CN217521216U - LED chip aging test fixture - Google Patents
LED chip aging test fixture Download PDFInfo
- Publication number
- CN217521216U CN217521216U CN202220983250.1U CN202220983250U CN217521216U CN 217521216 U CN217521216 U CN 217521216U CN 202220983250 U CN202220983250 U CN 202220983250U CN 217521216 U CN217521216 U CN 217521216U
- Authority
- CN
- China
- Prior art keywords
- test
- led chip
- pad
- aging
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a LED chip aging testing tool relates to semiconductor test equipment technical field, and this LED chip aging testing tool includes: testing the substrate; the utility model discloses a LED chip's aging testing, including test substrate, first test groove and second test groove are equipped with the first test groove of a plurality of and are used for the probe test of aging tester respectively on the test substrate, are equipped with a plurality of holding tanks between first test groove and the second test groove, and the holding tank is used for placing the LED chip, and the both ends of holding tank are equipped with anodal pad and negative pole pad respectively, and first test groove is connected in one side electricity of keeping away from the negative pole pad to anodal pad, and the second test groove is connected in one side electricity of keeping away from anodal pad to the negative pole pad to realize the aging testing of LED chip, the utility model discloses can solve among the prior art test quantity few and the single technical problem of test method.
Description
Technical Field
The utility model relates to a semiconductor test equipment technical field, concretely relates to LED chip aging testing tool.
Background
With the continuous development of semiconductors, light-emitting diodes (LEDs) are currently the most promising new semiconductor light source, which emits light by energy released from recombination of electrons and holes. The light emitting diode has the characteristics of long service life, high luminous efficiency, no interference, high cost performance and the like, and is widely applied to the fields of traffic indication, outdoor full color display and the like. In the current LED industry, an LED chip aging test fixture is usually used to screen and test the defective LED chips of the LED, and the simulation device works in the actual circuit for a certain time to expose the internal potential problems.
At present, a common LED chip aging test fixture is a fixture of an aluminum substrate and an FR4 substrate, a single LED chip is generally independently powered and can only bear 2-20 LED chips, and aging tests of a large number of LED chips cannot be realized. Moreover, due to the problem of circuit structure, the test methods for the aluminum substrate and FR4 substrate are single, and cannot completely meet the requirements of serial or parallel environmental tests of customers, and cannot achieve parallel and serial circuits while being compatible, and at the same time, cannot be compatible with various test devices. To solve this problem, it is common to add a patch plug in the middle of the fixture or to customize a dedicated tester. The common adapter plug has different line resistance values due to different metal materials used by the electrode reeds, so that the voltage and current values received by the LED chip are different from the output value of source meter equipment, and the aging test result of the LED chip is influenced. In addition, in the long-term use process of the adapter plug, the metal electrode oxidation and the aging of the insulating shell can cause poor contact, so that the reliability of the LED chip is directly influenced.
Therefore, the existing LED chip aging test fixture generally has the technical problems of small test quantity and single test method.
SUMMERY OF THE UTILITY MODEL
The utility model aims to prior art not enough, the utility model aims to provide a LED chip aging testing tool aims at solving among the prior art test quantity few and the single technical problem of test method.
The utility model provides a LED chip aging testing tool, LED chip aging testing tool includes:
testing the substrate; the LED chip aging testing device is characterized in that a plurality of first test slots and second test slots are arranged on the testing substrate, the first test slots and the second test slots are respectively used for probe testing of an aging tester, a plurality of accommodating grooves are arranged between the first test slots and the second test slots, the accommodating grooves are used for accommodating LED chips, positive pads and negative pads are respectively arranged at two ends of the accommodating grooves, the positive pads are electrically connected with the first test slots at one side away from the negative pads, and the negative pads are electrically connected with the second test slots at one side away from the positive pads, so that the aging testing of the LED chips is realized.
