CN103874335A - Circuit board etching line width control method - Google Patents
Circuit board etching line width control method Download PDFInfo
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- CN103874335A CN103874335A CN201410126226.6A CN201410126226A CN103874335A CN 103874335 A CN103874335 A CN 103874335A CN 201410126226 A CN201410126226 A CN 201410126226A CN 103874335 A CN103874335 A CN 103874335A
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Abstract
The invention discloses a circuit board etching line width control method which is characterized by comprising the steps that S1. all circuit boards which need etching are divided into batches according to copper thickness sections where board face copper thickness parts are placed, and a head board of each batch of circuit boards after batch dividing is selected; S2. according to the copper thickness sections where the plate face thickness parts of the head boards of the batches of circuit boards and the preset copper thickness section-best etching speed corresponding rule, the best etching speed of the head board of each batch of circuit boards is obtained; and S3. according to the best etching speed of the head board of each batch of circuit boards, the head board of each batch of circuit boards is subjected to etching, and if line width is qualified after head board etching, the circuit boards in the same batch as the head board are subjected to batch etching according to the best etching speed. According to the circuit board etching line width control method, the problem that copper thickness between boards of batch circuit boards is not even, so that after etching, line width of parts of the boards is not qualified can be effectively solved.
Description
Technical field
The present invention relates to circuit board fabrication field, relate in particular to a kind of circuit board etching line width controlling method.
Background technology
Along with the continuous development of circuit-board industry, product structure constantly upgrades, and client requires more and more stricter to the control of circuit board live width.
In the time of etching, owing to being subject to thick inhomogeneity impact of plate face copper, can cause live width control ratio more difficult through the circuit board of heavy copper coin plating, wherein, described live width refers to the circuit line width on remaining circuit board after etching.Thick definite in the situation that at live width compensation (being dry film compensation) and plate face copper, after etching, the size of live width depends on etching speed (t), etching speed is slower for etching speed V=etching section overall length L/ etching period, and corresponding etching period is longer, the copper etching away is more, and after etching, live width is less; Etching speed is faster, and corresponding etching period is shorter, and the copper etching away is fewer, and after etching, live width is larger.Therefore, for the thick plate of different Cu, all have a corresponding optimal etch speed, make the live width and the designing requirement value that etch the most approaching.
But the engraving method that circuit-board industry is generally taked is at present for controlling the batch engraving method of first plate (i.e. the circuit board for testing when etching for the first time), as shown in Figure 1: first plate of a collection of circuit board making, an etching speed is rule of thumb set, and according to the first plate of this etch rate etch, if the live width after etching is qualified, by whole circuit boards according to the etching in batches of this etching speed, if defective, again make first plate, and rule of thumb adjust etching speed, until the live width after first plate etching is qualified, etching speed when qualified according to first plate etching live width is afterwards to the etching in batches of all circuit boards.This method is strict to the thick uniformity requirement of batch circuit board plate face copper, if the copper of circuit board and first plate is thick inconsistent in batches, after can causing circuit board etching in batches, live width is not of uniform size, secondly, the method is finely tuned the etching speed of first plate next time according to experience, and accuracy rate is not high, may occur repeatedly the underproof situation of first plate, cause because first blackboard newspaper gives up too much, scrappage increases.
Summary of the invention
Technical problem to be solved by this invention is, a kind of circuit board etching line width controlling method is provided.The present invention adopts etching in batches, can effectively improve circuit board in batches and cause the underproof problem of etching live width because copper thickness ununiformity is even.
In order to solve the problems of the technologies described above, the invention provides a kind of circuit board etching line width controlling method, comprise step:
S1, will all need etched circuit board to carry out in batches according to the thick interval of copper at the thick place of plate face copper, and the first plate of every batch of circuit board after selecting in batches;
S2, draw the optimal etch speed of the first plate of every batch of circuit board according to the thick interval of copper at the thick place of plate face copper of the first plate of every batch of circuit board and the default thick interval-optimal etch of the copper speed rule of correspondence;
S3, according to the optimal etch speed of the first plate of the every batch of circuit board, the first plate of described every batch of circuit board is carried out to etching, if the live width after first plate etching is qualified, according to described optimal etch speed, the circuit board of same batch at described first plate place is carried out to batch etching.
