CN112747705A - Electro-coppering thickness measuring method and circuit board - Google Patents
Electro-coppering thickness measuring method and circuit board Download PDFInfo
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- CN112747705A CN112747705A CN202011561508.0A CN202011561508A CN112747705A CN 112747705 A CN112747705 A CN 112747705A CN 202011561508 A CN202011561508 A CN 202011561508A CN 112747705 A CN112747705 A CN 112747705A
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- copper
- circuit board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention provides a method for measuring the thickness of electroplated copper and a circuit board, wherein the method comprises the following steps: s1, taking a plurality of circuit boards in advance, detecting the copper thickness of the copper sheet on each circuit board, and slicing and measuring the actual copper thickness at each copper sheet to obtain the copper thickness difference mean value; and S2, detecting the copper thickness of the copper sheet of each circuit board during batch production, and adding the average value of the copper thickness difference to obtain the actual copper thickness. According to the invention, the copper sheet is designed on the circuit board and the copper thickness difference value is measured in advance, so that the copper thickness can be simply and rapidly measured and monitored when the circuit board is produced in batch, a large amount of slice measuring time is saved, and scrapping caused by destructive slicing can be avoided.
Description
Technical Field
The invention relates to a circuit board processing technology, in particular to a method for measuring the thickness of electroplated copper and a circuit board.
Background
With the continuous innovation and development of electronic products in the direction of multifunctionality and intellectualization, higher requirements are put forward on a carrier printed circuit board bearing electronic parts, and the circuit board is also promoted to be developed in the directions of lightness, thinness, shortness and smallness, so that the designed circuit is more and more dense and thinner. The traditional board surface electroplating process cannot meet the production requirement of a fine circuit, more and more circuit board manufacturers begin to introduce an MSAP (modified Semi-Additive process) process, and the control of the copper thickness of a conductor (a circuit and a large copper surface) is the key point in the production process using the process.
Because the circuit distribution is uneven, the electroplating plated area is uneven, after the electroplating process is finished, the copper thickness on the circuit board cannot be monitored in a quick and effective mode, the traditional CMI (copper thickness measuring instrument) cannot directly measure the circuit, and the measurement and monitoring can be carried out only in a destructive slicing mode.
Disclosure of Invention
The invention aims to provide a simple and convenient method for measuring the thickness of electroplated copper without damaging a circuit board.
Another objective of the present invention is to provide a circuit board with copper thickness measurement convenience.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to an aspect of the present invention, there is provided a method for measuring a thickness of electroplated copper, comprising the steps of:
s1, taking a plurality of circuit boards in advance, and detecting the copper thickness T at the copper sheet position on each circuit board1......TnSlicing at each copper sheet to measure the actual copper thickness T1′......Tn', obtaining the average value of copper thickness difference
S2, detecting the copper thickness T' at the copper sheet of each circuit board during batch production to obtain the actual copper thickness
In an embodiment, when n is 1, the steps S1 and S2 of the method are:
s1, taking a circuit board in advance, and detecting the copper thickness T at the copper sheet position on the circuit board1Slicing at the copper sheet to measure the actual copper thickness T1', obtaining a copper thickness difference value T0＝T1-T1′；
S2, detecting the copper thickness T 'of the copper sheet of each circuit board during batch production to obtain the actual copper thickness T ═ T' + T0。
In one embodiment, in the step S1 of the method, the copper thickness difference mean value
Where k and e are constant coefficients.
In one embodiment, k is 1.05 to 1.1, and e is-0.01 to-0.05.
According to another aspect of the invention, a circuit board convenient for measuring the copper thickness is further provided, wherein one or more copper sheets are arranged on the upper surface or the lower surface of the circuit board, and the size of the copper sheet is larger than or equal to the minimum measurement area of a probe of a copper thickness measuring instrument.
In an embodiment, the number of the copper sheets of the circuit board includes four, and four of the copper sheets are disposed at four corners of the circuit board.
In one embodiment, the distance from the copper sheet of the circuit board to the left and right edges of the circuit board is less than or equal to 0.5cm, and the distance from the copper sheet to the upper and lower edges of the circuit board is 8 cm-12 cm.
In one embodiment, the copper sheet of the circuit board is square.