Compared with the prior art, the beneficial effects of the utility model reside in that: through the LED chip aging test fixture provided by the utility model, a first test slot and a second test slot are arranged on a test substrate, the first test slot and the second test slot are respectively used for the probe test of an aging tester, a plurality of holding tanks are arranged between the first test slot and the second test slot and are used for placing LED chips, a plurality of holding tanks can be arranged between the first test slot and the second test slot, a unit formed by an area between the first test slot and the second test slot and a plurality of units form a circuit, a plurality of circuits can be arranged on the test substrate, therefore, a plurality of LED chips can be accommodated on the test substrate to realize the mass test of the LED chips, both ends of the holding tanks are respectively provided with an anode pad and a cathode pad, the anode pad is electrically connected with the first test slot at one side far away from the cathode pad, the cathode pad is electrically connected with the second test slot at one side far away from the anode pad, the LED chip aging test circuit has the advantages that the LED chip aging test is realized, the parallel connection and series connection structure of the LED chip aging test circuit is realized through different connection modes of the adjacent accommodating grooves and different connection modes of the adjacent units, and the technical problems of small test quantity and single test method in the prior art are solved.
Furthermore, the lengths of the positive electrode bonding pad and the negative electrode bonding pad are both 60-300 μm, the widths of the positive electrode bonding pad and the negative electrode bonding pad are both 60-300 μm, and the distance between the positive electrode bonding pad and the negative electrode bonding pad is 60-300 μm.
Furthermore, a solder block is connected between the positive electrode pad and the negative electrode pad, and the solder block is connected with the negative electrode pad at one side far away from the positive electrode pad so as to block the positive electrode pad and the negative electrode pad.
Further, any adjacent accommodating grooves between the first test groove and the second test groove are electrically connected through leads.
Further, the positive electrode pads of any adjacent accommodating grooves are electrically connected to each other through a lead, and the negative electrode pads are electrically connected to each other through a lead.
Further, the positive electrode pad of any one of the accommodating grooves is electrically connected to the negative electrode pad of the adjacent accommodating groove through a lead.
Further, the inner diameters of the first test groove and the second test groove are 120-600 μm.
Further, the distance between the first test slot and the positive electrode pad is 60-300 μm, and the distance between the second test slot and the negative electrode pad is 60-300 μm.
Furthermore, a first lead is arranged in the first test slot and extends to one end of the test substrate to be connected with the anode of the test machine.
Furthermore, a second lead is arranged in the second test slot and extends to one end of the test substrate to be connected with the negative electrode of the test machine.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of an aging test fixture for LED chips according to a first embodiment of the present invention;
fig. 2 is a schematic view of a partial structure of an aging test fixture for LED chips according to a first embodiment of the present invention;
fig. 3 is a partial cross-sectional view of an LED chip aging test fixture according to a first embodiment of the present invention;
fig. 4 is a schematic structural view of an aging test fixture for LED chips according to a second embodiment of the present invention;
fig. 5 is a schematic view of a partial structure of an aging test fixture for LED chips according to a second embodiment of the present invention;
the figure elements are illustrated in symbols:
the test device comprises a test substrate 10, a first test slot 11, a second test slot 12, an accommodating groove 13, an electrode plate 20, a negative electrode sheet 21, a positive electrode sheet 22, an auxiliary support plate 30, a first lead 110, a second lead 120, a positive pad 130, a negative pad 131 and a solder resist block 132.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Please refer to fig. 1-3, which illustrate the LED chip aging test fixture provided by the first embodiment of the present invention, the LED chip aging test fixture includes a test substrate 10, the test substrate 10 is made of aluminum or FR4, and the aluminum is used as the test substrate 10, so that the LED chip has good heat dissipation and heat conduction functions, because the LED chip generates heat greatly, the heat can be rapidly transmitted through the test substrate 10, and the heat dissipation of the LED chip is realized. And secondly, the aluminum material is used as the test substrate 10, so that the test substrate has good electrical insulation performance and machining performance, and the service life of the test substrate 10 can be prolonged. The FR-4 material is a fire-resistant material grade code, and is suitable for being applied to an LED chip aging test fixture due to stable electrical insulation performance, good flatness, smooth surface, no pit and standard thickness tolerance. The test substrate 10 is rectangular in shape, and an electrode plate 20 extends from one side of the test substrate to facilitate the access of a tester.
