CN106793586A - The application method of bonding sheet - Google Patents
The application method of bonding sheet Download PDFInfo
- Publication number
- CN106793586A CN106793586A CN201611122202.9A CN201611122202A CN106793586A CN 106793586 A CN106793586 A CN 106793586A CN 201611122202 A CN201611122202 A CN 201611122202A CN 106793586 A CN106793586 A CN 106793586A
- Authority
- CN
- China
- Prior art keywords
- bonding sheet
- copper foil
- distance
- location hole
- application method
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a kind of application method of bonding sheet, it is related to PCB to make field, comprises the following steps：At least two blocks Copper Foils are provided, at least four location holes are made on the Copper Foil；The distance between the location hole is measured, initial range is designated as；Bonding sheet is provided, the Copper Foil is respectively provided with the both sides of the bonding sheet, lamination treatment is carried out to the Copper Foil and the bonding sheet；Measurement carries out the distance between the location hole after lamination treatment to the Copper Foil and the bonding sheet, is designated as final distance；The final distance and the difference of the initial range are calculated, changing value is designated as.Initial range and final distance between by measuring the location hole, draw the change in size trend of bonding sheet, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process.
Description
Technical field
Field, more particularly to a kind of application method of bonding sheet are made the present invention relates to PCB.
Background technology
Bonding sheet because contain resin, under the HTHP effect of lamination treatment, from semi-cured state to solid state
Transformation.There are multiple core plates in one piece of multi-layer PCB, when making multi-layer PCB, because of the bonding sheet of different glass clothes in lamination process
Size changing value is differed, and causes the size changing value of core plate also to differ.If every core plate size harmomegathus is inconsistent, can lead
Reason layer is partially overproof to bring the failure mode such as internal layer short circuit and internal layer open circuit.The current partially overproof approach of preventive stratum is first to do a collection of
Or multiple batches of plate, each layer core plate size harmomegathus value is measured, a precompensation coefficient is given, then should by this precompensation coefficient
In next group plate, the purpose partially overproof to reach eliminating layer.Although this method can solve the problem that to a certain degree layer partially surpass
What difference band came scraps, however it is necessary that testing multiple batches of checking, causes low production efficiency and wastes raw material.Meanwhile, the method does not have
There is the influence for considering bonding sheet to core plate size harmomegathus, cause core plate easily to be produced core plate by the influence of PCB procedure for processing
The overproof layer for bringing of size harmomegathus is partially overproof to be scrapped.
The content of the invention
It is an object of the invention to provide a kind of application method of bonding sheet, the change in size trend of bonding sheet is measured, entered
And derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process.
It is that, up to this purpose, the present invention uses following technical scheme：
A kind of application method of bonding sheet, comprises the following steps：
S10, at least two blocks Copper Foils of offer, make at least four location holes on the Copper Foil；
Distance between S20, the measurement location hole, is designated as initial range；
Preferably, the distance between the location hole is specially the distance between center of each location hole.
S30, bonding sheet is provided, the Copper Foil is respectively provided with the both sides of the bonding sheet, to the Copper Foil and described viscous
Sheeting carries out lamination treatment；
S40, measurement carry out the distance between the location hole after lamination treatment, note to the Copper Foil and the bonding sheet
It is final distance；
S50, the calculating final distance and the difference of the initial range, are designated as changing value.
Preferably, the difference for calculating the final distance and the initial range, specifically：
The result that the final distance subtracts the initial range is designated as changing value；
Or, the absolute value that the initial range is subtracted the result of the final distance is designated as changing value.
Preferably, further comprising the steps of after step S50：
S60, in PCB manufacturing process the bonding sheet is selected according to the changing value.
Preferably, described select the bonding sheet in PCB manufacturing process according to the changing value, specifically：
Select the bonding sheet to be arranged between core plate according to the changing value, make the institute of the bonding sheet of adjacent position
The difference for stating changing value is less than or equal to predictive error.
Preferably, the predictive error determines according to the size of the location hole on the Copper Foil, wherein the location hole
Size can be the length or width or diameter of location hole.The size of the location hole is bigger, then the predictive error is bigger；Institute
The size for stating location hole is smaller, then the predictive error is smaller.
Further, the predictive error is equal to less than the 10% of the size of the location hole.
Preferably, further comprising the steps of after step S50：
S55, repeat step S10, S20, S30, S40 and S50, obtain the change of the different bonding sheet of some correspondences
Change value.
Preferably, further comprising the steps of after step S55：
S56, to be worth to correspondence according to the corresponding change of different types of bonding sheet different types of described viscous
The change in size tendency chart of sheeting.