Further, after step S3, also comprise step:
If the live width after the first plate etching of S4 is defective, the thick first plate of the next one of choosing current batch of the plate face copper of current batch of circuit board, and calculate according to the live width after described first plate etching and optimal etch speed corresponding to described first plate the optimal etch speed that the first plate of the described next one is corresponding, and return to execution step S3, until all circuit board etchings are complete.
Further, after step S4, also comprise step:
S5, carry out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, to proofread and correct the thick interval-optimal etch of the described default copper speed rule of correspondence.Note: this rule is affected by etching machine etching speed, admittedly answer regular calibration.
Wherein, the optimal etch speed V2 that the first plate of the described next one is corresponding obtains by following formula:
V2=(V1/W1)*W2
Wherein, V1 represents the optimal etch speed that described first plate is corresponding, and W1 represents the live width after described first plate etching, and W2 represents described designing requirement live width.
Wherein, the thick interval-optimal etch of the described default copper speed rule of correspondence obtains by following steps:
Draw the variation tendency of circuit board live width under different etching speeds in the thick interval of different plate face copper according to experiment; Live width and designing requirement live width under the different etching speeds that afterwards described experiment obtained compare, and draw the optimal etch speed corresponding to circuit board in the thick interval of different plate face copper, i.e. the thick interval-optimal etch of the described copper speed rule of correspondence.
Wherein, the plate face copper of described circuit board is thick obtains by following steps:
Adopt five point measurement methods to measure the thick data of plate face copper by copper thickness measuring instrument, the plate face copper that calculates described circuit board according to the thick data of described plate face copper is thick, wherein, the thick data of described plate face copper comprise intermediate point, upper left point, lower-left point, upper right point and the lower-right most point thick value of plate face copper of totally five points of circuit board, the mean value of the thick thick value of plate face copper that is described five points of plate face copper of described circuit board.
Wherein, the first plate of described every batch of circuit board obtains by following steps:
Calculate the difference between the thick value of plate face copper of five points of each circuit board, and sort by difference is ascending, choose front 3 circuit boards that in every batch of circuit board, difference is less first plate as every batch of circuit board, wherein difference minimum headed by plate one, difference second little headed by plate two, the like.
Implement the embodiment of the present invention, there is following beneficial effect:
1, with respect to etching speed of traditional employing to this batch of all circuit board etching, the wide problem not of uniform size of batch printed line after etching, the present invention adopts etching in batches to circuit board, can effectively improve batch circuit board because of the thick inconsistent defective problem of etching live width that causes of copper.
2, the present invention adopts the optimal etch speed that experiment obtains in advance to carry out etching to first plate, can increase first plate first-time qualification rate, reduces because of defective the scrapping of causing of first plate.
3,, in the time that live width is defective after first plate etching, can, according to the live width prompting optimal etch speed of first plate next time after first plate etching, first plate qualification rate for the second time be improved.
4, the present invention carries out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, can proofread and correct the thick interval-optimal etch of the described default copper speed rule of correspondence, the variation of response etching machine etching speed in time, makes circuit etching production quality keep best.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic flow sheet of existing batch engraving method;
Fig. 2 is the schematic flow sheet of the circuit board etching line width controlling method that provides of the embodiment of the present invention;
Fig. 3 is the thick measuring position of circuit board copper schematic diagram in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of circuit board etching line width controlling method, as shown in Figure 2, comprises step:
S1, will all need etched circuit board to carry out in batches according to the thick interval of copper at the thick place of plate face copper, and the first plate of every batch of circuit board after selecting in batches;
S2, draw the optimal etch speed of the first plate of every batch of circuit board according to the thick interval of copper at the thick place of plate face copper of the first plate of every batch of circuit board and the default thick interval-optimal etch of the copper speed rule of correspondence;
S3, according to the optimal etch speed of the first plate of the every batch of circuit board, the first plate of described every batch of circuit board is carried out to etching, if the live width after first plate etching is qualified, according to described optimal etch speed, the circuit board of same batch at described first plate place is carried out to batch etching.
