CN206300604U - A kind of graphic plating test cell - Google Patents
A kind of graphic plating test cell Download PDFInfo
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- CN206300604U CN206300604U CN201621252358.4U CN201621252358U CN206300604U CN 206300604 U CN206300604 U CN 206300604U CN 201621252358 U CN201621252358 U CN 201621252358U CN 206300604 U CN206300604 U CN 206300604U
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- test
- copper
- cellular zone
- effective cellular
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Abstract
Graphic plating test cell described in the utility model, including a test board, effective cellular zone and section test section are distributed with test board, line layer or copper face layer are provided with effective cellular zone, in section test section and its periphery has the line layer similar to effective cellular zone or copper face layer.Effective cellular zone and section test section are marked off in test board region, the figure cut into slices in test section is set to similar or identical with figure in effective cellular zone, this setup makes the CURRENT DISTRIBUTION difference very little in CURRENT DISTRIBUTION in section test section and effective cellular zone, reduce influence of the CURRENT DISTRIBUTION to copper thickness skewness, finally allow the copper layer thickness after the graphic plating of section test section true, accurately reflect the copper electroplating layer thickness in effective cellular zone, advantageously in the judgement of plating initial workpiece copper layer thickness, without repeatedly carrying out section test to test board, improve testing efficiency, reduce the scrappage of circuit board, so as to reduce testing cost.
Description
Technical field
The utility model belongs to printed circuit board production technical field, is related to a kind of graphic plating test device, specifically
Say and be related to a kind of graphic plating section test cell.
Background technology
Printed circuit board (Printed Circuit Board, abbreviation PCB) is also referred to as printed circuit board (PCB), is a kind of important
Electronic unit, plays a part of support electronic component, is electrically connected electronic component, and it is prepared using electron printing
, thus as printed circuit board (PCB).
With the gradually development of electronics industry, PCB has obtained increasingly being widely applied, and this is because PCB has a lot
Unique advantage：(1) can densification, with integrated circuit integrated level improve constantly circuit board constantly to can densification send out
Exhibition；(2) high reliability, generally can be used by the PCB of quality testing and is up to 20 years；(3) designability, it is various to PCB
Performance (such as electrically, physics, chemistry, machinery) requirement can realize that printed board is designed by design standard, standardization, when
Between short, efficiency high；(4) productibility, can use modern management, be standardized, scale, automated production, guarantee
The quality conformance of circuit board product；(5) testability, has established than more complete method of testing, testing standard, various surveys
Examination equipment and instrument are detected and identify the qualification and service life of PCB product；(6) drillability rate, PCB product had both been easy to respectively
Kind of element is standardized assembling, can be automated again, large-scale production.Meanwhile, PCB and various element assembled portions
Part also can be assembled and form bigger part, system, until whole machine.After electronic equipment uses printed board, due to the one of similar printed board
Cause property, so as to avoid the mistake of artificial wiring, and can realize electronic component inserting or attachment, automatic tin soldering, automatically automatically
Detection, it is ensured that the quality of electronic equipment, improves labor productivity, reduces cost, while being also easily accessible for service.
Graphic plating is one important procedure in printed circuit board production process, and after electric plating of whole board, plate is through overdrying
Needed after film exposure imaging by graphic plating, it is thick its object is to increase in circuit and hole copper, it is ensured that its electric conductivity and its
Its physical property, prevents conducting channel from heat and mechanical defect occur.General principle is：By the effect of voltage, make the copper of anode
Copper ion is oxidized into, the copper ion of copper cylinder obtains electron reduction into copper in negative electrode, and the copper of reduction thickeies circuit and hole wall copper
To the degree for meeting demand, and tin coating is used as the protective layer of subsequent etching process.
The technological process of graphic plating is generally：Acid deoiling-pickling-plating-sulfonic acid washes-tin plating-drying, in plating
During, electroplating temperature, current density, mixing speed are all to the effect important of graphic plating.Needed after the completion of plating
Whether the thickness and uniformity for testing copper electroplating layer meet requirement, and the uniformity quality of usual layers of copper can directly affect etching etc.
The making of operation afterwards.