Preferably, during the corresponding changing value of different types of bonding sheet is obtained, using identical
The Copper Foil, the position of the location hole on the Copper Foil is identical, and the laminater that lamination treatment is used is identical, and the layer
The parameter of the setting of pressure device is identical.
Preferably, the location hole is located at the bonding sheet in the view field on the Copper Foil；
With or, the Copper Foil near the bonding sheet side be the Copper Foil hair side.
Preferably, step S20 is specially：
The number of times of the distance between the measurement location hole is more than twice, the distance of each measurement to be averaged
It is worth the initial range；
With or, step S40 is specially：
The measurement carries out the distance between the location hole after lamination treatment to the Copper Foil and the bonding sheet
Number of times is more than twice, the distance of each measurement to be averaged and draws the final distance.
Preferably, at least four location holes that made on the Copper Foil are specially：
The Copper Foil is shaped as rectangle, the diagonal of the Copper Foil set the location hole and or described
The length of side direction of Copper Foil sets the location hole.
Beneficial effects of the present invention：Initial range and final distance between by measuring the location hole, draw bonding sheet
Change in size trend, and then derive influence of the bonding sheet to core plate size harmomegathus in PCB manufacturing process, it is further to ensure
The size harmomegathus of adjacent core plate possesses uniformity in multi-layer PCB.
Brief description of the drawings
Fig. 1 is a kind of FB(flow block) of the application method of bonding sheet of the invention.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
A kind of application method of bonding sheet as shown in Figure 1, comprises the following steps：
S10, at least two blocks Copper Foils of offer, make at least four location holes on Copper Foil.
In the present embodiment, there is provided Copper Foil be rectangle, by location hole be arranged on Copper Foil two diagonal and four
On the length of side direction on side.Certainly, in other embodiment, if Copper Foil is rectangle, location hole can be provided separately within the right of Copper Foil
It is provided separately within the length of side direction of the four edges of Copper Foil on linea angulata or by location hole.
Specifically, there is provided the specification of every block of Copper Foil is just the same, meanwhile, on every block of Copper Foil make location hole position
It is fixed, in the present embodiment, the thickness of Copper Foil is [0.3,0.7] OZ, and location hole is the circle of a diameter of [0.8,1.2] mm
Hole.That is, the fixed position on the duplicate Copper Foil of many block specifications opens up identical location hole.Certainly, implement in other
In example, the thickness of Copper Foil can be [0.2,1.2] OZ, [0.5,0.9] OZ, 0.3OZ, 0.5OZ or 0.7OZ；The diameter of location hole
Can be [0.4,1.8] mm, [0.9,2] mm, 0.8mm, 1mm or 1.2mm.
Distance between S20, measurement and positioning hole, is designated as initial range.
Specifically, the distance between number machine measurement and positioning hole is drawn using high accuracy Quadratic Finite Element.In the present embodiment, between location hole
Distance be specially the distance between center of each location hole, in other embodiment, it is fixed that the distance between location hole is alternatively
The distance between certain fixed position in position hole.Distance between location hole is multiple numerical value, including between diagonal upper Positioning holes
The distance between location hole in distance, the length of side direction of the four edges of Copper Foil.The numerical value of these distances is all as the original of location hole
Beginning distance.Most accurate initial range numerical value is obtained in order to eliminate measurement error, the number of times of measurement is more than twice, to take all of
The average value of measured value as determine initial range numerical value.
S30, offer bonding sheet, Copper Foil is respectively provided with the both sides of bonding sheet, and lamination treatment is carried out to Copper Foil and bonding sheet.
In the present embodiment, one block of Copper Foil is respectively provided with the upper side and lower side of bonding sheet.Specifically, Copper Foil is one side treatment
Copper Foil, the hair side of Copper Foil is fitted with the contacts side surfaces of bonding sheet.Lamination treatment is carried out to all of Copper Foil and bonding sheet.Specifically
Ground, there is provided bonding sheet for variety classes glass cloth bonding sheet, further, the bonding sheet to variety classes glass cloth is carried out respectively
Above-mentioned lamination treatment.Certainly, in other embodiment, Copper Foil can also be double treated foil, smooth surface treatment Copper Foil and dual light
Copper Foil.
Specifically, the influence of bonding sheet both is from order to ensure the change of distance between location hole, location hole is located at and bonds
Bonding sheet covers all of location hole to piece in view field on Copper Foil, namely when ensuring that bonding sheet is fitted with Copper Foil.
Further, it is ensured that the laminater that each lamination treatment is used is same device, and every time lamination treatment
Pressure programming is identical.This avoid the error that itself is produced in lamination process, it is ensured that Copper Foil after each lamination treatment
With the change that the change in size of bonding sheet both is from self attributes, will not be produced because of the equipment or the process for the treatment of that are used
Raw mismachining tolerance.
