CN104155021B - A kind of thermal conductivity factor instrument standard thermometric plate - Google Patents
A kind of thermal conductivity factor instrument standard thermometric plate Download PDFInfo
- Publication number
- CN104155021B CN104155021B CN201410349339.2A CN201410349339A CN104155021B CN 104155021 B CN104155021 B CN 104155021B CN 201410349339 A CN201410349339 A CN 201410349339A CN 104155021 B CN104155021 B CN 104155021B
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- Prior art keywords
- circuit plate
- plate
- thermal conductivity
- temperature detecting
- conductivity factor
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Abstract
The present invention relates to insulation material detection field, particularly to a kind of thermal conductivity factor instrument standard thermometric plate.It includes heater circuit plate and cold circuit plate, it is provided with heat-insulation layer between heater circuit plate and cold circuit plate, the two sides of heat-insulation layer is coated with heat-conducting silicone grease, heater circuit plate has space hole relative to the place of the space between thermal conductivity factor instrument metering plate and protective plate, the width in described space hole, more than the width of space, described heater circuit plate is welded with 9 temperature detecting resistances, and one of them is positioned at center, another 8 both sides being distributed on space hole, the both sides in each space hole are respectively arranged with one；Being welded with 5 temperature detecting resistances on described cold circuit plate, one of them is positioned at center, and remaining four temperature detecting resistance around center is uniform；Each temperature detecting resistance on heater circuit plate and cold circuit plate connects one group of wire, and often group wire has 4 wires, and the other end often organizing wire connects quick plug.This inventive structure is simple, and easy to use, testing result is accurate.
Description
(1) technical field
The present invention relates to insulation material detection field, particularly to a kind of thermal conductivity factor instrument standard thermometric plate.
(2) background technology
Thermal conductivity factor instrument is a kind of special equipment measuring insulation material thermal conductivity factor, and the thermal conductivity factor of insulation material is to close
It is tied to the important parameter of energy-saving and emission-reduction, along with the whole world attention to energy-saving and emission-reduction in recent years, in the building energy saving field of China
Flourish, thermal conductivity factor instrument is widely used.But the calibrating of thermal conductivity factor instrument, calibration operation are still in blank stage, nothing
Method examines the accuracy of thermal conductivity factor instrument accurately.
Thermal conductivity factor instrument is calibrated the main form using comparison thermal conductivity factor standard reference plate at present carry out, its principle
It is the standard substance by measuring known mean temperature and thermal conductivity value linear relationship with thermal conductivity factor instrument, to thermal conductivity factor instrument
Demarcate.But this principle mandates first has to the temperature value of cold-hot plate under accurate heat conducting coefficient measuring instrument poised state, the most often
The way seen is to be clipped in filament galvanic couple or flat thermometer in thermal conductivity factor instrument to measure, the most unreasonable, the most inaccurate.
(3) summary of the invention
The present invention is in order to make up the defect of prior art, it is provided that a kind of use simple, high, with strong points the leading of accuracy
Hot coefficient instrument standard thermometric plate.
The present invention is achieved through the following technical solutions:
A kind of thermal conductivity factor instrument standard thermometric plate, is characterized in that, including heater circuit plate and cold circuit plate, and heater circuit plate and cold
Being provided with heat-insulation layer between circuit board, the two sides of heat-insulation layer is coated with heat-conducting silicone grease, relative to thermal conductivity factor instrument on heater circuit plate
The place of the space between metering plate and protective plate has space hole, and the width in described space hole is more than the width of space, described
Being welded with 9 temperature detecting resistances on heater circuit plate, one of them is positioned at center, another 8 both sides being distributed on space hole, each every
The both sides of slot apertures are respectively arranged with one；Being welded with 5 temperature detecting resistances on described cold circuit plate, one of them is positioned at center, and remaining is four years old
The individual temperature detecting resistance correspondence metering plate area around center is uniform；Each temperature detecting resistance on heater circuit plate and cold circuit plate
Connecting one group of wire, often group wire has 4 wires, and the other end that circuit board is often organized wire concentrates on the side setting in plate face
Pad 10, is used for welding external wire, and the other end of external wire connects quick plug.
4 temperature detecting resistances inside 4 temperature detecting resistances peripheral on cold circuit plate and space hole on heater circuit plate one a pair
Should.
Described heater circuit plate, cold circuit plate are together with heat-insulation layer rivet riveting.
Described heat-insulation layer is made up of polyurethane material.
The invention has the beneficial effects as follows:
1, the heat of selecting circuit plate structure, cold drawing face, effective the fixing of thermometric thermal resistance and the orientation problem of solving is permissible
It is accurately positioned and measures target location, and solve the problem of surface smoothness, make heat, cold drawing face cold with tested thermal conductivity factor instrument
Hot plate is in close contact, simultaneously because plate lead-in wire at quarter is the thinnest, thin, makes process of the test substantially keep one dimensional heat transfer model.