The measuring method of copper layer thickness mainly includes following three kinds：X-fluorescence thickness measuring method, coulomb thickness measuring method and micro- survey of cutting into slices
Thick method, wherein, X-fluorescence thickness measuring method principle is：Various metallic atoms can inspire the X-ray of characteristic wavelength, feature under X-ray
There is quantitative relationship with the metal layer thickness in the range of certain thickness in the X-ray intensity of wavelength, this method can survey 1 μm with
Under thickness of coating, but its instrument and tap it is expensive, it is necessary to often correction；Coulomb thickness measuring rule is to utilize electrolytic metal
Quality and the electricity needed for electrolysis meet the thickness that quantitative this principle of faraday first calculates coating, but to be one kind have for this
Method of testing is damaged, and precision is not high；Micro- thickness measuring method of cutting into slices is to make be placed under metallographic microscope after section by sample to measure, its
It is intuitive and reliable, coating and base material situation can be simultaneously observed, it is a kind of current widely used method of testing.
Read copper thickness to carrying out section in circuit board unit and cause the scrappage to increase to reduce in actual test, often
In the white space design section position of big jigsaw inverter circuit unit, scrappage so can be not only reduced, can also accurately read
Copper layer thickness.But this method of testing has certain limitation, due to copper layer thickness uniformity after graphic plating and figure point
Cloth is closely related, and large stretch of copper face is more obvious with isolated copper cash region copper thickness difference, when slice position is in isolated copper cash
Region and when unit is mainly large area copper face in plate, the thick copper layer thickness that can be substantially than large area copper face of copper of position of cutting into slices is big,
Conversely, when the figure in section is mainly large area copper face area and unit is mainly isolated copper cash region in plate, position of cutting into slices
Copper layer thickness then can be substantially than copper cash region copper layer thickness it is small.Therefore tradition section test technology truly cannot reflect in unit
Accurate copper it is thick, be unfavorable for the thick judgement of graphic plating initial workpiece part product copper, judge that efficiency is low, if clipper circuit Slab element again
Section measure is carried out, then improves the scrappage of product.
Utility model content
Therefore, technical problem to be solved in the utility model is that existing section method of testing cannot be in actual response plate
The true copper layer thickness of effective district figure, testing efficiency are low, scrappage is easily raised, so as to propose that one kind more can actual response unit
Interior copper layer thickness, the thick graphic plating test cell for judging efficiency of raising plating initial workpiece copper.
In order to solve the above technical problems, the technical solution of the utility model is：
The utility model provides a kind of graphic plating test cell, and it includes a test board, is distributed with the test board
Effective cellular zone and section test section, are provided with line layer or copper face layer, in the section test section in effective cellular zone
And slicing layer test section periphery is provided with the line layer or copper face layer similar to effective cellular zone.
Preferably, effective cellular zone and the section test section are provided with plated through-hole.
Preferably, plated through-hole described in the section test section is 6, wherein the macropore, another of three apertures for 1mm
Outer three apertures are the aperture of 0.15mm-0.95mm.
Preferably, three linear type arrangements of macropore, the spacing between the adjacent macropore is 2.0-2.5mm.
Preferably, three linear type arrangements of aperture, the spacing between the adjacent aperture is 2.0-2.5mm.
Preferably, the radius-thickness ratio of the test board is not more than 8.
Above-mentioned technical proposal of the present utility model has advantages below compared to existing technology：
(1) graphic plating test cell described in the utility model, it includes a test board, is distributed with the test board
Effective cellular zone and section test section, are provided with line layer or copper face layer, in the section test section in effective cellular zone
And its periphery is provided with the line layer or copper face layer similar to effective cellular zone.Effective list is marked off in test board region
First area and section test section, by cut into slices test section in and its periphery figure be set to it is similar to the figure in effective cellular zone or
It is identical, solve and in the prior art cause because of graphic difference and current density not the edges of boards that test section of cutting into slices is arranged on test board
The uneven problem of copper electroplating layer thickness distribution caused by, in this programme, when the most of region in effective cellular zone is big face
During product copper face floor (large area copper face area occupies effect unit area and is more than 60%), section test section and its periphery are also configured as big face
Product copper face layer, the most of region in effective cellular zone is isolated line layer (line areas occupy effect unit area and are more than 60%)
When, to cut into slices in test section and its periphery is also configured as similar isolated line layer, this setup makes in section test section
CURRENT DISTRIBUTION difference very little in CURRENT DISTRIBUTION and effective cellular zone, reduces influence of the CURRENT DISTRIBUTION to copper thickness skewness, most
Allow the electro-coppering thickness that the copper layer thickness after the graphic plating of section test section is true, accurately reflect in effective cellular zone eventually
Degree, advantageously in the judgement of plating initial workpiece copper layer thickness, without repeatedly carrying out section test to test board, improves test effect
Rate, reduces the scrappage of circuit board, reduces testing cost.