The electrode plate 20 is rectangular, a plurality of electrode plates are arranged on the electrode plate 20, the electrode plates are strip-shaped and comprise a positive electrode plate 22 and a negative electrode plate 21, the positive electrode plate 22 is connected with the first lead 110, the negative electrode plate 21 is connected with the second lead 120, the positive electrode of the tester is connected with the positive electrode plate 22, and the negative electrode of the tester is connected with the negative electrode plate 21, so that the aging test of the LED chip is realized. By way of example and not limitation, the electrode tabs may be arranged in a common positive electrode or a common negative electrode, when the electrode tabs are arranged in a common positive electrode, only a single positive electrode tab 22 is connected to all the first leads 110, and the negative electrode tabs 21 correspond to the second leads 120 one by one, so as to realize the aging test of the LED chips for respectively controlling each segment of the circuit. When the electrode plates are set to be the common cathode, only a single cathode electrode plate 21 is connected with all the first leads 110, and the anode electrode plates 22 correspond to the second leads 120 one by one, so that the aging test of the LED chips of all the lines is controlled respectively.
In addition, the two ends of the test substrate 10 are respectively provided with the auxiliary support plates 30, the auxiliary support plates 30 are rectangular in shape and used for increasing the basic stability of the test, the test substrate 10 is large, the electrode plate 20 is small, when the electrode plate 20 is inserted into the slot of the tester, the electrode plate 20 cannot support the weight of the test substrate 10 and is not stable enough, the auxiliary support plates 30 are arranged, the auxiliary support plates 30 can be inserted into the auxiliary slot of the aging tester, the stability of the test substrate 10 is increased, the unstable fracture risk of the test substrate 10 is prevented, and the service life of the test substrate 10 is prevented from being influenced.
The test substrate 10 is provided with a plurality of first test slots 11 and second test slots 12, and the number of the first test slots 11 and the number of the second test slots 12 are set according to the number of products. The shapes of the first test slot 11 and the second test slot 12 are circular, the inner diameters of the first test slot 11 and the second test slot 12 are 120-600 μm, the inner diameters are respectively used for connecting probes of the aging tester for testing, when the inner diameters of the first test slot 11 and the second test slot 12 are smaller than 120 μm, the sizes of the probe tips of the aging tester are larger than the inner diameters of the first test slot 11 and the second test slot 12, the probes cannot be inserted into the first test slot 11 and the second test slot 12, and the LED chip aging test cannot be performed; when the first test slot 11 and the second test slot 12 are larger than 600 μm, the first leads 110 and the second leads 120 in the first test slot 11 and the second test slot 12 are too large, and have resistance, so that the aging data of the probe test has errors, and the result is abnormal.
In addition, a plurality of accommodating grooves 13 are arranged between the first test groove 11 and the second test groove 12, the accommodating grooves 13 are used for accommodating LED chips to be tested, two ends of the accommodating grooves 13 facing the test substrate 10 are respectively provided with a positive electrode pad 130 and a negative electrode pad 131, the positive electrode pad 130 is connected with a positive electrode of the LED chip, the negative electrode pad 131 is connected with a negative electrode of the LED chip, the lengths of the positive electrode pad 130 and the negative electrode pad 131 are both 60-300 μm, the widths of the positive electrode pad 130 and the negative electrode pad 131 are both 60-300 μm, and the sizes of the positive electrode pad 130 and the negative electrode pad 131 are set to prevent the bad contact between the positive electrode of the LED chip and the positive electrode pad 130 or the bad contact between the negative electrode of the LED chip and the negative electrode pad 131, so that the aging test of the LED chip is abnormal and the test result of the LED chip is affected. Meanwhile, the distance between the anode bonding pad 130 and the cathode bonding pad 131 is 60-300 μm to adapt to the size of the LED chip, so that the LED chip is prevented from shifting to one side, the LED chip is prevented from being in poor contact with the anode bonding pad 130 and the cathode bonding pad 131, and data abnormity can be generated in the aging test of the LED chip.
