CN110708878A - Processing method of printed circuit board - Google Patents
Processing method of printed circuit board Download PDFInfo
- Publication number
- CN110708878A CN110708878A CN201910984454.XA CN201910984454A CN110708878A CN 110708878 A CN110708878 A CN 110708878A CN 201910984454 A CN201910984454 A CN 201910984454A CN 110708878 A CN110708878 A CN 110708878A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- metal layer
- drilling
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing method of a printed circuit board, wherein the printed circuit board comprises an inner resin plate; one of the two opposite plate surfaces of the inner resin plate is fixedly connected with a first metal layer, and the other plate surface is fixedly connected with a second metal layer; the local area of the first metal layer corresponding to the path to be processed of the printed circuit board is hollowed. The processing method comprises the following steps: carrying out multiple laser drilling treatment on the printed circuit board by taking the surface of the printed circuit board where the first metal layer is located as a drilling surface along the path to be processed to form a drilling channel; the drilling channel comprises a plurality of drilling holes which are sequentially distributed along a path to be processed, the drilling holes penetrate through the inner resin plate, and two adjacent drilling holes are partially overlapped; and if the local area corresponding to the path to be processed on the second metal layer is hollow, finishing the processing of the printed circuit board. The processing method provided by the invention can avoid the burr problem caused by directly machining the resin layer.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a processing method of a printed circuit board.
Background
With the rapid development of 5G wireless mobile communication products, the signal transmission speed is faster and faster, and the requirement for transmission frequency is higher and higher. PTFE (polytetrafluoroethylene) plates have special electrical properties, are increasingly used in high-frequency PCB (printed circuit board) design, and the appearance edge of the PCB processed in the industry is generally processed by a mechanical milling cutter at present. When the PTFE sheet is used as a base material, the PTFE sheet has the characteristics of high toughness and good ductility due to the fact that the PTFE sheet is a thermoplastic resin material, and is difficult to cut by a mechanical milling cutter. Therefore, when the mechanical milling cutter is adopted to contain the PCB outline edge of the PTFE plate, the burr problem is easy to occur.
The prior art aims at the burr problem of PTFE plates, and generally adopts a mode of retaining copper sheets on the surfaces of the PTFE plates or paving green oil on the exposed PTFE surfaces to improve the burr generation. However, the design requirement that the PTFE surface can not retain the laying material is often met in the field of circuit boards, and the burr problem is difficult to improve in such a case by adopting a mechanical milling cutter processing mode. In addition, the PCB is cut by a laser cutting machine to improve the burr problem, but the laser cutting machine is expensive, and because resin and metal need to be cut simultaneously, the laser energy emitted by the laser cutting machine is high, so that the carbonization of the PTFE plate is easily caused, and the performance of the plate is influenced, especially when the thick copper design (the copper thickness is more than or equal to 0.5mm) is arranged below the PTFE plate.
Disclosure of Invention
The invention aims to provide a processing method of a printed circuit board, which solves the problem that burrs are easy to appear in processing when no laying object is arranged on the surface of a resin base material.
In order to achieve the purpose, the invention adopts the following technical scheme:
a processing method of a printed circuit board, the printed circuit board includes an inner resin plate; one of the two opposite plate surfaces of the inner resin plate is fixedly connected with a first metal layer, and the other plate surface is fixedly connected with a second metal layer; a local area on the first metal layer, corresponding to a path to be processed of the printed circuit board, is hollowed;
the processing method comprises the following steps:
carrying out multiple laser drilling treatments on the printed circuit board by taking the surface of the printed circuit board where the first metal layer is located as a drilling surface along the path to be processed to form a drilling channel; wherein the laser drilling depth is the thickness of the inner resin plate, and two adjacent drilling parts in the drilling channels are partially overlapped;
if the local area of the second metal layer corresponding to the path to be processed is hollow, processing the printed circuit board is completed;
and if the local area of the second metal layer corresponding to the path to be processed is not hollow, mechanically cutting the second metal layer along the path to be processed, wherein the mechanical cutting depth is the thickness of the second metal layer, and the processing of the printed circuit board is completed.
Optionally, a protective resin is partially or completely laid on the surface of the inner resin plate corresponding to the local area of the path to be processed;
the depth of the laser drilling is the sum of the thickness of the protective resin and the thickness of the inner resin plate.
Optionally, when the second metal layer is mechanically cut along the path to be processed, the mechanical cutting tool extends into the drilling channel to cut the second metal layer located below the drilling channel.
Optionally, the laser drilling process is performed by using a laser drilling machine, and the laser emitted by the laser drilling machine is far infrared light sensitive to resin and insensitive to metal.
