WO2019119770A1 - Method for estimating expansion and contraction compensation coefficient of new pcb material - Google Patents
Method for estimating expansion and contraction compensation coefficient of new pcb material Download PDFInfo
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- WO2019119770A1 WO2019119770A1 PCT/CN2018/093630 CN2018093630W WO2019119770A1 WO 2019119770 A1 WO2019119770 A1 WO 2019119770A1 CN 2018093630 W CN2018093630 W CN 2018093630W WO 2019119770 A1 WO2019119770 A1 WO 2019119770A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- the invention relates to the field of printed circuit boards, and more particularly to a method for evaluating the compensation coefficient of new material of PCB.
- PCBs are increasingly moving toward high speed, high frequency, high heat dissipation, and high reliability, prompting PCB substrate manufacturers to continuously optimize and upgrade the composition of the substrate to obtain low dielectric constant and low dielectric loss.
- high heat dissipation characteristics and high reliability of substrate materials there are more and more PCB substrate types and specifications.
- another important development trend of PCB is high alignment accuracy and high dimensional accuracy.
- the PCB is aligned due to the shrinkage and contraction effect of the substrate in complex environments such as force, heat and humidity. Accuracy and dimensional accuracy have an important impact.
- how to quickly and effectively evaluate the amount of change in PCB material during processing is a major problem in PCB fabrication.
- the current practice of PCB manufacturers is to first do a batch or batch of test boards, test the dimensional change values of each core board, and determine the material's shrinkage compensation coefficient, and then increase or decrease the material.
- the compensation coefficient is used in the PCB of the subsequent batch to reduce the influence of the shrinkage change on the alignment accuracy and dimensional accuracy of the PCB.
- the present invention overcomes the defects that the prior art cannot quickly and effectively evaluate the amount of change in the shrinkage and contraction of new PCB materials during processing, and provides an evaluation method for the compensation coefficient of the new material of the PCB.
- a method for evaluating the compensation coefficient of a new PCB material including:
- the first core plate is selected
- the specifications are the same as the specifications of the second core sheet, and the first prepreg is selected to have the same specifications as the second prepreg;
- the comparative material selected in the technical solution is a commonly used PCB material which has been determined by the big data method to have a perfect expansion and contraction compensation rule, and the different matching structure, core thickness, core copper thickness, prepreg type, and prepreg quantity of the comparative material. When there is a change, there is a corresponding expansion and contraction compensation rule.
- test method for the change in the change in the first core plate and the second core plate is:
- first test holes Forming at least four spaced apart first test holes on the first core board, at least four of the first test holes having a center line connection having a rectangular shape; and forming at least four interval settings on the second core board a first test hole, at least four of the first test holes have a center line connecting the rectangle;
- the first residual copper ratio and the second residual copper ratio are 0%, 50%, or 100%.
- At least four of the first test holes on the first core board are respectively disposed around the first core board; and at least four of the first tests on the second core board
- the holes are respectively disposed around the second core plate, and the two adjacent first test holes on the first core plate are respectively located in the warp or weft direction of the fiberglass cloth in the first core plate, and the second core The two adjacent first test holes on the plate are respectively located in the warp or weft direction of the fiberglass cloth in the second core plate.
- the graphic design of the first core plate and the graphic design of the second core plate are graphic designs that are evenly arranged in the warp and weft directions.
- test method for the change in the change in the first prepreg and the second prepreg is:
- At least four of the second test holes on the first dummy board are respectively disposed around the first dummy board; at least four of the second dummy board are The second test holes are respectively disposed around the second dummy board, and the adjacent second test holes on the first dummy board are respectively located in the warp or weft direction of the fiberglass cloth in the first dummy board, and The adjacent second test holes on the second dummy board are respectively located in the warp or weft direction of the fiberglass cloth in the second dummy board.
- the method for deriving the shrinkage compensation rule of the new PCB material is:
- FIG. 1 is a schematic structural view of a first core board or a second core board of the present invention
- FIG. 2 is a schematic view showing the structure of a first prepreg or a second prepreg according to the present invention.
- a method for evaluating the compensation coefficient of a new PCB material including:
- the first core plate is selected
- the specifications are the same as those of the second core sheet, and the first prepreg is selected to have the same specifications as the second prepreg; the specifications are the same including at least the thickness and the glass fiber type.
- the comparative material selected in the embodiment is a common PCB material which has been determined by the big data method to obtain a perfect shrinkage compensation rule, and the different matching structure, core thickness, core copper thickness, prepreg type, and prepreg number of the comparative material. When there is a change, there is a corresponding expansion and contraction compensation rule.
- test method for the change of the first core plate and the second core plate is:
- the first core plate and the second core plate are selected, wherein the first core plate and the second core plate are thin thickness specifications such as 0.05 mm, 0.10 mm, 0.13 mm, 0.15 mm, 0.20 mm, etc., which are easy to change in size, and the first core
- the copper thickness of the plate and the second core plate is 0.5 oz, 1 oz, and the like.
- the first core plate and the second core plate are both rectangular core plates.
- the number of the first core board and the second core board are multiple, and the specifications of the first core board and the second core board are one-to-one correspondence.
- At least four first test holes 10 are formed on the first core board.
- four first test holes 10 are arranged at intervals, and the center points of the four first test holes 10 are connected. Forming a rectangle; forming at least four first test holes 10 at intervals in the second core plate.
- four first test holes 10 are arranged at intervals, and the center points of the four first test holes 10 are The connection is rectangular.
- the four first test holes 10 are located at four corners of the rectangular core plate, that is, the four first test holes on the first core plate are respectively disposed around the first core plate;
- the four first test holes on the second core board are respectively disposed around the second core board, and the two adjacent first test holes on the first core board are respectively located in the first core board.
- first test holes on the second core board are respectively located in the warp or weft direction of the fiberglass cloth in the second core board.
- the first test hole 10 may be a circular shape, a regular polygon or the like.
- the distance between the first test hole 10 and the edge of the core plate is 2.54 mm - 50.8 mm, and the diameter or side length of the first test hole is 0.5. Mm-4mm, the larger the diameter of the first test hole, the higher the dimensional test accuracy.
- a circular shape is adopted as the shape of the first test hole 10.
- the distance from the first test hole 10 to the edge of the core plate is 25.4 mm, and the diameter of the first test hole 10 is 3.175 mm.
- the F 1 includes F 1A , F 1B , wherein F 1A represents a center distance F 1 of the first core plate in which the two meridional adjacent first test holes 10, and F 1B represents a second core plate in which two meridional adjacent portions a central hole 10 from the test F 1;
- F 2 comprising F 2A, F 2B;
- W 1 comprises the W 1A, W 1B;
- W 2 comprising a W 2A, W 2B.
- the rate is the same.
- the first core plate is subjected to a pretreatment line, that is, chemically microetched, cleaned, and then adhered to a dry film, and then transferred, developed, etched, and ejected by a pattern to obtain a graphic design having a 50% residual copper ratio.
- the graphic design is a pattern uniformly arranged in the warp and weft directions, and avoids the case where the warp and weft patterns interfere with each other when measuring the warp direction and the zonal up and down value; similarly, the second core board is made the same Processed to give it a graphic design with a 50% residual copper ratio.
- the first residual copper ratio and the second residual copper ratio may be 0%, 100%, or other values.
- the positions of the first test holes 10 after the lamination treatment in the first core plate and the second core plate are respectively measured, and the distances F 1 ', F 2 ', W 1 between the adjacent first test holes 10 are calculated.
- ', W 2 ' denoted as the final distance;
- the F 1 ' includes F 1A ', F 1B ', where F 1A ' represents the center distance F 1 of the first core plate in which the two longitudinally adjacent first test holes 10 are adjacent ', F 1B ' represents the center distance F 1 ' of the second core plate in which the two longitudinally adjacent first test holes 10;
- the F 2 ' includes F 2A ', F 2B ';
- the W 1 ' W 1A ', W 1B ' is included;
- W 2 ' includes W 2A ', W 2B '.
- the ⁇ F 1 includes ⁇ F 1A , ⁇ F 1B , wherein ⁇ F 1A represents the size change value ⁇ F 1 of the first core plate after etching and pressing, and ⁇ F 1B represents the dimensional change value ⁇ F of the second core plate after etching and pressing. 1;
- the ⁇ F 2 comprises ⁇ F 2A, F 2B;
- W 1 comprises said ⁇ W 1A, ⁇ W 1B;
- ⁇ W 2 comprises the ⁇ W 2A, ⁇ W 2B.
- test method for the change in the shrinkage and contraction of the first prepreg and the second prepreg is as follows:
- a layer of copper foil is respectively disposed on the top layer of the first prepreg to form a first pre-laminated sheet, and a layer of copper foil is respectively disposed on the top layer of the second prepreg to form a second pre-stack; the first prepreg selected in the embodiment
- the specifications of the second prepreg are 106, 1080, 3313, and 2116.
- the prepreg of each specification is a high-adhesive prepreg. The higher the amount of glue, the larger the shrinkage, and the higher the dimensional accuracy.
- the copper foil has a thickness of 0.33 oz or 0.5 oz.
- the first pre-stack is placed in a vacuum quick press, and is pressed into a first dummy plate at a certain temperature/pressure and time, wherein the pressing temperature is 105 ° C, the pressing time is 30 s, and the pressure is 50 psi;
- the second pre-laminated sheet is pressed into the second dummy board; the degree of curing reaction in each of the dummy boards is extremely low during the rapid pressing process, and the degree of curing is similar to that of the semi-curing.
- the first dummy board and the second dummy board are both rectangular dummy boards.
- At least four second test holes 20 are formed on the first dummy board.
- four second test holes 20 are used, and the center points of the four test holes 20 are rectangular.
- four second test holes 20 are used, and the center points of the four of the second test holes 20 are rectangular.
- the four second test holes 20 are located at the four corners of the rectangular dummy board, that is, the four second test holes 20 on the first dummy board are respectively disposed on the first dummy.
- the four test holes 20 on the second dummy board are respectively disposed around the second dummy board, and the two adjacent ones on the first dummy board are second
- the test holes 20 are respectively located in the warp or weft direction of the fiberglass cloth in the first dummy board, and the adjacent second test holes 20 on the second dummy board are respectively located in the fiber cloth of the second dummy board.
- Toward or latitude. This setting facilitates the measurement of the change in the warp and weft of the first dummy web and the change in the warp and weft of the second dummy web in the warp and weft directions.
- the second test hole 20 may be a circular shape, a regular polygon, or the like.
- the distance between the second test hole 20 and the side of the dummy board is 2.54 mm - 50.8 mm, and the diameter or side length of the second test hole 20 is The diameter of the second test hole 20 is 0.5 mm to 4 mm, and the dimensional test accuracy is higher.
- a circular shape is adopted as the shape of the second test hole 20.
- the distance from the first test hole 20 to the side of the dummy board is 25.4 mm, and the diameter of the second test hole 20 is 3.175 mm.
