer
The inside in the region that the target surrounds.
2. multilayer circuit board harmomegathus coefficient acquisition methods according to claim 1, which is characterized in that multiple inner platings
On the target upright projection to the lamina rara externa on after, throwing of the target on lamina rara externa on multiple inner platings
Shadow point is on two straight lines arranged side by side.
3. multilayer circuit board harmomegathus coefficient acquisition methods according to claim 2, which is characterized in that described in arbitrary neighborhood layer
The projection point distance S of two targets of the same apex angle of inner plating1It is equal, and S1For 5~10mm.
4. multilayer circuit board harmomegathus coefficient acquisition methods according to claim 2, which is characterized in that two arranged side by side described
The distance S of innermost two targets in straight line2For 200~300mm.
5. multilayer circuit board harmomegathus coefficient acquisition methods according to claim 1, which is characterized in that the inner plating and institute
It states and is both provided with more than two alignment targets on lamina rara externa, on the alignment target on the inner plating and the lamina rara externa
The alignment target corresponds.
6. multilayer circuit board harmomegathus coefficient acquisition methods according to claim 1, which is characterized in that set on the inner plating
It is equipped with character, the character is located at the periphery of the target, and the size of the character is 1~15pt, the character and the target
Target distance S3For 5~10mm.
7. multilayer circuit board harmomegathus coefficient acquisition methods according to any one of claims 1 to 6, which is characterized in that described
Target includes copper sheet and the annular slab positioned at copper sheet periphery, and the diameter R of the copper sheet is 1~2mm, the ring of the annular slab
Wide D is 6~8mm.
8. a kind of production method of multilayer circuit board, which is characterized in that include the following steps：
Multiple inner platings and lamina rara externa to be laminated are provided, the pre- of the inner plating and the lamina rara externa is obtained according to plank type
Harmomegathus coefficient a；
The line pattern of the inner plating is made according to the pre- harmomegathus coefficient a, wherein set on the inner plating there are three more than
Target, and the target stagger setting between multiple inner platings；
Multiple inner platings and the lamina rara externa are subjected to lamination treatment；
Obtain the target position information on multiple inner platings simultaneously by X-Ray punch；
The practical harmomegathus coefficient b of the inner plating is calculated according to the target position information on the inner plating；
Judge whether pre- harmomegathus coefficient a meets with practical harmomegathus coefficient b | a-b |≤0.2mil/inch；
If it is satisfied, then the laminate that the inner plating obtains after being pressed with the lamina rara externa meets the requirements；
If conditions are not met, then obtained laminate is undesirable after the inner plating and lamina rara externa pressing, and will be according to
The practical harmomegathus coefficient b makes the line pattern of the inner plating.
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| CN201510885490.2A CN105376964B (en) | 2015-12-03 | 2015-12-03 | A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board |
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| CN201510885490.2A CN105376964B (en) | 2015-12-03 | 2015-12-03 | A kind of production method of multilayer circuit board harmomegathus coefficient acquisition methods, multilayer circuit board |
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| CN106793586B (en) * | 2016-12-08 | 2019-05-07 | 生益电子股份有限公司 | The application method of bonding sheet |
| CN109600941A (en) * | 2019-01-28 | 2019-04-09 | 鹤山市世安电子科技有限公司 | A kind of PCB multilayer circuit board interlayer change in size measurement method |
| CN109922602B (en) * | 2019-04-02 | 2021-09-14 | 博敏电子股份有限公司 | Multi-functional target error-proofing design method for Analyyer plate |
| CN113498276B (en) * | 2021-07-16 | 2022-07-12 | 丰顺县锦顺科技有限公司 | Control method of printed circuit board production equipment and printed circuit board production equipment |
| CN115348737B (en) * | 2022-08-12 | 2023-09-26 | 江苏迪飞达电子有限公司 | Preparation method of double-sided thick copper-aluminum-based mixed pressing plate |
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| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03123099A (en) * | 1989-10-05 | 1991-05-24 | Mitsubishi Electric Corp | Inner layer position detecting method of multilayer printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
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