2, select thin film thermoelectric resistance, solved 4 line wiring issue of thermal resistance by board structure of circuit, eliminate lead-in wire shadow
Ring, and thin film thermoelectric resistance body amasss small, one side thermometric, therefore can measure the temperature on surface residing for it accurately.
3, the setting in space hole, it is to avoid tested thermal conductivity factor instrument metering plate and protective plate pass through thermometric in the case of there is the temperature difference
Plate produces heat bridge and brings impact, can reflect the hot plate temperature situation of tested thermal conductivity factor instrument really, distinguishes metering plate and prevents
The temperature value of backplate.
4, the setting of heat-conducting silicone grease coating, makes circuit board be in close contact with warming plate, eliminates the impact of thermal contact resistance, it is ensured that
The continuity of one dimensional heat transfer model.
5, the setting of heat-insulation layer, fully simulation thermal conductivity factor instrument normal operating conditions, makes the result of measurement to apply
In its daily test.
(4) accompanying drawing explanation
The present invention is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the plan structure schematic diagram of the present invention；
Fig. 2 be the present invention look up structural representation；
Fig. 3 is the local right TV structure schematic diagram of Fig. 1.
In figure, 1 heater circuit plate, 2 cold circuit plates, 3 heat-insulation layers, 4 heat-conducting silicone greases, 5 temperature detecting resistances, 6 space holes, 7 wires, 8
Quick plug, 9 rivets, 10 pads 10.
(5) detailed description of the invention
Accompanying drawing is the specific embodiment of the present invention.As shown in Figure 1, Figure 2, Figure 3 shows, this kind of thermal conductivity factor instrument standard thermometric plate,
Including heater circuit plate 1 and cold circuit plate 2, between heater circuit plate 1 and cold circuit plate 2, it is filled with the equal vacuum that thermal conductivity factor is less
Layer 3, is preferably made up of the polyurethane material that thickness is 25mm ± 2mm, and the two sides of heat-insulation layer 3 is coated with heat-conducting silicone grease 4, thermal conductive silicon
Fat 4 can eliminate owing to contacting thermal contact resistance that is not tight and that produce between cold circuit plate 2, heater circuit plate 1 and heat-insulation layer 3, it
Can make to keep between the cold-hot plate of thermal conductivity factor instrument stable one dimensional heat transfer state, the thermometric degree of accuracy and credible can be promoted
Degree, has space hole 6 relative to the place of the space between thermal conductivity factor instrument metering plate and protective plate on heater circuit plate 1,
The width in space hole 6, slightly larger than the width of space, prevents thermometric plate from going out when docking in thermal conductivity measuring apparatus the most accurately
Existing heat bridge, heater circuit plate 1 is welded with 9 temperature detecting resistances 5, and one of them is positioned at center, and another 8 are distributed on space hole 6
Both sides, the both sides in each space hole 6 are respectively arranged with one；Being welded with 5 temperature detecting resistances 5 on cold circuit plate 2, one of them is positioned at center
Position, remaining four temperature detecting resistances 5 around center are uniform, upper peripheral 4 temperature detecting resistances 5 of cold circuit plate 2 and heat
4 best one_to_one corresponding in temperature detecting resistance 5 position inside the upper space hole 6 of circuit board 1；Above-mentioned temperature detecting resistance 5 welding time its
Surface to flush with the circuit board at respective place, must not exceed, and its position senses with the temperature control on tested thermal conductivity factor instrument
Device wants consistent.Each temperature detecting resistance 5 on heater circuit plate 1 and cold circuit plate 2 connects one group of wire 7, and often group wire 7 has 4
Wire, often a part for group wire 7 is carved on circuit boards and extends to the edge of circuit board, and wire also must be with respective place
Circuit board flushes, it is therefore an objective to making plate face neatly and reduce the impact that hot-fluid form is produced by wire 7, another part of wire is outward
Connect wire, one pad 10 be set in above-mentioned edge, can be connected with external wire at pad 10 by wire on circuit boards,
The other end of external wire connects quick plug 8, for being connected with the quick socket of display instrument, wire 7 so can be made to lead
The door of hot coefficient instrument leans out from gap when closing, it is simple to operation, and the result that temperature detecting resistance 5 records is demonstrated by display instrument
Come；In the present embodiment, wire 7 uses polytetrafluoroethylene (PTFE) silver jacketed wire high temperature resistant, that intensity is big, pliability is good.
In order to increase fastness, together with use rivet 9 riveting of heater circuit plate 1, cold circuit plate 2 and heat-insulation layer 3, rivet 9 is also
Should flush with circuit board.
During work, the present invention is inserted between the hot and cold plate of tested thermal conductivity factor instrument, by quick plug 8 and display instrument
Table connects, and the data-signal that temperature detecting resistance 5 records just is shown by display instrument.
In addition to technical characteristic described in specification, remaining technical characteristic is all known to a person skilled in the art technology.