- the positions of the second test holes 20 in the first dummy plate and the second dummy plate are respectively measured, and the distances F 3 , F 4 , W 3 , and W 4 between the adjacent second test holes 20 are calculated and recorded as initials.
- the distance between the adjacent second test holes 20 is the center distance of each of the second test holes 20;
- the F 3 includes F 3A , F 3B , wherein F 3A represents the first dummy plate, wherein the two meridional phases vicinity of the center hole 20 from the second test F 3, F 3B representative of a second prosthesis from contact plate via two F 3 wherein the centers of adjacent test wells 20 of the second;
- the W 3 includes W 3A , W 3B ;
- the W 4 includes W 4A , W 4B .
- the positions of the second test holes 20 after the lamination treatment in the first dummy board and the second dummy board are respectively measured, and the distances F 3 ', F 4 ', W between the adjacent second test holes 20 are calculated.
- 3 ', W 4 ' denoted as the final distance;
- F 3 ' includes F 3A ', F 3B ', where F 3A ' represents the center distance of the first dummy board from the two adjacent test holes 20
- F 3 ', F 3B ' represents the center distance F 3 ' of the second dummy board in which two of the two adjacent test holes 20 are adjacent; similarly, the F 4 ' includes F 4A ', F 4B '; W 3 ' includes W 3A ', W 3B '; and W 4 ' includes W 4A ', W 4B '.
- the ⁇ F 3 includes ⁇ F 3A , ⁇ F 3B , wherein ⁇ F 3A represents the size change value ⁇ F 3 after etching and pressing of the first dummy board, and ⁇ F 3B represents the dimensional change of the second dummy board after etching and pressing.
- the value ⁇ F 3 for the same reason, the ⁇ F 4 includes ⁇ F 4A , F 4B ; the ⁇ W 3 includes ⁇ W 3A , ⁇ W 3B ; the ⁇ W 4 includes ⁇ W 4A , ⁇ W 4B .
- the method for deriving the shrinkage compensation rule of the new PCB material is:
- ⁇ F A ⁇ [( ⁇ F 1A + ⁇ F 2A )/2]
- ⁇ W A ⁇ [( ⁇ W 1A + ⁇ W 2A )/2]
- the ⁇ F 1A , ⁇ F 2A are the dimensional change values of the first core plate, respectively ⁇ F 1 , ⁇ F 2 , wherein ⁇ W 1A and ⁇ W 2A are dimensional change values ⁇ W 1 , ⁇ W 2 in the first core plate, respectively;
- ⁇ represents the core board or the dummy of each specification and quantity of the test. The sum of the calculated results of the board.
- Table 1 is the compensation rules for some specifications of the existing materials.
- the compensation coefficients for the new PCB materials can be introduced as shown in Table 2:
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Abstract
A method for estimating an expansion and contraction compensation coefficient of a new PCB material. The method comprises: selecting a common PCB material as a contrast material; respectively testing the expansion and contraction change values of a first core plate and a first prepreg of a new PCB material, and respectively testing the expansion and contraction change values of a second core plate and a second prepreg of the contrast material; carrying out a contrastive analysis on the expansion and contraction change values and the differences of the first core plate and the second core plate in respective processing flows; carrying out a contrastive analysis on the expansion and contraction change values and the differences of the first prepreg and the second prepreg in respective processing flows; and carrying out analogical derivation in combination with an expansion and contraction compensation rule of the contrast material, and deriving an expansion and contraction compensation rule of the new PCB material. According to the present invention, the expansion and contraction variation of a new PCB material can be quickly and effectively derived, so as to obtain an expansion and contraction compensation coefficient of the new PCB material, without requiring bulk testing of the expansion and contraction variation of a copper thickness, a plate thickness, a copper residual rate, a prepreg type, a prepreg number, etc., when designing different laminations of the new PCB material, thereby saving a large amount of manpower, material resources and financial resources.
Description
本发明涉及印制电路板领域,更具体地,涉及一种PCB新材料涨缩补偿系数的评估方法。The invention relates to the field of printed circuit boards, and more particularly to a method for evaluating the compensation coefficient of new material of PCB.
当前PCB不断趋于高速化、高频化、高散热化、高可靠性方向发展,促使PCB基材制作商不断对基材的组成进行优化、升级,以获得具有低介电常数、低介质损耗、高散热特性、高可靠性的基板材料,因此目前PCB基材种类、规格越来越多。同时,PCB的另一重要发展趋势是高对位精度和高尺寸精度,而PCB在加工制作过程中因基材在力、热、湿等复杂的环境下产生的涨缩效应对于PCB的对位精度和尺寸精度的有着重要的影响。随着基材的种类越来越多,如何快速、有效地评估PCB材料在加工过程中的涨缩变化量是PCB制作的一大难题。At present, PCBs are increasingly moving toward high speed, high frequency, high heat dissipation, and high reliability, prompting PCB substrate manufacturers to continuously optimize and upgrade the composition of the substrate to obtain low dielectric constant and low dielectric loss. With high heat dissipation characteristics and high reliability of substrate materials, there are more and more PCB substrate types and specifications. At the same time, another important development trend of PCB is high alignment accuracy and high dimensional accuracy. In the process of PCB manufacturing, the PCB is aligned due to the shrinkage and contraction effect of the substrate in complex environments such as force, heat and humidity. Accuracy and dimensional accuracy have an important impact. With the increasing variety of substrates, how to quickly and effectively evaluate the amount of change in PCB material during processing is a major problem in PCB fabrication.
对于新材料涨缩特性的评估,目前PCB厂商的一般做法是先做一批或几批测试板,测试各层芯板的尺寸变化值,从而确定材料的涨缩补偿系数,然后将此涨缩补偿系数用于后续批次的PCB中,以减小涨缩变化对PCB对位精度和尺寸精度的影响,虽然此方法能在一定程度上解决涨缩效应对PCB制作的影响,由于生产过程中各订单产品的文件设计和叠层设计均不一致,因而涨缩测试板的文件设计和叠层设计与实际订单存在差异,需要进行大量的测试方可获得能够稳定使用的涨缩系数。另外,业内另一种涨缩测试方法是基于大数据层面,大量测试不同叠层设计时铜厚、板厚、残铜率、半固化片类型、半固化片数量等的涨缩变化,以获得新材料的涨缩规律,建立相应的PCB涨缩补偿规则,但当材料的种类/型号不断增多时,需投入较多人力、物力、财力去研究不同材料的涨缩行为,且这种方法不能适应当前电子产品更新速度快、竞争日益激烈的需求。For the evaluation of the shrinkage and shrinkage characteristics of new materials, the current practice of PCB manufacturers is to first do a batch or batch of test boards, test the dimensional change values of each core board, and determine the material's shrinkage compensation coefficient, and then increase or decrease the material. The compensation coefficient is used in the PCB of the subsequent batch to reduce the influence of the shrinkage change on the alignment accuracy and dimensional accuracy of the PCB. Although this method can solve the influence of the shrinkage effect on the PCB fabrication to some extent, due to the production process. The file design and stack design of each order product are inconsistent, so the file design and stack design of the shrink test board are different from the actual order, and a large number of tests are required to obtain a stable shrinkage coefficient. In addition, another method of shrinking and testing in the industry is based on the big data level, which greatly tests the shrinkage and change of copper thickness, plate thickness, residual copper ratio, prepreg type, and number of prepregs in different laminate designs to obtain the rise of new materials. Reducing the law and establishing the corresponding PCB shrinkage compensation rules, but when the types/models of materials continue to increase, more manpower, material resources, and financial resources are needed to study the shrinkage behavior of different materials, and this method cannot adapt to current electronic products. Faster, more competitive demands.
发明内容Summary of the invention
基于此,本发明在于克服现有技术不能快速、有效地评估PCB新材料在加工过程中的涨缩变化量的缺陷,提供一种PCB新材料涨缩补偿系数的评估方法。Based on this, the present invention overcomes the defects that the prior art cannot quickly and effectively evaluate the amount of change in the shrinkage and contraction of new PCB materials during processing, and provides an evaluation method for the compensation coefficient of the new material of the PCB.
其技术方案如下:Its technical solutions are as follows:
一种PCB新材料涨缩补偿系数的评估方法,包括:A method for evaluating the compensation coefficient of a new PCB material, including:
选取一种已确定出完善的涨缩补偿规则的PCB常用材料作为对比材料;Select a common PCB material that has been determined to be a perfect inflation compensation rule as a comparison material;
分别测试PCB新材料的第一芯板以及第一半固化片的涨缩变化值,以及分别测试对比材料的第二芯板以及第二半固片的涨缩变化值,所述第一芯板选取的规格与第二芯板的规格相同,所述第一半固化片选取的规格与第二半固化片的规格相同;Testing the first core plate of the new material of the PCB and the change value of the first prepreg, and the change values of the second core plate and the second half solid film of the comparative material respectively, the first core plate is selected The specifications are the same as the specifications of the second core sheet, and the first prepreg is selected to have the same specifications as the second prepreg;
对比分析第一芯板、第二芯板在各自加工流程的涨缩变化值及差异;对比分析第一半固化片、第二半固化片在各自加工流程的涨缩变化值及差异;Contrast and analyze the change and difference of the first core plate and the second core plate in the respective processing flow; compare and analyze the change and difference of the first prepreg and the second prepreg in the respective processing flow;
结合对比材料的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combining the expansion and contraction compensation rules of the comparative materials, the analogy derivation is carried out, and the expansion and contraction compensation rules of the new PCB materials are derived.
本技术方案中所选取的对比材料为已通过大数据法确定出完善的涨缩补偿规则的PCB常用材料,该对比材料的不同配本结构、芯板厚度、芯板铜厚、半固化片类型、半固化片数量等发生变化时均已有对应的涨缩补偿规则。分别测试待评估的PCB新材料的特定规格的芯板和半固化片在影响涨缩值的关键加工流程中的涨缩变化差异,以及对比材料的特定规格的芯板和半固化片在影响涨缩值的关键加工流程中的涨缩变化差异,并结合对比材料的涨缩补偿规则进行类比推导,即可快速、有效地推导出PCB新材料的涨缩变化量,从而获得PCB新材料的涨缩补偿系数,无需大量测试PCB新材料不同叠层设计时铜厚、板厚、残铜率、半固化片类型、半固化片数量等的涨缩变化,节约了大量人力物力和财力。The comparative material selected in the technical solution is a commonly used PCB material which has been determined by the big data method to have a perfect expansion and contraction compensation rule, and the different matching structure, core thickness, core copper thickness, prepreg type, and prepreg quantity of the comparative material. When there is a change, there is a corresponding expansion and contraction compensation rule. Test the difference between the shrinkage and change of the core plate and the prepreg of the specific specification of the new PCB material to be evaluated in the key processing flow affecting the shrinkage value, and the key of the core plate and the prepreg of the specific material of the comparison material influencing the shrinkage value The difference between the ups and downs in the processing flow, combined with the comparison of the ups and downs compensation rules of the comparative materials, can be used to quickly and effectively derive the ups and downs of the new PCB materials, thereby obtaining the expansion and contraction compensation coefficient of the new PCB materials. There is no need to extensively test the shrinkage and change of copper thickness, plate thickness, residual copper ratio, prepreg type, and number of prepregs in different laminate design, saving a lot of manpower, material and financial resources.