Further, after step S3, also comprise step:
If the live width after the first plate etching of S4 is defective, the thick first plate of the next one of choosing current batch of the plate face copper of current batch of circuit board, and calculate according to the live width after described first plate etching and optimal etch speed corresponding to described first plate the optimal etch speed that the first plate of the described next one is corresponding, and return to execution step S3, until all circuit board etchings are complete.
Further, after step S4, also comprise step:
S5, carry out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, to proofread and correct the thick interval-optimal etch of the described default copper speed rule of correspondence.
Wherein, the optimal etch speed V2 that the first plate of the described next one is corresponding obtains by following formula:
V2=(V1/W1)*W2
Wherein, V1 represents the optimal etch speed that described first plate is corresponding, and W1 represents the live width after described first plate etching, and W2 represents the designing requirement live width of the first plate of the described next one.
Wherein, the thick interval-optimal etch of the described default copper speed rule of correspondence obtains by following steps:
Draw the variation tendency of circuit board live width under different etching speeds in the thick interval of different plate face copper according to experiment; Live width and designing requirement live width under the different etching speeds that afterwards described experiment obtained compare, and draw the optimal etch speed corresponding to circuit board in the thick interval of different plate face copper, i.e. the thick interval-optimal etch of the described copper speed rule of correspondence.
Wherein, the plate face copper of described circuit board is thick obtains by following steps:
Adopt five point measurement methods to measure the thick data of plate face copper by copper thickness measuring instrument, the plate face copper that calculates described circuit board according to the thick data of described plate face copper is thick, wherein, as shown in Figure 3, the thick data of described plate face copper comprise intermediate point 1, upper left point 2, lower-left point 3, upper right point 4 and the lower-right most point 5 thick value of plate face copper of totally five points of circuit board, the mean value of the thick thick value of plate face copper that is described five points of plate face copper of described circuit board.
Wherein, the first plate of described every batch of circuit board obtains by following steps:
Calculate the difference between the thick value of plate face copper of five points of each circuit board, and sort by difference is ascending, choose front 3 circuit boards that in every batch of circuit board, difference is less first plate as every batch of circuit board, wherein difference minimum headed by plate one, difference second little headed by plate two, the like.
Preferably, the thick interval of described copper be ± 5um or ± 10um.Between interval numerical value less, in batches more, corresponding etching speed is more accurate, but production efficiency can decrease; Interval numerical value is larger, in batches fewer, and corresponding etching speed error is larger, but production efficiency can be higher.Comprehensive above factor and actual production demand are selected the thick interval of best copper.
In actual applications, we can be according to an etching control software of the thick interval-optimal etch of copper speed rule of correspondence exploitation, to carry out above-described circuit board etching line width controlling method.The concrete function of etching control software has:
1, can typing the thick data of plate face copper of circuit boards of different numberings.
2,, according to the thick data of plate face copper of typing, automatically calculate also first plate numbering and the corresponding optimal etch speed of corresponding result, every batch of circuit board in batches of cue circuit plate.
3, in the time that first plate is defective, can be according to first plate numbering and the corresponding optimal etch speed next time of the live width automatic-prompting after first plate etching.
4, there is the thick interval selection function of copper.
Actual application is;
A, use typewriting mark machine are stamped numbering at circuit edges of boards;
B, use copper thickness measuring instrument are measured, and adopt 5 point measurement methods, as shown in Figure 3, and intermediate point 1, upper left point 2, lower-left point 3, upper right point 4 and the lower-right most point 5 thick value of plate face copper of totally five points of measuring circuit plate respectively;
C, to the numbering of etching control software typing circuit board and the thick value of plate face copper of five points, make it first plate numbering and the corresponding optimal etch speed of the result in batches of output circuit plate, every batch of circuit board;
D, according to the optimal etch speed of first plate, the first plate of every batch of circuit board is carried out to etching, if the live width after first plate etching is qualified, the circuit board etching in batches to current batch according to described optimal etch speed; Otherwise
If the live width after the first plate etching of e is defective, select the first plate of the next one of current batch of circuit board according to the thick data of circuit board plate face copper, and calculate according to the live width after first plate etching and optimal etch speed corresponding to first plate the optimal etch speed that the first plate of the described next one is corresponding, and return to execution step d, until all circuit board etchings are complete.
F, carry out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, with the thick interval-optimal etch of the copper speed rule of correspondence default in corrected time control software.
Implement the embodiment of the present invention, there is following beneficial effect:
1, carry out batch etching etching with respect to etching speed of traditional employing, live width problem not of uniform size between plate and plate after etching, the present invention adopts etching in batches to circuit board, can effectively improve batch circuit board because of the thick inconsistent defective problem of etching live width that causes of copper.
2, the present invention adopts the optimal etch speed that experiment obtains in advance to carry out etching to first plate, can increase first plate first-time qualification rate, reduces because of defective the scrapping of causing of first plate.
3,, in the time that live width is defective after first plate etching, can, according to the live width prompting optimal etch speed of first plate next time after first plate etching, first plate qualification rate for the second time be improved.
4, the present invention carries out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, can proofread and correct the thick interval-optimal etch of the described default copper speed rule of correspondence, the variation of response etching machine etching speed in time, makes etching production quality keep best.
Above disclosed is only a kind of preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.
Claims (7)
1. a circuit board etching line width controlling method, is characterized in that, comprises step:
S1, will all need etched circuit board to carry out in batches according to the thick interval of copper at the thick place of plate face copper, and the first plate of every batch of circuit board after selecting in batches;
S2, draw the optimal etch speed of the first plate of every batch of circuit board according to the thick interval of copper at the thick place of plate face copper of the first plate of every batch of circuit board and the default thick interval-optimal etch of the copper speed rule of correspondence;
S3, according to the optimal etch speed of the first plate of the every batch of circuit board, the first plate of described every batch of circuit board is carried out to etching, if the live width after first plate etching is qualified, according to described optimal etch speed, the circuit board of same batch at described first plate place is carried out to batch etching.
2. circuit board etching line width controlling method as claimed in claim 1, is characterized in that, also comprises step after step S3:
If the live width after the first plate etching of S4 is defective, according to the thick first plate of the next one of choosing current batch of the plate face copper of current batch of circuit board, and calculate according to the live width after described first plate etching and optimal etch speed corresponding to described first plate the optimal etch speed that the first plate of the described next one is corresponding, and return to execution step S3, until all circuit board etchings are complete.
3. circuit board etching line width controlling method as claimed in claim 2, is characterized in that, also comprises step after step S4:
S5, carry out statistical analysis for all live widths according to the circuit board after the etching of optimal etch speed, to proofread and correct the thick interval-optimal etch of the described default copper speed rule of correspondence.
4. circuit board etching line width controlling method as claimed in claim 2, is characterized in that, the optimal etch speed V2 that the first plate of the described next one is corresponding obtains by following formula:
V2=(V1/W1)*W2
Wherein, V1 represents the optimal etch speed that described first plate is corresponding, and W1 represents the live width after described first plate etching, and W2 represents described designing requirement live width.
5. circuit board etching line width controlling method as claimed in claim 1, is characterized in that, the thick interval-optimal etch of the described default copper speed rule of correspondence obtains by following steps:
Draw the variation tendency of circuit board live width under different etching speeds in the thick interval of different plate face copper according to experiment; Live width and designing requirement live width under the different etching speeds that afterwards described experiment obtained compare, and draw the optimal etch speed corresponding to circuit board in the thick interval of different plate face copper, i.e. the thick interval-optimal etch of the described copper speed rule of correspondence.
6. the circuit board etching line width controlling method as described in any one in claim 1 to 5, is characterized in that, the plate face copper of described circuit board is thick to be obtained by following steps:
Adopt five point measurement methods to measure the thick data of plate face copper by copper thickness measuring instrument, the plate face copper that calculates described circuit board according to the thick data of described plate face copper is thick, wherein, the thick data of described plate face copper comprise intermediate point, upper left point, lower-left point, upper right point and the lower-right most point thick value of plate face copper of totally five points of circuit board, the mean value of the thick thick value of plate face copper that is described five points of plate face copper of described circuit board.
7. circuit board etching line width controlling method as claimed in claim 6, is characterized in that, the first plate of described every batch of circuit board obtains by following steps:
Calculate the difference between the thick value of plate face copper of five points of each circuit board, and sort by difference is ascending, choose front 3 circuit boards that in every batch of circuit board, difference is less first plate as every batch of circuit board, wherein difference minimum headed by plate one, difference second little headed by plate two, the like.
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| CN201410126226.6A CN103874335A (en) | 2014-03-31 | 2014-03-31 | Circuit board etching line width control method |
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Cited By (7)
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| CN104582294A (en) * | 2014-12-26 | 2015-04-29 | 惠州市特创电子科技有限公司 | Method and system for automatically regulating etching line speed |
| CN105636358A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | PCB etching method |
| CN107588731A (en) * | 2017-09-30 | 2018-01-16 | 江西景旺精密电路有限公司 | A kind of pcb board line width measuring method and system |
| CN110402033A (en) * | 2019-07-18 | 2019-11-01 | 大连崇达电路有限公司 | A kind of route processing method of 10oz thick copper circuit board |
| CN111432567A (en) * | 2020-04-28 | 2020-07-17 | 昆山苏杭电路板有限公司 | Processing method of independent tiny bonding pad on PCB |
| CN114423168A (en) * | 2021-12-10 | 2022-04-29 | 西安金百泽电路科技有限公司 | Control method for etching line width of thick copper circuit board |
| CN114786347A (en) * | 2022-03-02 | 2022-07-22 | 深南电路股份有限公司 | Processing method of circuit board |
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Cited By (11)
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|---|---|---|---|---|
| CN104582294A (en) * | 2014-12-26 | 2015-04-29 | 惠州市特创电子科技有限公司 | Method and system for automatically regulating etching line speed |
| CN104582294B (en) * | 2014-12-26 | 2017-11-03 | 惠州市特创电子科技有限公司 | Etch the Automatic adjustment method and system of linear speed |
| CN105636358A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | PCB etching method |
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| CN107588731A (en) * | 2017-09-30 | 2018-01-16 | 江西景旺精密电路有限公司 | A kind of pcb board line width measuring method and system |
| CN107588731B (en) * | 2017-09-30 | 2019-11-22 | 江西景旺精密电路有限公司 | A kind of pcb board line width measuring method and system |
| CN110402033A (en) * | 2019-07-18 | 2019-11-01 | 大连崇达电路有限公司 | A kind of route processing method of 10oz thick copper circuit board |
| CN110402033B (en) * | 2019-07-18 | 2022-10-04 | 大连崇达电路有限公司 | Circuit processing method of 10oz thick copper circuit board |
| CN111432567A (en) * | 2020-04-28 | 2020-07-17 | 昆山苏杭电路板有限公司 | Processing method of independent tiny bonding pad on PCB |
| CN114423168A (en) * | 2021-12-10 | 2022-04-29 | 西安金百泽电路科技有限公司 | Control method for etching line width of thick copper circuit board |
| CN114786347A (en) * | 2022-03-02 | 2022-07-22 | 深南电路股份有限公司 | Processing method of circuit board |
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