Optionally, in the drilling channel, the overlapping rate of the drilling holes is 30% -80%.
Optionally, in the drilling channel, the overlapping rate of the drilling holes is 50%; the aperture of drilling is 4 mils, and the centre-to-centre spacing of two adjacent drilling is 2 mils.
Optionally, when the mechanical cutting tool extends into the drilling channel, the distance between the mechanical cutting tool and the inner resin plate is at least 2 mils.
Optionally, the inner resin plate is made of polytetrafluoroethylene, the first metal layer and the second metal layer are made of copper, and the protective resin is green oil.
Optionally, the mechanical cutting tool is a milling cutter of a milling machine.
Optionally, the path to be processed of the printed circuit board corresponds to the outline of the printed circuit board.
Compared with the prior art, the invention has the following beneficial effects:
according to the processing method of the printed circuit board, the resin is removed in a laser drilling mode to form a compact drilling channel, and then a mechanical cutting tool penetrates through the drilling channel to process the second metal layer. The mode processing resin layer that adopts laser drilling can not produce deckle edge, can avoid directly carrying out the deckle edge problem that machining brought to the resin layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
The structure, proportion, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that the person skilled in the art can understand and read the description, and the description is not used for limiting the limit condition of the implementation of the invention, so the method has no technical essence, and any structural modification, proportion relation change or size adjustment still falls within the scope covered by the technical content disclosed by the invention without affecting the effect and the achievable purpose of the invention.
Fig. 1 is a schematic top view of a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a printed circuit board according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a printed circuit board after laser drilling processing according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a printed circuit board being machined according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a drilled via in a printed circuit board provided by an embodiment of the present invention;
fig. 6 is a schematic diagram of a processing method of a printed circuit board according to an embodiment of the present invention.
Illustration of the drawings: 11. a first metal layer; 12. a second metal layer; 2. an inner resin plate; 3. a path to be processed; 4. drilling a channel; 41. drilling; 5. a mechanical cutting tool.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. It should be noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The embodiment of the invention provides a processing method of a printed circuit board.
Referring to fig. 1 and 2, the printed circuit board includes an inner resin plate 2. Of the two opposing faces of the inner resin plate 2, one face is fixedly connected with a first metal layer 11, and the other face is fixedly connected with a second metal layer 12. The area of the first metal layer 11 corresponding to the path 3 to be processed of the printed circuit board is hollowed out.
Referring to fig. 3 to 6, the processing method includes the following steps:
s1, carrying out multiple laser drilling treatment on the printed circuit board by taking the board surface where the first metal layer 11 is located as a drilling surface along the path 3 to be processed, and removing the inner resin board 2 on the path 3 to be processed to form a drilling channel 4; the drilling channel 4 comprises a plurality of drilling holes 41 which are sequentially arranged along the path 3 to be processed, the drilling holes 41 penetrate through the inner resin plate 2, and two adjacent drilling holes 41 are partially overlapped;
s21, if the area of the second metal layer 12 corresponding to the path 3 to be processed is hollow, processing the printed circuit board is completed;
and S22, if the area of the second metal layer 12 corresponding to the path 3 to be processed is not hollow, mechanically cutting the second metal layer 12 along the path 3 to be processed, wherein the mechanical cutting depth is at least the thickness of the second metal layer 12, and thus, the processing of the printed circuit board is completed.
Specifically, when the second metal layer 12 is mechanically cut along the path 3 to be processed, the mechanical cutting tool 5 extends into the drilling channel 4 to cut the second metal layer 12 located below the drilling channel 4.
In the embodiment of the present invention, the material of the inner resin plate 2 is teflon, and the materials of the first metal layer 11 and the second metal layer 12 are both copper. The path 3 to be processed of the printed circuit board corresponds to the contour of the outer edge of the printed circuit board.
During laser drilling, laser penetrates through the hollow area of the first metal layer 11 and penetrates through the inner resin plate 2. The laser drilling energy is set according to the thickness of the resin layer, and the thicker the resin layer, the greater the laser drilling energy. The method for processing the resin layer by adopting the laser drilling mode can not generate burrs, and the problem of burrs caused by directly machining the resin layer can be avoided.
In the embodiment of the present invention, it is preferable to perform the laser drilling process using a laser drill, and the laser emitted by the laser drill is far infrared light that is sensitive to resin and insensitive to metal. The mechanical cutting tool 5 is preferably a milling cutter of a numerically controlled milling machine.