在其中一个实施例中,所述第一芯板和第二芯板的涨缩变化值的测试方法为:In one embodiment, the test method for the change in the change in the first core plate and the second core plate is:
在所述第一芯板上制作至少四个间隔设置的第一测试孔,至少四个所述第一测试孔的中心点连线呈矩形;在所述第二芯板制作至少四个间隔设置的第一 测试孔,至少四个所述第一测试孔的中心点连线呈矩形;Forming at least four spaced apart first test holes on the first core board, at least four of the first test holes having a center line connection having a rectangular shape; and forming at least four interval settings on the second core board a first test hole, at least four of the first test holes have a center line connecting the rectangle;
分别测量第一芯板和第二芯板中各第一测试孔的位置,计算相邻的第一测试孔之间的距离F
1、F
2、W
1、W
2,记为初始距离;
Measuring the positions of the first test holes in the first core plate and the second core plate respectively, and calculating the distances F 1 , F 2 , W 1 , W 2 between the adjacent first test holes, and recording the initial distances;
将所述第一芯板蚀刻为具有第一残铜率的图形设计;将所述第二芯板蚀刻为具有第二残铜率的图形设计,所述第一残铜率与第二残铜率相同;Etching the first core plate into a graphic design having a first residual copper ratio; etching the second core plate into a graphic design having a second residual copper ratio, the first residual copper ratio and the second residual copper The same rate;
将所述第一芯板在该材料对应的压合程序下进行层压处理;将所述第二芯板在该材料对应的压合程序下进行层压处理;Laminating the first core plate under a pressing process corresponding to the material; laminating the second core plate under a pressing process corresponding to the material;
分别测量第一芯板和第二芯板中经层压处理后的各第一测试孔的位置,计算相邻的第一测试孔之间的距离F
1′、F
2′、W
1′、W
2′,记为最终距离;
Measuring the positions of the first test holes after the lamination treatment in the first core plate and the second core plate, respectively, and calculating the distances F 1 ', F 2 ', W 1 ' between the adjacent first test holes, W 2 ', recorded as the final distance;
分别计算第一芯板和第二芯板经蚀刻、压合后的尺寸变化值ΔF
1、ΔF
2、ΔW
1、ΔW
2;其中ΔF
1=(F
1′-F
1)/F
1,ΔF
2=(F
2′-F
2)/F
2,ΔW
1=(W
1′-W
1)/W
1,ΔW
2=(W
2′-W
2)/W
2。
The dimensional change values ΔF 1 , ΔF 2 , ΔW 1 , ΔW 2 of the first core plate and the second core plate after etching and pressing are respectively calculated; wherein ΔF 1 = (F 1 '-F 1 )/F 1 , ΔF 2 = (F 2 '-F 2 ) / F 2 , ΔW 1 = (W 1 '-W 1 ) / W 1 , ΔW 2 = (W 2 '-W 2 ) / W 2 .
在其中一个实施例中,所述第一残铜率与第二残铜率为0%、50%或100%。In one embodiment, the first residual copper ratio and the second residual copper ratio are 0%, 50%, or 100%.
在其中一个实施例中,所述第一芯板上的至少四个所述第一测试孔分别设于第一芯板的四周;所述第二芯板上的至少四个所述第一测试孔分别设于第二芯板的四周,且所述第一芯板上相邻的两个第一测试孔分别位于第一芯板中玻纤布的经向或纬向,所述第二芯板上相邻的两个第一测试孔分别位于第二芯板中玻纤布的经向或纬向。In one embodiment, at least four of the first test holes on the first core board are respectively disposed around the first core board; and at least four of the first tests on the second core board The holes are respectively disposed around the second core plate, and the two adjacent first test holes on the first core plate are respectively located in the warp or weft direction of the fiberglass cloth in the first core plate, and the second core The two adjacent first test holes on the plate are respectively located in the warp or weft direction of the fiberglass cloth in the second core plate.
在其中一个实施例中,所述第一芯板的图形设计以及第二芯板的图形设计均为经纬方向均匀排布的图形设计。In one embodiment, the graphic design of the first core plate and the graphic design of the second core plate are graphic designs that are evenly arranged in the warp and weft directions.
在其中一个实施例中,所述第一半固化片和第二半固化片的涨缩变化值的测试方法为:In one embodiment, the test method for the change in the change in the first prepreg and the second prepreg is:
在第一半固化片的顶底层分别设置一层铜箔,形成第一预叠板,在第二半固化片的顶底层分别设置一层铜箔,形成第二预叠板;Forming a layer of copper foil on the top bottom layer of the first prepreg to form a first pre-laminated sheet, and respectively forming a layer of copper foil on the top bottom layer of the second prepreg to form a second pre-stack;
将第一预叠板快速压合为第一假接板,将第二预叠板快速压合为第二假接板;Quickly pressing the first pre-stack into a first dummy board, and pressing the second pre-stack into a second dummy board;
在所述第一假接板上制作至少四个间隔设置的第二测试孔,至少四个所述第二测试孔的中心点连线呈矩形;在所述第二芯板制作至少四个间隔设置的第 二测试孔,至少四个所述第二测试孔的中心点连线呈矩形;Forming at least four spaced second test holes on the first dummy board, at least four of the second test holes having a center line connection having a rectangular shape; and forming at least four intervals on the second core board a second test hole is disposed, and a center line of at least four of the second test holes is rectangular;
分别测量第一假接板和第二假接板中各第二测试孔的位置,计算相邻的第二测试孔之间的距离F
3、F
4、W
3、W
4,记为初始距离;
Measure the positions of the second test holes in the first dummy plate and the second dummy plate, respectively, and calculate the distances F 3 , F 4 , W 3 , and W 4 between the adjacent second test holes, and record the initial distance. ;
将所述第一假接板在该材料对应的压合程序下进行层压处理;将所述第二假接板在该材料对应的压合程序下进行层压处理;Laminating the first dummy board under a pressing process corresponding to the material; and laminating the second dummy board under a pressing process corresponding to the material;
分别测量第一假接板和第二假接板中经层压处理后的各第二测试孔的位置,计算相邻的第二测试孔之间的距离F
3′、F
4′、W
3′、W
4′,记为最终距离;
Measure the positions of the second test holes after the lamination process in the first dummy plate and the second dummy plate, respectively, and calculate the distances F 3 ', F 4 ', W 3 between the adjacent second test holes. ', W 4 ', recorded as the final distance;
分别计算第一假接板和第二假接板经压合后的尺寸变化值ΔF
3、ΔF
4、ΔW
3、ΔW
4;其中ΔF
3=(F
3′-F
3)/F
3,ΔF
4=(F
4′-F
4)/F
4,ΔW
1=(W
3′-W
3)/W
3,ΔW
4=(W
4′-W
4)/W
4。
Calculating the dimensional change values ΔF 3 , ΔF 4 , ΔW 3 , ΔW 4 after pressing the first dummy plate and the second dummy plate, respectively; wherein ΔF 3 = (F 3 '-F 3 )/F 3 , ΔF 4 = (F 4 '-F 4 ) / F 4 , ΔW 1 = (W 3 '-W 3 ) / W 3 , ΔW 4 = (W 4 '-W 4 ) / W 4 .
在其中一个实施例中,所述第一假接板上的至少四个所述第二测试孔分别设于第一假接板的四周;所述第二假接板上的至少四个所述第二测试孔分别设于第二假接板的四周,且所述第一假接板上相邻的第二测试孔分别位于第一假接板中玻纤布的经向或纬向,且所述第二假接板上相邻的第二测试孔分别位于第二假接板中玻纤布的经向或纬向。In one embodiment, at least four of the second test holes on the first dummy board are respectively disposed around the first dummy board; at least four of the second dummy board are The second test holes are respectively disposed around the second dummy board, and the adjacent second test holes on the first dummy board are respectively located in the warp or weft direction of the fiberglass cloth in the first dummy board, and The adjacent second test holes on the second dummy board are respectively located in the warp or weft direction of the fiberglass cloth in the second dummy board.
在其中一个实施例中,所述PCB新材料的涨缩补偿规则的推导方法为:In one embodiment, the method for deriving the shrinkage compensation rule of the new PCB material is:
分别计算第一芯板在加工过程中经向的尺寸变化ΔF
A和纬向的尺寸变化ΔW
A;分别计算第二芯板在加工过程中经向的尺寸变化ΔF
B和纬向的尺寸变化ΔW
B;
Calculate the dimensional change ΔF A and the dimensional change ΔW A of the first core in the warp direction during the machining process respectively; calculate the dimensional change ΔF B and the dimensional change ΔW of the warp direction of the second core during the machining process, respectively. B ;
计算第一芯板和第二芯板在径向的尺寸变化的差值ΔF
c=ΔF
A-ΔF
B,计算第一芯板和第二芯板在纬向的尺寸变化的差值ΔW
c=ΔW
A-ΔW
B;
Calculating a difference ΔF c =ΔF A -ΔF B of the dimensional change of the first core plate and the second core plate in the radial direction, and calculating a difference ΔW c of the dimensional change of the first core plate and the second core plate in the weft direction ΔW A - ΔW B ;
分别计算第一假接板在层压加工过程中经向的尺寸变化ΔF
A′和纬向的尺寸变化ΔW
A′;分别计算第二假接板板在层压加工过程中经向的尺寸变化ΔF
B′和纬向的尺寸变化ΔW
B′;
Calculating the dimensional change ΔF A ' of the warp direction of the first dummy web during the lamination process and the dimensional change ΔW A ' of the weft direction respectively; calculating the dimensional change of the warp direction of the second dummy web during the laminating process ΔF B ' and zonal dimensional change ΔW B ';
计算第一假接板和第二假接板在径向的尺寸变化的差值ΔF
p=ΔF
A′-ΔF
B′,计算第一假接板和第二假接板在纬向的尺寸变化的差值ΔW
p=ΔW
A′-ΔW
B′;
Calculating a difference ΔF p =ΔF A ′−ΔF B ′ of the dimensional change of the first dummy plate and the second dummy plate in the radial direction, and calculating a dimensional change of the first dummy plate and the second dummy plate in the weft direction The difference ΔW p = ΔW A '- ΔW B ';
则PCB新材料与对比材料在经向和纬向的涨缩变化值分别为ΔF=(ΔF
c+ΔF
p)/2;ΔW=(ΔW
c+ΔW
p)/2;
Then, the change values of the new material of the PCB and the contrast material in the warp and latitude are ΔF=(ΔF c +ΔF p )/2; ΔW=(ΔW c +ΔW p )/2;
结合对比材料已由的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combined with the comparison of the ups and downs compensation rules of comparative materials, the analogy derivation is derived, and the rules for the expansion and contraction of new PCB materials are derived.