S40, measurement the location hole after lamination treatment is carried out to Copper Foil and bonding sheet between distance, be designated as final distance.
In the present embodiment, using the distance between location hole after high accuracy Quadratic Finite Element drawing number machine measurement lamination treatment.Tool
Body ground, the distance after measurement lamination treatment between location hole is also multiple numerical value, including is carried out after lamination treatment on diagonal
The distance between location hole on the length of side direction of the four edges of distance, Copper Foil between location hole.Further, in order to eliminate measurement
Error obtains most accurate final distance values, and the number of times of measurement is made more than twice, to take the average value of all of measured value
It is the numerical value of the final distance of determination.
S50, the calculating final distance and the difference of the initial range, are designated as changing value.
In the present embodiment, the result that final distance subtracts initial range is designated as changing value；In other embodiment
The absolute value of the result that initial range can be subtracted into final distance is designated as changing value.
Specifically, as the distance between the diagonal upper Positioning holes carried out after lamination treatment of one of final distance and work
For one of initial distance diagonal upper Positioning holes between distance it is corresponding；As one of final distance carry out lamination treatment it
The four edges of the distance between location hole on the length of side direction of the four edges of Copper Foil afterwards and the Copper Foil as one of initial distance
Length of side direction on location hole between distance it is corresponding.Therefore, changing value includes changing value and the length of side side of diagonal
To changing value.
Because the distance change between location hole is because the change in size of Copper Foil is caused, and the change in size of Copper Foil be by
What the change in size of bonding sheet was influenceed, also just draw the size changing value and variation tendency of bonding sheet.Can be further anti-
Release the trend that bonding sheet influences on core plate size harmomegathus in the manufacturing process of multi-layer PCB.
It is further comprising the steps of after step S50：
S55, repeat step S10, S20, S30, S40 and S50, obtain the changing value of the different bonding sheet of some correspondences.
Further, the survey of the changing value of distance between above-mentioned location hole is all carried out for the bonding sheet of variety classes glass cloth
Amount, and the size changing value of the bonding sheet of every kind of glass cloth is drawn, and instead release every kind of glass cloth in the manufacturing process of multi-layer PCB
The trend that is influenceed on core plate size harmomegathus of bonding sheet.
It is further comprising the steps of after step S55：
S56, the size for being worth to the different types of bonding sheet of correspondence according to the corresponding change of different types of bonding sheet become
Change tendency chart.
In the present embodiment, in order to subsequently more easily be influenceed on core plate size harmomegathus using the bonding sheet of various glass clothes
Trend, the change in size trend of the different types of bonding sheet of correspondence is worth to according to the corresponding change of different types of bonding sheet
Figure, thus can draw every kind of bonding sheet to core by observing the corresponding change in size tendency chart of the bonding sheet of variety classes glass cloth
The trend of board size harmomegathus influence.Certainly, in other embodiment, the bonding sheet change in size trend of variety classes glass cloth is obtained
Can be the mode or other suitable modes for drawing form.
S60, in PCB manufacturing process according to changing value select bonding sheet.
After the bonding sheet change in size trend for drawing variety classes glass cloth, by the bonding sheet for observing variety classes glass cloth
Change in size trend can derive the trend of influence of the bonding sheet to core plate size harmomegathus.The bonding sheet that will be derived is to core plate
The effect tendency of size harmomegathus is applied in the making of multi-layer PCB, and multi-layer PCB is made up of polylith core plate, is additionally provided between core plate
Bonding sheet, before to core plate and bonding sheet pressing, the structure of bonding sheet, adjustment core plate and bonding sheet is selected according to changing value,
Make the difference of the changing value of the bonding sheet of adjacent position less than or equal to predictive error, to ensure to be laminated core plate and bonding sheet
The size harmomegathus change of adjacent core plate is consistent after treatment.Also every piece of core plate size harmomegathus is inconsistent in avoiding multi-layer PCB,
And then avoid because the partially overproof internal layer short circuit for bringing of layer and internal layer are opened a way.
Specifically, above-mentioned predictive error determines that wherein the size of location hole can be according to the location hole size on Copper Foil
The length or width or diameter of location hole.Location hole size is bigger, then predictive error is bigger；Location hole size is smaller, then make a reservation for
Error is smaller.Further, predictive error is equal to less than the 10% of location hole size.
In other embodiment, the shape of Copper Foil can be different from the rectangular shape provided in the present embodiment.Specifically, if copper
Paper tinsel is circular slab, location hole can be set along the diametric(al) and circumferencial direction of Copper Foil, between corresponding measurement and positioning hole away from
The changing value of distance between borehole is positioned before and after lamination treatment is drawn.
