CN108240996B - Chip failure analysis method and device - Google Patents
Chip failure analysis method and device Download PDFInfo
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- CN108240996B CN108240996B CN201611229910.2A CN201611229910A CN108240996B CN 108240996 B CN108240996 B CN 108240996B CN 201611229910 A CN201611229910 A CN 201611229910A CN 108240996 B CN108240996 B CN 108240996B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Abstract
The invention relates to a chip failure positioning method and a chip failure positioning device. Meanwhile, a heat insulation gasket is arranged between the machine platform connecting plate and the heating platform disc; loading a heating table plate on the position of a sample table of the light emission microscope; placing a chip to be tested on a table top of a heating table disc, and setting the temperature range of the heating table disc to enable the chip to be tested to be at a testing temperature, wherein the temperature range is 140-160 ℃; the bright spot on the chip to be tested is the failure position of the chip to be tested. Therefore, the chip to be tested can be positioned at the testing temperature by combining the heating table plate, and the failure position of the chip to be tested is positioned by the light emission microscope.
Description
Technical Field
The invention relates to chip failure positioning, in particular to a chip failure positioning method and device in a high-temperature environment.
Background
The conventional means adopted in the industry for electrical analysis of failed circuits at present mainly measures leakage and EMMI (light emission microscope) positioning, which is usually performed at room temperature, and some leakage caused by failure needs to be reflected under high temperature working conditions. With the development of the technology and the improvement of the integration level of the IC, millions of circuits are integrated on one chip, and failure analysis is performed on the premise that directions are not provided by electrical positioning, as in a sea fishing needle.
The room temperature EMMI machine can provide conventional failure location positioning work, but can not be used for a die which has no leakage at room temperature and fails due to high-temperature leakage. In the previous analysis, there is no good method for the failure, the method is to analyze by means of morphology observation, alignment comparison, VC voltage contrast image observation and the like of key layers, the whole process is long in time consumption and little in effect, and the real failure reason is often not found.
Disclosure of Invention
Therefore, a method for locating a chip failure in a high temperature environment is needed.
A chip failure analysis method is used for positioning the failure position of a chip to be tested in a high-temperature environment, and comprises the following steps:
manufacturing a machine station connecting plate, wherein a first connecting part and a second connecting part are preset on the machine station connecting plate;
fixedly connecting the first connecting part with a base of the light emission microscope;
fixedly connecting the second connecting part with a base of a heating table plate to enable the machine table connecting plate to be positioned between the light emission microscope and the heating table plate;
a heat insulation gasket is arranged between the machine table connecting plate and the heating table disc;
the heating table plate fixedly connected with the machine table connecting plate is arranged on the position where a sample table of the light emission microscope is located, so that the table surface of the heating table plate replaces the sample table;
placing a chip to be tested on the heating table plate, and setting the temperature range of the heating table plate to enable the chip to be tested to be at the test temperature, wherein the temperature range is 140-160 ℃;
and marking the bright spot on the chip to be tested, wherein the bright spot is the failure position of the chip to be tested.
In one embodiment, the step of manufacturing a machine connecting plate, where the machine connecting plate reserves the first connecting portion and the second connecting portion, includes:
manufacturing a machine station connecting plate which is a Teflon circular plate;
a square opening is formed in the edge of the Teflon circular plate and used for being buckled with a heating module on the heating table plate;
a plurality of first connecting parts which do not penetrate through the Teflon round plate are arranged on the Teflon round plate, the first connecting parts are first screw holes, and the first screw holes are used for connecting the Teflon round plate with a base of the light emission microscope;
the Teflon round plate is provided with a plurality of second connecting parts, the second connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon round plate with a base of the heating table plate.
The step of making the machine connecting plate comprises the following steps:
and manufacturing a Teflon circular plate with the thickness larger than the height of the heating module.
In one embodiment, three second screw holes are arranged on the teflon round plate, the second screw holes are wide at the top and narrow at the bottom, and the wider end of each second screw hole is connected with the heating table plate.
In one embodiment, four first screw holes which do not penetrate through the teflon round plate are arranged on the teflon round plate, and the first screw holes are arranged on the teflon round plate in a matrix manner.