在其中一个实施例中,其中ΔF
A=∑[(ΔF
1A+ΔF
2A)/2],ΔW
A=∑[(ΔW
1A+ΔW
2A)/2],所述ΔF
1A、ΔF
2A分别为第一芯板的尺寸变化值ΔF
1、ΔF
2,所述ΔW
1A、ΔW
2A分别为第一芯板中的尺寸变化值ΔW
1、ΔW
2,所述∑为各规格和数量的第一芯板的变化总和;其中ΔF
B=∑[(ΔF
1B+ΔF
2B)/2],ΔW
B=∑[(ΔW
1B+ΔW
2B)/2],所述ΔF
1B、ΔF
2B分别为第二芯板中的尺寸变化值ΔF
1、ΔF
2,所述ΔW
1B、ΔW
2B分别为第二芯板中的尺寸变化值ΔW
1、ΔW
2,所述∑为各规格和数量的第二芯板的变化总和。
In one embodiment, wherein ΔF A = ∑ [(ΔF 1A + ΔF 2A )/2], ΔW A = ∑ [(ΔW 1A + ΔW 2A )/2], the ΔF 1A , ΔF 2A are respectively a core plate of size variation value ΔF 1, ΔF 2, the ΔW 1A, ΔW 2A are dimensional changes in the value of the first core plate is ΔW 1, ΔW 2, Σ is the first size and number of each core plate The sum of the changes; where ΔF B = ∑ [(ΔF 1B + ΔF 2B )/2], ΔW B = ∑ [(ΔW 1B + ΔW 2B )/2], the ΔF 1B , ΔF 2B are the second core plates respectively the dimensional change value ΔF 1, ΔF 2, the ΔW 1B, ΔW 2B are dimensional changes in the value of the second core plate is ΔW 1, ΔW 2, Σ is a change in the size and number of second core plate of each of sum.
在其中一个实施例中,其中ΔF
A′=∑[(ΔF
1A′+ΔF
2A′)/2],ΔW
A′=∑[(ΔW
1A′+ΔW
2A′)/2],所述ΔF
1A′、ΔF
2A′分别为第一假接板中的两经向相邻的测试孔之间的距离F
1′、F
2′,所述ΔW
1A、ΔW
2A分别为第一假接板中的两纬向相邻的测试孔之间的距离W
1′、W
2′,所述∑为各规格和数量的第一假接板的变化总和;其中ΔF
B′=∑[(ΔF
1B′+ΔF
2B′)/2],ΔW
B′=∑[(ΔW
1B′+ΔW
2B′)/2],所述ΔF
1B′、ΔF
2B′分别为第二假接板中的两经向相邻的测试孔之间的距离F
1′、F
2′,所述ΔW
1B′、ΔW
2B′分别为第二假接板中的两纬向相邻的测试孔之间的距离W
1′、W
2′,所述∑为各规格和数量的第二假接板的变化总和。
In one of the embodiments, wherein ΔF A '= ∑ [(ΔF 1A ′ + ΔF 2A ′)/2], ΔW A ′ = ∑ [(ΔW 1A ′ + ΔW 2A ′)/2], the ΔF 1A ', ΔF 2A ' is the distance F 1 ', F 2 ' between the two adjacent test holes in the first dummy plate, respectively, and the ΔW 1A , ΔW 2A are respectively in the first dummy plate The distance W 1 ', W 2 ' between the adjacent test holes of the two latitudinal directions, which is the sum of changes of the first dummy plates of various specifications and numbers; wherein ΔF B '= ∑ [(ΔF 1B ′+ ΔF 2B ')/2], ΔW B ' = ∑ [(ΔW 1B ′ + ΔW 2B ′) /2], the ΔF 1B ′, ΔF 2B ′ are respectively two meridional adjacent in the second dummy plate Distances F 1 ', F 2 ' between the test holes, the ΔW 1B ', ΔW 2B ' are the distances W 1 ', W between the two latitudinal adjacent test holes in the second dummy plate, respectively 2 ', the ∑ is the sum of changes of the second dummy splicing plates of various specifications and quantities.
图1为本发明的第一芯板或第二芯板的结构示意图;1 is a schematic structural view of a first core board or a second core board of the present invention;
图2为本发明的第一半固化片或第二半固化片的结构示意图。2 is a schematic view showing the structure of a first prepreg or a second prepreg according to the present invention.
附图标记说明:Description of the reference signs:
10、第一测试孔;20、第二测试孔。10. The first test hole; 20, the second test hole.
为使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及具体实施方式,对本发明进行进一步的详细说明。应当理解的是,此处所描述的具体实施方式仅用以解释本发明,并不限定本发明的保护范围。The present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the scope of the invention.
一种PCB新材料涨缩补偿系数的评估方法,包括:A method for evaluating the compensation coefficient of a new PCB material, including:
选取一种已通过确定出完善的涨缩补偿规则的PCB常用材料作为对比材料;Select a commonly used PCB material that has been determined by a perfect inflation and contraction compensation rule as a comparison material;
分别测试PCB新材料的第一芯板以及第一半固化片的涨缩变化值,以及分别测试对比材料的第二芯板以及第二半固片的涨缩变化值,所述第一芯板选取的规格与第二芯板的规格相同,所述第一半固化片选取的规格与第二半固化片的规格相同;所述规格相同至少包括厚度以及玻纤类别相同。Testing the first core plate of the new material of the PCB and the change value of the first prepreg, and the change values of the second core plate and the second half solid film of the comparative material respectively, the first core plate is selected The specifications are the same as those of the second core sheet, and the first prepreg is selected to have the same specifications as the second prepreg; the specifications are the same including at least the thickness and the glass fiber type.
对比分析第一芯板、第二芯板在各自加工流程的涨缩变化值及差异;对比分析第一半固化片、第二半固化片在各自加工流程的涨缩变化值及差异;Contrast and analyze the change and difference of the first core plate and the second core plate in the respective processing flow; compare and analyze the change and difference of the first prepreg and the second prepreg in the respective processing flow;
结合对比材料的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combining the expansion and contraction compensation rules of the comparative materials, the analogy derivation is carried out, and the expansion and contraction compensation rules of the new PCB materials are derived.
本实施方式中所选取的对比材料为已通过大数据法确定出完善的涨缩补偿规则的PCB常用材料,该对比材料的不同配本结构、芯板厚度、芯板铜厚、半固化片类型、半固化片数量等发生变化时均已有对应的涨缩补偿规则。分别测试待评估的PCB新材料的特定规格的芯板和半固化片在影响涨缩值的关键加工流程中的涨缩变化差异,以及对比材料的特定规格的芯板和半固化片在影响涨缩值的关键加工流程中的涨缩变化差异,并结合对比材料的涨缩补偿规则进行类比推导,即可快速、有效地推导出PCB新材料的涨缩变化量,从而获得PCB新材料的涨缩补偿系数,无需大量测试PCB新材料不同叠层设计时铜厚、板厚、残铜率、半固化片类型、半固化片数量等的涨缩变化,节约了大量人力物力和财力。The comparative material selected in the embodiment is a common PCB material which has been determined by the big data method to obtain a perfect shrinkage compensation rule, and the different matching structure, core thickness, core copper thickness, prepreg type, and prepreg number of the comparative material. When there is a change, there is a corresponding expansion and contraction compensation rule. Test the difference between the shrinkage and change of the core plate and the prepreg of the specific specification of the new PCB material to be evaluated in the key processing flow affecting the shrinkage value, and the key of the core plate and the prepreg of the specific material of the comparison material influencing the shrinkage value The difference between the ups and downs in the processing flow, combined with the comparison of the ups and downs compensation rules of the comparative materials, can be used to quickly and effectively derive the ups and downs of the new PCB materials, thereby obtaining the expansion and contraction compensation coefficient of the new PCB materials. There is no need to extensively test the shrinkage and change of copper thickness, plate thickness, residual copper ratio, prepreg type, and number of prepregs in different laminate design, saving a lot of manpower, material and financial resources.
如图1所示,所述第一芯板和第二芯板的涨缩变化值的测试方法为:As shown in FIG. 1, the test method for the change of the first core plate and the second core plate is:
选取第一芯板和第二芯板,其中第一芯板和第二芯板采用0.05mm、0.10mm、0.13mm、0.15mm、0.20mm等易产生尺寸变化的薄厚度规格,且第一芯板和第二芯板的铜厚采用0.5oz、1oz等常见规格。另外,本实施方式中,所述第一芯板和第二芯板均为矩形芯板。为了测试多组数据提高本实施方式涨缩补偿规则的精准度,所述第一芯板和第二芯板的数量均为多个,且第一芯板和第二芯板的规格一一对应,均包括如下几种规格:0.075mm厚度,配本:1080*1;0.10mm 厚度,配本:3313*1;0.125mm厚度,配本:2116*1;0.15mm厚度,配本:1080*2;0.20mm,配本:3313*2、0.25mm,配本:2116*2,尺寸为16*18inch、16*21inch或18*24inch等常用规格。The first core plate and the second core plate are selected, wherein the first core plate and the second core plate are thin thickness specifications such as 0.05 mm, 0.10 mm, 0.13 mm, 0.15 mm, 0.20 mm, etc., which are easy to change in size, and the first core The copper thickness of the plate and the second core plate is 0.5 oz, 1 oz, and the like. In addition, in the embodiment, the first core plate and the second core plate are both rectangular core plates. In order to test the accuracy of the expansion and contraction compensation rule of the embodiment, the number of the first core board and the second core board are multiple, and the specifications of the first core board and the second core board are one-to-one correspondence. , including the following specifications: 0.075mm thickness, with this: 1080 * 1; 0.10mm thickness, with this: 3313 * 1; 0.125mm thickness, with this: 2116 * 1; 0.15mm thickness, with this: 1080 * 2; 0.20mm , with this: 3313 * 2, 0.25mm, with this: 2116 * 2, size is 16 * 18inch, 16 * 21inch or 18 * 24inch and other common specifications.