Obviously, the above embodiment of the present invention illustrates example of the present invention just for the sake of clear, and is not right
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no need and unable to be exhaustive to all of implementation method.It is all this
Any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
1. a kind of application method of bonding sheet, it is characterised in that comprise the following steps：
S10, at least two blocks Copper Foils of offer, make at least four location holes on the Copper Foil；
Distance between S20, the measurement location hole, is designated as initial range；
S30, offer bonding sheet, are respectively provided with the Copper Foil, to the Copper Foil and the bonding sheet in the both sides of the bonding sheet
Carry out lamination treatment；
S40, measurement carry out the distance between the location hole after lamination treatment to the Copper Foil and the bonding sheet, are designated as most
Whole distance；
S50, the calculating final distance and the difference of the initial range, are designated as changing value.
2. the application method of bonding sheet according to claim 1, it is characterised in that the calculating final distance and institute
The difference of initial range is stated, specifically：
The result that the final distance subtracts the initial range is designated as changing value；
Or, the absolute value that the initial range is subtracted the result of the final distance is designated as changing value.
3. the application method of bonding sheet according to claim 1, it is characterised in that also include after step S50 following
Step：
S60, in PCB manufacturing process the bonding sheet is selected according to the changing value.
4. the application method of bonding sheet according to claim 3, it is characterised in that the basis in PCB manufacturing process
The changing value selects the bonding sheet, specifically：
Select the bonding sheet to be arranged between core plate according to the changing value, make the change of the bonding sheet of adjacent position
The difference of change value is less than or equal to predictive error.
5. the application method of bonding sheet according to claim 1, it is characterised in that also include after step S50 following
Step：
S55, repeat step S10, S20, S30, S40 and S50, obtain the change of the different bonding sheet of some correspondences
Value.
6. the application method of bonding sheet according to claim 5, it is characterised in that also include after step S55 following
Step：
S56, the different types of bonding sheet of correspondence is worth to according to the corresponding change of different types of bonding sheet
Change in size tendency chart.
7. the application method of bonding sheet according to claim 5, it is characterised in that obtaining different types of bonding
During the corresponding changing value of piece, using Copper Foil described in identical, the position of the location hole on the Copper Foil is identical, layer
The used laminater of pressure treatment is identical, and the parameter of the setting of the laminater is identical.
8. the application method of bonding sheet according to claim 1, it is characterised in that the location hole is located at the bonding sheet
In view field on the Copper Foil；
With or, the Copper Foil near the bonding sheet side be the Copper Foil hair side.
9. the application method of bonding sheet according to claim 1, it is characterised in that step S20 is specially：
The number of times of the distance between the measurement location hole is more than twice, the distance of each measurement to be averaged
Go out the initial range；
With or, step S40 is specially：
The measurement carries out the number of times of the distance between the location hole after lamination treatment to the Copper Foil and the bonding sheet
More than twice, the distance of each measurement to be averaged and drawing the final distance.
10. the application method of bonding sheet according to claim 1, it is characterised in that it is described made on the Copper Foil to
Few four location holes are specially：
The Copper Foil is shaped as rectangle, the diagonal of the Copper Foil set the location hole and or in the Copper Foil
The length of side direction location hole is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611122202.9A CN106793586B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611122202.9A CN106793586B (en) | 2016-12-08 | 2016-12-08 | The application method of bonding sheet |
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| CN106793586A true CN106793586A (en) | 2017-05-31 |
| CN106793586B CN106793586B (en) | 2019-05-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108088401A (en) * | 2017-12-06 | 2018-05-29 | 广州兴森快捷电路科技有限公司 | Prepreg harmomegathus measuring method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
| CN105376963A (en) * | 2015-11-04 | 2016-03-02 | 江门崇达电路技术有限公司 | Method for grabbing internal layer compensation coefficients |
-
2016
- 2016-12-08 CN CN201611122202.9A patent/CN106793586B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN105376963A (en) * | 2015-11-04 | 2016-03-02 | 江门崇达电路技术有限公司 | Method for grabbing internal layer compensation coefficients |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 胡友作: "挠性PCB的制作工艺参数优化研究及应用", 《中国优秀硕士学位论文全文数据库》 * |
| 黄志远等: "HDI印制板制作中涨缩控制及爆版问题研究", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108088401A (en) * | 2017-12-06 | 2018-05-29 | 广州兴森快捷电路科技有限公司 | Prepreg harmomegathus measuring method |
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| CN106793586B (en) | 2019-05-07 |
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