A chip failure analysis device is used for positioning failure positions of chips to be tested in a high-temperature environment, and comprises a light emission microscope, a heating table plate, a table connecting plate and a heat insulation gasket;
the machine platform connecting plate is provided with a first connecting part and a second connecting part in advance; the first connecting part is used for being fixedly connected with a base of the light emission microscope; the second connecting part is used for being fixedly connected with a base of the heating table plate, so that the machine table connecting plate is positioned between the light emission microscope and the heating table plate;
a heat insulation gasket is arranged between the machine table connecting plate and the heating table disc; after the heating platform disc is fixedly connected with the machine table connecting plate, the heating platform disc is used for being arranged at the position where a sample table of the light emission microscope is located, so that the platform surface of the heating platform disc replaces the sample table; the chip to be tested is arranged on the heating table plate, and the heating table plate is used for setting the temperature range required by the chip to be tested so that the chip to be tested is at the testing temperature; and under the test temperature, the bright spot on the chip to be tested is the failure position of the chip to be tested.
In one embodiment, the machine connecting plate is a teflon circular plate, a square opening is formed in the edge of the teflon circular plate, and the square opening is used for being buckled on a heating module on the heating table plate;
the Teflon round plate is provided with a plurality of first connecting parts which do not penetrate through the Teflon round plate, the first connecting parts are first screw holes, and the first screw holes are used for connecting the Teflon round plate with the light emission microscope;
the Teflon round plate is provided with a plurality of second connecting parts, the second connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon round plate with a base of the heating table plate.
In one embodiment, the thickness of the teflon disk is greater than the height of the heating module.
In one embodiment, three second screw holes are arranged on the teflon round plate, the second screw holes are wide at the top and narrow at the bottom, and the wider end of each second screw hole is connected with the heating table plate.
In one embodiment, four first screw holes which do not penetrate through the teflon round plate are arranged on the teflon round plate, and the first screw holes are arranged on the teflon round plate in a matrix manner.
The chip failure positioning method and the device connect the light emission microscope and the heating table disc through the machine table connecting plate, so that the machine table connecting plate is positioned between the base of the light emission microscope and the base of the heating table disc. Meanwhile, a heat insulation gasket is arranged between the machine platform connecting plate and the heating platform disc; loading a heating table plate on the position of a sample table of the light emission microscope; placing a chip to be tested on a table top of a heating table disc, and setting the temperature range of the heating table disc to enable the chip to be tested to be at a testing temperature, wherein the temperature range is 140-160 ℃; the bright spot on the chip to be tested is the failure position of the chip to be tested. Therefore, the chip to be tested can be positioned at the testing temperature by combining the heating table plate, and the failure position of the chip to be tested is positioned by the light emission microscope.
Drawings
FIG. 1 is a flow chart of a method of chip failure analysis;
FIG. 2 is a schematic structural diagram of a machine connecting plate;
FIG. 3 is a cross-sectional block diagram of a chip failure analysis apparatus.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 is a flow chart of a chip failure analysis method.
A chip failure analysis method is used for positioning the failure position of a chip to be tested in a high-temperature environment, and comprises the following steps:
step S110, manufacturing a machine connecting plate, wherein the machine connecting plate is provided with a first connecting part and a second connecting part in advance.
The light emission microscope is used for analyzing whether the chip to be tested has electric leakage failure or not at normal temperature.
The heating platen can simulate the failure mode of high-temperature electric leakage, but cannot be effectively electrically positioned.
Therefore, in a high temperature environment, it is necessary to combine the functions of the light emission microscope and the heating stage. Therefore, the first connecting part and the second connecting part are respectively preset for connecting the light emission microscope and the heating table.
Specifically, step S110 includes:
step S112, manufacturing a machine connecting plate, wherein the machine connecting plate is a Teflon round plate.
And step S114, a square opening is formed in the edge of the Teflon circular plate, and the square opening is used for being buckled with a heating module on the heating table plate.
Step S116, a plurality of first connecting parts which do not penetrate through the Teflon round plate are arranged on the Teflon round plate, the first connecting parts are first screw holes, and the first screw holes are used for connecting the Teflon round plate with a base of the light emission microscope.
And S118, arranging a plurality of second connecting parts on the Teflon circular plate, wherein the second connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon circular plate with a base of the heating table.
Since the general light emission microscope and the heating table are both circular, the connecting plate of the machine needs to be made into circular shape, i.e. teflon round plate, teflon, also known as polytetrafluoroethylene (Polytetrafluoroethene), which is generally called as "non-stick coating" or "easy-to-clean wok material"; is an artificially synthesized high molecular material which uses fluorine to replace all hydrogen atoms in polyethylene. The material has the characteristics of acid resistance, alkali resistance and various organic solvents resistance, and is almost insoluble in all solvents. Meanwhile, the polytetrafluoroethylene has the characteristic of high temperature resistance, has extremely low friction coefficient, can be used for lubricating, and becomes an ideal coating for an easy-to-clean wok and an inner layer of a water pipe.