在所述第一芯板上制作至少四个间隔设置的第一测试孔10,本实施方式采用四个间隔设置的第一测试孔10,四个所述第一测试孔10的中心点连线呈矩形;在所述第二芯板制作至少四个间隔设置的第一测试孔10,本实施方式采用四个间隔设置的第一测试孔10,四个所述第一测试孔10的中心点连线呈矩形。本实施方式中,四个第一测试孔10位于矩形芯板的四个角的位置,即所述第一芯板上的四个所述第一测试孔分别设于第一芯板的四周;所述第二芯板上的四个所述第一测试孔分别设于第二芯板的四周,且所述第一芯板上相邻的两个第一测试孔分别位于第一芯板中玻纤布的经向或纬向,所述第二芯板上相邻的第一测试孔分别位于第二芯板中玻纤布的经向或纬向。此设置便于测量第一芯板在经向和纬向的涨缩变化值,以及第二芯板在经向和纬向的涨缩变化值。所述第一测试孔10可为圆形、正多边形等,所述第一测试孔10到芯板板边的距离为2.54mm-50.8mm,所述第一测试孔的直径或边长为0.5mm-4mm,第一测试孔的直径越大,尺寸测试精度越高。本实施方式采用圆形作为第一测试孔10的形状,第一测试孔10到芯板板边的距离为25.4mm,第一测试孔10的直径为3.175mm。At least four first test holes 10 are formed on the first core board. In this embodiment, four first test holes 10 are arranged at intervals, and the center points of the four first test holes 10 are connected. Forming a rectangle; forming at least four first test holes 10 at intervals in the second core plate. In this embodiment, four first test holes 10 are arranged at intervals, and the center points of the four first test holes 10 are The connection is rectangular. In this embodiment, the four first test holes 10 are located at four corners of the rectangular core plate, that is, the four first test holes on the first core plate are respectively disposed around the first core plate; The four first test holes on the second core board are respectively disposed around the second core board, and the two adjacent first test holes on the first core board are respectively located in the first core board. In the warp or weft direction of the fiberglass cloth, adjacent first test holes on the second core board are respectively located in the warp or weft direction of the fiberglass cloth in the second core board. This setting facilitates measurement of the change in the warp and weft of the first core in the warp and weft directions, as well as the change in the warp and weft of the second core in the warp and weft directions. The first test hole 10 may be a circular shape, a regular polygon or the like. The distance between the first test hole 10 and the edge of the core plate is 2.54 mm - 50.8 mm, and the diameter or side length of the first test hole is 0.5. Mm-4mm, the larger the diameter of the first test hole, the higher the dimensional test accuracy. In this embodiment, a circular shape is adopted as the shape of the first test hole 10. The distance from the first test hole 10 to the edge of the core plate is 25.4 mm, and the diameter of the first test hole 10 is 3.175 mm.
分别测量第一芯板和第二芯板中各第一测试孔10的位置,计算相邻的第一测试孔10之间的距离F
1、F
2、W
1、W
2,记为初始距离,相邻的第一测试孔10之间的距离为各第一测试孔10的中心间距。所述F
1包括F
1A、F
1B,其中F
1A代表第一芯板其中两经向相邻第一测试孔10的中心距F
1,F
1B代表第二芯板其中两经向相邻第一测试孔10的中心距F
1;同理,所述F
2包括F
2A、F
2B;所述W
1包括W
1A、W
1B;所述W
2包括W
2A、W
2B。
Measuring the positions of the first test holes 10 in the first core plate and the second core plate respectively, and calculating the distances F 1 , F 2 , W 1 , and W 2 between the adjacent first test holes 10, which are recorded as initial distances. The distance between the adjacent first test holes 10 is the center distance of each of the first test holes 10. The F 1 includes F 1A , F 1B , wherein F 1A represents a center distance F 1 of the first core plate in which the two meridional adjacent first test holes 10, and F 1B represents a second core plate in which two meridional adjacent portions a central hole 10 from the test F 1; Similarly, the F 2 comprising F 2A, F 2B; W 1 comprises the W 1A, W 1B; the W 2 comprising a W 2A, W 2B.
将所述第一芯板蚀刻为具有第一残铜率的图形设计;将所述第二芯板蚀刻为具有第二残铜率的图形设计,所述第一残铜率与第二残铜率相同。本实施方式中,将第一芯板经过前处理线,即化学微蚀、清洗后贴上干膜,而后通过图形转移、显影、蚀刻、退膜,获得具有50%残铜率的图形设计,所述图形设计为经纬方向均匀排布的图形,避免测量经向涨缩值和纬向涨缩值时,经向和纬 向图形互相影响干涉的情况;同理,将第二芯板做相同处理,使之具有50%的残铜率的图形设计。在其他实施方式中,所述第一残铜率和第二残铜率可为0%、100%或其他数值。Etching the first core plate into a graphic design having a first residual copper ratio; etching the second core plate into a graphic design having a second residual copper ratio, the first residual copper ratio and the second residual copper The rate is the same. In this embodiment, the first core plate is subjected to a pretreatment line, that is, chemically microetched, cleaned, and then adhered to a dry film, and then transferred, developed, etched, and ejected by a pattern to obtain a graphic design having a 50% residual copper ratio. The graphic design is a pattern uniformly arranged in the warp and weft directions, and avoids the case where the warp and weft patterns interfere with each other when measuring the warp direction and the zonal up and down value; similarly, the second core board is made the same Processed to give it a graphic design with a 50% residual copper ratio. In other embodiments, the first residual copper ratio and the second residual copper ratio may be 0%, 100%, or other values.
将所述第一芯板在压合程序下进行层压处理;将所述第二芯板在压合程序下进行层压处理;所述压合程序为PCB新材料和对比材料对应的半固化片的压合程序。Laminating the first core plate under a pressing process; laminating the second core plate under a pressing process; the pressing process is a new material of the PCB and a prepreg corresponding to the comparative material Pressing procedure.
分别测量第一芯板和第二芯板中经层压处理后的各第一测试孔10的位置,计算相邻的第一测试孔10之间的距离F
1′、F
2′、W
1′、W
2′,记为最终距离;所述F
1′包括F
1A′、F
1B′,其中F
1A′代表第一芯板其中两经向相邻第一测试孔10的中心距F
1′,F
1B′代表第二芯板其中两经向相邻第一测试孔10的中心距F
1′;同理,所述F
2′包括F
2A′、F
2B′;所述W
1′包括W
1A′、W
1B′;所述W
2′包括W
2A′、W
2B′。
The positions of the first test holes 10 after the lamination treatment in the first core plate and the second core plate are respectively measured, and the distances F 1 ', F 2 ', W 1 between the adjacent first test holes 10 are calculated. ', W 2 ', denoted as the final distance; the F 1 'includes F 1A ', F 1B ', where F 1A ' represents the center distance F 1 of the first core plate in which the two longitudinally adjacent first test holes 10 are adjacent ', F 1B ' represents the center distance F 1 ' of the second core plate in which the two longitudinally adjacent first test holes 10; similarly, the F 2 ' includes F 2A ', F 2B '; the W 1 ' W 1A ', W 1B ' is included; and W 2 ' includes W 2A ', W 2B '.
分别计算第一芯板和第二芯板经蚀刻、压合后的尺寸变化值ΔF
1、ΔF
2、ΔW
1、ΔW
2;其中ΔF
1=(F
1′-F
1)/F
1,ΔF
2=(F
2′-F
2)/F
2,ΔW
1=(W
1′-W
1)/W
1,ΔW
2=(W
2′-W
2)/W
2。所述ΔF
1包括ΔF
1A、ΔF
1B,其中ΔF
1A代表第一芯板经蚀刻、压合后的尺寸变化值ΔF
1,ΔF
1B代表第二芯板经蚀刻、压合后的尺寸变化值ΔF
1;同理,所述ΔF
2包括ΔF
2A、F
2B;所述ΔW
1包括ΔW
1A、ΔW
1B;所述ΔW
2包括ΔW
2A、ΔW
2B。
The dimensional change values ΔF 1 , ΔF 2 , ΔW 1 , ΔW 2 of the first core plate and the second core plate after etching and pressing are respectively calculated; wherein ΔF 1 = (F 1 '-F 1 )/F 1 , ΔF 2 = (F 2 '-F 2 ) / F 2 , ΔW 1 = (W 1 '-W 1 ) / W 1 , ΔW 2 = (W 2 '-W 2 ) / W 2 . The ΔF 1 includes ΔF 1A , ΔF 1B , wherein ΔF 1A represents the size change value ΔF 1 of the first core plate after etching and pressing, and ΔF 1B represents the dimensional change value ΔF of the second core plate after etching and pressing. 1; Similarly, the ΔF 2 comprises ΔF 2A, F 2B; Delta] W 1 comprises said ΔW 1A, ΔW 1B; ΔW 2 comprises the ΔW 2A, ΔW 2B.
本实施方式中所述第一半固化片和第二半固化片的涨缩变化值的测试方法为:In the present embodiment, the test method for the change in the shrinkage and contraction of the first prepreg and the second prepreg is as follows:
在第一半固化片的顶底层分别设置一层铜箔,形成第一预叠板,在第二半固化片的顶底层分别设置一层铜箔,形成第二预叠板;本实施方式选取的第一半固化片和第二半固化片的规格为106、1080、3313、2116,各规格的半固化片的含胶量均为高含胶量半固化片,含胶量越高,涨缩越大,测得的尺寸精度越高。所述铜箔的厚度为0.33oz或0.5oz。A layer of copper foil is respectively disposed on the top layer of the first prepreg to form a first pre-laminated sheet, and a layer of copper foil is respectively disposed on the top layer of the second prepreg to form a second pre-stack; the first prepreg selected in the embodiment The specifications of the second prepreg are 106, 1080, 3313, and 2116. The prepreg of each specification is a high-adhesive prepreg. The higher the amount of glue, the larger the shrinkage, and the higher the dimensional accuracy. The copper foil has a thickness of 0.33 oz or 0.5 oz.
将第一预叠板置于真空快压机中,在一定的温度/压力和时间内压合为第一假接板,其中压合温度为105℃,压合时间为30s,压力为50psi;同理,将第二预叠板压合为第二假接板;各假接板中在快压过程中固化反应程度极低,固化度与半固化类似。本实施方式中,所述第一假接板和第二假接板均为矩形假接 板。The first pre-stack is placed in a vacuum quick press, and is pressed into a first dummy plate at a certain temperature/pressure and time, wherein the pressing temperature is 105 ° C, the pressing time is 30 s, and the pressure is 50 psi; Similarly, the second pre-laminated sheet is pressed into the second dummy board; the degree of curing reaction in each of the dummy boards is extremely low during the rapid pressing process, and the degree of curing is similar to that of the semi-curing. In this embodiment, the first dummy board and the second dummy board are both rectangular dummy boards.