The invention adopts the mode of combining the laser drilling machine and the numerical control milling machine for processing, the laser emitted by the laser drilling machine is far infrared light, the energy is lower, the laser is not sensitive to metal, and the plate carbonization can not be caused. The existing laser cutting machine emits high-frequency and high-energy ultraviolet light to simultaneously cut resin and metal, so that the plate is easily carbonized. Especially, when the second metal layer 12 is designed to be thick copper (the thickness of copper is greater than or equal to 0.5mm), the laser energy required by the laser cutting machine is very high, the test on equipment is great, and the performance is affected by the carbonization of the plate due to high-energy cutting.
In the embodiment of the present invention, the surface of the inner resin plate 2 corresponding to the region of the path 3 to be processed may be partially or entirely laid with a protective resin, specifically, green oil. Since both the protective resin and the inner resin plate 2 can be removed by laser drilling, the present invention is also applicable to the case where the entire surface of the inner resin plate 2 is coated with the green oil or a part of the hollow portion is coated with the green oil. Specifically, when the printed circuit board is subjected to multiple laser drilling treatments with the surface of the printed circuit board where the first metal layer 11 is located as a drilling surface, the depth of the laser drilling is the sum of the thickness of the protective resin and the thickness of the inner resin plate 2, that is, the laser penetrates through the protective resin and the inner resin plate 2 in sequence to form a drilling channel 4.
In the present embodiment, the overlapping rate of the drill holes 41 in the drill passage 4 is preferably 30% to 80%, and more preferably 50%. Preferably, the bore 41 has a bore diameter of 4 mils, and the centers of two adjacent bores 41 are spaced apart by 2 mils. The distance between the cutter and the inner resin plate 2 when the cutter passes through the drill passage 4 is at least 2 mils. This aperture and overlap ratio may just ensure that the milling cutter passes without touching the inner resin plate 2 and also avoid the problem that too high an overlap ratio of the drilled holes 41 requires too many holes to be drilled.
The overlapping ratio of the drill holes 41 is (the area of the overlapping portion of two adjacent drill holes 41/the area of a single drill hole 41) × 100%. The center-to-center distance of the two bores 41 refers to the distance between the centers of the two bores 41.
According to the processing method of the printed circuit board, the inner resin is removed in a laser drilling mode to form the drilling channel 4, and then the mechanical cutting tool 5 penetrates through the drilling channel 4 to process the second metal layer 12. The mode processing resin layer that adopts laser drilling can not produce deckle edge, can avoid directly carrying out the deckle edge problem that machining brought to the resin layer, and a face that is particularly useful for PTFE panel can not remain the condition of laying the thing. In addition, the processing method does not need to adopt an expensive laser cutting machine, only adopts a cheap laser drilling machine, and is low in cost.
The above examples are only for illustrating the technical solutions of the present invention, and are not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: modifications of the technical solutions described in the embodiments or equivalent replacements of some technical features may still be made. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A processing method of a printed circuit board is characterized in that the printed circuit board comprises an inner resin plate; one of the two opposite plate surfaces of the inner resin plate is fixedly connected with a first metal layer, and the other plate surface is fixedly connected with a second metal layer; the area of the first metal layer corresponding to the path to be processed of the printed circuit board is hollow;
the processing method comprises the following steps:
carrying out multiple laser drilling treatments on the printed circuit board by taking the surface of the printed circuit board where the first metal layer is located as a drilling surface along the path to be processed to form a drilling channel; the drilling channel comprises a plurality of drilling holes which are sequentially arranged along the path to be processed, the drilling holes penetrate through the inner resin plate, and two adjacent drilling holes are partially overlapped;
if the area of the second metal layer corresponding to the path to be processed is hollow, processing the printed circuit board is completed;
and if the area of the second metal layer corresponding to the path to be processed is not hollow, mechanically cutting the second metal layer along the path to be processed, wherein the mechanical cutting depth is at least the thickness of the second metal layer, and processing the printed circuit board is completed.
2. The processing method of a printed circuit board according to claim 1, wherein a surface of the inner resin plate corresponding to a region of the path to be processed is partially or entirely laid with a protective resin;
the bore hole penetrates the protective resin and the inner resin plate.
3. The method as claimed in claim 1, wherein when the second metal layer is mechanically cut along the path to be processed, a mechanical cutting tool is inserted into the drilling passage to cut the second metal layer located below the drilling passage.
4. The method for processing a printed circuit board according to claim 1, wherein the laser drilling process is performed using a laser drilling machine that emits laser light of far infrared light that is sensitive to resin and insensitive to metal.
5. The method as claimed in claim 1, wherein the overlap ratio of the drilled holes in the drilled passage is 30-80%.
6. The printed circuit board processing method according to claim 5, wherein in the drilled passage, the overlap ratio of the drilled holes is 50%; the aperture of drilling is 4 mils, and the centre-to-centre spacing of two adjacent drilling is 2 mils.