(2) graphic plating test cell described in the utility model, effective cellular zone and the section test section set
Plated through-hole is equipped with, plated through-hole described in the section test section is 6, wherein macropore, in addition three of three apertures for 1mm
Individual aperture is 0.15mm-0.95mm, generally takes the aperture in minimum edge PTH hole aperture in unit.Setting plated through-hole can be by right
Hole in section test section carries out whether the section effective cellular zone inner hole wall copper electroplating layer thickness of test judgement reaches requirement, and
The hole of different size is set in section test section, can be with the copper electroplating layer thickness in different holes in the effective cellular zone of actual response, can
Efficiently, the uniformity of effective unit endoporus inwall electro-coppering is quickly judged.
Brief description of the drawings
In order that content of the present utility model is more likely to be clearly understood, below according to specific implementation of the present utility model
Example and with reference to accompanying drawing, the utility model is described in further detail, wherein
Fig. 1 is the graphic plating test cell schematic diagram described in the utility model embodiment 1；
Fig. 2 is the graphic plating test cell schematic diagram described in the utility model embodiment 2.
Reference is expressed as in figure：1- test boards；The effective cellular zones of 2-；3- sections test section.
Specific embodiment
Embodiment 1
The present embodiment provides a kind of graphic plating test cell, and graphic plating test cell is used for printed circuit board as described
The uniformity of copper electroplating layer is tested after graphic plating, by carrying out section test to graphic plating test cell, figure electricity is judged
Whether enough, coating whether there is depression to thickness of coated copper layer, no can occur whether plating leakage situation and hole copper have exception.The present embodiment
In, as shown in figure 1, the graphic plating test cell includes a test board 1, effective cellular zone 2 is distributed with the test board
With section test section 3, line layer or copper face layer are provided with effective cellular zone 2, the section test section 3 is interior and section is surveyed
The periphery for trying area 3 is provided with and line layer or copper face floor similar or identical in effective cellular zone 2.When effective cellular zone 2
Most of region when being larger areas of copper surface layer, it is effectively single in section test section 3 and its periphery is also configured as larger areas of copper surface layer
When most of area in first area 2 is isolated line layer, section test section 3 is interior and its periphery is also configured as similar isolated line
Road floor, this setup makes the CURRENT DISTRIBUTION difference very little in CURRENT DISTRIBUTION in section test section 3 and effective cellular zone 2,
Influence of the CURRENT DISTRIBUTION to copper thickness skewness is reduced, finally allows the copper layer thickness after the graphic plating of section test section 3 true
Real, the copper electroplating layer thickness accurately reflected in effective cellular zone 2, advantageously in the judgement of plating initial workpiece copper layer thickness.Set
There is the periphery relatively section test section 3 outwards unilateral extension with the section test section 3 of the same or analogous figure of effective cellular zone 2
30-50mm。
Further, as shown in figure 1, effective cellular zone 2 at least two, the section test section 3 is arranged at institute
State between effective cellular zone, in the present embodiment, effective cellular zone 2 is 2, is arranged at the both sides of the test board 1, described
Section test section 3 is arranged between two effective cellular zones 2.
Further, plated through-hole, the survey are both provided with the effective cellular zone 2 and section test section 3
The radius-thickness ratio of test plate (panel) 1 is that the plated through-hole in 8.0, and the section test section 3 is 6, wherein three is the big of aperture 1mm
Hole, the other three are the aperture of aperture 0.2mm, three linear type arrangements of macropore, the spacing between the adjacent macropore
It is 2.5mm；Three linear type arrangements of aperture, the spacing between the adjacent aperture is 2.5mm, final 6 Kong Chengyi
It is arranged in a straight line.