在所述第一假接板上制作至少四个间隔设置的第二测试孔20,本实施方式采用四个第二测试孔20,四个所述第二测试孔20的中心点连线呈矩形;在所述第二假接板制作至少四个间隔设置的第二测试孔20,本实施方式采用四个第二测试孔20,四个所述第二测试孔20的中心点连线呈矩形;本实施方式中,四个第二测试孔20位于矩形假接板的四个角的位置,即所述第一假接板上的四个所述第二测试孔20分别设于第一假接板的四周;所述第二假接板上的四个所述第二测试孔20分别设于第二假接板的四周,且所述第一假接板上相邻的两个第二测试孔20分别位于第一假接板中玻纤布的经向或纬向,所述第二假接板上相邻的第二测试孔20分别位于第二假接板中玻纤布的经向或纬向。此设置便于测量第一假接板在经向和纬向的涨缩变化值,以及第二假接板在经向和纬向的涨缩变化值。所述第二测试孔20可为圆形、正多边形等,所述第二测试孔20到假接板板边的距离为2.54mm-50.8mm,所述第二测试孔20的直径或边长为0.5mm-4mm,第二测试孔20的直径越大,尺寸测试精度越高。本实施方式采用圆形作为第二测试孔20的形状,第一测试孔20到假接板板边的距离为25.4mm,第二测试孔20的直径为3.175mm。At least four second test holes 20 are formed on the first dummy board. In this embodiment, four second test holes 20 are used, and the center points of the four test holes 20 are rectangular. Forming at least four second test holes 20 at intervals in the second dummy board. In this embodiment, four second test holes 20 are used, and the center points of the four of the second test holes 20 are rectangular. In this embodiment, the four second test holes 20 are located at the four corners of the rectangular dummy board, that is, the four second test holes 20 on the first dummy board are respectively disposed on the first dummy. The four test holes 20 on the second dummy board are respectively disposed around the second dummy board, and the two adjacent ones on the first dummy board are second The test holes 20 are respectively located in the warp or weft direction of the fiberglass cloth in the first dummy board, and the adjacent second test holes 20 on the second dummy board are respectively located in the fiber cloth of the second dummy board. Toward or latitude. This setting facilitates the measurement of the change in the warp and weft of the first dummy web and the change in the warp and weft of the second dummy web in the warp and weft directions. The second test hole 20 may be a circular shape, a regular polygon, or the like. The distance between the second test hole 20 and the side of the dummy board is 2.54 mm - 50.8 mm, and the diameter or side length of the second test hole 20 is The diameter of the second test hole 20 is 0.5 mm to 4 mm, and the dimensional test accuracy is higher. In this embodiment, a circular shape is adopted as the shape of the second test hole 20. The distance from the first test hole 20 to the side of the dummy board is 25.4 mm, and the diameter of the second test hole 20 is 3.175 mm.
分别测量第一假接板和第二假接板中各第二测试孔20的位置,计算相邻第二测试孔20之间的距离F
3、F
4、W
3、W
4,记为初始距离,相邻的第二测试孔20之间的距离为各第二测试孔20的中心间距;所述F
3包括F
3A、F
3B,其中F
3A代表第一假接板其中两经向相邻第二测试孔20的中心距F
3,F
3B代表第二假接板其中两经向相邻第二测试孔20的中心距F
3;同理,所述F
4包括F
4A、F
4B;所述W
3包括W
3A、W
3B;所述W
4包括W
4A、W
4B。
The positions of the second test holes 20 in the first dummy plate and the second dummy plate are respectively measured, and the distances F 3 , F 4 , W 3 , and W 4 between the adjacent second test holes 20 are calculated and recorded as initials. The distance between the adjacent second test holes 20 is the center distance of each of the second test holes 20; the F 3 includes F 3A , F 3B , wherein F 3A represents the first dummy plate, wherein the two meridional phases vicinity of the center hole 20 from the second test F 3, F 3B representative of a second prosthesis from contact plate via two F 3 wherein the centers of adjacent test wells 20 of the second; Similarly, comprising the F 4 F 4A, F 4B The W 3 includes W 3A , W 3B ; the W 4 includes W 4A , W 4B .
将所述第一假接板在压合程序下进行层压处理;将所述第二假接板在压合程序下进行层压处理;所述压合程序为PCB新材料和对比材料对应的半固化片的压合程序。Laminating the first dummy board under a pressing process; laminating the second dummy board under a pressing procedure; the pressing procedure is corresponding to a new PCB material and a comparative material Pressing procedure for prepregs.
分别测量第一假接板和第二假接板中经层压处理后的各第二测试孔20的位置,计算相邻第二测试孔20之间的距离F
3′、F
4′、W
3′、W
4′,记为最终距离;所述F
3′包括F
3A′、F
3B′,其中F
3A′代表第一假接板其中两经向相邻第二测试孔20 的中心距F
3′,F
3B′代表第二假接板其中两经向相邻第二测试孔20的中心距F
3′;同理,所述F
4′包括F
4A′、F
4B′;所述W
3′包括W
3A′、W
3B′;所述W
4′包括W
4A′、W
4B′。
The positions of the second test holes 20 after the lamination treatment in the first dummy board and the second dummy board are respectively measured, and the distances F 3 ', F 4 ', W between the adjacent second test holes 20 are calculated. 3 ', W 4 ', denoted as the final distance; F 3 'includes F 3A ', F 3B ', where F 3A ' represents the center distance of the first dummy board from the two adjacent test holes 20 F 3 ', F 3B ' represents the center distance F 3 ' of the second dummy board in which two of the two adjacent test holes 20 are adjacent; similarly, the F 4 ' includes F 4A ', F 4B '; W 3 ' includes W 3A ', W 3B '; and W 4 ' includes W 4A ', W 4B '.
分别计算第一假接板和第二假接板经压合后的尺寸变化值ΔF
3、ΔF
4、ΔW
3、ΔW
4;其中ΔF
3=(F
3′-F
3)/F
3,ΔF
4=(F
4′-F
4)/F
4,ΔW
1=(W
3′-W
3)/W
3,ΔW
4=(W
4′-W
4)/W
4。所述ΔF
3包括ΔF
3A、ΔF
3B,其中ΔF
3A代表第一假接板经蚀刻、压合后的尺寸变化值ΔF
3,ΔF
3B代表第二假接板经蚀刻、压合后的尺寸变化值ΔF
3;同理,所述ΔF
4包括ΔF
4A、F
4B;所述ΔW
3包括ΔW
3A、ΔW
3B;所述ΔW
4包括ΔW
4A、ΔW
4B。
Calculating the dimensional change values ΔF 3 , ΔF 4 , ΔW 3 , ΔW 4 after pressing the first dummy plate and the second dummy plate, respectively; wherein ΔF 3 = (F 3 '-F 3 )/F 3 , ΔF 4 = (F 4 '-F 4 ) / F 4 , ΔW 1 = (W 3 '-W 3 ) / W 3 , ΔW 4 = (W 4 '-W 4 ) / W 4 . The ΔF 3 includes ΔF 3A , ΔF 3B , wherein ΔF 3A represents the size change value ΔF 3 after etching and pressing of the first dummy board, and ΔF 3B represents the dimensional change of the second dummy board after etching and pressing. The value ΔF 3 ; for the same reason, the ΔF 4 includes ΔF 4A , F 4B ; the ΔW 3 includes ΔW 3A , ΔW 3B ; the ΔW 4 includes ΔW 4A , ΔW 4B .
在其中一个实施例中,所述PCB新材料的涨缩补偿规则的推导方法为:In one embodiment, the method for deriving the shrinkage compensation rule of the new PCB material is:
分别计算第一芯板在加工过程中经向的尺寸变化ΔF
A和纬向的尺寸变化ΔW
A;分别计算第二芯板在加工过程中经向的尺寸变化ΔF
B和纬向的尺寸变化ΔW
B;
Calculate the dimensional change ΔF A and the dimensional change ΔW A of the first core in the warp direction during the machining process respectively; calculate the dimensional change ΔF B and the dimensional change ΔW of the warp direction of the second core during the machining process, respectively. B ;
计算第一芯板和第二芯板在经向的尺寸变化的差值ΔF
c=ΔF
A-ΔF
B,计算第一芯板和第二芯板在纬向的尺寸变化的差值ΔW
c=ΔW
A-ΔW
B;
Calculating a difference ΔF c =ΔF A -ΔF B of the dimensional change of the first core plate and the second core plate in the warp direction, and calculating a difference ΔW c of the dimensional change of the first core plate and the second core plate in the weft direction ΔW A - ΔW B ;
分别计算第一假接板在加工过程中经向的尺寸变化ΔF
A′和纬向的尺寸变化ΔW
A′;分别计算第二假接板板在加工过程中经向的尺寸变化ΔF
B′和纬向的尺寸变化ΔW
B′;
Calculating the dimensional change ΔF A ' of the warp direction of the first dummy web during processing and the dimensional change ΔW A ' of the weft direction respectively; calculating the dimensional change ΔF B ' of the warp direction of the second dummy web during processing, respectively Dimension change in latitude ΔW B ';
计算第一假接板和第二假接板在经向的尺寸变化的差值ΔF
p=ΔF
A′-ΔF
B′,计算第一假接板和第二假接板在纬向的尺寸变化的差值ΔW
p=ΔW
A′-ΔW
B′;
Calculating the difference in size of the first dummy plate and the second dummy plate in the warp direction by ΔF p = ΔF A '- ΔF B ', and calculating the dimensional change of the first dummy plate and the second dummy plate in the weft direction The difference ΔW p = ΔW A '- ΔW B ';
则PCB新材料与对比材料在经向和纬向的涨缩变化值分别为ΔF=(ΔF
c+ΔF
p)/2;ΔW=(ΔW
c+ΔW
p)/2;
Then, the change values of the new material of the PCB and the contrast material in the warp and latitude are ΔF=(ΔF c +ΔF p )/2; ΔW=(ΔW c +ΔW p )/2;
结合对比材料已由的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combined with the comparison of the ups and downs compensation rules of comparative materials, the analogy derivation is derived, and the rules for the expansion and contraction of new PCB materials are derived.
其中ΔF
A=∑[(ΔF
1A+ΔF
2A)/2],ΔW
A=∑[(ΔW
1A+ΔW
2A)/2],所述ΔF
1A、ΔF
2A分别为第一芯板的尺寸变化值ΔF
1、ΔF
2,所述ΔW
1A、ΔW
2A分别为第一芯板中的尺寸变化值ΔW
1、ΔW
2;其中ΔF
B=∑[(ΔF
1B+ΔF
2B)/2],ΔW
B=∑[(ΔW
1B+ΔW
2B)/2],所述ΔF
1B、ΔF
2B分别为第二芯板中的尺寸变化值ΔF
1、ΔF
2,所述ΔW
1B、ΔW
2B 分别为第二芯板中的尺寸变化值ΔW
1、ΔW
2。
Where ΔF A = ∑ [(ΔF 1A + ΔF 2A )/2], ΔW A = ∑ [(ΔW 1A + ΔW 2A )/2], the ΔF 1A , ΔF 2A are the dimensional change values of the first core plate, respectively ΔF 1 , ΔF 2 , wherein ΔW 1A and ΔW 2A are dimensional change values ΔW 1 , ΔW 2 in the first core plate, respectively; wherein ΔF B = ∑ [(ΔF 1B + ΔF 2B )/2], ΔW B = ∑[(ΔW 1B +ΔW 2B )/2], the ΔF 1B , ΔF 2B are the dimensional change values ΔF 1 , ΔF 2 in the second core plate, respectively, and the ΔW 1B and ΔW 2B are the second core plates respectively The dimensional change values ΔW 1 , ΔW 2 in the middle.
其中ΔF
A′=∑[(ΔF
1A′+ΔF
2A′)/2],ΔW
A′=∑[(ΔW
1A′+ΔW
2A′)/2],所述ΔF
1A′、ΔF
2A′分别为第一假接板中的两经向相邻的测试孔之间的距离F
1′、F
2′,所述ΔW
1A、ΔW
2A分别为第一假接板中的两纬向相邻的测试孔之间的距离W
1′、W
2′;其中ΔF
B′=∑[(ΔF
1B′+ΔF
2B′)/2],ΔW
B′=∑[(ΔW
1B′+ΔW
2B′)/2],所述ΔF
1B′、ΔF
2B′分别为第二假接板中的两经向相邻的测试孔之间的距离F
1′、F
2′,所述ΔW
1B′、ΔW
2B′分别为第二假接板中的两纬向相邻的测试孔之间的距离W
1′、W
2′。由于第一芯板、第二芯板、第一假接板和第二假接板的规格和数量均为两个或多个,因此,∑代表测试的各规格和数量的芯板或假接板的所计算出的结果之和。
Where ΔF A ′=∑[(ΔF 1A ′+ΔF 2A ′′/2], ΔW A ′=∑[(ΔW 1A ′+ΔW 2A ′′/2], the ΔF 1A ′, ΔF 2A ′ are respectively The distance F 1 ', F 2 ' between two adjacent test holes in the first dummy plate, the ΔW 1A , ΔW 2A are respectively two latitudinal adjacent tests in the first dummy plate The distance between the holes W 1 ', W 2 '; where ΔF B ' = ∑ [(ΔF 1B ′ + ΔF 2B ′)/2], ΔW B ′ = ∑ [(ΔW 1B ′ + ΔW 2B ′) /2 ΔF 1B ′, ΔF 2B ′ are respectively distances F 1 ′, F 2 ′ between two adjacent test holes in the second dummy plate, respectively, ΔW 1B ′, ΔW 2B ′ respectively It is the distance W 1 ', W 2 ' between adjacent test holes in the two latitudinals of the second dummy board. Since the specifications and the number of the first core board, the second core board, the first dummy board, and the second dummy board are two or more, ∑ represents the core board or the dummy of each specification and quantity of the test. The sum of the calculated results of the board.
通过如下具体实施例的推导演算过程对上述实施方式进行具体说明:The above embodiment is specifically described by the following procedure of the specific embodiment:
表1Table 1
其中,表1为对比材料已有的部分规格涨缩补偿规则。Among them, Table 1 is the compensation rules for some specifications of the existing materials.
通过测试后,PCB新材料和对比材料在经向和纬向的尺寸变化分别如下:After passing the test, the dimensional changes of the new and comparative materials of the PCB in the warp and weft directions are as follows:
第一芯板:ΔF
A=-3,ΔW
A=-2;第二芯板:ΔF
B=-2.5,ΔW
B=-1.6;
First core plate: ΔF A = -3, ΔW A = -2; second core plate: ΔF B = -2.5, ΔW B = -1.6;
第一半固化片:ΔF
A′=-5,ΔW
A′=-4.2;第二半固化片:ΔF
B′=-3.8,ΔW
B′=-2.5
First half-cured sheet: ΔF A '=-5, ΔW A '=-4.2; second prepreg: ΔF B '=-3.8, ΔW B '=-2.5
则:ΔF
c=ΔF
A-ΔF
B=-3+2.5=-0.5;ΔW
c=ΔW
A-ΔW
B=-2+1.6=-0.4;
Then: ΔF c = ΔF A - ΔF B = -3 + 2.5 = -0.5; ΔW c = ΔW A - ΔW B = -2 + 1.6 = -0.4;
ΔF
p=ΔF
A′-ΔF
B′=-5+3.8=-1.2;ΔW
p=ΔW
A′-ΔW
B′=-4.2+2.5=-1.7;
ΔF p =ΔF A '-ΔF B '=-5+3.8=-1.2; ΔW p =ΔW A '-ΔW B '=-4.2+2.5=-1.7;
从而PCB新材料与对比材料在经向和纬向的涨缩变化值分别为Therefore, the change values of the new material and the comparative material in the warp and weft directions are respectively
ΔF=(ΔF
c+ΔF
p)/2=(-0.5-1.2)/2=-0.85;ΔW=(ΔW
c+ΔW
p)/2=(-0.4-1.7)/2=-1.05;
ΔF=(ΔF c +ΔF p )/2=(-0.5-1.2)/2=-0.85; ΔW=(ΔW c +ΔW p )/2=(-0.4-1.7)/2=-1.05;
结合对比材料的涨缩补偿规则,即可推出PCB新材料的补偿系数如表2所示:Combined with the ups and downs compensation rules of the comparative materials, the compensation coefficients for the new PCB materials can be introduced as shown in Table 2:
表2Table 2
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.
Claims (10)
- 一种PCB新材料涨缩补偿系数的评估方法,其特征在于,包括:A method for evaluating a compensation coefficient for a new material of a PCB, characterized in that it comprises:选取一种已确定出完善的涨缩补偿规则的PCB常用材料作为对比材料;Select a common PCB material that has been determined to be a perfect inflation compensation rule as a comparison material;分别测试PCB新材料的第一芯板以及第一半固化片的涨缩变化值,以及分别测试对比材料的第二芯板以及第二半固片的涨缩变化值,所述第一芯板选取的规格与第二芯板的规格相同,所述第一半固化片选取的规格与第二半固化片的规格相同;Testing the first core plate of the new material of the PCB and the change value of the first prepreg, and the change values of the second core plate and the second half solid film of the comparative material respectively, the first core plate is selected The specifications are the same as the specifications of the second core sheet, and the first prepreg is selected to have the same specifications as the second prepreg;对比分析第一芯板、第二芯板在各自加工流程的涨缩变化值及差异;对比分析第一半固化片、第二半固化片在各自加工流程的涨缩变化值及差异;Contrast and analyze the change and difference of the first core plate and the second core plate in the respective processing flow; compare and analyze the change and difference of the first prepreg and the second prepreg in the respective processing flow;结合对比材料的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combining the expansion and contraction compensation rules of the comparative materials, the analogy derivation is carried out, and the expansion and contraction compensation rules of the new PCB materials are derived.
- 根据权利要求1所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,所述第一芯板和第二芯板的涨缩变化值的测试方法为:The method for evaluating a shrinkage compensation coefficient of a new material of a PCB according to claim 1, wherein the test method for the change of the expansion and contraction of the first core plate and the second core plate is:在所述第一芯板上制作至少四个间隔设置的第一测试孔,至少四个所述第一测试孔的中心点连线呈矩形;在所述第二芯板制作至少四个间隔设置的第一测试孔,至少四个所述第一测试孔的中心点连线呈矩形;Forming at least four spaced apart first test holes on the first core board, at least four of the first test holes having a center line connection having a rectangular shape; and forming at least four interval settings on the second core board a first test hole, at least four of the first test holes have a center line connecting the rectangle;分别测量第一芯板和第二芯板中各第一测试孔的位置,计算相邻的第一测试孔之间的距离F 1、F 2、W 1、W 2,记为初始距离; Measuring the positions of the first test holes in the first core plate and the second core plate respectively, and calculating the distances F 1 , F 2 , W 1 , W 2 between the adjacent first test holes, and recording the initial distances;将所述第一芯板蚀刻为具有第一残铜率的图形设计;将所述第二芯板蚀刻为具有第二残铜率的图形设计,所述第一残铜率与第二残铜率相同;Etching the first core plate into a graphic design having a first residual copper ratio; etching the second core plate into a graphic design having a second residual copper ratio, the first residual copper ratio and the second residual copper The same rate;将所述第一芯板在压合程序下进行层压处理;将所述第二芯板在压合程序下进行层压处理;Laminating the first core sheet under a pressing process; laminating the second core sheet under a pressing process;分别测量第一芯板和第二芯板中经层压处理后的各第一测试孔的位置,计算相邻第一测试孔之间的距离F 1′、F 2′、W 1′、W 2′,记为最终距离; Measuring the positions of the first test holes after lamination in the first core plate and the second core plate, respectively, and calculating distances F 1 ', F 2 ', W 1 ', W between adjacent first test holes 2 ', recorded as the final distance;分别计算第一芯板和第二芯板经蚀刻、压合后的尺寸变化值ΔF 1、ΔF 2、ΔW 1、ΔW 2;其中ΔF 1=(F 1′-F 1)/F 1,ΔF 2=(F 2′-F 2)/F 2,ΔW 1=(W 1′-W 1)/W 1,ΔW 2=(W 2′-W 2)/W 2。 The dimensional change values ΔF 1 , ΔF 2 , ΔW 1 , ΔW 2 of the first core plate and the second core plate after etching and pressing are respectively calculated; wherein ΔF 1 = (F 1 '-F 1 )/F 1 , ΔF 2 = (F 2 '-F 2 ) / F 2 , ΔW 1 = (W 1 '-W 1 ) / W 1 , ΔW 2 = (W 2 '-W 2 ) / W 2 .
- 根据权利要求2所述的PCB新材料涨缩补偿系数的评估方法,其特征在 于,所述第一残铜率与第二残铜率为0%、50%或100%。The method for evaluating a new material shrinkage compensation coefficient of a PCB according to claim 2, wherein the first residual copper ratio and the second residual copper ratio are 0%, 50% or 100%.
- 根据权利要求2所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,所述第一芯板上的至少四个所述第一测试孔分别设于第一芯板的四周;所述第二芯板上的至少四个所述第一测试孔分别设于第二芯板的四周,且所述第一芯板上相邻的两个第一测试孔分别位于第一芯板中玻纤布的经向或纬向,所述第二芯板上相邻的第一测试孔分别位于第二芯板中玻纤布的经向或纬向。The method for evaluating a new material shrinkage compensation coefficient of a PCB according to claim 2, wherein at least four of the first test holes on the first core board are respectively disposed around the first core board; At least four of the first test holes on the second core board are respectively disposed around the second core board, and two adjacent first test holes on the first core board are respectively located in the first core board In the warp or weft direction of the fiberglass cloth, adjacent first test holes on the second core board are respectively located in the warp or weft direction of the fiberglass cloth in the second core board.
- 根据权利要求2所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,所述第一芯板的图形设计以及第二芯板的图形设计均为经纬方向均匀排布的图形设计。The method for evaluating a new material expansion and contraction compensation coefficient of a PCB according to claim 2, wherein the graphic design of the first core plate and the graphic design of the second core plate are graphic designs uniformly arranged in the warp and weft directions.
- 根据权利要求2-5任一项所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,所述第一半固化片和第二半固化片的涨缩变化值的测试方法为:The method for evaluating a shrinkage compensation coefficient of a new material of a PCB according to any one of claims 2 to 5, characterized in that the test method for the change of the expansion and contraction of the first prepreg and the second prepreg is:在第一半固化片的顶底层分别设置一层铜箔,形成第一预叠板,在第二半固化片的顶底层分别设置一层铜箔,形成第二预叠板;Forming a layer of copper foil on the top bottom layer of the first prepreg to form a first pre-laminated sheet, and respectively forming a layer of copper foil on the top bottom layer of the second prepreg to form a second pre-stack;将第一预叠板快速压合为第一假接板,将第二预叠板快速压合为第二假接板;Quickly pressing the first pre-stack into a first dummy board, and pressing the second pre-stack into a second dummy board;在所述第一假接板上制作至少四个间隔设置的第二测试孔,至少四个所述第二测试孔的中心点连线呈矩形;在所述第二芯板制作至少四个间隔设置的第二测试孔,至少四个所述第二测试孔的中心点连线呈矩形;Forming at least four spaced second test holes on the first dummy board, at least four of the second test holes having a center line connection having a rectangular shape; and forming at least four intervals on the second core board a second test hole is disposed, and a center line of at least four of the second test holes is rectangular;分别测量第一假接板和第二假接板中各第二测试孔的位置,计算相邻的第二测试孔之间的距离F 3、F 4、W 3、W 4,记为初始距离; Measure the positions of the second test holes in the first dummy plate and the second dummy plate, respectively, and calculate the distances F 3 , F 4 , W 3 , and W 4 between the adjacent second test holes, and record the initial distance. ;将所述第一假接板在压合程序下进行层压处理;将所述第二假接板在压合程序下进行层压处理;Laminating the first dummy board under a pressing process; laminating the second dummy board under a pressing procedure;分别测量第一假接板和第二假接板中经层压处理后的各第二测试孔的位置,计算相邻的第二测试孔之间的距离F 3′、F 4′、W 3′、W 4′,记为最终距离; Measure the positions of the second test holes after the lamination process in the first dummy plate and the second dummy plate, respectively, and calculate the distances F 3 ', F 4 ', W 3 between the adjacent second test holes. ', W 4 ', recorded as the final distance;分别计算第一假接板和第二假接板经压合后的尺寸变化值ΔF 3、ΔF 4、ΔW 3、ΔW 4;其中ΔF 3=(F 3′-F 3)/F 3,ΔF 4=(F 4′-F 4)/F 4,ΔW 1=(W 3′-W 3)/W 3,ΔW 4=(W 4′-W 4)/W 4。 Calculating the dimensional change values ΔF 3 , ΔF 4 , ΔW 3 , ΔW 4 after pressing the first dummy plate and the second dummy plate, respectively; wherein ΔF 3 = (F 3 '-F 3 )/F 3 , ΔF 4 = (F 4 '-F 4 ) / F 4 , ΔW 1 = (W 3 '-W 3 ) / W 3 , ΔW 4 = (W 4 '-W 4 ) / W 4 .
- 根据权利要求6所述的PCB新材料涨缩补偿系数的评估方法,其特征在 于,所述第一假接板上的至少四个所述第二测试孔分别设于第一假接板的四周;所述第二假接板上的至少四个所述第二测试孔分别设于第二假接板的四周,且所述第一假接板上相邻的第二测试孔分别位于第一假接板中玻纤布的经向或纬向,且所述第二假接板上相邻的第二测试孔分别位于第二假接板中玻纤布的经向或纬向。The method for evaluating a new material expansion and contraction compensation coefficient of a PCB according to claim 6, wherein at least four of the second test holes on the first dummy board are respectively disposed around the first dummy board. The at least four second test holes on the second dummy board are respectively disposed around the second dummy board, and the adjacent second test holes on the first dummy board are respectively located at the first The warp or weft direction of the fiberglass cloth in the dummy board, and the adjacent second test holes on the second dummy board are respectively located in the warp or weft direction of the fiberglass cloth in the second dummy board.
- 根据权利要求6所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,所述PCB新材料的涨缩补偿规则的推导方法为:The method for evaluating a new material shrinkage compensation coefficient of a PCB according to claim 6, wherein the method for deriving the expansion and contraction compensation rule of the new PCB material is:分别计算第一芯板在加工过程中经向的尺寸变化ΔF A和纬向的尺寸变化ΔW A;分别计算第二芯板在加工过程中经向的尺寸变化ΔF B和纬向的尺寸变化ΔW B; Calculate the dimensional change ΔF A and the dimensional change ΔW A of the first core in the warp direction during the machining process respectively; calculate the dimensional change ΔF B and the dimensional change ΔW of the warp direction of the second core during the machining process, respectively. B ;计算第一芯板和第二芯板在经向的尺寸变化的差值ΔF c=ΔF A-ΔF B,计算第一芯板和第二芯板在纬向的尺寸变化的差值ΔW c=ΔW A-ΔW B; Calculating a difference ΔF c =ΔF A -ΔF B of the dimensional change of the first core plate and the second core plate in the warp direction, and calculating a difference ΔW c of the dimensional change of the first core plate and the second core plate in the weft direction ΔW A - ΔW B ;分别计算第一假接板在加工过程中经向的尺寸变化ΔF A′和纬向的尺寸变化ΔW A′;分别计算第二假接板板在加工过程中经向的尺寸变化ΔF B′和纬向的尺寸变化ΔW B′; Calculating the dimensional change ΔF A ' of the warp direction of the first dummy web during processing and the dimensional change ΔW A ' of the weft direction respectively; calculating the dimensional change ΔF B ' of the warp direction of the second dummy web during processing, respectively Dimension change in latitude ΔW B ';计算第一假接板和第二假接板在经向的尺寸变化的差值ΔF p=ΔF A′-ΔF B′,计算第一假接板和第二假接板在纬向的尺寸变化的差值ΔW p=ΔW A′-ΔW B′; Calculating the difference in size of the first dummy plate and the second dummy plate in the warp direction by ΔF p = ΔF A '- ΔF B ', and calculating the dimensional change of the first dummy plate and the second dummy plate in the weft direction The difference ΔW p = ΔW A '- ΔW B ';则PCB新材料与对比材料在经向和纬向的涨缩变化值分别为ΔF=(ΔF c+ΔF p)/2;ΔW=(ΔW c+ΔW p)/2; Then, the change values of the new material of the PCB and the contrast material in the warp and latitude are ΔF=(ΔF c +ΔF p )/2; ΔW=(ΔW c +ΔW p )/2;结合对比材料已由的涨缩补偿规则进行类比推导,推导出PCB新材料的涨缩补偿规则。Combined with the comparison of the ups and downs compensation rules of comparative materials, the analogy derivation is derived, and the rules for the expansion and contraction of new PCB materials are derived.
- 根据权利要求8所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,其中ΔF A=∑[(ΔF 1A+ΔF 2A)/2],ΔW A=∑[(ΔW 1A+ΔW 2A)/2],所述ΔF 1A、ΔF 2A分别为第一芯板的尺寸变化值ΔF 1、ΔF 2,所述ΔW 1A、ΔW 2A分别为第一芯板中的尺寸变化值ΔW 1、ΔW 2,所述∑为各规格和数量的第一芯板的变化总和;其中ΔF B=∑[(ΔF `+ΔF 2B)/2],ΔW B=∑[(ΔW `+ΔW 2B)/2],所述ΔF 1B、ΔF 2B分别为第二芯板中的尺寸变化值ΔF 1、ΔF 2,所述ΔW 1B、ΔW 2B分别为第二芯板中的尺寸变化值ΔW 1、ΔW 2,所述∑为各规格和数量的第二芯板的变化总和。 The method for evaluating a new material shrinkage compensation coefficient of a PCB according to claim 8, wherein ΔF A = ∑ [(ΔF 1A + ΔF 2A )/2], ΔW A = ∑ [(ΔW 1A + ΔW 2A) /2], the ΔF 1A and ΔF 2A are the dimensional change values ΔF 1 and ΔF 2 of the first core plate, respectively, and the ΔW 1A and ΔW 2A are the dimensional change values ΔW 1 and ΔW in the first core plate, respectively. 2 , the ∑ is the sum of the changes of the first core plates of various specifications and quantities; wherein ΔF B = ∑ [(ΔF ` + ΔF 2B )/2], ΔW B = ∑ [(ΔW ` + ΔW 2B )/2 The ΔF 1B and ΔF 2B are the dimensional change values ΔF 1 and ΔF 2 in the second core plate, respectively, and the ΔW 1B and ΔW 2B are the dimensional change values ΔW 1 and ΔW 2 in the second core plate, respectively. The crucible is the sum of the variations of the second core sheets of various specifications and quantities.
- 根据权利要求8所述的PCB新材料涨缩补偿系数的评估方法,其特征在于,其中ΔF A′=∑[(ΔF 1A′+ΔF 2A′)/2],ΔW A′=∑[(ΔW 1A′+ΔW 2A′)/2],所述ΔF 1A′、ΔF 2A′分别为第一假接板中的两经向相邻的测试孔之间的距离F 1′、F 2′,所述ΔW 1A、ΔW 2A分别为第一假接板中的两纬向相邻的测试孔之间的距离W 1′、W 2′,所述∑为各规格和数量的第一假接板的变化总和;其中ΔF B′=∑[(ΔF 1B′+ΔF 2B′)/2],ΔW B`∑[(ΔW 1B′+ΔW 2B′)/2],所述ΔF 1B′、ΔF 2B′分别为第二假接板中的两经向相邻的测试孔之间的距离F 1′、F 2′,所述ΔW 1B′、ΔW 2B′分别为第二假接板中的两纬向相邻的测试孔之间的距离W 1′、W 2′,所述∑为各规格和数量的第二假接板的变化总和。 The method for evaluating a PCB new material expansion and contraction compensation coefficient according to claim 8, wherein ΔF A ' = ∑ [(ΔF 1A ′ + ΔF 2A ′)/2], ΔW A ′ = ∑ [(ΔW) 1A '+ΔW 2A ')/2], the ΔF 1A ', ΔF 2A ' are the distances F 1 ', F 2 ' between the two adjacent test holes in the first dummy board, respectively ΔW 1A and ΔW 2A are the distances W 1 ', W 2 ' between the two latitudinal adjacent test holes in the first dummy board, respectively, which are the first dummy boards of various specifications and numbers. The sum of changes; where ΔF B '= ∑ [(ΔF 1B ′ + ΔF 2B ′)/2], ΔW B ∑ [(ΔW 1B ′ + ΔW 2B ′) /2], the ΔF 1B ′, ΔF 2B ′ The distances F 1 ', F 2 ' between the two adjacent test holes in the second dummy plate, respectively, the ΔW 1B ′, ΔW 2B ′ are the two latitudinals in the second dummy plate The distance W 1 ', W 2 ' between adjacent test holes, which is the sum of changes of the second dummy plates of various specifications and numbers.
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CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
CN106061106A (en) * | 2016-08-04 | 2016-10-26 | 高德(江苏)电子科技有限公司 | Method for monitoring expansion-contraction matching degree of different internal-layer core plates |
CN106572600A (en) * | 2016-10-12 | 2017-04-19 | 江西景旺精密电路有限公司 | Novel PCB linear expansion control method |
CN108072343A (en) * | 2017-12-18 | 2018-05-25 | 广州兴森快捷电路科技有限公司 | The appraisal procedure of PCB new material harmomegathus penalty coefficients |
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CN108072343A (en) | 2018-05-25 |
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