In one embodiment, the copper sheet of the circuit board is 2cm long.
The method has the advantages that: the copper thickness difference value is obtained through pre-measurement, the copper thickness can be simply and quickly measured and monitored during batch production, a large amount of slicing time is saved, and scrapping caused by destructive slicing can be avoided.
The embodiment of the circuit board is convenient to implement by arranging the copper sheet.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.
FIG. 1 is a flow chart of a method embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be construed as imposing any limitation on the scope of the present invention.
As shown in fig. 1, an embodiment of the invention provides a method for measuring a thickness of electroplated copper, comprising the following steps:
s1, taking a plurality of circuit boards in advance, and detecting the copper thickness T at the copper sheet position on each circuit board by using a copper thickness measuring instrument1......TnThen slicing is carried out at each copper sheet, and the actual copper thickness T is measured1′......Tn', obtaining the average value of copper thickness difference
S2, when in batch production, detecting the copper thickness T' at the copper sheet of each circuit board by using a copper thickness measuring instrument to obtain the actual copper thickness
Because the copper thickness of copper skin department can directly use the copper thickness measurement appearance to measure, consequently need not the section, convenient and fast more.
The method for measuring the average value of a plurality of circuit boards in advance can eliminate the error influence caused by the inconsistent copper thickness of each circuit board. However, if the accuracy requirement is not high and efficiency is sought, only one circuit board can be detected in advance to obtain the copper thickness difference value, and then the steps S1 and S2 are as follows:
s1, taking a circuit board in advance, and detecting the copper thickness T at the copper sheet position on the circuit board1Slicing at the copper sheet to measure the actual copper thickness T1', obtaining a copper thickness difference value T0＝T1-T1′；
S2, detecting the copper thickness T 'of the copper sheet of each circuit board during batch production to obtain the actual copper thickness T ═ T' + T0。
Further, in order to eliminate the error caused in the measurement process, the copper thickness difference can be made to be different from the average value
Wherein k and e are constant coefficients, and the average value of the copper thickness difference is controlled by adjusting the constant coefficients. Usually, in order to ensure that the actual copper thickness of the circuit board reaches the standard, the copper thickness difference value (which is a negative value) can be slightly enlarged, so that k is 1.05-1.1, and e is-0.01-0.05. In the present embodiment, it is preferred that,
corresponding to the above method, the embodiment of the invention further provides a circuit board 1 convenient for measuring the copper thickness, as shown in fig. 2, one or more copper sheets 2 are arranged on the upper surface or the lower surface of the circuit board 1. The size of the copper sheet 2 is larger than or equal to the minimum measurement area of the probe of the copper thickness measuring instrument, so that the probe of the copper thickness measuring instrument can be completely covered.
In the present embodiment, in order to eliminate the error caused by the uneven copper thickness at each position of the same circuit board, four copper sheets 2 are provided, and the four copper sheets 2 are provided at four corners of the circuit board 1. In addition, for convenience of measurement and cutting processing, the distance from the copper sheet 2 to the left edge and the right edge of the circuit board 1 is less than or equal to 0.5cm, and the distance from the copper sheet 2 to the upper edge and the lower edge of the circuit board 1 is 8 cm-12 cm.
In this embodiment, the copper sheet 2 is a square copper sheet with a side length of 2cm, and the processing is convenient.
In summary, the copper sheet is designed on the circuit board and the copper thickness difference value is measured in advance, so that the copper thickness can be simply and rapidly measured and monitored during mass production of the circuit board, a large amount of slice measuring time is saved, and scrapping caused by destructive slicing can be avoided.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.
Claims (9)
1. A method for measuring the thickness of electroplated copper is characterized by comprising the following steps:
s1, taking a plurality of circuit boards in advance, and detecting the copper thickness T at the copper sheet position on each circuit board1......TnSlicing at each copper sheet to measure the actual copper thickness T1′......Tn', obtaining the average value of copper thickness difference
S2, detecting the copper thickness T' at the copper sheet of each circuit board during batch production to obtain the actual copper thickness
2. The method of claim 1, wherein when n is 1, the steps S1 and S2 are:
s1, taking a circuit board in advance, and detecting the copper thickness T at the copper sheet position on the circuit board1Slicing at the copper sheet to measure the actual copper thickness T1', obtaining a copper thickness difference value T0＝T1-T1′；
S2, detecting the copper thickness T 'of the copper sheet of each circuit board during batch production to obtain the actual copper thickness T ═ T' + To。
3. The method as claimed in claim 1, wherein the copper thickness difference average value in S1
Where k and e are constant coefficients.
4. The method of claim 3, wherein k is 1.05-1.1 and e is-0.01-0.05.
5. The utility model provides a circuit board convenient to measure copper thickness which characterized in that: one or more copper sheets are arranged on the upper surface or the lower surface of the circuit board, and the size of each copper sheet is larger than or equal to the minimum measurement area of the probe of the copper thickness measuring instrument.
6. The circuit board of claim 5, wherein: the copper sheet includes four, four the copper sheet set up in the four corners position of circuit board.
7. The circuit board of claim 6, wherein: the distance from the copper sheet to the left edge and the right edge of the circuit board is less than or equal to 0.5cm, and the distance from the copper sheet to the upper edge and the lower edge of the circuit board is 8 cm-12 cm.
8. The circuit board of claim 5, wherein: the copper sheet is square.
9. The circuit board of claim 8, wherein: the side length of the copper sheet is 2 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011561508.0A CN112747705A (en) | 2020-12-25 | 2020-12-25 | Electro-coppering thickness measuring method and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011561508.0A CN112747705A (en) | 2020-12-25 | 2020-12-25 | Electro-coppering thickness measuring method and circuit board |
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| CN202011561508.0A Pending CN112747705A (en) | 2020-12-25 | 2020-12-25 | Electro-coppering thickness measuring method and circuit board |
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Citations (8)
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|---|---|---|---|---|
| JPS63308996A (en) * | 1987-06-11 | 1988-12-16 | Fujitsu Ltd | Measuring method for film thickness of resist for printed board |
| CN201758487U (en) * | 2010-07-06 | 2011-03-09 | 深南电路有限公司 | Printed circuit board |
| CN203104951U (en) * | 2013-02-26 | 2013-07-31 | 福清三照电子有限公司 | Printed circuit board (PCB) easily subjected to gummosis |
| CN108398112A (en) * | 2018-02-08 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | Circuit board copper plating detecting system and detection method |
| TW201928341A (en) * | 2017-12-21 | 2019-07-16 | 國立虎尾科技大學 | Non-contact upper and lower layer copper thickness measurement method applied to PCB multilayer board using the magnetic field applied to a metal film and then calculating the loss amount of eddy currents |
| CN110375696A (en) * | 2019-07-23 | 2019-10-25 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| CN110519925A (en) * | 2019-07-23 | 2019-11-29 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| CN210664405U (en) * | 2019-09-17 | 2020-06-02 | 深圳明阳电路科技股份有限公司 | PCB copper thickness measuring system |
-
2020
- 2020-12-25 CN CN202011561508.0A patent/CN112747705A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63308996A (en) * | 1987-06-11 | 1988-12-16 | Fujitsu Ltd | Measuring method for film thickness of resist for printed board |
| CN201758487U (en) * | 2010-07-06 | 2011-03-09 | 深南电路有限公司 | Printed circuit board |
| CN203104951U (en) * | 2013-02-26 | 2013-07-31 | 福清三照电子有限公司 | Printed circuit board (PCB) easily subjected to gummosis |
| TW201928341A (en) * | 2017-12-21 | 2019-07-16 | 國立虎尾科技大學 | Non-contact upper and lower layer copper thickness measurement method applied to PCB multilayer board using the magnetic field applied to a metal film and then calculating the loss amount of eddy currents |
| CN110779436A (en) * | 2017-12-21 | 2020-02-11 | 陈建璋 | Non-contact upper and lower layer copper thickness measuring method applied to PCB multi-layer board |
| CN108398112A (en) * | 2018-02-08 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | Circuit board copper plating detecting system and detection method |
| CN110375696A (en) * | 2019-07-23 | 2019-10-25 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| CN110519925A (en) * | 2019-07-23 | 2019-11-29 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| CN210664405U (en) * | 2019-09-17 | 2020-06-02 | 深圳明阳电路科技股份有限公司 | PCB copper thickness measuring system |
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