7. The printed circuit board processing method of claim 3, wherein the distance between the mechanical cutting tool and the inner resin plate when the mechanical cutting tool is inserted into the drilled passage is at least 2 mils.
8. The method of manufacturing a printed circuit board according to claim 2, wherein the inner resin plate is made of polytetrafluoroethylene, the first metal layer and the second metal layer are made of copper, and the protective resin is green oil.
9. The method of claim 3, wherein the mechanical cutting tool is a milling cutter of a milling machine.
10. The method of claim 1, wherein the path of the printed circuit board to be processed corresponds to the outline of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984454.XA CN110708878B (en) | 2019-10-16 | 2019-10-16 | Processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984454.XA CN110708878B (en) | 2019-10-16 | 2019-10-16 | Processing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110708878A true CN110708878A (en) | 2020-01-17 |
| CN110708878B CN110708878B (en) | 2021-05-25 |
Family
ID=69200001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910984454.XA Active CN110708878B (en) | 2019-10-16 | 2019-10-16 | Processing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110708878B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112580294A (en) * | 2020-12-30 | 2021-03-30 | 芯和半导体科技(上海)有限公司 | Cutting method of PCB layout |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
| CN103369864A (en) * | 2012-03-27 | 2013-10-23 | 珠海方正科技高密电子有限公司 | Method of processing through hole on circuit board |
| CN105392284A (en) * | 2015-10-22 | 2016-03-09 | 北大方正集团有限公司 | Circuit board and method for preparing blind hole in circuit board |
| CN110248474A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A kind of production method of high-frequency high-speed random layer HDI plate laser blind hole |
-
2019
- 2019-10-16 CN CN201910984454.XA patent/CN110708878B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
| CN103369864A (en) * | 2012-03-27 | 2013-10-23 | 珠海方正科技高密电子有限公司 | Method of processing through hole on circuit board |
| CN105392284A (en) * | 2015-10-22 | 2016-03-09 | 北大方正集团有限公司 | Circuit board and method for preparing blind hole in circuit board |
| CN110248474A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A kind of production method of high-frequency high-speed random layer HDI plate laser blind hole |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112580294A (en) * | 2020-12-30 | 2021-03-30 | 芯和半导体科技(上海)有限公司 | Cutting method of PCB layout |
| CN112580294B (en) * | 2020-12-30 | 2023-12-19 | 芯和半导体科技（上海）股份有限公司 | Cutting method of PCB layout |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110708878B (en) | 2021-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108513458B (en) | Method for processing super-thick 5G antenna PCB module | |
| CN109807477B (en) | Composite processing method for PCB hole | |
| CN104540338B (en) | High Aligning degree HDI production methods | |
| CN112752437B (en) | Forming method of metallized semi-hole and PCB | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN110708878B (en) | Processing method of printed circuit board | |
| CN106341961A (en) | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph | |
| KR20100138755A (en) | Boring method for printed substrate | |
| KR101425566B1 (en) | A process for forming via hole of core board for PCB | |
| CN105682363A (en) | Fabrication method of PCB with metalized plate edges | |
| CN106525114A (en) | Method for testing production line hole making capability in positive process | |
| CN106604577A (en) | HDI circuit board manufacturing process capable of realizing accurate alignment | |
| CN105009697B (en) | High-speed printed circuit board with uniform via interior diameter | |
| CN110740591B (en) | Blind hole processing method of multilayer printed board | |
| JPH08288660A (en) | Multilayered metal core printed wiring board | |
| CN109561583B (en) | Efficient drilling method for multilayer PCB | |
| CN114423161A (en) | PCB processing method and PCB | |
| JPH09191168A (en) | Method for making contact hole through printed wiring board | |
| CN105792520A (en) | Method for preparing V-shaped slot line in PCB | |
| CN112399716A (en) | Back drilling method and preparation method of PCB and prepared PCB | |
| CN114501804B (en) | Back drilling depth control method for 5G precise circuit board | |
| CN105323970A (en) | Fabrication method for backdrilling of asymmetric printed circuit board | |
| CN106102352B (en) | A method of solving non-symmetrical line slab warping | |
| CN112911791B (en) | Printed circuit board for detecting deviation of drilling hole | |
| CN221688894U (en) | Stacked blind hole alignment structure of high-order HDI circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211231 Address after: No.3127, Dongzhen Industrial Park, Dongsha District, Guangdong Province Patentee after: SHENGYI ELECTRONICS Co.,Ltd. Patentee after: Ji'an Shengyi Electronics Co., Ltd Address before: No.3127, Dongzhen Industrial Park, Dongsha District, Guangdong Province Patentee before: SHENGYI ELECTRONICS Co.,Ltd. |