Any adjacent accommodating grooves 13 are electrically connected through lead wires, in this embodiment, the positive pads 130 of any adjacent accommodating grooves 13 are electrically connected through lead wires, the negative pads 131 are electrically connected through lead wires, so that parallel connection of the LED chips is realized, the first test slot 11 is electrically connected to one side of each positive pad 130 away from the corresponding negative pad 131, the second test slot 12 is electrically connected to one side of each negative pad 131 away from the corresponding positive pad 130, the LED chips connected in parallel are tested by inserting probes into the first test slot 11 and the second test slot 12, and the positive electrode plate 22 and the negative electrode plate 21 connected to the first lead 110 and the second lead 120 are also inserted into the slots of the aging tester, so that testing of the LED chips connected in parallel is realized, and the testing of probes and positive and negative electrodes can be simultaneously adopted, and various testing devices are compatible. In addition, the area between the first test slot 11 and the second test slot 12 is used as a unit, and the parallel connection and the serial connection of the LED chips in the unit can be realized by connecting a plurality of groups of units in series, namely, the first test slot 11 of one unit is connected with the second test slot 12 of an adjacent unit to realize the series connection between the units, so that the parallel connection and the serial connection of the LED chips in the unit can be realized, the parallel connection and the serial connection structure of the LED chip aging test circuit can be realized, the test methods are various, the serial connection or the parallel connection environmental test requirements of customers can be completely realized, the parallel connection and the serial connection compatible circuit can be realized, and the problem of the circuit structure is avoided, the test method of the jig for the aluminum substrate and the FR4 substrate is single, the serial connection or the parallel connection environmental test requirements of customers can not be completely realized, and the parallel connection and the serial connection compatible circuit can not be realized.
It should be noted that a plurality of holding grooves 13 may be disposed between the first test slot 11 and the second test slot 12, an area between the first test slot 11 and the second test slot 12 forms a unit, a plurality of units are connected in series to form a circuit, and a plurality of circuits may be disposed on one test substrate 10. For example, 20 accommodating grooves 13 can be provided between the first test groove 11 and the second test groove 12, and 20 units are connected in series to form a circuit. One circuit can realize the test of 400 LED chips, and 20 circuits on one test substrate 10 are simultaneously used, so 8000 LED chips can be tested on one test substrate 10. The large-scale and large-quantity simultaneous testing of the LED chips is realized, the time for the aging testing of the LED chips is saved, and the productivity of the aging tester is improved.
The solder resist block 132 is connected between the positive pad 130 and the negative pad 131, and the solder resist block 132 is connected to the negative pad 131 at a side away from the positive pad 130 to block the connection between the positive pad 130 and the negative pad 131, so as to prevent the conduction between the positive pad 130 and the negative pad 131, short circuit of the circuit, and burnout of the test substrate 10. The distance between the first test slot 11 and the positive pads 130 is 60-300 microns, the distance between the second test slot 12 and the negative pads 131 is 60-300 microns, the distances are too close, the situation that the probes are directly contacted with the single positive pads 130 or the single negative pads 131 to cause inaccurate test data is prevented, the distances are too far, and the situation that the resistance of a circuit is too large to cause abnormal LED chip aging test data is prevented.
Compared with the prior art, the LED chip aging test fixture provided by the embodiment has the advantages that: through the LED chip aging test fixture provided by the utility model, a first test slot and a second test slot are arranged on a test substrate, the first test slot and the second test slot are respectively used for the probe test of an aging tester, a plurality of holding tanks are arranged between the first test slot and the second test slot and are used for placing LED chips, a plurality of holding tanks can be arranged between the first test slot and the second test slot, a unit formed by an area between the first test slot and the second test slot and a plurality of units form a circuit, a plurality of circuits can be arranged on the test substrate, therefore, a plurality of LED chips can be accommodated on the test substrate to realize the mass test of the LED chips, both ends of the holding tanks are respectively provided with an anode pad and a cathode pad, the anode pad is electrically connected with the first test slot at one side far away from the cathode pad, the cathode pad is electrically connected with the second test slot at one side far away from the anode pad, the LED chip aging test circuit has the advantages that the LED chip aging test is realized, the parallel connection and series connection structure of the LED chip aging test circuit is realized through the parallel connection of the adjacent accommodating grooves and the series connection of the adjacent units, and the technical problems of small test quantity and single test method in the prior art are solved.