Embodiment 2
The present embodiment provides a kind of graphic plating test cell, and graphic plating test cell is used for printed circuit board as described
The uniformity of copper electroplating layer is tested after graphic plating, by carrying out section test to graphic plating test cell, figure electricity is judged
Whether enough, coating whether there is depression to thickness of coated copper layer, no can occur whether plating leakage situation and hole copper have exception.The present embodiment
In, as shown in Fig. 2 the graphic plating test cell includes a test board 1, effective cellular zone 2 is distributed with the test board
With section test section 3, line layer or copper face layer, in the section test section 3 and its periphery are provided with effective cellular zone 2
It is provided with and line layer similar or identical in effective cellular zone 2 or copper face layer.When the most of area in effective cellular zone 2
When domain is larger areas of copper surface layer, section test section 3 is interior and its periphery is also configured as larger areas of copper surface layer, in effective cellular zone 2
When most of region is isolated line layer, section test section 3 is interior and its periphery is also configured as similar isolated line layer, this
Set-up mode makes the CURRENT DISTRIBUTION difference very little in CURRENT DISTRIBUTION in section test section 3 and effective cellular zone 2, reduces electric current point
Influence of the cloth to copper thickness skewness, finally allows that the copper layer thickness after the graphic plating of section test section 3 is true, accurately reflects
Copper electroplating layer thickness in effective cellular zone 2, advantageously in the judgement of plating initial workpiece copper layer thickness.It is provided with and effective unit
Relatively cut into slices the outwards unilateral extension 30-50mm of test section 3 on the periphery of the section test section 3 of the same or analogous figure in area 2.
Further, as shown in Fig. 2 effective cellular zone 2 at least two, the section test section 3 is arranged at institute
State between effective cellular zone, in the present embodiment, the section test section 3 is arranged at the middle part of the test board 1, the section test
The both sides of area 3 are each provided with 4 effective cellular zones 2, and 4 effective cellular zones 2 per side are sequentially connected with, and effective cellular zone 2
Side near the section test section 3 is connected with the section test section 3.
Further, plated through-hole, the survey are both provided with the effective cellular zone 2 and section test section 3
The radius-thickness ratio of test plate (panel) 1 is that the plated through-hole in 2.0, and the section test section 3 is 6, wherein three is the big of aperture 1mm
Hole, the other three are the aperture of aperture 0.9mm, three linear type arrangements of macropore, the spacing between the adjacent macropore
It is 2.0mm；Three linear type arrangements of aperture, the spacing between the adjacent aperture is 2.0mm.
Obviously, above-described embodiment is only intended to clearly illustrate example, and not to the restriction of implementation method.It is right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need and unable to be exhaustive to all of implementation method.And the obvious change thus extended out or
Among the protection domain that variation is created still in the utility model.
Claims (6)
1. a kind of graphic plating test cell, it is characterised in that including a test board, effective unit is distributed with the test board
Area and section test section, be provided with effective cellular zone line layer or copper face layer, the section test section in and section survey
Examination area periphery is provided with the line layer or copper face floor similar to effective cellular zone.
2. graphic plating test cell according to claim 1, it is characterised in that effective cellular zone and the section
Test section is provided with plated through-hole.
3. graphic plating test cell according to claim 2, it is characterised in that metal described in the section test section
It is 6 to change hole, wherein macropore, aperture that the other three aperture be 0.15mm-0.95mm of three apertures for 1mm.
4. graphic plating test cell according to claim 3, it is characterised in that three linear types rows of macropore
Row, the spacing between the adjacent macropore is 2.0-2.5mm.
5. graphic plating test cell according to claim 4, it is characterised in that three linear types rows of aperture
Row, the spacing between the adjacent aperture is 2.0-2.5mm.
6. graphic plating test cell according to claim 5, it is characterised in that the radius-thickness ratio of the test board is not more than
8。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252358.4U CN206300604U (en) | 2016-11-22 | 2016-11-22 | A kind of graphic plating test cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252358.4U CN206300604U (en) | 2016-11-22 | 2016-11-22 | A kind of graphic plating test cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206300604U true CN206300604U (en) | 2017-07-04 |
Family
ID=59213060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621252358.4U Expired - Fee Related CN206300604U (en) | 2016-11-22 | 2016-11-22 | A kind of graphic plating test cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206300604U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322996A (en) * | 2018-03-07 | 2018-07-24 | 汕头超声印制板（二厂）有限公司 | A kind of circuit board and preparation method thereof of high jigsaw utilization rate |
-
2016
- 2016-11-22 CN CN201621252358.4U patent/CN206300604U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322996A (en) * | 2018-03-07 | 2018-07-24 | 汕头超声印制板（二厂）有限公司 | A kind of circuit board and preparation method thereof of high jigsaw utilization rate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20211122 |