Therefore, the Teflon disks can resist the high temperature of the heating table plate.
In this embodiment, the step of manufacturing the machine connecting plate includes:
and manufacturing a Teflon circular plate with the thickness larger than the height of the heating module.
Because the square opening of the Teflon circular plate needs to be buckled on the heating module, the thickness of the Teflon circular plate needs to be larger than the height of the heating module, and the heating module is prevented from being in direct contact with the base of the light emission microscope.
The sequence of the steps S112 to S114 can be changed arbitrarily, and the final shape structure of the Teflon disk is not affected.
Step S120, fixedly connecting the first connecting portion to the base of the light emission microscope.
The first connecting portion of board connecting plate is used for with light emission microscope's base fixed connection.
Please refer to fig. 2.
Four first screw holes 201 which do not penetrate through the teflon circular plate 20 are arranged on the teflon circular plate 20, and the first screw holes 201 are arranged on the teflon circular plate 20 in a matrix manner.
After penetrating through the teflon circular plate 20, the teflon circular plate is connected by the nut, so that electric leakage is easy to occur, and therefore, the first screw hole 201 cannot penetrate through the teflon circular plate 20, the electric leakage phenomenon can be avoided, and further the failure positioning result is avoided being influenced.
Step S130, connecting the second connecting portion with a heating platen, so that the platen connecting plate is located between the light emission microscope and the heating platen.
The second connecting portion of board connecting plate is used for being connected with the platform dish that heats.
Specifically, three second screw holes 202 are arranged on the teflon round plate 20, the second screw holes 202 are wide at the top and narrow at the bottom, and the wider end of the second screw holes 202 is connected with the heating table plate.
The second screw hole 202 is formed in a shape with a wide top and a narrow bottom, so that the nut can be sunk into the teflon circular plate 20, and the teflon circular plate can be firmly connected and can play a certain insulating role.
Because the table top of the heating table tray is used for replacing a sample table of the light-emitting microscope, after the first connecting part of the machine table connecting plate is connected with the base of the light-emitting microscope, the machine table connecting plate is connected with the base of the heating table tray again, so that the table top of the heating table tray faces the lens direction of the light-emitting microscope, and a user can observe a chip to be tested on the table top of the heating table tray through the lens.
Step S140, arranging a heat insulation gasket between the machine table connecting plate and the heating table disc.
Specifically, the heat insulating gasket passes through the nut corresponding to the second screw hole 202, so that the machine table connecting plate is not in direct contact with the heating table plate.
Because the board connecting plate has certain heat conductivity, overheated can influence the effect of inefficacy location, consequently, set up thermal-insulated packing ring between board connecting plate and the platform dish of heating, make the circulation of air between the two, do benefit to the heat dissipation.
And S150, mounting the heating table plate fixedly connected with the machine table connecting plate on the position where a sample table of the light emission microscope is located, and enabling the table surface of the heating table plate to replace the sample table.
After bench plate and emission microscope are connected to machine platform connecting plate and are heated, need make and heat bench plate and emission microscope and can match, need make and heat bench plate and replace the former sample platform on the emission microscope, be about to emission microscope's sample platform and demolish, simultaneously, fix the bench plate that heats through emission microscope's base, machine platform connecting plate, make and heat bench plate and have the function of former sample platform, simultaneously, also can heat for the bench plate that heats can combine with emission microscope's function.
Step S160, placing the chip to be tested on the heating table plate, and setting the temperature range of the heating table plate to enable the chip to be tested to be at the test temperature, wherein the temperature range is 140-160 ℃.
Because the test chip is at the failure position in the high-temperature environment, the temperature range of the heating table needs to be preset, so that the chip to be tested is at the test temperature.
As shown in Table 1, the set value of the heating table panel is the corresponding value of the actual temperature of the thermocouple.
| Temperature range | Panel setting | Thermocouple (C) |
| Condition 1 | 50 | 50 |
| Condition 2 | 75 | 74.5 |
| Condition 3 | 100 | 98.5 |
| Condition 4 | 125 | 123.3 |
| Condition 5 | 150 | 147.7 |
| Condition 6 | 175 | 172.9 |
| Condition 7 | 200 | 196.9 |
TABLE 1
In one embodiment, the chip to be tested is placed in an environment at 150 ℃ and then a failure location test is performed. Generally, when the set value of the heating table panel is 150 ℃, the thermocouple is only 147.7 ℃ actually, namely, the chip to be tested is in the environment of 147.7 ℃ actually, but the accuracy of the test result is not affected.
And S170, marking a bright spot on the chip to be tested, wherein the bright spot is the failure position of the chip to be tested.
After the steps S110 to S160 are completed, bright spots may appear on the chip to be tested, the bright spots are failure positions, and the failure positions of the chip to be tested can be obtained by marking the bright spots.
In summary, the chip failure analysis method can quickly find out the real position of electric leakage only by replacing the platform disc, does not need to perform physical analysis on the premise of no direction, can reduce the workload of subsequent analysis, and can also quickly find out weak links for improving some chips with design problems. EMMI analysis technique and platform dish of heating are mature techniques, and carry out the analysis through combining both and can find out the position of losing efficacy chip high temperature electric leakage fast, consequently use high temperature test platform dish to change ordinary EMMI test platform dish and realize losing efficacy to the sample location that loses efficacy under the high temperature, and then find the defect point.
Fig. 3 is a block diagram of the chip failure analysis apparatus.
A chip failure analysis device is used for positioning the failure position of a chip to be tested in a high-temperature environment and comprises a light emission microscope 301, a heating table plate 302, a table connecting plate 303 and a heat insulation gasket 304.
The machine connecting plate 303 is provided with a first connecting part and a second connecting part in advance; the first connecting part is used for being fixedly connected with the base of the light emission microscope 301; the second connecting portion is used for being fixedly connected with a base of the heating platen 302, so that the platen connecting plate 303 is located between the light emission microscope 301 and the heating platen 302.
A heat insulation gasket 304 is arranged between the machine platform connecting plate 303 and the heating platform disc 302; after being fixedly connected with the machine table connecting plate, the heating table plate 302 is used for being installed on the position where a sample table of the light emission microscope 301 is located, so that the table surface of the heating table plate replaces the sample table; the chip to be tested is placed on the heating table plate; the heating table 302 is used for setting a temperature range required by the chip to be tested, so that the chip to be tested is at a testing temperature; and under the test temperature, the bright spot on the chip to be tested is the failure position of the chip to be tested.
The machine platform connecting plate 303 is a teflon circular plate, a square opening is formed in the edge of the teflon circular plate, and the square opening is used for being buckled with a heating module on the heating table plate 303.
A plurality of first connecting parts are arranged on the Teflon circular plate, the first connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon circular plate with the heating table plate 302.
Set up a plurality of not pierce through on the teflon plectane the second connecting portion of teflon plectane, the second connecting portion are first screw, first screw is used for connecting the teflon plectane with light emission microscope 301.
The thickness of the Teflon round plate is larger than the height of the heating module.
Three second screw holes are formed in the Teflon round plate, the second screw holes are wide in top and narrow in bottom, and the wider end of each second screw hole is connected with the heating table plate 302.
Four first screw holes which do not penetrate through the Teflon circular plate are arranged on the Teflon circular plate, and the first screw holes are arranged on the Teflon circular plate in a matrix manner.
The chip failure positioning method and device connect the light emission microscope 301 and the heating platform 302 through the platform connecting plate, so that the platform connecting plate 303 is located between the base of the light emission microscope 301 and the base of the heating platform 302. Meanwhile, a heat insulation gasket 304 is arranged between the machine table connecting plate 303 and the heating table disc 302; loading a heating table plate 302 on the position where the sample table of the light emission microscope 301 is located; placing a chip to be tested on a table top of a heating table disc, and setting the temperature range of the heating table disc 302 to ensure that the chip to be tested is at a test temperature, wherein the temperature range is 140-160 ℃; the bright spot on the chip to be tested is the failure position of the chip to be tested. Therefore, the heating platen 302 can be combined to make the chip to be tested at the testing temperature, and the failure position of the chip to be tested can be located by the light emission microscope 301.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A chip failure analysis method is used for positioning the failure position of a chip to be tested in a high-temperature environment, and is characterized by comprising the following steps:
manufacturing a machine station connecting plate, wherein a first connecting part and a second connecting part are preset on the machine station connecting plate;
fixedly connecting the first connecting part with a base of the light emission microscope;
fixedly connecting the second connecting part with a base of a heating table plate to enable the machine table connecting plate to be positioned between the light emission microscope and the heating table plate;
a heat insulation gasket is arranged between the machine table connecting plate and the heating table disc;
removing a sample table of the light-emitting microscope, and installing the heating table plate fixedly connected with the machine table connecting plate on the position of the sample table of the light-emitting microscope to enable a table top of the heating table plate to replace the sample table;
placing a chip to be tested on the heating table plate, and setting the temperature range of the heating table plate to enable the chip to be tested to be at the test temperature, wherein the temperature range is 140-160 ℃;
marking a bright spot on the chip to be tested, wherein the bright spot is a failure position of the chip to be tested;
the manufacturing method comprises the following steps of manufacturing a machine connecting plate, wherein the step of presetting a first connecting part and a second connecting part by the machine connecting plate comprises the following steps:
manufacturing a machine station connecting plate which is a Teflon circular plate;
a square opening is formed in the edge of the Teflon circular plate and used for buckling a heating module on the heating table plate;
a plurality of first connecting parts which do not penetrate through the Teflon round plate are arranged on the Teflon round plate, the first connecting parts are first screw holes, and the first screw holes are used for connecting the Teflon round plate with a base of the light emission microscope;
the Teflon round plate is provided with a plurality of second connecting parts, the second connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon round plate with a base of the heating table plate.
2. The chip failure analysis method of claim 1, wherein the step of fabricating the machine board connection board comprises:
and manufacturing a Teflon circular plate with the thickness larger than the height of the heating module.
3. The chip failure analysis method according to claim 2, wherein three second screw holes are arranged on the teflon circular plate, the second screw holes are wide at the top and narrow at the bottom, and the wider end of the second screw holes is connected with the heating table plate.
4. The chip failure analysis method according to claim 2, wherein four first screw holes that do not penetrate the teflon disk are provided in the teflon disk, and the first screw holes are arranged in a matrix on the teflon disk.
5. A chip failure analysis device is used for positioning the failure position of a chip to be tested in a high-temperature environment, and comprises a light emission microscope and a heating table disc, and is characterized by further comprising a table connecting plate and a heat insulation gasket;
the machine platform connecting plate is provided with a first connecting part and a second connecting part in advance; the first connecting part is used for being fixedly connected with a base of the light emission microscope; the second connecting part is used for being fixedly connected with a base of the heating table plate, so that the machine table connecting plate is positioned between the light emission microscope and the heating table plate;
a heat insulation gasket is arranged between the machine table connecting plate and the heating table disc; after the heating platform disc is fixedly connected with the machine table connecting plate, the heating platform disc is used for being arranged at the position where a sample table of the light emission microscope is located, so that the platform surface of the heating platform disc replaces the sample table; the chip to be tested is arranged on the heating table plate, and the heating table plate is used for setting the temperature range required by the chip to be tested so that the chip to be tested is at the testing temperature; under the test temperature, the bright spot on the chip to be tested is the failure position of the chip to be tested;
the machine table connecting plate is a Teflon circular plate, a square opening is formed in the edge of the Teflon circular plate, and the square opening is used for clamping a heating module on the heating table plate;
the Teflon round plate is provided with a plurality of first connecting parts which do not penetrate through the Teflon round plate, the first connecting parts are first screw holes, and the first screw holes are used for connecting the Teflon round plate with a base of the light emission microscope;
the Teflon round plate is provided with a plurality of second connecting parts, the second connecting parts are second screw holes, and the second screw holes are used for connecting the Teflon round plate with a base of the heating table plate.
6. The chip failure analysis device according to claim 5, wherein the thickness of the Teflon disk is greater than the height of the heating module.
7. The chip failure analysis device according to claim 6, wherein three second screw holes are arranged on the Teflon circular plate, the second screw holes are wide at the top and narrow at the bottom, and the wider end of the second screw holes is connected with the heating table plate.
8. The chip failure analysis device according to claim 6, wherein four first screw holes that do not penetrate through the Teflon disk are disposed on the Teflon disk, and the first screw holes are arranged in a matrix on the Teflon disk.
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| CN109342915A (en) * | 2018-08-29 | 2019-02-15 | 佛山市国星半导体技术有限公司 | A kind of detection method for the LED chip that leaks electricity |
| CN109188252A (en) * | 2018-10-16 | 2019-01-11 | 上海华力微电子有限公司 | A kind of failure independent positioning method based on high temperature light emitting Microbeam Analysis Techniques |
| CN112180238A (en) * | 2020-09-25 | 2021-01-05 | 贵州航天计量测试技术研究所 | Integrated circuit internal short circuit failure positioning method based on liquid crystal phase change |
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