Example two
Referring to fig. 4-5, an LED chip aging testing fixture provided by a second embodiment of the present invention is shown, the LED chip aging testing fixture in this embodiment has a structure substantially the same as the LED chip aging testing fixture in the first embodiment, and the difference is that:
the positive pads 130 of the holding grooves 13 are electrically connected to the negative pads 131 of the adjacent holding grooves 13 by leads, so that the series connection of the LED chips is realized, and at the same time, the area between the first test slot 11 and the second test slot 12 serves as a unit, the first test slot 11 of the unit is connected with the second test slot 12 of the adjacent unit through leads to realize the parallel connection of the units, the series connection of the LED chips in the units can be realized, the units are connected in parallel, the series connection and parallel connection structure of the LED chip aging test circuit is realized, the test method is diversified, the series connection or parallel connection environmental test requirements of customers are completely realized, the series connection and parallel connection simultaneously-compatible circuit is realized, the problem of circuit structure is avoided, the jig test methods of the aluminum substrate and the FR4 substrate are single, the series connection or parallel connection environmental test requirements of the customers cannot be completely realized, and the parallel connection and series connection simultaneously-compatible circuit cannot be realized. Meanwhile, the positive electrode plates 22 correspond to the first leads 110 of the circuit one by one, and the negative electrode plates 21 correspond to the second leads 120 of the circuit one by one, so as to realize the aging test of the LED chips respectively controlling each section of circuit.
It should be noted that a plurality of accommodating grooves 13 may be disposed between the first test slot 11 and the second test slot 12, an area between the first test slot 11 and the second test slot 12 forms a unit, the plurality of units are connected in parallel to form a circuit, and a plurality of circuits may be disposed on one test substrate 10. Thus, a large number of led chips can be tested on one test substrate 10. The large-scale and large-quantity simultaneous testing of the LED chips is realized, the time for the aging test of the LED chips is saved, and the productivity of the aging tester is improved.
Compared with the prior art, the LED chip aging test fixture provided by the embodiment has the advantages that: through the LED chip aging test fixture provided by the utility model, a first test slot and a second test slot are arranged on a test substrate, the first test slot and the second test slot are respectively used for the probe test of an aging tester, a plurality of holding tanks are arranged between the first test slot and the second test slot and are used for placing LED chips, a plurality of holding tanks can be arranged between the first test slot and the second test slot, a unit is formed by an area between the first test slot and the second test slot, a plurality of units form a circuit, a plurality of circuits can be arranged on the test substrate, therefore, a plurality of LED chips can be accommodated on the test substrate to realize the mass test of the LED chips, both ends of the holding tanks are respectively provided with an anode pad and a cathode pad, the anode pad is electrically connected with the first test slot at one side far away from the cathode pad, the cathode pad is electrically connected with the second test slot at one side far away from the anode pad, the LED chip aging test circuit has the advantages that the LED chip aging test is realized, the serial connection and parallel connection structure of the LED chip aging test circuit is realized through the serial connection of the adjacent accommodating grooves and the parallel connection of the adjacent units, and the technical problems of small test quantity and single test method in the prior art are solved.
The LED chip aging test fixture of the first to second embodiments can be implemented by cutting the test substrate, also cutting the board, and cutting the large copper clad laminate into the test substrate meeting the size requirements of the printed or custom finished product.
Carrying out circuit printing on the test substrate; and printing the required circuit pattern on the test substrate by using photosensitive ink through silk screen printing, wherein the place covered by the photosensitive ink is the required circuit pattern, and the photosensitive ink is cured after being irradiated by UV light.
Etching the ink on the test substrate; and etching the uncovered copper foil through an etching process, and finally washing the cured photosensitive ink to form the required circuit pattern.
Coating solder mask blocks on a test substrate; mainly, a layer of solder resist material is coated on the surface of the board by screen printing or solder resist ink coating, parts needing to be welded are exposed by exposure and development, and solder resist blocks are covered on other areas to prevent short circuit during welding.
And (3) adopting the die to carry out processes such as punching forming, chamfering, edging and the like on the test substrate to finish the final form required by a customer, namely the LED chip aging test jig.
And testing the LED chip aging test fixture, and connecting each line of the LED chip aging test fixture with a probe to test the electrical performance of the LED chip aging test fixture. (open/close of inspection jig line)
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a LED chip aging testing tool, its characterized in that, LED chip aging testing tool includes the test substrate, be equipped with the first test groove of a plurality of and the second test groove on the test substrate, first test groove with the second test groove is used for the probe test of aging tester respectively, first test groove with be equipped with a plurality of holding tank between the second test groove, the holding tank is used for placing the LED chip, the both ends of holding tank are equipped with anodal pad and negative pole pad respectively, anodal pad is in keeping away from first test groove is connected to one side electricity of negative pole pad, the second test groove is connected in keeping away from one side electricity of anodal pad to realize the aging testing of LED chip.