Claims (4)
1. a thermal conductivity factor instrument standard thermometric plate, is characterized in that, including heater circuit plate (1) and cold circuit plate (2), heater circuit plate
(1) and be provided with heat-insulation layer (3) between cold circuit plate (2), the two sides of heat-insulation layer (3) is coated with heat-conducting silicone grease (4), at heater circuit plate
(1) space hole (6), described space hole are had relative to the place of the space between thermal conductivity factor instrument metering plate and protective plate on
(6) width, more than the width of space, described heater circuit plate (1) is welded with 9 temperature detecting resistances (5), and one of them is positioned at center
Position, another 8 both sides being distributed on space hole (6), the both sides of each space hole (6) are respectively arranged with one；On described cold circuit plate (2)
Being welded with 5 temperature detecting resistances (5), one of them is positioned at center, and remaining four temperature detecting resistance around center (5) is equal
Cloth；Each temperature detecting resistance (5) on heater circuit plate (1) and cold circuit plate (2) connects one group of wire (7), often organizes wire (7) and has
Article 4, wire, the other end often organizing wire (7) connects quick plug (8).
Thermal conductivity factor instrument standard thermometric plate the most according to claim 1, is characterized in that, 4 of the upper periphery of cold circuit plate (2)
4 temperature detecting resistance (5) one_to_one corresponding of inner side, temperature detecting resistance (5) space hole (6) upper with heater circuit plate (1).
Thermal conductivity factor instrument standard thermometric plate the most according to claim 1 and 2, is characterized in that, described heater circuit plate (1), cold
Circuit board (2) and heat-insulation layer (3) are with rivet (9) riveting together.
Thermal conductivity factor instrument standard thermometric plate the most according to claim 3, is characterized in that, described heat-insulation layer (3) is by polyurethane
Material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410349339.2A CN104155021B (en) | 2014-07-22 | 2014-07-22 | A kind of thermal conductivity factor instrument standard thermometric plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410349339.2A CN104155021B (en) | 2014-07-22 | 2014-07-22 | A kind of thermal conductivity factor instrument standard thermometric plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104155021A CN104155021A (en) | 2014-11-19 |
| CN104155021B true CN104155021B (en) | 2016-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410349339.2A Expired - Fee Related CN104155021B (en) | 2014-07-22 | 2014-07-22 | A kind of thermal conductivity factor instrument standard thermometric plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN104155021B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677048B (en) * | 2021-08-19 | 2021-12-24 | 北京林电伟业电子技术有限公司 | Heating unit of heat conductivity coefficient tester |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86101542A (en) * | 1986-08-18 | 1988-03-02 | 同济大学 | Double-sample protection hot plate high temperature conductometer |
| SU1597707A1 (en) * | 1987-07-09 | 1990-10-07 | Предприятие П/Я А-7840 | Apparatus for measuring heat conduction of hard materials |
| CN200962094Y (en) * | 2006-05-31 | 2007-10-17 | 天津佛瑞德科技有限公司 | Heat conduction coefficient measurement device of intelligent temperature-preservation material |
| CN103411996A (en) * | 2013-08-05 | 2013-11-27 | 电子科技大学 | Measuring equipment and measuring method for heat conductivity coefficients of solid materials |
| CN203630062U (en) * | 2013-12-06 | 2014-06-04 | 南京江宁分析仪器有限公司 | Thermal conductivity measuring apparatus |
| CN204043811U (en) * | 2014-07-22 | 2014-12-24 | 山东省计量科学研究院 | A kind of coefficient of heat conductivity instrument standard thermometric plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101092894B1 (en) * | 2009-07-31 | 2011-12-12 | 한국과학기술원 | Apparatus for measuring coefficient of heat transfer |
-
2014
- 2014-07-22 CN CN201410349339.2A patent/CN104155021B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86101542A (en) * | 1986-08-18 | 1988-03-02 | 同济大学 | Double-sample protection hot plate high temperature conductometer |
| SU1597707A1 (en) * | 1987-07-09 | 1990-10-07 | Предприятие П/Я А-7840 | Apparatus for measuring heat conduction of hard materials |
| CN200962094Y (en) * | 2006-05-31 | 2007-10-17 | 天津佛瑞德科技有限公司 | Heat conduction coefficient measurement device of intelligent temperature-preservation material |
| CN103411996A (en) * | 2013-08-05 | 2013-11-27 | 电子科技大学 | Measuring equipment and measuring method for heat conductivity coefficients of solid materials |
| CN203630062U (en) * | 2013-12-06 | 2014-06-04 | 南京江宁分析仪器有限公司 | Thermal conductivity measuring apparatus |
| CN204043811U (en) * | 2014-07-22 | 2014-12-24 | 山东省计量科学研究院 | A kind of coefficient of heat conductivity instrument standard thermometric plate |
Non-Patent Citations (2)
| Title |
|---|
| 固化吸附剂导热系数测量参数选择;孟祥睿等;《制冷学报》;20080831;第29卷(第4期);第42-46页 * |
| 真空绝热板导热系数测量装置的设计;阚安康等;《上海海事大学学报》;20060331;第27卷(第1期);第9-11页 * |
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| CN104155021A (en) | 2014-11-19 |
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