2. The jig for testing aging of LED chips as claimed in claim 1, wherein the positive bonding pad and the negative bonding pad have a length of 60-300 μm and a width of 60-300 μm, and the distance between the positive bonding pad and the negative bonding pad is 60-300 μm.
3. The LED chip aging test fixture of claim 1, wherein a solder bump is connected between the positive electrode pad and the negative electrode pad, and the solder bump is connected to the negative electrode pad at a side away from the positive electrode pad to block the positive electrode pad and the negative electrode pad.
4. The LED chip burn-in test fixture of claim 1, wherein any adjacent receiving slots between the first test slot and the second test slot are electrically connected by leads.
5. The jig for testing LED chip aging according to claim 4, wherein the positive pads of any adjacent receiving grooves are electrically connected to each other by a lead, and the negative pads are electrically connected to each other by a lead.
6. The jig for testing aging of LED chips as claimed in claim 4, wherein the positive bonding pad of any one of the receiving grooves is electrically connected to the negative bonding pad of the adjacent receiving groove by a lead.
7. The jig for testing LED chip aging as claimed in claim 1, wherein the inner diameters of the first and second test slots are 120-600 μm.
8. The jig of claim 1, wherein the first test slot is spaced from the positive pads by 60-300 μm, and the second test slot is spaced from the negative pads by 60-300 μm.
9. The jig of claim 1, wherein a first lead is disposed in the first test slot, and the first lead extends to one end of the test substrate for connection to a positive electrode of a tester.
10. The jig of claim 1, wherein a second lead is disposed in the second test slot and extends to one end of the test substrate for connection to a negative electrode of a tester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220983250.1U CN217521216U (en) | 2022-04-26 | 2022-04-26 | LED chip aging test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220983250.1U CN217521216U (en) | 2022-04-26 | 2022-04-26 | LED chip aging test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217521216U true CN217521216U (en) | 2022-09-30 |
Family
ID=83372457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220983250.1U Active CN217521216U (en) | 2022-04-26 | 2022-04-26 | LED chip aging test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217521216U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117129834A (en) * | 2023-08-29 | 2023-11-28 | 武汉永力睿源科技有限公司 | Chip aging testing device |
-
2022
- 2022-04-26 CN CN202220983250.1U patent/CN217521216U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117129834A (en) * | 2023-08-29 | 2023-11-28 | 武汉永力睿源科技有限公司 | Chip aging testing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217521216U (en) | LED chip aging test fixture | |
| CN103743991A (en) | Method and apparatus for testing conductive-hole electrical property of PCB plate | |
| CN111103724A (en) | LED backlight module, display screen and LED backlight module detection method | |
| CN109148421B (en) | Microwave monolithic integrated circuit grounding structure and mounting process thereof | |
| CN106898602B (en) | LED module BGA package fixing structure | |
| US7982317B2 (en) | Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module | |
| CN212625492U (en) | LED chip detection device | |
| CN214585837U (en) | Aging testing device | |
| CN209894849U (en) | High-precision detection clamp for laser chip | |
| KR101651587B1 (en) | Inspection equipment for led packaging burn-in test | |
| CN221528878U (en) | Detection device of Type-C interface | |
| CN112735284A (en) | Micro LED module, Micro LED module production method and display | |
| CN110446361A (en) | A kind of matrix LED car light circuit board and production method | |
| CN219036550U (en) | Lamp panel | |
| CN215910593U (en) | Be suitable for field effect transistor to burn and smelt experimental board of smelting always | |
| CN211203685U (en) | COB (chip on board) packaged L ED (electronic device) microwave oven lamp module | |
| CN113299816B (en) | Method for mounting light emitting diode array | |
| CN220249818U (en) | Backlight module with conveniently replaced LED lamp beads | |
| CN217443484U (en) | Clamp convenient to disassemble and assemble for power cycle experiment | |
| CN218217823U (en) | Novel circuit board assembly suitable for multiple LEDs | |
| CN216117883U (en) | Bias test board | |
| CN216624278U (en) | Combined LED lamp strip | |
| CN219496472U (en) | PCB diode welding detection device | |
| CN102375114B (en) | Method for verifying quality of device under test (DUT) plate | |
| CN209784484U (en) | Aging circuit board of SMD product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |